CN216487960U

CN216487960U - Chip mounting device

Info

Publication number: CN216487960U
Application number: CN202123341351.3U
Authority: CN
Inventors: 雷伟庄
Original assignee: Weijian Intelligent Packaging Technology Shenzhen Co ltd
Current assignee: Weijian Intelligent Packaging Technology Shenzhen Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-10
Anticipated expiration: 2031-12-27

Abstract

The utility model relates to the technical field of die bonder, in particular to a chip mounting device, which comprises a body, a moving part and an elastic part, wherein the body comprises a support column, the elastic part is sleeved on the support column, one end of the elastic part is connected with the body, the other end of the elastic part is connected with one end of the moving part, a position limiting part is arranged on the support column and used for limiting the moving part, when the moving part is subjected to external force, the distance between the moving part and the body is shortened, an elastic element is arranged between the moving part and the body, the elastic element is subjected to stretching change along with the external force, the sensor is used for measuring the distance between the moving part and the sensor, and by controlling the stretching change of the elastic element, and then the dynamics of control elastic component control suction nozzle absorption chip dress base plate avoids the dynamics undersize, and chip dress base plate is insecure, and the dynamics is too big, leads to chip and base plate to damage, may cause secondary process, has solved the not high problem of chip dress efficiency.

Description

Chip mounting device

[ technical field ] A method for producing a semiconductor device

The utility model relates to a solid brilliant machine technical field, in particular to chip pastes dress device.

[ background of the invention ]

With the continuous development of industrial technology, the size of the chip is smaller and smaller, and the requirement for sucking the chip by the suction nozzle is higher and higher. In the prior art, a suction nozzle for mounting a chip by using a suction nozzle generally adopts a fixed type suction nozzle, and when the chip is mounted, the suction nozzle adsorbs the chip and moves the chip to a corresponding position on a substrate for mounting. When the chip is mounted, the chip is easy to damage due to large force when the suction nozzle sucks the chip to mount on the substrate because the chip is small; the power is little, pastes the dress insecurely, and laminating distance between unable accurate control chip and the base plate, and then can't improve the installation accuracy between chip and the base plate, probably brings the secondary operation, has the not high problem of chip subsides dress efficiency.

[ Utility model ] content

For solving the not high problem that exists of current chip subsides dress efficiency, the utility model provides a chip pastes dress device.

The utility model provides a technical problem's scheme provides a chip pastes dress device, including body, moving part and elastic component, the body includes the support column, the elastic component is established to the cover on the support column, the body is connected to elastic component one end, the elastic component other end is connected moving part one end, be provided with the locating part on the support column and be used for giving the moving part is spacing, works as when the moving part receives external force, the moving part with distance between the body shortens.

Preferably, one end of the body is provided with a sensor, and the sensor is used for sensing the distance between the sensor and the movable member.

Preferably, the sensor may be one of a hall sensor, an ultrasonic wave, a laser, a grating ruler or a magnetic grating ruler.

Preferably, the other end of the movable member away from the elastic member is connected to the suction nozzle.

Preferably, the limiting member is detachably disposed on the supporting column.

Preferably, the chip mounting device further comprises an accommodating part, and the accommodating part is connected with one end of the movable part far away from the elastic part to accommodate the suction nozzle.

Preferably, the accommodating piece comprises a hollow tube, a through hole is formed in one side of the accommodating piece, and the hollow tube penetrates from the through hole and is used for sucking the suction nozzle.

Preferably, the caliber of the hollow tube is slightly larger than that of the suction nozzle.

Preferably, the hollow tube is detachably connected to the mouthpiece.

Preferably, the chip mounter further includes an electronic scale for testing the magnitude of the external force applied to the moving member in the direction toward the sensor.

Compared with the prior art, the utility model discloses a chip pastes dress device has following advantage:

1. the utility model relates to a chip mounting device, which comprises a body, a moving part and an elastic part, wherein the body comprises a support column, the elastic part is sleeved on the support column, one end of the elastic part is connected with the body, the other end of the elastic part is connected with one end of the moving part, a position limiting part is arranged on the support column for limiting the moving part, when the moving part receives external force, the distance between the moving part and the body is shortened, when the moving part receives external force, because the support column is sleeved with the elastic element, wherein one end is connected with the body, the other end is connected with one end of the movable part, the elastic part is changed by stretching along with the application of external force, meanwhile, a limit piece is arranged on the supporting column, one end of the elastic piece far away from the body is abutted against the movable piece, when the spring is subjected to telescopic change, the limiting piece is arranged to prevent the movement track of the elastic piece from exceeding the range of the elastic piece, so that the elastic piece is prevented from popping up to accidentally injure people; secondly, when the moving part is subjected to external force and the direction of the external force is towards one end of the body, the distance between the moving part and the body is shortened; through the compression of control elastic component or the distance between extension control moving part and the body in this structure, and then the dynamics that the subassembly that accurate control and moving part are connected received, avoid in follow-up chip pastes the dress flow, the dynamics is too big, cause chip and base plate to damage, the dynamics undersize, paste dress insecure when leading to the chip to paste the dress base plate, cause subsequent secondary process, operator's safety has also been guaranteed to a certain extent, the life of relevant subassembly has also been prolonged in addition, the loss is reduced, the problem that chip subsides dress efficiency is not high has been solved.

