CN216443927U - Heat sealing machine for photovoltaic silicon wafer - Google Patents
Heat sealing machine for photovoltaic silicon wafer Download PDFInfo
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- CN216443927U CN216443927U CN202122456666.6U CN202122456666U CN216443927U CN 216443927 U CN216443927 U CN 216443927U CN 202122456666 U CN202122456666 U CN 202122456666U CN 216443927 U CN216443927 U CN 216443927U
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Abstract
The utility model relates to a heat sealing machine for a photovoltaic silicon wafer, which comprises a rack, a feeding belt conveyor, a correcting mechanism, a manual sampling inspection mechanism, a film cutting mechanism, a heat shrinkage mechanism, a laser film opening machine and a marking and transferring mechanism, wherein the manual sampling inspection mechanism is positioned on the output side of the correcting mechanism and comprises a clamping jaw which horizontally moves along the rack in a reciprocating manner, the clamping jaw is used for grabbing a product on the feeding belt conveyor, one end, which is far away from the feeding belt conveyor, in the moving path of the clamping jaw corresponds to a sampling inspection platform assembly, the film cutting mechanism comprises an edge sealing cutter and a traction plate assembly positioned on the feeding side of the edge sealing cutter, the heat shrinkage mechanism is positioned on the output side of the film cutting mechanism, a hollowed transmission chain is correspondingly arranged below the heat shrinkage mechanism, the laser film opening machine is positioned on the output side of the hollowed transmission chain, the output end of the discharging belt conveyor is a marking and transferring mechanism, and the marking mechanism comprises a marking machine, a marking machine and a marking and a transferring mechanism, And the six-axis robot corresponds to one output end of the marking machine. The whole set of plastic packaging process can be completed by one device.
Description
Technical Field
The utility model relates to the technical field of heat sealing machines, in particular to a heat sealing machine for a photovoltaic silicon wafer.
Background
The heat sealer is one device for heating, sealing and packing plastic film base material, composite flexible package film and other heat sealing composite film.
At present, most heat sealing machines in the market package products by using heat-shrinkable films, but a piece of equipment with only a single heat-sealing function is usually adopted in a heat-sealing step to carry out plastic package on the products conveyed in the previous step, and in the processing process of the single equipment, the products need to be processed, collected and transported for multiple times, so that the operation is not simple and convenient.
SUMMERY OF THE UTILITY MODEL
The applicant provides a heat sealing machine for photovoltaic silicon wafers with a reasonable structure aiming at the defects in the prior art, and the heat sealing machine is particularly suitable for plastic packaging of photovoltaic silicon wafers, and has the steps of correcting, detecting, plastic packaging and the like in the whole machine equipment, so that the automation degree of the equipment is improved, and the operation efficiency is improved.
The technical scheme adopted by the utility model is as follows:
the utility model provides a heat sealing machine for photovoltaic silicon chip, includes the frame, be equipped with the feeding belt feeder in the frame, be equipped with in proper order along the direction of delivery of feeding belt feeder: a correcting mechanism, a manual sampling inspection mechanism, a film cutting mechanism, a thermal shrinkage mechanism, a laser film opening machine and a marking and transferring mechanism,
the righting mechanism comprises cylinder assemblies positioned at two sides of the feeding end of the belt conveyor and further comprises a lower pressing cylinder positioned above the feeding belt conveyor, a piston rod of the lower pressing cylinder is connected with a pressing plate,
the manual selective inspection mechanism is positioned at the output side of the return mechanism and comprises a clamping jaw which reciprocates horizontally along the machine frame, the clamping jaw is used for grabbing products on the feeding belt conveyor, one end of the clamping jaw in the motion path, which is far away from the feeding belt conveyor, corresponds to the selective inspection platform assembly,
the film cutting mechanism comprises an edge sealing cutter and a traction plate group positioned on the feeding side of the edge sealing cutter,
the thermal shrinkage mechanism is positioned at the output side of the film cutting mechanism, a hollow transmission chain is correspondingly arranged below the thermal shrinkage mechanism,
the laser film opening machine is located on one side of the output of the hollow transmission chain, the output end of the hollow transmission chain is correspondingly connected with the discharge belt conveyor, the motion direction of the discharge belt conveyor is perpendicular to that of the feeding belt conveyor, the output end of the discharge belt conveyor is the marking transfer mechanism, and the marking transfer mechanism comprises a marking machine and six robots corresponding to one end of the output of the marking machine.
