CN216432240U

CN216432240U - Infiltration tank based on copper pipe contact refrigeration

Info

Publication number: CN216432240U
Application number: CN202122466808.7U
Authority: CN
Inventors: 解明帅; 田博; 唐女钞
Original assignee: Chongqing Aibuna Infiltration Technology Co ltd
Current assignee: Chongqing Aibuna Infiltration Technology Co ltd
Priority date: 2021-10-13
Filing date: 2021-10-13
Publication date: 2022-05-03
Anticipated expiration: 2031-10-13

Abstract

The utility model is suitable for the technical field of infiltration, and discloses an infiltration tank based on copper pipe contact refrigeration, which comprises a base surface; the cooling device comprises a base surface, a tank body and a cooling liquid box, wherein the tank body is arranged on the right side of the cooling liquid box, a copper pipe is arranged in the tank body, heat absorbing sheets are connected to two sides of the outer wall of the copper pipe, one end of the copper pipe is communicated with a cooling pipe, the cooling pipe penetrates through the left side of the tank body, the other end of the copper pipe is communicated with a return pipe, and the return pipe penetrates through the right side of the tank body; the tail end of the cooling pipe is connected with the liquid outlet end of the water pump, and the water pump is arranged on the left side of the top end of the cooling liquid tank. The utility model discloses a cooling subassembly that sets up in the cooling jacket can cool off the coolant liquid in the cooling pipe to can form the cooling state of continuation, thereby can guarantee that jar internal temperature is in best operating temperature, thereby improve the quality and the efficiency of whole production.

Description

Infiltration tank based on copper pipe contact refrigeration

Technical Field

The utility model is suitable for a technical field infiltrates, especially relates to a jar infiltrates based on copper pipe contact refrigeration.

Background

At present, the impregnation process is divided into the working procedures of impregnation, whirl coating, cleaning, curing and the like, wherein the impregnation is the most critical one, and how to improve the impregnation efficiency greatly helps the whole impregnation process, wherein the quality of the impregnation liquid is important to the impregnation process, and the temperature of the impregnation liquid is generally kept to be about 11-14 ℃.

Among the prior art, refrigeration adopts the water cycle to drive the heat, but endless mode water constantly heaies up, and the heat of long-term back water that uses becomes high, will can't reach better refrigeration effect, if do not adopt the circulating water to absorb heat, will need a large amount of water to cool down, the water resource of wasting, in order to solve the problem that exists among the above-mentioned, consequently, we propose a infiltration jar based on copper pipe contact refrigeration.

SUMMERY OF THE UTILITY MODEL

The utility model provides a jar infiltrates based on copper pipe contact refrigeration has solved the problem of proposing in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an infiltration tank based on copper pipe contact refrigeration comprises a base surface;

the cooling device comprises a base surface, a tank body and a cooling liquid box, wherein the tank body is arranged on the right side of the cooling liquid box, a copper pipe is arranged in the tank body, heat absorbing sheets are connected to two sides of the outer wall of the copper pipe, one end of the copper pipe is communicated with a cooling pipe, the cooling pipe penetrates through the left side of the tank body, the other end of the copper pipe is communicated with a return pipe, and the return pipe penetrates through the right side of the tank body;

the end-to-end connection of cooling pipe communicates with the liquid outlet end of water pump, the water pump sets up in the left side on coolant liquid tank top, the feed liquor end and the pipette of water pump are linked together, and the pipette is located the inside of coolant liquid tank, the end of back flow is linked together with the right side of coolant liquid tank, the right side evenly distributed on coolant liquid tank top has the outlet duct, the outer wall of cooling pipe has cup jointed the cooling cover, and the cooling cover is provided with four groups, the left side and the right side of cooling cover inner wall all are provided with the semiconductor refrigeration piece, the surface intercommunication of cooling cover has the gas hood, and the inside of gas hood is provided with the fan, the louvre has evenly been seted up to the back of cooling cover.

Preferably, the cooling jacket is hollow inside to form a double-layer structure.

Preferably, the refrigeration face of semiconductor refrigeration piece is located the inner wall of cooling cover, and the refrigeration face of semiconductor refrigeration piece fits the outer wall of cooling pipe, the cooling surface of semiconductor refrigeration piece is located the inside of cooling pipe.