2. The utility model discloses an one end of body is provided with a sensor, and the sensor is used for the distance between sensing sensor and the moving part, and this setting makes when the moving part receives external force, and the direction of external force is towards the direction that is equipped with the sensor, and the distance between moving part and the sensor can shorten; the distance between the moving part and the sensor is controlled by controlling the compression or extension amount of the elastic part, so that the force applied to the component connected with the moving part is accurately controlled, secondly, the distance between the moving part and the sensor is sensed by the sensor, and along with the extension or compression of the elastic part, the distance sensed by the sensor can be changed along with the distance, so that the force applied to the component connected with the moving part in the subsequent chip mounting process is accurately controlled, the damage to the chip and the substrate caused by overlarge force in the subsequent chip mounting process is avoided,

the force is too small, so that the chip mounting substrate is not firm, subsequent secondary processes are caused, the service life of related components is prolonged, the loss is reduced, and the practicability of the sensor structure is reflected.

3. The sensor of the utility model can be one of a Hall sensor, an ultrasonic wave, a laser, a grating ruler or a magnetic grating ruler, the induction distance of the Hall sensor is the strength of a magnetic field, the magnetic field intensity is enhanced, and the distance which can be induced by the Hall sensor is farther, wherein the Hall sensor has smaller volume, light weight, long service life and stronger practicability; the ultrasonic sensor is characterized in that the propagation speed of ultrasonic waves in the air is utilized, the time of the reflected sound waves after being transmitted and encountering an obstacle is measured, the actual distance from an emergent point to the obstacle is calculated according to the time difference between the transmitting time and the receiving time, and the ultrasonic sensor is relatively resistant to dirt and can be used in a poor environment; the laser ranging method has the advantages that the laser ranging method is characterized by good unidirectionality, strong directivity and the like, the working time is long, and the precision is high; the grating ruler adopts an absolute measurement method, the subsequent electronic equipment can obtain a position value while the grating ruler is powered on, and a reference point can be found without moving the object to be measured; the magnetic grid ruler reads by non-contact installation of the magnetic reading head and the magnetic ruler, the magnetic reading head senses the change of a magnetic field in the process of moving along the magnetic ruler and converts the change of the magnetic field into an analog signal or a digital signal for outputting, so that the distance is obtained, and the magnetic grid ruler has the advantages of higher measurement precision, wide measurement range and strong anti-interference capability; above arbitrary kind of sensor can both be when pasting the dress to the chip, when surveying the distance between moving part and the sensor, obtain comparatively accurate numerical value, improve the efficiency of follow-up flow, embody its practicality.

4. The other end of the moving part, which is far away from the elastic part, is connected with the suction nozzle, when the chip mounting is carried out, one end of the moving part, which is far away from the elastic part, is connected with the suction nozzle, the suction nozzle absorbs the chip, when the moving part receives external force, and the direction of the external force is towards the direction provided with the sensor, and the distance between the moving part and the sensor can be shortened; the distance between the movable part and the sensor is controlled by controlling the compression or extension of the elastic part, and the movable part drives the suction nozzle and the chip to move towards the direction close to the substrate; secondly, the sensor is used for measuring the distance between moving part and the sensor, and then the dynamics when control chip pastes the base plate avoids the dynamics too big, and the base plate damages, and the dynamics undersize, chip subsides dress insecure causes the damage, has protected each subassembly when improving chip subsides dress efficiency specially, has embodied the practicality of its structure.

5. The utility model discloses a moving part includes a locating part, the locating part can be dismantled and set up on the support column, this setting makes when the chip is absorb to the suction nozzle, the moving part when moving towards the direction that sets up the sensor removes, because there is an elastic component to maintain between body and the moving part, the setting of support column is used for supporting the moving part, and the locating part can be dismantled and set up on the support column, the locating part is used for supporting the moving part promptly, follow the moving part and keep away from or be close to the direction motion of body, and the locating part can avoid the moving part to slide the deformation volume of elastic component from top to bottom great, pressure is too big, avoid the moving part to exceed its movement track, when having protected the moving part, also avoid suction nozzle and the direct emergence collision of base plate, the life of moving part and suction nozzle has been prolonged, the efficiency of chip subsides dress has also been improved.

