CN216425286U

CN216425286U - Semiconductor storage device

Info

Publication number: CN216425286U
Application number: CN202122735381.6U
Authority: CN
Inventors: 胡建文
Original assignee: Individual
Current assignee: Nanjing Wanlangshi Electronic Technology Co.,Ltd.
Priority date: 2021-11-09
Filing date: 2021-11-09
Publication date: 2022-05-03
Anticipated expiration: 2031-11-09

Abstract

The utility model discloses a semiconductor strorage device relates to the semiconductor and deposits technical field. The utility model discloses a deposit the case main part, deposit case main part upper end and rotate and be connected with the enclosing cover, deposit one side of case main part upper end and be close to the position department of enclosing cover and install two plane shape snap locks. The utility model can effectively absorb shock in the transportation process and effectively avoid the semiconductor inside the device from being damaged by the mutual matching of the U-shaped fixing block, the U-shaped connecting rod, the connecting supporting rod, the first round cylinder, the first round block, the first spring, the round slide rod, the second round block, the second round cylinder, the second spring and the rectangular fixing block; and through mutually supporting of first L shape intake pipe, first solenoid valve, second L shape intake pipe, second solenoid valve, semiconductor refrigeration piece, blast pipe, fan and temperature sensor, can effectually carry out constant temperature regulation and control to the inside temperature of device, provide a good environment of depositing for the semiconductor.

Description

Semiconductor storage device

Technical Field

The utility model belongs to the technical field of the semiconductor is deposited, especially, relate to a semiconductor strorage device.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor needs to be stored and transported after production, a storage device is needed, the existing storage device cannot effectively absorb shock in the transportation process, the semiconductor inside the device is easily damaged, subsequent use is affected, the existing storage device cannot effectively regulate and control the temperature inside the device at constant temperature, the temperature difference inside the device is larger, and the semiconductor is easily affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor strorage device to current problem has been solved: the existing storage device cannot effectively absorb shock in the transportation process, so that the semiconductor inside the device is easily damaged, and subsequent use is influenced.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a semiconductor storage device, which comprises a storage box main body, wherein the upper end of the storage box main body is rotatably connected with an outer cover, two planar snap-buckles are arranged at one side of the upper end of the storage box main body and at the position close to the outer cover, the lower end of the storage box main body is slidably connected with a buffer box, and a plurality of wheels are fixed at the lower end of the buffer box;

a plurality of U-shaped fixing blocks are fixed at the lower end of the storage box main body, two ends of each U-shaped fixing block are rotatably connected with a U-shaped connecting rod, one end of the U-shaped connecting rod, which is far away from the U-shaped fixed block, is rotatably connected with a connecting supporting rod, one end of the connecting supporting rod, which is far away from the U-shaped connecting rod, is fixedly provided with a first round block, the peripheral side surface of the connecting supporting rod is slidably connected with a first round tube, the first round blocks are connected with the first round cylinder in a sliding way, the peripheral side surfaces of the connecting support rods are sleeved with first springs, the first springs are all positioned between the first circular block and the first circular cylinder, a rectangular fixed block is fixed at one end of the first circular cylinder far away from the connecting support rod, the rectangular fixing blocks are all fixed with the buffer tank, and hydraulic oil is arranged inside the first round cylinder and on one side, far away from the connecting support rod, of the first round block;

the lower extreme of U-shaped fixed block all is fixed with circular slide bar, the equal sliding connection of all side of circular slide bar has the circular section of thick bamboo of second, just the circular section of thick bamboo of second all is fixed with the baffle-box, the lower extreme of circular slide bar all is fixed with the circular piece of second, just the circular piece of second all with the circular section of thick bamboo sliding connection of second, the upper end of the circular section of thick bamboo of second and the side of all being located circular slide bar all are provided with the second spring.

Further, a first L-shaped air inlet pipe is fixed to one end of the storage box body, a first electromagnetic valve is installed at a position, close to the storage box body, of the first L-shaped air inlet pipe, a second L-shaped air inlet pipe is fixed to a position, close to the first L-shaped air inlet pipe, of one end of the storage box body, a second electromagnetic valve is installed at a position, close to the storage box body, of the second L-shaped air inlet pipe, a semiconductor refrigeration piece is fixed between the second L-shaped air inlet pipe and the first L-shaped air inlet pipe, the hot end of the semiconductor refrigeration piece is located inside the first L-shaped air inlet pipe, the cold end of the semiconductor refrigeration piece is located inside the second L-shaped air inlet pipe, an exhaust pipe is fixed to the lower portion of one end of the storage box body, a fan is installed inside the exhaust pipe, and a temperature sensor is installed inside the storage box body.

