CN216461209U - Shockproof type stamping die for circuit board production - Google Patents
Shockproof type stamping die for circuit board production Download PDFInfo
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- CN216461209U CN216461209U CN202122382713.7U CN202122382713U CN216461209U CN 216461209 U CN216461209 U CN 216461209U CN 202122382713 U CN202122382713 U CN 202122382713U CN 216461209 U CN216461209 U CN 216461209U
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Abstract
The utility model discloses a shockproof stamping die for producing a circuit board, which belongs to the technical field of stamping dies, wherein a placing and limiting assembly comprises a placing plate and a limiting groove, the limiting groove is formed in the two sides of the middle of the inner wall of a bottom die, the placing plate is placed in the middle of the placing groove, a positioning assembly comprises a positioning block and a limiting hole, the positioning block is arranged in the middle of the two sides of the top of the bottom die, the limiting hole is formed in the middle of the positioning block, a connecting assembly comprises a die and a limiting plate, the die is placed at the top of the placing plate, the limiting plate is arranged in the middle of the two sides of the die, the limiting plate can be inserted into the middle of the limiting groove, a worker connects an upper die, a connecting rod, a connecting plate and a positioning hole with equipment through screws, the bottom die is placed at the bottom of the upper die in the placing groove at the top of the placing groove after connection, the limiting plate is inserted into the limiting groove, and the positioning hole is inserted into the limiting groove to position the limiting plate, and the damping and the limiting are carried out through a limiting rubber band and a damping spring.
Description
Technical Field
The utility model relates to a shockproof stamping die, in particular to a shockproof stamping die for producing a circuit board, and belongs to the technical field of stamping dies.
Background
The equipment and the die are required to be correspondingly adjusted to ensure the quality in the initial stages of line changing production, die debugging and the like of punching, the accuracy of the equipment is generally ensured by adjusting the parallelism of a device sliding block, an air cushion and the like, the die temperature is ensured by adjusting the die clearance, a draw bead, plate limitation and the like, and the adjustment is difficult due to small equipment difference, so that a large amount of time is required for adjusting the die in the initial stages of the line changing production and the die debugging.
Most of the existing molds are fixed, and the problem that the position of the mold is easy to shift due to vibration prevention is solved.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a shockproof stamping die for producing a circuit board.
The purpose of the utility model can be achieved by adopting the following technical scheme:
a shockproof stamping die for producing a circuit board comprises a bottom die and a placing groove, the mould, limiting plate and last mould, the standing groove has been seted up at die block utensil top middle part, the standing groove inner wall is equipped with places spacing subassembly, be equipped with locating component in the middle of the die block utensil top both sides, die block utensil top middle part is equipped with the mould, it is equipped with coupling assembling to go up die block utensil top middle part, place and install the spacing subassembly of shock attenuation on the spacing subassembly, place spacing subassembly including placing board and spacing groove, both sides department in the middle of the die block utensil inner wall is seted up to the spacing groove, place the board and place department in the middle of the standing groove, locating component includes locating piece and spacing hole, the locating piece is established in the middle of die block utensil top both sides, spacing hole is seted up in the middle of the locating piece, coupling assembling includes mould and limiting plate, the mould is placed board top department, the limiting plate is installed in the middle of the mould both sides, and the limiting plate can insert department in the middle of spacing groove.
Preferably, the spacing subassembly of shock attenuation includes connecting rod, connecting plate, locating hole, spacing rubber band and damping spring, and the connecting rod is installed in last mould top middle part department, and the connecting plate is installed in connecting rod top department, and the locating hole is equidistant to be seted up on the connecting plate, and damping spring is equidistant to be installed in placing board bottom department, and the department in the middle of placing the board both sides is installed to spacing rubber band, and the one end and the die block utensil interconnect of spacing rubber band.
The utility model has the beneficial technical effects that:
according to the shockproof stamping die for producing the circuit board, provided by the utility model, a worker connects the upper die, the connecting rod, the connecting plate and the positioning hole with equipment through screws, after connection, the bottom die is placed at the bottom of the upper die, the die is placed in the placing groove at the top of the placing groove, the limiting plate is inserted into the limiting groove, the positioning hole is inserted into the limiting groove to position the limiting plate, and damping and limiting are carried out through the limiting rubber band and the damping spring.
Drawings
FIG. 1 is a front view of the overall structure of the shockproof stamping die for circuit board production according to the preferred embodiment of the utility model;
FIG. 2 is a view showing a structure of a die placement shock absorber of a preferred embodiment of a shockproof type press die for circuit board production according to the present invention;
fig. 3 is a structural diagram of a bottom mold of a preferred embodiment of the shockproof type stamping mold for producing a circuit board according to the utility model.
In the figure: 1-bottom mould, 2-placing groove, 3-placing plate, 4-limiting groove, 5-mould, 6-limiting plate, 7-upper mould, 8-connecting rod, 9-connecting plate, 10-positioning hole, 11-positioning block, 12-limiting hole, 13-limiting rubber band and 14-damping spring.