6. The utility model discloses an it includes the hollow tube to hold a piece, a through-hole has been seted up to holding one side, the hollow tube penetrates from the through-hole and is used for absorbing the suction nozzle, the hollow tube is arranged in absorbing the air in the suction nozzle, make and keep vacuum between suction nozzle and the hollow tube, sneak into the air in avoiding the suction nozzle, directly fall, the suction nozzle damages with the base plate, the base plate has also been protected when the setting up of hollow tube makes the protection suction nozzle, the chip, the flow of whole operation has also been accelerated, the efficiency is improved, the life of extension suction nozzle.

7. The utility model discloses a bore of hollow tube slightly is greater than the bore of suction nozzle, when the hollow tube was to the suction nozzle extraction vacuum, when the bore of hollow tube slightly was greater than the bore of suction nozzle, can guarantee that powerful suction can also guarantee that the suction nozzle does not drop when extracting the suction nozzle air, avoids the suction nozzle directly to collide with ground, leads to the damage of suction nozzle, should set up the life who has prolonged the suction nozzle, also guarantees that the process that the suction nozzle absorbs the chip is smooth, embodies its practicality.

8. The utility model discloses a hollow tube can be dismantled with the suction nozzle and be connected, should set up and make the suction nozzle that can replace different specifications to the chip of different specifications, the suction nozzle can be dismantled with the hollow tube and be connected and make the suction nozzle conveniently change, raises the efficiency, embodies its practicality.

9. The utility model discloses a chip pastes dress device still includes an electronic scale and is used for testing the moving part and receives the size of the reaction force towards sensor one end, the pressure value is surveyed to the electronic scale, this setting makes when exerting pressure to the moving part, and when the direction orientation was equipped with the one end of sensor, the other end that the elastic component was kept away from to the moving part is connected with the suction nozzle, suction nozzle and electronic scale butt, its pressure value is surveyed to the electronic scale, thereby this structure makes and judges its pressure value unanimous with the preset pressure value through suction nozzle and electronic scale butt, subsequent process has improved work efficiency, embody its practicality.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a chip mounting device according to a first embodiment of the present invention.

Fig. 2 is a block diagram of a die bonder according to a second embodiment of the present invention.

The attached drawings indicate the following:

1. a chip mounting device; 2. a die bonder;

10. a body; 20. a suction nozzle; 30. an elastic member; 40. a receiving member; 50. an electronic scale;

11. a sensor; 12. a movable member; 13. a support pillar; 41. a hollow tube; 121. and a limiting member.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, a chip mounting device 1 of the present invention includes a body 10, a moving member 12 and an elastic member 30, the body 10 includes a supporting post 13, the elastic member 30 is sleeved on the supporting post 13, one end of the elastic member 30 is connected to the body 10, the other end of the elastic member 30 is connected to one end of the moving member 12, the supporting post 13 is provided with a position limiting member 121 for limiting the position of the moving member 12, when the moving member 12 is subjected to an external force, the distance between the moving member 12 and the body 10 is shortened, when the moving member 12 is subjected to the external force, because the supporting post 13 is sleeved with an elastic member 30, one end of which is connected to the body 10, the other end of which is connected to one end of the moving member 12, the elastic member 30 is changed in a stretching manner along with the application of the external force, meanwhile, the supporting post 13 is provided with a position limiting member 121, one end of the elastic member 30 away from the body 10 abuts against the moving member 12, when the elastic member 30 is changed in a stretching manner, the limiting member 121 prevents the movement track of the elastic member 30 from exceeding the range thereof, and prevents the elastic member 30 from popping up to accidentally injure people; secondly, when the moving part 12 is subjected to an external force, and the direction of the external force is towards one end of the main body 10, the distance between the moving part 12 and the main body 10 is shortened; the distance between the compression or the extension control moving part 12 and the body 10 through controlling the elastic component 30 in this structure, and then the dynamics that the subassembly that accurate control and moving part 12 are connected received, avoid in follow-up chip pastes the dress flow, the dynamics is too big, cause chip and base plate to damage, the dynamics undersize, paste dress insecure when leading to the chip to paste the dress base plate, cause subsequent secondary process, operator's safety has also been guaranteed to a certain extent, the life of relevant subassembly has also been prolonged in addition, the loss is reduced, the problem that chip pastes dress efficiency is not high has been solved.

