CN216429759U - Water cooling machine device convenient to disassemble and assemble for semiconductor processing - Google Patents
Water cooling machine device convenient to disassemble and assemble for semiconductor processing Download PDFInfo
- Publication number
- CN216429759U CN216429759U CN202123286883.1U CN202123286883U CN216429759U CN 216429759 U CN216429759 U CN 216429759U CN 202123286883 U CN202123286883 U CN 202123286883U CN 216429759 U CN216429759 U CN 216429759U
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- Prior art keywords
- block
- limiting
- semiconductor processing
- machine body
- panel
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- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 11
- 238000001125 extrusion Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a semiconductor processing is with water-cooling machine device of dismouting of being convenient for, include: the organism, surface mounting has the fin, the inside through connection of fin has spacing post, the cross-section of looking sideways at of spacing post is "T" type structure, and the one end surface of spacing post can rotate in the inside of organism, the block piece, and the one end gomphosis is kept away from the one end surface of organism at spacing post, the one end fixedly connected with shifting block of block piece, and one side of keeping away from spacing post of block piece is connected with the block spring. This water-cooling machine device of semiconductor processing with being convenient for dismouting promotes the shifting block, and the shifting block drives the block piece and removes, and the block piece extrusion block spring takes place to deform, later with the riveting piece to taking out to the one side of keeping away from spacing post, dismantles the fin to the one side of keeping away from the organism again and takes out, separates until fin and spacing post to can be more convenient carry out the dismouting with the fin.
Description
Technical Field
The utility model relates to a water-cooling machine technical field specifically is a semiconductor processing is with water-cooling machine device of dismouting of being convenient for.
Background
The water cooler is also called a water cooler, and is a cooling water device capable of providing constant temperature, constant flow and constant pressure. The water-cooled engine generates great heat during operation, so that the temperature is increased, and the metal performance of parts of the engine is reduced due to the increase of the temperature of the engine.
Like patent CN202022803640.X a double-deck water-cooling machine device, including the frame, the frame middle part is equipped with the crossbeam that is used for the support, the crossbeam top is equipped with the electrical apparatus region, and the crossbeam below is equipped with the water-cooling region, the utility model discloses bilayer structure places the automatically controlled part in upper portion, arranges other spare parts in the product lower part, reduces unit appearance chi, adopts the parallel flow core, and whole frame adopts aluminium alloy material, reduces whole product weight.
This prior art solution also presents the following problems when in use:
1. when the device is used, the radiating fins on the device cannot be disassembled and assembled, and the radiating fins are directly welded on the device;
2. when the device is used, the panel is not convenient to open, and accessories inside the panel are checked.
Improvements are needed to address the above issues to meet market demands.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor processing is with water-cooling machine device of dismouting of being convenient for to propose equipment and can not carry out the dismouting with the fin on the device when using in solving above-mentioned background art, because the fin is the problem of lug weld on the device.
In order to achieve the above object, the utility model provides a following technical scheme: a water-cooling machine device convenient to disassemble and assemble for semiconductor processing comprises:
the side-view cross section of the limiting column is of a T-shaped structure, and the surface of one end of the limiting column can rotate in the machine body;
the clamping piece is embedded in the surface of one end, far away from the machine body, of the limiting column, a shifting block is fixedly connected to one end of the clamping piece, a clamping spring is connected to one side, far away from the limiting column, of the clamping piece, a riveting block is connected to one end, far away from the clamping piece, of the clamping spring, and the riveting block is connected with the limiting column in an inserting mode.
Preferably, the heat sink includes:
the threaded column is movably connected with the radiating fins on the surface, the threaded column is in threaded connection with the radiating fins, one side of the threaded column is fixedly connected with the connecting rod, the connecting rod is rotated through the structure, one end of the connecting rod drives the threaded column to rotate, and the threaded column is in threaded connection with the radiating fins.
Preferably, the fixed surface of connecting rod is connected with the limiting plate, the surperficial swing joint of limiting plate has the briquetting, the inside through connection of briquetting has the connecting rod, and briquetting one end is connected with the filter, and through above-mentioned structure, when connecting rod pivoted in-process limiting plate can drive the briquetting and compress tightly the filter.
Preferably, the body comprises:
the panel is movably connected with the machine body through the surface of the rotating shaft, the panel is of a rotating structure between the rotating shaft and the machine body, and the panel can be pulled through the structure and can rotate on the machine body through the rotating shaft.
Preferably, the panel gomphosis is on the surface of organism, and the one end swing joint that the pivot was kept away from to the panel has the clamp plate, be sliding connection between clamp plate and the panel, and clamp plate one end fixedly connected with depression bar, through above-mentioned structure, press the depression bar, the depression bar can drive the clamp plate and slide in the inside of panel for clamp plate extrusion stopper.
Preferably, clamp plate side surface laminating is connected with the stopper, bottom one side of stopper is the slope structure, and the top of stopper is connected with spacing spring, the organism is connected to the one end that the stopper was kept away from to spacing spring, and through above-mentioned structure, the stopper can be extruded to the clamp plate, and the stopper extrudes spacing spring and takes place deformation to drive the stopper and stretch out and draw back the activity on the surface of organism.
