CN216481421U

CN216481421U - Semiconductor cooling device

Info

Publication number: CN216481421U
Application number: CN202122716885.3U
Authority: CN
Inventors: 张辉; 曾本发; 钟叶红; 姚松良
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-11-08
Filing date: 2021-11-08
Publication date: 2022-05-10
Anticipated expiration: 2031-11-08

Abstract

The utility model provides a semiconductor cooling device, includes box and apron, and air intake and cold wind export have been seted up to the apron, and the air outlet, its characterized in that have been seted up to the box lateral wall: an air duct is arranged in the box body, the air duct is of a box-type structure, a fan placing groove for placing a fan is formed in the rear end of the air duct, the front end of the air duct is divided into a double-layer structure by a partition plate, the upper layer in the double-layer structure is a hot air channel, the lower layer is a cold air channel, the rear ends of the hot air channel and the cold air channel are communicated with the fan placing groove, the front end of the hot air channel is communicated with an air outlet, and the front end of the cold air channel is communicated with a cold air outlet; a refrigeration mounting frame is arranged in the center of the partition plate, semiconductor refrigeration sheets are arranged in the refrigeration mounting frame, cooling aluminum fins are arranged above the partition plate, cooling aluminum fins are arranged below the partition plate, and the bottom surfaces of the cooling aluminum fins and the top surfaces of the cooling aluminum fins are both in contact with the semiconductor refrigeration sheets; the cover plate is provided with a water collecting tank corresponding to the bottom surface of the air duct box body, and a liquid level sensor and an ultrasonic atomization device are arranged in the water collecting tank.

Description

Semiconductor cooling device

Technical Field

The utility model belongs to the field of household appliances, and particularly relates to a semiconductor cooling and heating device.

Background

The air heater is also called a ceiling fan, is arranged on an integrated ceiling and is generally arranged in a kitchen or a bathroom for exchanging indoor air and blowing cold air to adjust the indoor temperature. Condensed water is generated in the refrigeration process of the air heater, and the condensed water accumulated in the box body of the air heater can cause potential safety hazards such as circuit short circuit and the like; the heat dissipation of ordinary cold super is equipped with solitary radiating fin or cooling fan generally, and its functional power consumption is great, has the extravagant problem of electric energy.

Disclosure of Invention

In order to solve the above problems, the present invention provides the following solutions:

a semiconductor air heater comprises a box body and a cover plate, wherein the cover plate is provided with an air inlet and a cold air outlet, the side wall of the box body is provided with an air outlet, an air channel is arranged in the box body, the air channel is of a box-shaped structure, the rear end of the air channel is a fan placing groove for placing a fan, the front end of the air channel is divided into a double-layer structure by a partition plate, the upper layer of the double-layer structure is a hot air channel, the lower layer of the double-layer structure is a cold air channel, the rear ends of the hot air channel and the cold air channel are both communicated with the fan placing groove, the front end of the hot air channel is communicated with the air outlet, and the front end of the cold air channel is communicated with the cold air outlet; a refrigeration mounting frame is arranged in the center of the partition plate, semiconductor refrigeration sheets are arranged in the refrigeration mounting frame, cooling aluminum fins are arranged above the partition plate, cooling aluminum fins are arranged below the partition plate, and the bottom surfaces of the cooling aluminum fins and the top surfaces of the cooling aluminum fins are both in contact with the semiconductor refrigeration sheets; a water collecting tank is arranged on the cover plate beside the cold air outlet, a liquid level sensor and an ultrasonic atomization device are arranged in the water collecting tank, and a water mist channel is arranged at the position, corresponding to the water collecting tank, of the air channel.

Furthermore, heat insulation foam is arranged between the heat dissipation aluminum fins and the partition plate and between the cold aluminum fins and the partition plate, and heat insulation foam is also arranged between the semiconductor refrigeration pieces and the refrigeration mounting frame.

Furthermore, the heat insulation foam between the heat dissipation aluminum fin and the partition plate and the heat insulation foam between the cold aluminum fin and the partition plate are both provided with placing frames through which the semiconductor refrigerating sheet passes.

Furthermore, the front end of the partition board is bent downwards to enable the space below the partition board to form a cold air channel and be communicated with the cold air outlet.

Further, the air duct and the cover plate are fixed through screws.

Furthermore, a grid is arranged in the cold air outlet, a water passing groove is formed in the periphery of the grid, and the water passing groove and one end, close to the water collecting groove, of the grid are communicated through a water passing hole.

Further, one end of the grating, which is close to the water collecting tank, is lower than one end of the grating, which is far away from the water collecting tank.

The utility model adopts the semiconductor refrigeration piece to refrigerate; the air duct is divided into an upper part and a lower part, the upper layer is a heating area, the lower layer is a refrigerating area, the middle part is a semiconductor refrigerating sheet and is connected with a heat dissipation aluminum fin and a cold aluminum fin, and the spare parts of the two fins are insulated by heat insulation cotton.

