CN216433284U - Thermistor, temperature measurement component and household appliance - Google Patents
Thermistor, temperature measurement component and household appliance Download PDFInfo
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- CN216433284U CN216433284U CN202122498658.8U CN202122498658U CN216433284U CN 216433284 U CN216433284 U CN 216433284U CN 202122498658 U CN202122498658 U CN 202122498658U CN 216433284 U CN216433284 U CN 216433284U
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Abstract
The utility model discloses a thermistor, temperature measurement subassembly and domestic appliance, wherein, thermistor includes temperature sensing chip and packaging structure, packaging structure once encapsulate in the outside of temperature sensing chip, last being formed with of packaging structure touches portion of connecting, touch portion of connecting has the face of touching, touch the face of connecting for setting up to and waiting to adopt the appearance adaptation of temperature body lateral surface, so that touch portion of connecting and waiting to adopt the face contact between the temperature body, touch portion of connecting and can paste tightly in waiting to adopt the temperature body, simultaneously, face contact has great area of contact for point contact and line contact, has improved the sensitivity and the accuracy of measuring temperature, and the sample of temperature is more accurate, more can in time react the temperature variation condition of waiting to adopt the temperature body.
Description
Technical Field
The utility model relates to a domestic appliance's temperature measurement technical field, in particular to thermistor, temperature measurement subassembly and domestic appliance.
Background
Thermistor that uses among the present domestic appliance is because of receiving the structural constraint, and the temperature sensing reaction is slow, and the occasion has increased the supplementary temperature sensing of heat conduction silicone grease a bit, but also can be in the temperature sensing reaction slow after the heat conduction silicone grease withers, and is very big to whole machine result of use and the controllable influence of quality, consequently, needs optimize current thermistor structure.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a thermistor, temperature measurement component and domestic appliance, aim at optimizing current thermistor to improve measured temperature's sensitivity.
To achieve the above object, the present invention provides a thermistor, comprising:
a heat-sensitive chip; and the number of the first and second groups,
the packaging structure is packaged at the outer side of the thermosensitive chip at one time, a contact part is formed on the packaging structure and is provided with a contact surface, and the contact surface is matched with the outer side surface of the body to be heated in shape so that the contact part is in surface contact with the body to be heated.
Optionally, the contact surface is arranged in a plane or a cambered surface.
Optionally, the contacting portion is provided in a plate shape.
Optionally, the thickness of the contacting portion is T, and T is greater than 0 and less than or equal to 2 mm.
Optionally, the package structure includes a package body surrounding the periphery of the thermal sensitive chip, and the contact portion is disposed beyond the package body toward one end of the thermal sensitive chip.
Optionally, the material of the package structure is at least one of ceramic, glass, and epoxy resin.
The utility model also provides a temperature measurement subassembly, temperature measurement subassembly includes thermistor, thermistor includes:
a heat-sensitive chip; and the number of the first and second groups,
the packaging structure is packaged at the outer side of the thermosensitive chip at one time, a contact part is formed on the packaging structure and is provided with a contact surface, and the contact surface is matched with the outer side surface of the body to be heated in shape so that the contact part is in surface contact with the body to be heated.
Optionally, the temperature measuring assembly further includes:
the support frame is used for installing the thermistor;
a wire harness having one end electrically connected to the thermistor; and the number of the first and second groups,
and the connecting terminal is arranged at the other end of the wire harness and is electrically connected with the wire harness.
Optionally, the package structure includes a package body surrounding the periphery of the heat-sensitive chip;
the supporting frame is provided with a supporting surface, and the packaging main body is tightly propped against the supporting surface.
Optionally, the wire harness is arranged on one side of the support frame, which faces away from the package main body;
two through holes are formed in the supporting surface;
the thermistor also comprises two pins, one end of each pin is electrically connected with the thermosensitive chip, and the other end of each pin extends out of the packaging main body to be electrically connected with the wiring harness.
Optionally, the supporting surface is partially recessed to form a groove, and the package body abuts against a bottom wall surface of the groove.
The utility model also provides a domestic appliance, domestic appliance includes temperature measurement component, temperature measurement component includes thermistor, thermistor includes:
a heat-sensitive chip; and the number of the first and second groups,
the packaging structure is packaged at the outer side of the thermosensitive chip at one time, a contact part is formed on the packaging structure and is provided with a contact surface, and the contact surface is matched with the outer side surface of the body to be heated in shape so that the contact part is in surface contact with the body to be heated.