The cylinder component structures on the two sides of the correcting mechanism are as follows: the device comprises a first cylinder and a second cylinder, wherein the relative position between the first cylinder and the belt conveyor is kept unchanged, the second cylinder is driven by the first cylinder, and the motion directions of piston rods of the first cylinder and the second cylinder are vertical to each other and respectively correspond to two vertical edges of a product on the belt conveyor.
The piston rod of the pressing cylinder moves horizontally, the connecting piece is installed on the piston rod, the pressing cylinder is installed at one end, away from the piston rod of the pressing cylinder, of the connecting piece, the piston rod of the pressing cylinder moves vertically, and the pressing plate is located on the piston rod of the pressing cylinder.
And an elastic layer is arranged on one side of the pressing plate facing the feeding belt conveyor.
A sliding rail vertical to the feeding belt conveyor is arranged on the frame, and the clamping jaw is positioned on the sliding rail; one end of the sliding rail is correspondingly arranged above the feeding belt conveyor, a moving platform assembly is correspondingly arranged below the other end of the sliding rail, and the silicon wafer to be detected, which is grabbed by the clamping jaw, is arranged on the moving platform assembly.
The moving platform assembly comprises a platform supporting leg and a lower mounting plate which is located on the platform supporting leg and reciprocates, and a drawer rail is connected between the platform supporting leg and the lower mounting plate.
Feeding belt feeder one side is equipped with the membrane and rolls up the support frame, the pyrocondensation membrane book has been placed at membrane book support frame top, and the membrane area that pulls out is rolled up around behind traction plate group, through the banding cutter to pyrocondensation membrane.
The waste film transmission assembly is arranged on one output side of the edge sealing cutter and located on the side edge of the feeding belt conveyor, the waste film transmission assembly comprises an upper belt pulley and a lower belt pulley, the upper belt pulley moves vertically, the lower belt pulley is highly fixed, the waste film is clamped and transmitted by the upper belt pulley and the lower belt pulley, and one output end of the waste film is pulled to a winding wheel arranged at the bottom of the machine frame.
And a guide wheel set is arranged between the winding wheel and the waste film transmission assembly.
The utility model has the following beneficial effects:
the utility model has compact and reasonable structure and convenient operation, integrates the functions of correcting, sampling inspection, heat-sealing plastic coating, marking and the like on one whole machine device, and achieves the aim that one device can complete the whole set of working procedures.
The correcting mechanism is used for finishing the silicon wafers and extruding an air layer between the silicon wafers through the pressing cylinder; the elastic layer is additionally arranged on the pressing plate, so that the possibility that the pressing plate crushes the silicon wafer can be reduced;
the manual sampling inspection mechanism is used for sampling inspection of samples, so that the qualification rate is ensured;
the film cutting mechanism is matched with the waste film transmission assembly and the winding wheel, so that the effects of timely winding the waste film and adjusting the tension on the waste film are achieved, and the normal operation of equipment is guaranteed;
the laser film opening machine is used for opening the packaged product, so that the subsequent product is convenient to disassemble and package.
The utility model integrates a plurality of functions, can complete the encapsulation of the silicon chip in a running water manner, and greatly improves the working efficiency.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the reforming mechanism of the present invention.
Fig. 3 is a schematic view of the mounting structure of the cylinder in the reforming mechanism of the present invention.
Fig. 4 is a schematic diagram of a manual sampling inspection structure according to the present invention.
FIG. 5 is a schematic view of a film cutting mechanism according to the present invention.
FIG. 6 is a schematic view of a waste film winding structure installed at the bottom of a frame according to the present invention.
FIG. 7 is a schematic structural view of a waste film transfer assembly according to the present invention.
Fig. 8 is a schematic view of a heat shrinking mechanism in the present invention.
Fig. 9 is a schematic structural diagram of a discharge belt conveyor behind the heat-shrinking mechanism in the utility model.