The working principle is that the air duct feeds indoor air from the air inlet, the air is divided into two parts, one part is used for heat dissipation of the electric appliance by the upper air duct, the heat-dissipated hot air is discharged to the outside from the air outlet on the side wall of the box body 1, the other part is used for cooling the air by the lower air duct through the semiconductor refrigerating sheet and the cold aluminum fins, and cold air is blown into the room through the cold air outlet on the cover plate; the other apron top surface in cold wind export is provided with the water catch bowl, set up ultrasonic atomization device and level sensor in the water catch bowl, be provided with the grid in the cold wind export, the grid becomes certain angle with the level, it is the low side to be close to water catch bowl department, it has the basin and crosses the water hole to open simultaneously, conveniently collect water in the water catch bowl, water triggers level sensor when reaching the certain degree, ultrasonic atomization device begins work, send steam atomizing back to the upper air duct by the water smoke passageway, it is outdoor with steam discharge by the air outlet at last.

The utility model has the advantages that: one part of indoor air is used for auxiliary heat dissipation, and the other part is sent back to the indoor after refrigerating, saves a large amount of electric energy for heat dissipation when adjusting the indoor air, sets up water collection structure simultaneously, prevents the inside siltation comdenstion water in wind channel and the potential safety hazard that produces.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic view of the cover plate structure of the present invention;

fig. 3 is a schematic structural diagram of part B in fig. 2.

In the figure: 1. a box body; 2. an air outlet; 3. radiating aluminum fins; 4. a semiconductor refrigeration sheet; 5. a partition plate; 6. a water mist channel; 7. an air duct; 8. cooling the aluminum fins; 9. a cover plate; 10. a cold air outlet; 11, an air inlet; 12. a fan; 13. heat insulation foam; 14. a grid; 15. a water collection tank; 16. an ultrasonic atomization device; 17. a liquid level sensor; 18. passing through a water tank; 19. and a water through hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. In the following description, certain specific details are set forth in order to provide a thorough understanding of the present invention. Rather, the utility model will be implemented without these specific details, i.e., those skilled in the art will more effectively describe the nature of their work to others skilled in the art using the description and presentation herein. Furthermore, it should be noted that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the scope of the actual protection. All the raw materials used in the following examples are commercially available products.

Example 1: a semiconductor air heater comprises a box body 1 and a cover plate 9, wherein the cover plate 9 is provided with an air inlet 11 and a cold air outlet 10, the side wall of the box body 1 is provided with an air outlet 2, an air channel 7 is arranged in the box body 1, the air channel 7 is of a box-shaped structure, the rear end of the air channel 7 is a fan placing groove for placing a fan, the front end of the air channel 7 is divided into a double-layer structure by a partition plate 5, the upper layer in the double-layer structure is a hot air channel, the lower layer is a cold air channel, the rear ends of the hot air channel and the cold air channel are both communicated with the fan placing groove, the front end of the hot air channel is communicated with the air outlet 11, and the front end of the cold air channel is communicated with the cold air outlet 10; a refrigeration mounting frame is arranged in the center of the partition plate 5, semiconductor refrigeration sheets 4 are arranged in the refrigeration mounting frame, heat dissipation aluminum fins 3 are arranged above the partition plate 5, cold aluminum fins 8 are arranged below the partition plate 5, and the bottom surfaces of the heat dissipation aluminum fins 3 and the top surfaces of the cold aluminum fins 8 are both in contact with the semiconductor refrigeration sheets 4; a water collecting tank 15 is arranged on the cover plate beside the cold air outlet 10, a liquid level sensor 17 and an ultrasonic atomization device 16 are arranged in the water collecting tank 15, and a water mist channel 6 is arranged at the position, corresponding to the water collecting tank 15, of the air duct 7.

Further, heat insulation foam 13 is arranged between the heat dissipation aluminum fins 3 and the partition plates 5 and between the cold aluminum fins 8 and the partition plates 5, and heat insulation foam 13 is also arranged between the semiconductor refrigeration pieces 4 and the refrigeration mounting frame.

Further, the heat insulation foam 13 between the heat dissipation aluminum fin 3 and the partition plate 5 and the heat insulation foam 13 between the cold aluminum fin 8 and the partition plate 5 are both provided with placing frames for the semiconductor refrigerating sheet 4 to pass through.

Further, the front end of the partition board 5 is bent downwards, so that a cold air channel is formed in the space below the partition board 5 and is communicated with the cold air outlet 10.

Further, the air duct 7 and the cover plate 9 are fixed by screws.

Furthermore, a grille 14 is arranged in the cold air outlet 10, a water passing groove 18 is arranged around the grille 14, and the water passing groove 18 and one end of the grille 14 close to the water collecting groove 15 are communicated through a water passing hole 19.