Further, one end of the body 10 is provided with a sensor 11, the sensor 11 is used for sensing the distance between the sensor 11 and the moving part 12, and the arrangement is such that when the moving part 12 receives an external force, and the direction of the external force is towards the direction in which the sensor 11 is arranged, the distance between the moving part 12 and the sensor 11 is shortened; the distance between the moving part 12 and the sensor 11 is controlled by controlling the compression or extension amount of the elastic part 30, and then the force received by the component connected with the moving part 12 is accurately controlled, secondly, the distance between the moving part 12 and the sensor 11 is sensed by the sensor 11, along with the extension or compression of the elastic part 30, the distance sensed by the sensor 11 can be changed along with the distance, and then the force received by the component connected with the moving part 12 in the subsequent mounting process is accurately controlled, so that the excessive force in the subsequent chip mounting process is avoided, the damage to the chip and the substrate is caused, the force is too small, the chip mounting substrate is not firm, the subsequent secondary process is caused, the service life of the related component is prolonged, the loss is reduced, and the practicability of the structure of the sensor 11 is embodied.

As an optional implementation, the sensor 11 may be one of a hall sensor, an ultrasonic wave, a laser, a grating ruler or a magnetic grating ruler, the sensing distance of the hall sensor is the distance that the hall sensor can sense the magnetic field is far away due to the strength of the magnetic field, and the hall sensor has a small volume, a light weight, a long service life and a strong practicability; the ultrasonic sensor is characterized in that the propagation speed of ultrasonic waves in the air is utilized, the time of the reflected sound waves after being transmitted and encountering an obstacle is measured, the actual distance from an emergent point to the obstacle is calculated according to the time difference between the transmitting time and the receiving time, and the ultrasonic sensor is relatively resistant to dirt and can be used in a poor environment; the laser ranging method has the advantages that the laser ranging method is characterized by good unidirectionality, strong directivity and the like, the working time is long, and the precision is high; the grating ruler adopts an absolute measurement method, the subsequent electronic equipment can obtain a position value while the grating ruler is powered on, and a reference point can be found without moving the object to be measured; the magnetic grid ruler reads by non-contact installation of the read head and the magnetic ruler, the read head senses the change of the magnetic field in the process of moving along the magnetic ruler and converts the change of the magnetic field into an analog signal or a digital signal for outputting, thereby solving the distance, the measuring precision of the magnetic grid ruler is higher,

the measuring range is wide, and the anti-interference capability is strong; above arbitrary kind of sensor 11 can both obtain comparatively accurate numerical value when pasting the dress to the chip, when surveying the distance between moving part 12 and the sensor 11, improves the efficiency of follow-up flow, embodies its practicality.

Further, the other end of the moving part 12, which is far away from the elastic member 30, of the moving part 12 of the present invention is connected to the suction nozzle 20, when the chip mounting is performed, the one end, which is far away from the elastic member 30, of the moving part 12 is connected to the suction nozzle 20, the suction nozzle 20 sucks the chip, and when the moving part 12 is subjected to an external force, and the direction of the external force is toward the direction in which the sensor 11 is disposed, the distance between the moving part 12 and the sensor 11 is shortened; the distance between the movable element 12 and the sensor 11 is controlled by controlling the compression or extension of the elastic element 30, and the movable element 12 moves towards the direction close to the substrate with the suction nozzle 20 and the chip; secondly, sensor 11 is used for measuring the distance between moving part 12 and the sensor 11, and then the dynamics when control chip pastes the base plate avoids the dynamics too big, and the base plate damages, and the dynamics undersize, chip subsides dress insecure, causes the damage, has protected each subassembly when improving chip subsides dress efficiency specially, has embodied the practicality of its structure.

Referring to fig. 1, the movable element 12 includes a position-limiting element 121, the position-limiting element 121 is detachably disposed on the supporting pillar 13, the arrangement is such that, when the chip is sucked by the suction nozzle 20, the movable member 12 moves in the direction in which the sensor 11 is arranged, because an elastic element 30 is maintained between the body 10 and the moving element 12, the supporting column 13 is arranged for supporting the moving element 12, and the limiting element 121 is detachably arranged on the supporting column 13, namely, the stopper 121 is used for supporting the movable member 12, following the movement of the movable member 12 in a direction away from or close to the main body 10, and the limiting member 121 can prevent the movable member 12 from sliding up and down, and the elastic member 30 has a large deformation amount and an excessive pressure, so as to prevent the movable member 12 from exceeding the movement track thereof, and protect the movable member 12, the direct collision between the suction nozzle 20 and the substrate is avoided, the service lives of the movable part 12 and the suction nozzle 20 are prolonged, and the chip mounting efficiency is improved.