Furthermore, a plurality of hinges are fixed at the position, close to the outer cover, of one side, far away from the plane-shaped snap fastener, of the storage box main body, and the storage box main body is rotatably connected with the outer cover through the hinges.

Further, a handle is fixed to the other end of the storage box main body.

Furthermore, a sponge sleeve is sleeved on the peripheral side face of the handle.

Furthermore, a storage battery is fixed inside the buffer box.

Furthermore, the filter screen is installed to the one end that deposits the case main part is kept away from to first L shape intake pipe, second L shape intake pipe and blast pipe.

The utility model discloses following beneficial effect has:

1. the utility model discloses a mutually supporting of U-shaped fixed block, U-shaped connecting rod, joint support pole, first circular section of thick bamboo, first circular piece, first spring, circular slide bar, second circular piece, the circular section of thick bamboo of second, second spring and rectangle fixed block can effectively carry out the shock attenuation at the in-process of transportation, has effectively avoided the inside semiconductor of device to receive the damage.

2. The utility model discloses a mutually supporting of first L shape intake pipe, first solenoid valve, second L shape intake pipe, second solenoid valve, semiconductor refrigeration piece, blast pipe, fan and temperature sensor can be effectual carries out constant temperature regulation and control to the temperature of device inside, provides a good environment of depositing for the semiconductor.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial view of the present invention;

FIG. 3 is a schematic structural view of the inside of the buffer box of the present invention;

fig. 4 is a sectional view of the buffer box of the present invention;

fig. 5 is a cross-sectional view of a first cylinder of the present invention;

fig. 6 is a cross-sectional view of a second cylinder of the present invention;

FIG. 7 is an enlarged view of the portion A of FIG. 2 according to the present invention;

fig. 8 is a cross-sectional view of a first L-shaped intake duct and a second L-shaped intake duct of the present invention;

fig. 9 is a sectional view of the exhaust pipe of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a storage box main body; 2. an outer cover; 3. a planar snap fastener; 4. a buffer tank; 5. a U-shaped fixing block; 6. a U-shaped connecting rod; 7. connecting the supporting rods; 8. a first circular cylinder; 9. a first circular block; 10. a first spring; 11. a circular slide bar; 12. a second circular block; 13. a second circular cylinder; 14. a second spring; 15. a rectangular fixed block; 16. a storage battery; 17. a wheel; 18. a first L-shaped air inlet pipe; 19. a first solenoid valve; 20. a second L-shaped air inlet pipe; 21. a second solenoid valve; 22. a semiconductor refrigeration sheet; 23. an exhaust pipe; 24. a fan; 25. a temperature sensor.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-9, the utility model relates to a semiconductor storage device, including storage box main body 1, install enclosing cover 2 on storage box main body 1, storage box main body 1 keeps away from one side of planar spring hasp 3 and is fixed with a plurality of hinges near the position department of enclosing cover 2, storage box main body 1 and enclosing cover 2 carry out the rotation connection through the hinge, be convenient for enclosing cover 2 to rotate, one side of storage box main body 1 upper end and near enclosing cover 2 is installed two planar spring hasps 3, storage box main body 1's lower extreme sliding connection has buffer box 4, buffer box 4's lower extreme is fixed with a plurality of wheels 17, buffer box 4's inside is fixed with battery 16, provide portable power source;

a plurality of U-shaped fixed blocks 5 are fixed at the lower end of the storage box main body 1, both ends of the U-shaped fixed blocks 5 are rotatably connected with U-shaped connecting rods 6, one ends of the U-shaped connecting rods 6, far away from the U-shaped fixed blocks 5, are rotatably connected with connecting supporting rods 7, one ends of the connecting supporting rods 7, far away from the U-shaped connecting rods 6, are respectively fixed with a first round block 9, the peripheral side surfaces of the connecting supporting rods 7 are respectively and slidably connected with a first round tube 8, the first round blocks 9 are connected with the first round cylinder 8 in a sliding way, the peripheral side surfaces of the connecting support rods 7 are sleeved with first springs 10, and the first springs 10 are all positioned between the first round block 9 and the first round cylinder 8, a rectangular fixed block 15 is fixed at one end of the first round cylinder 8 far away from the connecting support rod 7, the rectangular fixing blocks 15 are all fixed with the buffer tank 4, and hydraulic oil is arranged inside the first round cylinder 8 and on one side, far away from the connecting support rod 7, of the first round block 9;