Preferably, the cooling pipe is square, and the copper pipe is U-shaped.

Preferably, a switch is arranged on the left side of the cooling liquid tank and is electrically connected with the water pump, the semiconductor refrigeration sheet and the fan.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a cooling subassembly that sets up in the cooling jacket can cool off the coolant liquid in the cooling pipe to can form the cooling state of continuation, thereby can guarantee that jar internal temperature is in best operating temperature, thereby improve the quality and the efficiency of whole production.

2. The utility model discloses an outer wall connection of copper pipe has the heat absorbing sheet, and it is internal that the jar is arranged in to the heat absorbing sheet to increase the contact surface between copper pipe and the infiltration liquid, thereby improve the efficiency of heat conduction, play better radiating effect.

Drawings

Fig. 1 is a schematic view of the overall structure of an infiltration tank based on copper pipe contact refrigeration of the present invention;

fig. 2 is a schematic view of the internal structure of a cooling jacket of an infiltration tank based on copper pipe contact refrigeration of the present invention;

fig. 3 is a schematic view of the top structure of the cooling liquid tank of the infiltration tank based on contact refrigeration of the copper pipe of the present invention;

fig. 4 is the utility model provides a copper pipe and heat sink junction structural sketch of jar oozes based on copper pipe contact refrigeration.

In the figure: 1. a base surface; 2. a tank body; 3. a coolant tank; 4. a water pump; 5. a cooling pipe; 6. a copper pipe; 7. a heat absorbing sheet; 8. a return pipe; 9. an air outlet pipe; 10. a pipette; 11. a switch; 12. a temperature reduction sleeve; 13. a gas hood; 14. a semiconductor refrigeration sheet; 15. a fan; 16. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in the model of providing with electrical apparatus only refer to, can be through changing the different models that the function is the same according to the actual use condition with electrical apparatus, to the ordinary technical personnel in this field, can understand that above-mentioned term is in by particular case the utility model provides a concrete meaning.

Referring to fig. 1-4, an infiltration tank based on copper pipe contact refrigeration comprises a base surface 1;

a tank body 2 and a cooling liquid tank 3 are arranged at the top of the base surface 1, the tank body 2 is positioned on the right side of the cooling liquid tank 3, a copper pipe 6 is arranged in the tank body 2, heat absorbing sheets 7 are connected to two sides of the outer wall of the copper pipe 6, one end of the copper pipe 6 is communicated with a cooling pipe 5, the cooling pipe 5 penetrates through the left side of the tank body 2, the other end of the copper pipe 6 is communicated with a return pipe 8, and the return pipe 8 penetrates through the right side of the tank body 2;

the tail end of the cooling pipe 5 is connected and communicated with the liquid outlet end of the water pump 4, the water pump 4 is arranged on the left side of the top end of the cooling liquid tank 3, the liquid inlet end of the water pump 4 is communicated with the liquid suction pipe 10, the liquid suction pipes 10 are positioned in the cooling liquid tank 3, the tail end of the return pipe 8 is communicated with the right side of the cooling liquid tank 3, the air outlet pipes 9 are uniformly distributed on the right side of the top end of the cooling liquid tank 3, the cooling jacket 12 is sleeved on the outer wall of the cooling pipe 5, the cooling jacket 12 is provided with four groups, the semiconductor refrigerating sheets 14 are arranged on the left side and the right side of the inner wall of the cooling jacket 12, the surface of the cooling jacket 12 is communicated with the air hood 13, the fan 15 is arranged in the air hood 13, the heat dissipation holes 16 are uniformly formed in the back of the cooling jacket 12, in the embodiment, referring to fig. 1, the cooling assembly arranged in the cooling jacket 12 can cool the cooling liquid in the cooling pipe 5, and a continuous cooling state can be formed, so that the temperature in the tank body 2 can be ensured to be at the optimal working temperature, and the quality and the efficiency of the whole production are improved.

In this embodiment, referring to fig. 2, the cooling jacket 12 is hollow to form a double-layer structure.