Further, the end of the grid 14 close to the water collection sump 15 is lower than the end far from the water collection sump 15.

The utility model adopts the semiconductor refrigeration piece 4 to refrigerate; a fan 12 is adopted for supplying air, the air duct 7 is divided into an upper part and a lower part, the upper layer is a heating area, the lower layer is a refrigerating area, the middle part is a semiconductor refrigerating sheet 4, the radiating aluminum fins 3 and the cold aluminum fins 8 are connected, and the spare parts of the two fins are insulated by heat insulation cotton 13.

The working principle is that the air duct 7 feeds indoor air from the air inlet 11, the air is divided into two parts, one part is used for heat dissipation of an electric appliance by the upper air duct, the heat-dissipated hot air is discharged to the outside from the air outlet 2 on the side wall of the box body 1, the other part is used for cooling the air through the lower air duct, the semiconductor refrigerating sheet 4 and the cold aluminum fins 8, and cold air is blown into the room through the cold air outlet 10 on the cover plate 9; the top surface of the cover plate 9 beside the cold air outlet 10 is provided with a water collecting tank 15, an ultrasonic atomization device 16 and a liquid level sensor 17 are arranged in the water collecting tank 15, a grating 14 is arranged in the cold air outlet 10, the grating 14 and the level form a certain angle, the position close to the water collecting tank 15 is a low end, a water groove 18 and a water hole 19 are formed simultaneously, water is conveniently collected in the water collecting tank 15, the liquid level sensor 17 is triggered when the water reaches a certain degree, the ultrasonic atomization device 16 starts working, the atomized water is delivered to an upper air channel through a water mist channel 6, and finally, the water vapor is discharged outdoors through an air outlet 2.

According to the utility model, one part of indoor air is used for auxiliary heat dissipation, and the other part of indoor air is returned to the room after being refrigerated, so that a large amount of electric energy for heat dissipation is saved while the indoor air is regulated, and meanwhile, the water collection structure is arranged, so that potential safety hazards caused by deposition of condensed water in the air duct are prevented.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments above are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for those skilled in the art, there may be variations in the embodiments, specific implementations and application ranges according to the present invention, and in summary, the present disclosure should not be construed as limiting the present invention.

Claims

1. The utility model provides a semiconductor cooling device, includes box and apron, and air intake and cold wind export have been seted up to the apron, and the air outlet, its characterized in that have been seted up to the box lateral wall: an air duct is arranged in the box body, the air duct is of a box-type structure, a fan placing groove for placing a fan is formed in the rear end of the air duct, the front end of the air duct is divided into a double-layer structure by a partition plate, the upper layer in the double-layer structure is a hot air channel, the lower layer is a cold air channel, the rear ends of the hot air channel and the cold air channel are communicated with the fan placing groove, the front end of the hot air channel is communicated with an air outlet, and the front end of the cold air channel is communicated with a cold air outlet; a refrigeration mounting frame is arranged in the center of the partition plate, semiconductor refrigeration sheets are arranged in the refrigeration mounting frame, cooling aluminum fins are arranged above the partition plate, cooling aluminum fins are arranged below the partition plate, and the bottom surfaces of the cooling aluminum fins and the top surfaces of the cooling aluminum fins are both in contact with the semiconductor refrigeration sheets; a water collecting tank is arranged on the cover plate beside the cold air outlet, a liquid level sensor and an ultrasonic atomization device are arranged in the water collecting tank, and a water mist channel is arranged at the position, corresponding to the water collecting tank, of the air channel.

2. The semiconductor heater of claim 1, wherein: thermal insulation foam is arranged between the heat dissipation aluminum fins and the partition plate and between the cold aluminum fins and the partition plate, and thermal insulation foam is also arranged between the semiconductor refrigeration sheets and the refrigeration mounting frame.

3. The semiconductor heater of claim 2, wherein: the heat insulation foam between the heat dissipation aluminum fins and the partition plate and the heat insulation foam between the cold aluminum fins and the partition plate are both provided with placing frames through which the semiconductor refrigerating sheet passes.

4. A semiconductor light as defined in claim 1, wherein: the front end of the partition board is bent downwards to enable the space below the partition board to form a cold air channel and be communicated with the cold air outlet.

5. The semiconductor heater of claim 1, wherein: the air duct and the cover plate are fixed through screws.

6. The semiconductor heater of claim 1, wherein: a grid is arranged in the cold air outlet, a water passing groove is formed in the periphery of the grid, and the water passing groove and one end, close to the water collecting groove, of the grid are communicated through a water passing hole.

7. The semiconductor heater of claim 6, wherein: one end of the grating, which is close to the water collecting tank, is lower than one end of the grating, which is far away from the water collecting tank.