As an alternative embodiment, the die bonding apparatus 1 further includes a receiving member 40, and the receiving member 40 is connected to one end of the movable member 12.

Further, the accommodating part 40 comprises a hollow tube 41, a through hole is formed in one side of the accommodating part 40, the hollow tube 41 penetrates from the through hole and is used for sucking the suction nozzle 20, the hollow tube 41 is used for sucking air in the suction nozzle 20, so that vacuum is kept between the suction nozzle 20 and the hollow tube 41, air mixing in the suction nozzle 20 is avoided, direct falling is realized, the suction nozzle 20 and a substrate are damaged, the substrate and a chip are protected while the suction nozzle 20 is protected due to the arrangement of the hollow tube 41, the flow of the whole operation is accelerated, the efficiency is improved, and the service life of the suction nozzle 20 is prolonged.

As an optional implementation manner, the caliber of the hollow tube 41 is slightly larger than the caliber of the suction nozzle 20, when the hollow tube 41 extracts vacuum from the suction nozzle 20, and the caliber of the hollow tube 41 is slightly larger than the caliber of the suction nozzle 20, it can be ensured that the suction nozzle 20 does not fall down while extracting air from the suction nozzle 20, and damage to the suction nozzle 20 caused by direct collision between the suction nozzle 20 and the ground is avoided.

Further, the hollow tube 41 is detachably connected with the suction nozzle 20, the suction nozzle 20 with different specifications can be replaced by chips with different specifications due to the arrangement, the suction nozzle 20 is detachably connected with the hollow tube 41, so that the suction nozzle 20 is convenient to replace, the efficiency is improved, and the practicability is embodied.

As an optional implementation manner, the chip mounting device 1 further includes an electronic scale 50 for testing the reaction force of the movable part 12 towards one end of the sensor, the suction nozzle 20 abuts against the electronic scale 50, the electronic scale 50 measures the pressure value, the setting is such that when applying pressure to the movable part 12, and the direction orientation is equipped with the one end of the sensor 11, the other end of the movable part 12 away from the elastic part 30 is connected with the suction nozzle 20, the suction nozzle 20 abuts against the electronic scale 50, the electronic scale 50 measures the pressure value thereof, the structure makes the suction nozzle 20 abut against the electronic scale 50 to judge whether the pressure value is consistent with the preset pressure value, thereby improving the work efficiency of the subsequent process, and embodying the practicability thereof.

Referring to fig. 2, a second embodiment of the present invention provides a die bonder 2, including a chip mounter 1 according to the first embodiment of the present invention.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip mounting device is characterized in that: including body, moving part and elastic component, the body includes the support column, the elastic component is established to the cover on the support column, the body is connected to elastic component one end, the elastic component other end is connected moving part one end, be provided with the locating part on the support column and be used for the moving part is spacing, works as when the moving part receives external force, the moving part with distance between the body shortens.

2. A chip mounting apparatus according to claim 1, wherein: one end of the body is provided with a sensor, and the sensor is used for sensing the distance between the sensor and the moving part.

3. A chip mounting apparatus according to claim 2, wherein: the sensor may be one of a hall sensor, ultrasonic, laser, grating scale or magnetic grating scale.

4. A chip mounting apparatus according to claim 1, wherein: the other end of the movable piece, which is far away from the elastic piece, is connected with the suction nozzle.

5. A chip mounting apparatus according to claim 1, wherein: the limiting part is detachably arranged on the supporting column.

6. The chip mounting apparatus according to claim 4, wherein: the chip mounting device further comprises an accommodating piece, and the accommodating piece is connected with one end, far away from the elastic piece, of the movable piece to accommodate the suction nozzle.

7. A chip mounting apparatus according to claim 6, wherein: the accommodating piece comprises a hollow pipe, a through hole is formed in one side of the accommodating piece, and the hollow pipe penetrates through the through hole and is used for sucking the suction nozzle.

8. A chip mounting apparatus according to claim 7, wherein: the caliber of the hollow pipe is slightly larger than that of the suction nozzle.

9. A chip mounting apparatus according to claim 8, wherein: the hollow pipe is detachably connected with the suction nozzle.

10. A chip mounting apparatus according to claim 2, wherein: the chip mounting device further comprises an electronic scale used for testing the size of the reaction force of the movable part, wherein the reaction force is towards one end of the sensor.