Optionally, the household appliance comprises a multi-head induction cooker, an induction cooker, a microwave oven and a water heater.
The technical scheme of the utility model, the outside of temperature sensing chip is once packaged with packaging structure, packaging structure is last to be formed with to touch and connects portion, touch and connect portion and have the face of touching, touch and connect the face and be used for setting up to and wait to adopt the appearance adaptation of temperature body lateral surface, so that touch and connect portion and wait to adopt the face contact between the temperature body, touch and connect portion and can paste tightly in waiting to adopt the temperature body, simultaneously, face contact has great area of contact for point contact and line contact, has improved the sensitivity and the accuracy of measuring temperature, and the sample of temperature is more accurate, more can in time react the temperature change condition of waiting to adopt the temperature body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic view of a front view structure of an embodiment of a temperature measurement assembly provided by the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
1000 | Temperature measuring assembly |
| 1 | |
200 | |
| 11 | |
201 | |
| 111 | |
202 | |
| 12 | |
300 | |
| 2 | |
400 | Connecting terminal |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Thermistor that uses among the present domestic appliance is because of receiving the structural constraint, and the temperature sensing reaction is slow, and the occasion has increased the supplementary temperature sensing of heat conduction silicone grease a bit, but also can be in the temperature sensing reaction slow after the heat conduction silicone grease withers, and is very big to whole machine result of use and the controllable influence of quality, consequently, needs optimize current thermistor structure.
In view of the above, the present invention provides a thermistor 100, and referring to fig. 1, the thermistor 100 includes a thermal chip (not shown) and a package structure 1.
The packaging structure 1 is packaged at the outer side of the thermosensitive chip at one time.
The package structure 1 is formed with a contacting portion 11, the contacting portion 11 has a contacting surface 111, and the contacting surface 111 is configured to be matched with the outer side surface of the body to be heated, so that the contacting portion 11 is in surface contact with the body to be heated.
The technical scheme of the utility model, once packaged with packaging structure 1 in the outside of temperature sensing chip, packaging structure 1 is last to be formed with to touch and to connect portion 11, touch and to connect portion 11 and have touch face 111, touch face 111 for set up to with wait to adopt the appearance adaptation of temperature body lateral surface, so that touch and to connect portion 11 and wait to adopt the face contact between the temperature body, touch and to connect portion 11 and can paste tightly in waiting to adopt the temperature body, simultaneously, face contact has great area of contact for point contact and line contact, has improved the sensitivity and the accuracy of measuring temperature, and the sample of temperature is more accurate, more can in time react the temperature change condition of waiting to adopt the temperature body.
It should be noted that the core of the thermistor 100 is the thermal chip, the thermistor 100 can be formed by packaging the package structure 1 on the outer side of the thermal chip, the resistance value of the thermal chip changes with the change of temperature, and the thermal chip is divided into a positive temperature coefficient thermal chip and a negative temperature coefficient thermal chip according to the difference of temperature coefficients, the resistance value of the positive temperature coefficient thermal chip increases with the increase of temperature, and the resistance value of the negative temperature coefficient thermal chip decreases with the increase of temperature.
To thermistor 100, according to the structural shape, thermistor 100 includes multiple types such as disc (slice), cylindrical (cylindricality), circle shape (washer shape), and foretell structural shape all by packaging structure 1's appearance decides, the utility model discloses in, through once the encapsulation structure 1, and through changing packaging structure 1's appearance to better adapt to go with the temperature body contact that awaits measuring.
It can be understood that, in the embodiment of the present invention, when manufacturing the thermistor 100, the package structure 1 is directly packaged outside the thermistor chip, that is, a package is performed once, and this package manner is different from a manner of performing a secondary package or a multiple package on the basis of the thermistor 100 that has completed the package and the formation, and of course, is also different from a manner of combining other structures on the basis of the thermistor 100 that has completed the package and the formation.
It can be understood that the temperature body that awaits measuring can have multiple shape, for example, have cambered surface, plane or arbitrary curved surface etc. for better with the cooperation of the temperature body that awaits measuring, touch the appearance of face 111 with the temperature body that awaits measuring carries out the adaptation, if, common domestic appliance mostly has plane or cambered surface, consequently, in some embodiments, can with touch face 111 and set up to plane or cambered surface, so, be convenient for on the one hand thermistor 100 with the laminating of the temperature body that awaits measuring, on the other hand, increased thermistor 100 with the area of contact between the temperature body that awaits measuring has improved the sensitivity and the accuracy of measuring the temperature.