Wherein: 1. a frame; 2. feeding a belt conveyor; 3. a righting mechanism; 4. a manual spot inspection mechanism; 5. a film cutting mechanism; 6. a thermal shrinkage mechanism; 7. laser film opening machine; 8. a marking transfer mechanism; 9. A discharging belt conveyor; 10. a waste film transmission assembly; 11. a film roll support frame;
301. pressing down the air cylinder; 302. a first cylinder; 303. a second cylinder; 304. connecting sheets; 305. A pressurizing cylinder; 306. an elastic layer; 307. pressing a plate;
401. a clamping jaw; 402. a spot check platform assembly; 403. a slide rail; 404. a drawer rail; 405. A platform leg; 406. a lower mounting plate;
501. an edge sealing cutter; 502. a traction plate set;
601. hollowing out the transmission chain;
801. marking machine; 802. a six-axis robot;
101. a belt pulley; 102. a winding wheel; 103. a guide wheel set.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1-9, the heat sealing machine for photovoltaic silicon wafer of this embodiment includes a frame 1, and a feeding belt conveyor 2 is arranged on the frame 1, and is sequentially arranged along a conveying direction of the feeding belt conveyor 2: a restoring mechanism 3, a manual sampling inspection mechanism 4, a film cutting mechanism 5, a thermal shrinkage mechanism 6, a laser film opening machine 7 and a marking transfer mechanism 8,
the righting mechanism 3 comprises cylinder assemblies positioned at two sides of the feeding end of the belt conveyor, and also comprises a lower pressing cylinder 301 positioned above the feeding belt conveyor 2, a piston rod of the lower pressing cylinder 301 is connected with a pressing plate,
the manual selective inspection mechanism 4 is positioned at the output side of the return mechanism 3 and comprises a clamping jaw 401 which reciprocates horizontally along the machine frame 1, the clamping jaw 401 is used for grabbing products on the feeding belt conveyor 2, one end of the motion path of the clamping jaw 401, which is far away from the feeding belt conveyor 2, is correspondingly provided with a selective inspection platform assembly 402,
the film cutting mechanism 5 comprises an edge sealing cutter 501 and a traction plate group 502 positioned on the feeding side of the edge sealing cutter 501,
the thermal shrinkage mechanism 6 is positioned at the output side of the film cutting mechanism 5, a hollow transmission chain 601 is correspondingly arranged below the thermal shrinkage mechanism 6,
the laser film opening machine 7 is located on one output side of the hollowed-out transmission chain 601, an output end of the hollowed-out transmission chain 601 is correspondingly provided with a discharge belt conveyor 9, the motion direction of the discharge belt conveyor 9 is perpendicular to the motion direction of the feeding belt conveyor 2, the output end of the discharge belt conveyor 9 is a marking transfer mechanism 8, and the marking transfer mechanism 8 comprises a marking machine 801 and a six-axis robot 802 corresponding to the output end of the marking machine 801.
The cylinder component structures on the two sides of the correcting mechanism 3 are as follows: the device comprises a first air cylinder 302 and a second air cylinder 303, wherein the relative position between the first air cylinder 302 and the belt conveyor is kept unchanged, the second air cylinder 303 is driven by the first air cylinder 302, and the moving directions of piston rods of the first air cylinder 302 and the second air cylinder 303 are perpendicular to each other and respectively correspond to two vertical edges of a product on the belt conveyor.
The piston rod of the down-pressing cylinder 301 moves horizontally, a connecting piece 304 is installed on the piston rod, a pressurizing cylinder 305 is installed at one end, away from the piston rod of the down-pressing cylinder 301, of the connecting piece 304, the piston rod of the pressurizing cylinder 305 moves vertically, and a pressing plate 307 is located on the piston rod of the pressurizing cylinder 305.
The side of the press plate 307 facing the feeder belt 2 is fitted with an elastic layer 306.
A slide rail 403 which is vertical to the feeding belt conveyor 2 is arranged on the frame 1, and the clamping jaw 401 is positioned on the slide rail 403; one end of the slide rail 403 is correspondingly arranged above the feeding belt conveyor 2, a moving platform assembly is correspondingly arranged below the other end of the slide rail, and the silicon wafer to be detected, which is grabbed by the clamping jaw 401, is arranged on the moving platform assembly.
The mobile platform assembly includes a platform foot 405, a lower mounting plate 406 reciprocally disposed on the platform foot 405, and a drawer rail 404 coupled between the platform foot 405 and the lower mounting plate 406.