Detailed Description
In order to make the technical solutions of the present invention more clear and definite for those skilled in the art, the present invention is further described in detail below with reference to the examples and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-3, the shockproof stamping die for circuit board production provided in this embodiment includes a bottom die 1, a placement groove 2, a die 5, a limiting plate 6 and an upper die 7, the placement groove 2 is formed in the middle of the top of the bottom die 1, a placement limiting component is disposed on the inner wall of the placement groove 2, a positioning component is disposed in the middle of two sides of the top of the bottom die 1, the upper die 7 is disposed in the middle of the top of the upper die 7, a connecting component is disposed in the middle of the top of the bottom die 1, a shock absorption limiting component is mounted on the placement limiting component, the placement limiting component includes a placement plate 3 and a limiting groove 4, the limiting groove 4 is disposed in two sides of the middle of the inner wall of the bottom die 1, the placement plate 3 is disposed in the middle of the placement groove 2, the positioning component includes a positioning block 11 and a limiting hole 12, the positioning block 11 is disposed in the middle of two sides of the top of the bottom die 1, the limiting hole 12 is disposed in the middle of the positioning block 11, the connecting component includes the die 5 and the limiting plate 6, the mould 5 is placed and is being placed 3 tops departments of board, and limiting plate 6 is installed in the middle of 5 both sides of mould, and limiting plate 6 can insert into the middle department of spacing groove 4.
The general working principle is as follows: the staff is connected last mould 7, connecting rod 8, connecting plate 9 and locating hole 10 and equipment through the screw, puts end mould 1 in 7 bottoms of last mould department place mould 5 in standing groove 2 at standing groove 3 tops after connecting, inserts limiting plate 6 and advances limiting groove 4 interior through inserting locating hole 11 and advance limiting groove 4 and fix a position limiting plate 6, carries out the shock attenuation and spacing through spacing rubber band 13 and damping spring 14.
In this embodiment: the spacing subassembly of shock attenuation includes connecting rod 8, connecting plate 9, locating hole 10, spacing rubber band 13 and damping spring 14, and connecting rod 8 is installed in 7 top middle parts of last mould department, and connecting plate 9 is installed in 8 top departments of connecting rod, and locating hole 10 equidistant is seted up on connecting plate 9, and damping spring 14 equidistant is installed in placing 3 bottom departments of board, and spacing rubber band 13 is installed and is being placed 3 middle departments in both sides of board, and 1 interconnect of one end and the die block utensil of spacing rubber band 13.
The above description is only for the purpose of illustrating the present invention and is not intended to limit the scope of the present invention, and any person skilled in the art can substitute or change the technical solution of the present invention and its conception within the scope of the present invention.
Claims (2)
1. The utility model provides a shockproof formula stamping die for circuit board production which characterized in that: comprises a bottom die (1), a placing groove (2), a die (5), a limiting plate (6) and an upper die (7), wherein the placing groove (2) is arranged in the middle of the top of the bottom die (1), a placing limiting component is arranged on the inner wall of the placing groove (2), a positioning component is arranged in the middle of two sides of the top of the bottom die (1), the upper die (7) is arranged in the middle of the top of the bottom die (1), a connecting component is arranged in the middle of the top of the upper die (7), a damping limiting component is arranged on the placing limiting component, the placing limiting component comprises a placing plate (3) and a limiting groove (4), the limiting groove (4) is arranged in two sides of the middle of the inner wall of the bottom die (1), the placing plate (3) is arranged in the middle of the placing groove (2), the positioning component comprises a positioning block (11) and a limiting hole (12), the positioning block (11) is arranged in the middle of two sides of the top of the bottom die (1), the limiting hole (12) is arranged in the middle of the positioning block (11), coupling assembling includes mould (5) and limiting plate (6), and place board (3) top department in mould (5), and department in the middle of mould (5) both sides is installed in limiting plate (6), and limiting plate (6) can insert into the department in the middle of spacing groove (4).
2. The shockproof stamping die for producing the circuit board as claimed in claim 1, wherein: spacing subassembly of shock attenuation includes connecting rod (8), connecting plate (9), locating hole (10), spacing rubber band (13) and damping spring (14), connecting rod (8) are installed in last mould (7) top middle part department, connecting plate (9) are installed in connecting rod (8) top department, locating hole (10) equidistant seting up on connecting plate (9), damping spring (14) equidistant installation is in placing board (3) bottom department, department in the middle of placing board (3) both sides is installed in spacing rubber band (13), and the one end and the end mould (1) interconnect of spacing rubber band (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122382713.7U CN216461209U (en) | 2021-09-30 | 2021-09-30 | Shockproof type stamping die for circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122382713.7U CN216461209U (en) | 2021-09-30 | 2021-09-30 | Shockproof type stamping die for circuit board production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216461209U true CN216461209U (en) | 2022-05-10 |
Family
ID=81438174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122382713.7U Active CN216461209U (en) | 2021-09-30 | 2021-09-30 | Shockproof type stamping die for circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216461209U (en) |
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2021
- 2021-09-30 CN CN202122382713.7U patent/CN216461209U/en active Active
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