In this embodiment, referring to fig. 2, the refrigerating surface of the semiconductor refrigerating sheet 14 is located on the inner wall of the cooling sleeve 12, the refrigerating surface of the semiconductor refrigerating sheet 14 is attached to the outer wall of the cooling pipe 5, the heat dissipating surface of the semiconductor refrigerating sheet 14 is located inside the cooling pipe 5, and the semiconductor refrigerating sheet 14 is beneficial to constantly reducing the temperature of the liquid after heat absorption, so as to ensure the overall heat absorption effect.

Referring to fig. 1 and 3 in the present embodiment, the cooling tube 5 is square, and the copper tube 6 is U-shaped.

Referring to fig. 1 in this embodiment, a switch 11 is disposed on the left side of the cooling liquid tank 3, and the switch 11 is electrically connected to the water pump 4, the semiconductor chilling plate 14 and the fan 15.

The utility model discloses during the use: switch 11 starts water pump 4, pipette 10 carries the water in the coolant liquid case 3 to in the cooling tube 5, carry to copper pipe 6 in by cooling tube 5, finally return into the inside of coolant liquid case 3 by

back flow

8, 3 tops of coolant liquid case are provided with outlet duct 9, do benefit to and dispel the heat to the liquid after the heat absorption, switch 11 starts 14 during operations of semiconductor refrigeration piece, the refrigeration face of refrigeration piece will cool down to cooling tube 5 outer wall, reduce the temperature of coolant liquid, make the liquid that gets into in the jar body 2 be in the low temperature state all the time, will absorb more heat when passing through

copper pipe

6, 14 during operations of semiconductor refrigeration piece, the face that heats will generate heat, start fan 15, fan 15 will drive the heat dissipation that the semiconductor refrigeration face produced, discharge by 16 louvres of heat dissipation, improve 14's of semiconductor refrigeration piece life, the design is simple, and is comparatively practical.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. An infiltration tank based on copper pipe contact refrigeration is characterized by comprising a base surface (1);

the cooling device is characterized in that a tank body (2) and a cooling liquid box (3) are arranged at the top of the base surface (1), the tank body (2) is located on the right side of the cooling liquid box (3), a copper pipe (6) is arranged in the tank body (2), heat absorbing sheets (7) are connected to two sides of the outer wall of the copper pipe (6), one end of the copper pipe (6) is communicated with a cooling pipe (5), the cooling pipe (5) penetrates through the left side of the tank body (2), the other end of the copper pipe (6) is communicated with a return pipe (8), and the return pipe (8) penetrates through the right side of the tank body (2);

the tail end of the cooling pipe (5) is connected and communicated with the liquid outlet end of the water pump (4), the water pump (4) is arranged on the left side of the top end of the cooling liquid tank (3), the liquid inlet end of the water pump (4) is communicated with the liquid suction pipe (10), and the pipette (10) is positioned inside the cooling liquid tank (3), the end of the return pipe (8) is communicated with the right side of the cooling liquid tank (3), the right side of the top end of the cooling liquid tank (3) is uniformly distributed with an air outlet pipe (9), the outer wall of the cooling pipe (5) is sleeved with a cooling sleeve (12), four groups of cooling sleeves (12) are arranged, semiconductor refrigerating sheets (14) are arranged on the left side and the right side of the inner wall of each cooling sleeve (12), the surface of each cooling sleeve (12) is communicated with an air hood (13), and a fan (15) is arranged in the gas hood (13), and heat dissipation holes (16) are uniformly formed in the back of the cooling sleeve (12).

2. The infiltration tank based on copper pipe contact refrigeration of claim 1, characterized in that the cooling jacket (12) is hollow inside and forms a double-layer structure.

3. The infiltration tank based on copper pipe contact refrigeration of claim 1, wherein the refrigeration surface of the semiconductor refrigeration piece (14) is located on the inner wall of the cooling sleeve (12), the refrigeration surface of the semiconductor refrigeration piece (14) is attached to the outer wall of the cooling pipe (5), and the heat dissipation surface of the semiconductor refrigeration piece (14) is located inside the cooling pipe (5).

4. The infiltration tank based on copper pipe contact refrigeration of claim 1, characterized in that, cooling pipe (5) is square, and copper pipe (6) is U-shaped.

5. The infiltration tank based on copper pipe contact refrigeration of claim 1, characterized in that, the left side of coolant liquid case (3) is provided with switch (11), and switch (11) and water pump (4), semiconductor refrigeration piece (14) and fan (15) are electric connection.