Feeding belt feeder 2 one side is equipped with membrane book support frame 11, and thermal shrinkage membrane book has been placed at membrane book support frame 11 top, and the membrane area that pulls out on the thermal shrinkage membrane book is around behind traction plate group 502, through banding cutter 501.
The waste film transmission assembly 10 located on the side edge of the feeding belt conveyor 2 is installed on one output side of the edge sealing cutter 501, the waste film transmission assembly 10 comprises an upper belt pulley 101 and a lower belt pulley 101, the upper belt pulley 101 moves vertically, the lower belt pulley 101 is highly fixed, a waste film is clamped and transmitted by the upper belt pulley 101 and the lower belt pulley 101, and one output end of the waste film is pulled to a winding wheel 102 arranged at the bottom of the rack 1.
A guide wheel set 103 is arranged between the winding wheel 102 and the waste film transmission assembly 10.
The specific structure and working process of the embodiment are as follows:
as shown in fig. 1, a feeding belt conveyor 2 and a discharging belt conveyor 9 are mounted on a frame 1, and the conveying directions of the feeding belt conveyor 2 and the discharging belt conveyor 9 are perpendicular to each other. Along the direction of delivery of belt feeder, set gradually each mechanism, wherein, the feeding one end that is located feeding belt feeder 2 is equipped with mechanism 3 of reforming, and mechanism 3 of reforming's effect reforms the silicon chip pile on feeding belt feeder 2, aligns four sides, extrudes the air bed between the silicon chip.
As shown in fig. 2, the correcting mechanism 3 includes two sets of cylinder groups, which are symmetrically arranged on two sides of the belt conveyor, the cylinder group on each side includes a first cylinder 302 with a fixed position, the first cylinder 302 is fixed by a rod body extending from the frame 1, a piston rod of the first cylinder 302 points to the feeding belt conveyor 2, a second cylinder 303 is driven by the piston rod of the first cylinder 302, a piston rod of the second cylinder 303 extends out perpendicularly to the piston rod of the first cylinder 302, rod bodies for pushing the side edges of the silicon wafers are mounted on the piston rods of the first cylinder 302 and the second cylinder 303, when the first cylinder 302 and the second cylinder 303 move, the rod bodies and the side walls of the silicon wafers move relatively, and the piston rod of the first cylinder 302 extends out to push the silicon wafers to be parallel to the side edges of the feeding belt conveyor 2; the piston rod of the second cylinder 303 is in an extending state initially, and when the piston rod retracts, the silicon wafer is pushed to be perpendicular to the side edge of one side of the feeding belt conveyor 2, so that the silicon wafer is restored in the horizontal plane.
The piston rod of the pressing cylinder 301 reciprocates to drive the connecting piece 304 to move in the horizontal direction; after the connecting sheet 304 drives the pressurizing cylinder 305 to move to the center position of the silicon wafer, the piston rod of the pressurizing cylinder 305 extends out to drive the pressing plate to extrude the air layer between the silicon wafers. The elastic layer 306 on the pressing plate can be made of soft materials, such as silica gel and sponge, or be connected by a spring, so that the elastic layer has elasticity and prevents the silicon wafer from being crushed in the rigid pressing process.
As shown in fig. 3, for the manual selective examination mechanism 4, the manual selective examination mechanism 4 is implemented by a clamping jaw 401 reciprocating on a sliding rail 403, the clamping jaw 401 grabs the silicon wafer at the feeding belt conveyor 2 and sends the silicon wafer to the selective examination platform 402, the selective examination person pulls a lower mounting plate 406, and the drawer rail 407 slides the lower mounting plate 406, so that the selective examination person can take out the silicon wafer on the lower mounting plate 406. In the embodiment, a motor is used for driving a belt to drive the clamping jaw 401 to realize the power source of the clamping jaw 401 which reciprocates on the sliding rail 403; since such a power source is a common means for driving the clamping jaw 401, it is not described in detail in this embodiment.