The embodiment of the utility model provides an in, do not restrict touch the concrete shape of portion 11, if, can be hemispherical, cubic, column etc. in one embodiment, touch portion 11 and be the platelike setting, satisfying can with the prerequisite of the temperature body adaptation that awaits measuring under, reduce touch face 111 with interval between the heat sensitive chip improves the sensitivity and the accuracy of temperature measurement further.
Particularly, the thickness of touching portion 11 is T, and 0 < T is less than or equal to 2mm, is about to the thickness of touching portion 11 sets up within 2mm, and thickness is big more, can increase the heat sensitive chip with contact the interval between the face 111, thickness is little, is difficult to the appearance of the body that awaits measuring of adaptation, consequently, will the thickness of touching portion 11 sets up within 2mm, under the condition of having guaranteed can the appearance of the body that awaits measuring of adaptation, can improve the sensitivity and the accuracy of temperature measurement.
Further, in the extending direction of the contacting portion 11, in an embodiment, the package structure 1 includes a package body 12 surrounding the periphery of the heat sensitive chip.
The contact portion 11 is disposed beyond the package body 12 toward one end of the thermal sensitive chip.
That is, by increasing the area of the extension of the contacting portion 11, the area of the contacting surface 111 is further increased, and the sensitivity and accuracy of temperature measurement are further improved.
It is understood that the contacting portion 11 may also be disposed beyond the package body 12 toward the other end of the thermal chip, that is, in a vertical plane, a projection of the contacting portion 11 is disposed to cover the package body 12, for example, a ratio of a projection area of the contacting portion 11 to a projection area of the package body 12 is 1.1, 1.2, 1.3, 1.4, 1.5, and so on.
The embodiment of the utility model provides a do not restrict yet packaging structure 1's material can be in pottery, glass, epoxy, also can be the combination of two arbitrary kinds among pottery, glass, the epoxy, also can be the combination of three kinds among pottery, glass, the epoxy, of course, can also have other materials, all above the embodiment of the utility model.
The utility model provides a temperature measurement subassembly 1000, temperature measurement subassembly 1000 includes foretell thermistor 100's whole technical characteristics, also consequently has the technological effect that above-mentioned whole technical characteristics brought, and here is no longer repeated one by one.
In some embodiments, the temperature measuring assembly 1000 further includes a support frame 200, a wire harness 300, and a connection terminal 400.
The support frame 200 is used for mounting the thermistor 100.
One end of the wire harness 300 is electrically connected to the thermistor 100, and the connection terminal 400 is provided at the other end of the wire harness 300 and is electrically connected to the wire harness 300.
Namely, the thermistor 100 is mounted on the support frame 200, the thermistor 100 is in contact with the temperature body to be measured, the temperature of the temperature body to be measured is sensed, the temperature signal is converted into an electric signal in the thermistor chip, the electric signal is transmitted to an external circuit structure through the wiring harness 300 and the connecting terminal 400, the electric signal is analyzed into the temperature signal in the external circuit structure, and then the temperature of the temperature body to be measured is obtained, so that the temperature of the temperature body to be measured is conveniently measured through the temperature measuring assembly 1000.
The support frame 200 is used for mounting the thermistor 100, and it is understood that the thermistor 100 is fixed on the support frame 200, for example, adhered or clamped on the support frame 200, and specifically, in one embodiment, a support surface 201 is formed on the support frame 200.
The package body 12 abuts against the supporting surface 201.
Namely, the upper end of the thermistor 100 abuts against the temperature body to be measured, the lower end of the thermistor 100 abuts against the supporting surface 201, the temperature body to be measured is clamped by the clamping force between the supporting frame 200 and the temperature body to be measured, and the thermistor 100 can be rapidly installed only by fixedly adjusting the position of the supporting frame 200.
Further, in some embodiments, the supporting surface 201 is partially recessed to form a groove 202, and the package body 12 abuts against the bottom wall surface of the groove 202, so that other structures of the thermistor 100 can be hidden in the groove 202, thereby reducing the probability of the other structures of the thermistor 100 contacting the temperature body to be measured, such as the pin 2 structure, and further improving the service life of the thermistor 100.
Furthermore, in the recess 202, a portion of the bottom wall surface of the recess 202 corresponding to the thermistor 100 protrudes upward to raise the position of the thermistor 100, thereby further protecting other structures of the thermistor 100, such as a pin 2 structure and the like.
In one specific embodiment, the wire harness 300 is disposed on a side of the supporting frame 200 facing away from the package body 12.