Compared with the prior art, the beneficial effects of the utility model are that: this water-cooling machine device of semiconductor processing with be convenient for dismouting can be more convenient carry out the dismouting with the fin for the filter can filter the air that the fin saw through, and the staff can be more convenient inspects panel internal fittings.
1. Promote the shifting block, the shifting block drives the block piece and removes, and block piece extrusion block spring takes place deformation, later with the riveting piece to taking out to the one side of keeping away from spacing post, dismantles the fin to the one side of keeping away from the organism again and takes out, separates until fin and spacing post to can be more convenient carry out the dismouting with the fin.
2. Place the filter in one side of fin, later rotate the connecting rod, connecting rod one end drives the screw thread post and rotates, can carry out threaded connection between screw thread post and the fin, and the limiting plate can drive the briquetting and compress tightly the filter when connecting rod pivoted in-process, and then makes the filter can filter the air that the fin saw through.
3. Pressing the depression bar, the depression bar can drive the clamp plate and slide in the inside of panel for clamp plate extrusion stopper, when clamp plate extrusion stopper, the stopper extrudees spacing spring and takes place deformation, thereby drive the stopper and stretch out and draw back the activity on the surface of organism, until stopper surface and panel separation, later rotate the panel, thereby open the panel, so that the staff can be more convenient to the inside accessory of panel inspect.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;
FIG. 3 is a schematic side view of the cross-sectional structure of the panel of the present invention;
FIG. 4 is a side view, sectional and schematic view of the heat sink of the present invention;
fig. 5 is an enlarged schematic structural diagram of the utility model a.
In the figure: 1. a body; 2. a heat sink; 3. a limiting column; 4. a clamping sheet; 5. shifting blocks; 6. a snap spring; 7. riveting blocks; 8. a threaded post; 9. a connecting rod; 10. a limiting plate; 11. pressing into blocks; 12. a filter; 13. a rotating shaft; 14. a panel; 15. pressing a plate; 16. a pressure lever; 17. a limiting block; 18. and a limiting spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a water-cooling machine device convenient to disassemble and assemble for semiconductor processing comprises:
the radiating fin structure comprises a machine body 1, a radiating fin 2 is installed on the surface of the machine body 1, a limiting column 3 is connected inside the radiating fin 2 in a penetrating manner, the side-view cross section of the limiting column 3 is of a T-shaped structure, one end surface of the limiting column 3 can rotate inside the machine body 1, a clamping sheet 4 is embedded on one end surface of the limiting column 3, which is far away from the machine body 1, one end of the clamping sheet 4 is fixedly connected with a shifting block 5, one side of the clamping sheet 4, which is far away from the limiting column 3, is connected with a clamping spring 6, one end of the clamping spring 6, which is far away from the clamping sheet 4, is connected with a riveting block 7, the riveting block 7 is in an inserting connection with the limiting column 3, the shifting block 5 is pushed, the shifting block 5 drives the clamping sheet 4 to move, the clamping sheet 4 extrudes the clamping spring 6 to deform, then the riveting block 7 is taken out to one side far away from the limiting column 3, the radiating fin 2 is taken out to one side far away from the machine body 1, until the radiating fin 2 is separated from the limiting column 3, therefore, the radiating fins 2 can be more conveniently disassembled and assembled;
the heat sink 2 includes: the surface of the threaded column 8 is movably connected with the radiating fin 2, the threaded column 8 is in threaded connection with the radiating fin 2, one side of the threaded column 8 is fixedly connected with a connecting rod 9, the surface of the connecting rod 9 is fixedly connected with a limiting plate 10, the surface of the limiting plate 10 is movably connected with a pressing block 11, the connecting rod 9 is connected inside the pressing block 11 in a penetrating mode, one end of the pressing block 11 is connected with a filter 12, the filter 12 is placed on one side of the radiating fin 2, then the connecting rod 9 is rotated, one end of the connecting rod 9 drives the threaded column 8 to rotate, threaded connection can be conducted between the threaded column 8 and the radiating fin 2, the limiting plate 10 can drive the pressing block 11 to tightly press the filter 12 in the rotating process of the connecting rod 9, and therefore the filter 12 can filter air penetrating through the radiating fin 2;
the body 1 includes: the surface of the rotating shaft 13 is movably connected with the machine body 1, the surface of the rotating shaft 13 movably penetrates through the panel 14, the panel 14 forms a rotating structure with the machine body 1 through the rotating shaft 13, the panel 14 is embedded on the surface of the machine body 1, one end, far away from the rotating shaft 13, of the panel 14 is movably connected with a pressing plate 15, the pressing plate 15 is in sliding connection with the panel 14, one end of the pressing plate 15 is fixedly connected with a pressing rod 16, one side surface of the pressing plate 15 is attached with a limiting block 17, one side of the bottom of the limiting block 17 is of an inclined structure, the top of the limiting block 17 is connected with a limiting spring 18, one end, far away from the limiting block 17, of the limiting spring 18 is connected with the machine body 1, the pressing rod 16 can drive the pressing plate 15 to slide in the panel 14, so that the limiting block 17 is extruded by the pressing plate 15, and when the limiting block 17 is extruded by the pressing plate 15, the limiting block 17 extrudes the limiting spring 18 to deform, thereby drive stopper 17 and stretch out and draw back the activity on organism 1's surface, until stopper 17 surface and panel 14 separation, later rotate panel 14 to open panel 14, so that the staff can be more convenient to the panel 14 inside accessories inspect.