As shown in fig. 4 and 5, when the silicon wafer moves to the middle of the feeding belt conveyor 2, the silicon wafer is gradually close to the heat-shrinkable film, a heat-shrinkable film roll is placed on the top of the film roll support frame 602, after the heat-shrinkable film roll is pulled out, the heat-shrinkable film roll is pulled to the position of the traction plate group 502 and is propped by the traction plate group 502, the turning of the film belt is realized, the film belt passes through the traction plate group 502 and then is changed from the original direction perpendicular to the conveying direction of the feeding belt conveyor 2 to be parallel to the feeding belt conveyor 2, the cover advances on the product, when the product and the film belt move together to the position of the edge sealing cutter 501, the edge sealing cutter 501 cuts downwards to cut out a film belt corresponding to the product, the film belt of the product is continuously conveyed forwards, enters the heat-shrinkable mechanism 6 and is heated and thermally shrunk by the heat-shrinkable mechanism 6 to form a plastic packaged product. The heat shrinking mechanism 6 is a commercially available component, and is not described in detail in this embodiment.
After cutting off part on the membrane area, the remaining is the waste film, the waste film is drawn to waste film drive assembly 10 department, be located between two upper and lower belt pulleys 101, two sets of belt pulleys 101 are furnished with a vertical board and install, vertical high higher belt pulley 101 is driven by the active grab, install the active grab at the top of board, vertical high higher belt pulley 101 is connected bottom the active grab, and be equipped with the guide arm on the board, vertical high higher belt pulley 101 overlaps on the guide arm, when pulling the active grab, the active grab can drive the belt pulley 101 of top along the guide arm up-and-down motion, when top belt pulley 101 is downward, with the belt pulley 101 cooperation of below, press from both sides the waste film tightly, initiative through wind-up wheel 102 is rotated, with the waste film rolling. A guide wheel set 103 is arranged between the winding wheel 102 and the belt pulley 101, and a fixed pulley and a movable pulley are arranged in the guide wheel set 103 to play a role in guiding the waste film.
As shown in fig. 8 and 9, the feeding pulley 101 at the bottom of the heat shrinking mechanism 6 is made into a hollow transmission chain 601 by using a rod body such as a heat-resistant metal rod instead of a belt body, so as to facilitate the flow of hot air. The product is a semi-finished product coated with plastic after being output from the heat shrinkage mechanism 6, and then the plastic-coated silicon wafer is opened through a laser film opening machine 7, so that the plastic-coated product is provided with an opening convenient for subsequent opening. At this time, a finished product is obtained.
The finished product is output from the discharging belt conveyor 9, marked on a subsequent marking machine 801, grabbed by a six-axis robot 802, and sent to the next process.
The above description is intended to illustrate the present invention and not to limit the present invention, which is defined by the scope of the claims, and may be modified in any manner within the scope of the present invention.
Claims (9)
1. The utility model provides a heat sealing machine for photovoltaic silicon chip, includes frame (1), its characterized in that: be equipped with feeding belt feeder (2) on frame (1), be equipped with in proper order along the direction of delivery of feeding belt feeder (2): a restoring mechanism (3), a manual sampling inspection mechanism (4), a film cutting mechanism (5), a thermal shrinkage mechanism (6), a laser film opening machine (7) and a marking transfer mechanism (8),
the righting mechanism (3) comprises air cylinder assemblies positioned on two sides of the feeding end of the belt conveyor and further comprises a pressing air cylinder (301) positioned above the feeding belt conveyor (2), a piston rod of the pressing air cylinder (301) is connected with a pressing plate (307),
the manual selective inspection mechanism (4) is positioned on the output side of the return mechanism (3) and comprises a clamping jaw (401) which moves horizontally in a reciprocating mode along the rack (1), the clamping jaw (401) is used for grabbing products on the feeding belt conveyor (2), one end, deviating from the feeding belt conveyor (2), of the motion path of the clamping jaw (401) corresponds to a selective inspection platform assembly (402),
the film cutting mechanism (5) comprises an edge sealing cutter (501) and a traction plate group (502) positioned on the feeding side of the edge sealing cutter (501),
the thermal shrinkage mechanism (6) is positioned at the output side of the film cutting mechanism (5), a hollow transmission chain (601) is correspondingly arranged below the thermal shrinkage mechanism (6),
laser is opened membrane machine (7) and is located output one side of fretwork driving chain (601), the output one end correspondence of fretwork driving chain (601) has accepted ejection of compact belt feeder (9), the direction of motion of the direction of motion perpendicular to feeding belt feeder (2) of ejection of compact belt feeder (9), the output one end of ejection of compact belt feeder (9) is for marking move the mechanism (8) of carrying, it moves the mechanism (8) including marking machine (801), six robots (802) corresponding in the output one end of marking machine (801) to mark.