Two through holes are arranged on the supporting surface 201.
The thermistor 100 further includes two pins 2, one end of each of the pins 2 is electrically connected to the thermal chip, and the other end of each of the pins 2 extends out of the package body 12 to be electrically connected to the wire harness 300.
That is, the two through holes guide the pin 2 on one side of the supporting surface 201 to one side back to the supporting surface 201, and the wire harness 300 and the connecting terminal 400 convey the electric signal to an external circuit structure, the electric signal is analyzed into a temperature signal in the external circuit structure, and then the temperature of the temperature body to be measured is obtained, so that the temperature of the temperature body to be measured is conveniently measured.
The utility model provides a domestic appliance, domestic appliance includes the whole technical characteristics including foretell temperature measurement subassembly 1000, also consequently has the technological effect that the whole technical characteristics of above-mentioned brought, and here is no longer repeated.
It can be understood that household appliances include bull induction cooker, electromagnetism stove, microwave oven and water heater, in foretell household appliances, adopt temperature measurement subassembly 1000 sample temperature is more accurate, more can in time react the temperature rise condition of heated thing (pan), reaches timely, accurate control, reaches effectual built-in overtemperature protection, increase of service life, simultaneously, stops the quality control incident because of heat conduction silicone grease inefficacy arouses, promotes market satisfaction.
The above is only the optional embodiment of the present invention, and not therefore the limit to the patent scope of the present invention, all the concepts of the present invention utilize the equivalent structure transformation of the content of the specification and the attached drawings, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (13)
1. A thermistor, comprising:
a heat-sensitive chip; and the number of the first and second groups,
the packaging structure is packaged at the outer side of the thermosensitive chip at one time, a contact part is formed on the packaging structure and is provided with a contact surface, and the contact surface is matched with the outer side surface of the body to be heated in shape so that the contact part is in surface contact with the body to be heated.
2. A thermistor as claimed in claim 1, characterized in that the contact surface is arranged flat or curved.
3. A thermistor according to claim 1, characterized in that the contact portion is provided in the form of a plate.
4. A thermistor according to claim 3, characterized in that the thickness of the contact is T and 0 < T.ltoreq.2 mm.
5. A thermistor as claimed in claim 1, characterized in that the package structure comprises a package body surrounding the periphery of the heat-sensitive chip, and the contact portion is arranged beyond the package body towards one end of the heat-sensitive chip.
6. A thermistor as claimed in claim 1, characterized in that the material of the encapsulation is at least one of ceramic, glass and epoxy.
7. A thermometric assembly comprising a thermistor according to any of claims 1 to 6.
8. The thermometric assembly of claim 7, wherein the thermometric assembly further comprises:
the support frame is used for installing the thermistor;
a wire harness having one end electrically connected to the thermistor; and the number of the first and second groups,
and the connecting terminal is arranged at the other end of the wire harness and is electrically connected with the wire harness.
9. The thermometric assembly of claim 8, wherein the package structure comprises a package body surrounding the periphery of the thermally sensitive chip;
the supporting frame is provided with a supporting surface, and the packaging main body is tightly propped against the supporting surface.
10. The temperature measuring assembly of claim 9, wherein the wiring harness is disposed on a side of the support frame facing away from the package body;
two through holes are formed in the supporting surface;
the thermistor also comprises two pins, one end of each pin is electrically connected with the thermosensitive chip, and the other end of each pin extends out of the packaging main body to be electrically connected with the wiring harness.
11. The temperature measuring assembly of claim 9, wherein the supporting surface is partially recessed to form a recess, and the package body abuts against a bottom wall surface of the recess.
12. An electric household appliance comprising a thermometric assembly according to any one of claims 7 to 11.
13. The household appliance according to claim 12, wherein the household appliance comprises a multiple-burner induction cooker, an induction cooker, a microwave oven and a water heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122498658.8U CN216433284U (en) | 2021-10-15 | 2021-10-15 | Thermistor, temperature measurement component and household appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122498658.8U CN216433284U (en) | 2021-10-15 | 2021-10-15 | Thermistor, temperature measurement component and household appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216433284U true CN216433284U (en) | 2022-05-03 |
Family
ID=81331854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122498658.8U Active CN216433284U (en) | 2021-10-15 | 2021-10-15 | Thermistor, temperature measurement component and household appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216433284U (en) |
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2021
- 2021-10-15 CN CN202122498658.8U patent/CN216433284U/en active Active
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