In summary, the following steps: as shown in fig. 1-5, when the water cooling device for semiconductor processing is used, the shifting block 5 is firstly pushed, the shifting block 5 drives the engaging piece 4 to move, the engaging piece 4 extrudes the engaging spring 6 to deform, then the riveting block 7 is taken out to the side far away from the limiting post 3, then the heat sink 2 is disassembled to the side far away from the machine body 1 and taken out until the heat sink 2 is separated from the limiting post 3, the filter 12 is placed on one side of the heat sink 2, then the connecting rod 9 is rotated, one end of the connecting rod 9 drives the threaded post 8 to rotate, the threaded post 8 and the heat sink 2 can be in threaded connection, when the limiting plate 10 can drive the pressing block 11 to press the filter 12 in the rotating process of the connecting rod 9, the pressing rod 16 can drive the pressing plate 15 to slide in the panel 14, so that the pressing plate 15 extrudes the limiting block 17, and the pressing plate 15 extrudes the limiting block 17, the stopper 17 extrudes the limiting spring 18 to deform, so that the stopper 17 is driven to stretch and retract on the surface of the machine body 1 until the surface of the stopper 17 is separated from the panel 14, and then the panel 14 is rotated, so that the panel 14 is opened, and the semiconductor processing water cooler device is characterized by being convenient to disassemble and assemble.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a semiconductor processing is with water-cooling machine device convenient to dismouting which characterized in that includes:
the radiating fin structure comprises a machine body (1), radiating fins (2) are mounted on the surface of the machine body (1), limiting columns (3) penetrate through the interior of the radiating fins (2), the side-view cross sections of the limiting columns (3) are of T-shaped structures, and one end surfaces of the limiting columns (3) are rotatably mounted in the machine body (1);
the clamping piece (4), the one end gomphosis is kept away from the one end surface of organism (1) in spacing post (3), the one end fixedly connected with shifting block (5) of clamping piece (4), and the one side of keeping away from spacing post (3) of clamping piece (4) is connected with block spring (6), the one end that clamping piece (4) were kept away from in block spring (6) is connected with riveting piece (7), be connected for inserting between riveting piece (7) and spacing post (3).
2. A water cooler device for semiconductor processing which is easy to disassemble and assemble according to claim 1, wherein the heat sink (2) comprises:
the surface of the threaded column (8) is movably connected with the radiating fins (2), the threaded column (8) is in threaded connection with the radiating fins (2), and one side of the threaded column (8) is fixedly connected with the connecting rod (9).
3. The water cooling machine device convenient to disassemble and assemble for semiconductor processing according to claim 2, wherein a limiting plate (10) is fixedly connected to the surface of the connecting rod (9), a pressing block (11) is movably connected to the surface of the limiting plate (10), the connecting rod (9) penetrates through the pressing block (11), and a filter (12) is connected to one end of the pressing block (11).
4. The semiconductor processing water cooling machine device convenient to assemble and disassemble as claimed in claim 1, wherein the machine body (1) comprises:
the surface of the rotating shaft (13) is movably connected with the machine body (1), the surface of the rotating shaft (13) movably penetrates through the panel (14), and the panel (14) forms a rotating structure with the machine body (1) through the rotating shaft (13).
5. The water cooling machine device convenient to disassemble and assemble for semiconductor processing according to claim 4, wherein the panel (14) is embedded on the surface of the machine body (1), a pressure plate (15) is movably connected to one end of the panel (14) far away from the rotating shaft (13), the pressure plate (15) is in sliding connection with the panel (14), and a pressure rod (16) is fixedly connected to one end of the pressure plate (15).
6. The water cooling machine device convenient to disassemble and assemble for semiconductor processing according to claim 5, wherein a limiting block (17) is attached to one side surface of the pressure plate (15), one side of the bottom of the limiting block (17) is of an inclined structure, a limiting spring (18) is connected to the top of the limiting block (17), and one end, far away from the limiting block (17), of the limiting spring (18) is connected with the machine body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123286883.1U CN216429759U (en) | 2021-12-24 | 2021-12-24 | Water cooling machine device convenient to disassemble and assemble for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123286883.1U CN216429759U (en) | 2021-12-24 | 2021-12-24 | Water cooling machine device convenient to disassemble and assemble for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216429759U true CN216429759U (en) | 2022-05-03 |
Family
ID=81319085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123286883.1U Expired - Fee Related CN216429759U (en) | 2021-12-24 | 2021-12-24 | Water cooling machine device convenient to disassemble and assemble for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216429759U (en) |
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2021
- 2021-12-24 CN CN202123286883.1U patent/CN216429759U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220503 |