2. The heat sealer for photovoltaic silicon wafers as claimed in claim 1, wherein: the cylinder component structures on the two sides of the correcting mechanism (3) are as follows: the device comprises a first air cylinder (302) and a second air cylinder (303), wherein the relative position between the first air cylinder and the belt conveyor is kept unchanged, the second air cylinder (302) is driven by the first air cylinder (302), and the moving directions of piston rods of the first air cylinder (302) and the second air cylinder (303) are mutually vertical and respectively correspond to two vertical edges of a product on the belt conveyor.
3. The heat sealer for photovoltaic silicon wafers as claimed in claim 2, wherein: the piston rod of the pressing cylinder (301) moves horizontally, the connecting piece (304) is installed on the piston rod, the pressing cylinder (305) is installed at one end, deviating from the pressing cylinder (301), of the piston rod of the connecting piece (304), the piston rod of the pressing cylinder (305) moves vertically, and the pressing plate (307) is located on the piston rod of the pressing cylinder (305).
4. The heat sealer for photovoltaic silicon wafers according to claim 3, characterized in that: and an elastic layer (306) is arranged on one side of the pressing plate (307) facing the feeding belt conveyor (2).
5. The heat sealer for photovoltaic silicon wafers as claimed in claim 1, wherein: a sliding rail (403) perpendicular to the feeding belt conveyor (2) is arranged on the frame (1), and the clamping jaw (401) is positioned on the sliding rail (403); one end of the sliding rail (403) is correspondingly arranged above the feeding belt conveyor (2), a moving platform assembly is correspondingly arranged below the other end of the sliding rail, and the silicon wafer to be detected, which is grabbed by the clamping jaw (401), is arranged on the moving platform assembly.
6. The heat sealer for photovoltaic silicon wafers according to claim 5, characterized in that: the mobile platform assembly comprises a platform supporting foot (405) and a lower mounting plate (406) which is located on the platform supporting foot (405) and reciprocates, and a drawer rail (404) is connected between the platform supporting foot (405) and the lower mounting plate (406).
7. The heat sealer for photovoltaic silicon wafers as claimed in claim 1, wherein: feeding belt feeder (2) one side is equipped with membrane book support frame (11), pyrocondensation membrane book has been placed at membrane book support frame (11) top, and the membrane area that pulls out on the pyrocondensation membrane book is around behind traction plate group (502), through banding cutter (501).
8. The heat sealer for photovoltaic silicon wafers according to claim 7, wherein: the utility model discloses a film sealing machine, including frame (1), edge sealing cutter (501) and output one side, the waste film transmission assembly (10) that are located feeding belt feeder (2) side are installed to output one side, waste film transmission assembly (10) are including upper and lower two sets of belt pulleys (101), top belt pulley (101) vertical motion, and below belt pulley (101) highly fixed, waste film is driven by upper and lower two sets of belt pulleys (101) centre gripping, and the output one end of waste film is pulled to on wind-up wheel (102) that frame (1) bottom was established.
9. The heat sealer for photovoltaic silicon wafers according to claim 8, characterized in that: a guide wheel set (103) is arranged between the winding wheel (102) and the waste film transmission assembly (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122456666.6U CN216443927U (en) | 2021-10-12 | 2021-10-12 | Heat sealing machine for photovoltaic silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122456666.6U CN216443927U (en) | 2021-10-12 | 2021-10-12 | Heat sealing machine for photovoltaic silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN216443927U true CN216443927U (en) | 2022-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122456666.6U Active CN216443927U (en) | 2021-10-12 | 2021-10-12 | Heat sealing machine for photovoltaic silicon wafer |
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| CN (1) | CN216443927U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116161295A (en) * | 2023-04-26 | 2023-05-26 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
-
2021
- 2021-10-12 CN CN202122456666.6U patent/CN216443927U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116161295A (en) * | 2023-04-26 | 2023-05-26 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
| CN116161295B (en) * | 2023-04-26 | 2023-08-08 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
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