the lower ends of the U-shaped fixed blocks 5 are all fixed with round slide bars 11, the peripheral side surfaces of the round slide bars 11 are all connected with second round cylinders 13 in a sliding mode, the second round cylinders 13 are all fixed with the buffer box 4, the lower ends of the round slide bars 11 are all fixed with second round blocks 12, the second round blocks 12 are all connected with the second round cylinders 13 in a sliding mode, and second springs 14 are arranged at the upper ends of the second round cylinders 13 and on the peripheral side surfaces of the round slide bars 11;

a first L-shaped air inlet pipe 18 is fixed at one end of the storage box main body 1, a first electromagnetic valve 19 is installed at the position, close to the storage box main body 1, of the first L-shaped air inlet pipe 18, a second L-shaped air inlet pipe 20 is fixed at one end of the storage box main body 1 and the position, close to the first L-shaped air inlet pipe 18, of the first L-shaped air inlet pipe 18, a second electromagnetic valve 21 is installed at the position, close to the storage box main body 1, of the second L-shaped air inlet pipe 20, a semiconductor refrigeration sheet 22 is fixed between the second L-shaped air inlet pipe 20 and the first L-shaped air inlet pipe 18, the hot end of the semiconductor refrigeration sheet 22 is located inside the first L-shaped air inlet pipe 18, the cold end of the semiconductor refrigeration sheet is located inside the second L-shaped air inlet pipe 20, an exhaust pipe 23 is fixed at the lower part of one end of the storage box main body 1, a fan 24 is installed inside the exhaust pipe 23, a temperature sensor 25 is installed inside the storage box main body 1, filter screens are installed at one ends, of the first L-shaped air inlet pipe 18, the second L-shaped air inlet pipe 20 and the exhaust pipe 23, far away from the storage box main body 1, the external impurities are convenient to filter;

the semiconductor refrigeration sheet 22 is an existing device, and utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the purpose of refrigeration can be achieved, the semiconductor refrigeration sheet is mainly used for an air conditioner, a cold and hot dual-purpose box, a water dispenser and an electronic mailbox, and the description is omitted for mature technology;

the temperature sensor 25 is a conventional device, is a sensor that senses temperature and converts the sensed temperature into a usable output signal, is often applied to the fields of water heaters, refrigerators, kitchen equipment, air conditioners and the like, and is a mature technology, and is not described herein in detail;

the other end of the storage box body 1 is fixed with a handle which is convenient for the movement of the device, and the sponge sleeve is sleeved on the peripheral side of the handle to provide comfort for a user.

One specific application of this embodiment is: when the device is used, the electric equipment is electrically connected with the storage battery 16, when the device is moved to shake, the storage box main body 1 is moved, so that the U-shaped fixing block 5 is driven to move, when the U-shaped fixing block 5 moves downwards, the U-shaped connecting rod 6 is rotationally connected with the U-shaped fixing block 5 due to the fact that the U-shaped connecting rod 6 is rotationally connected with the connecting supporting rod 7, the connecting supporting rod 7 is slidably connected with the first round tube 8, the first round tube 8 is fixedly connected with the rectangular fixing block 15, the first L-shaped air inlet pipe 18 is fixedly connected with the buffer box 4, so that the connecting supporting rod 7 moves inside the first round tube 8, as the hydraulic oil is arranged inside the first round tube 8, the first round block 9 compresses the hydraulic oil, energy absorption and buffering are carried out through compression of the hydraulic oil, when the U-shaped fixing block 5 moves downwards, as the round sliding rod 11 is slidably connected with the second round tube 13, the circular slide rod 11 is driven to move downwards, so that the distance between the U-shaped fixing block 5 and the second circular cylinder 13 is reduced, the second spring 14 is compressed and absorbed, when the U-shaped fixing block 5 moves upwards, the connecting support rod 7 is driven to move towards the direction far away from the first circular cylinder 8, and the first circular block 9 is fixedly connected with the connecting support rod 7, so that the first spring 10 is compressed and absorbed, the shock absorption can be effectively carried out in the transportation process, and the semiconductor in the device is effectively prevented from being damaged;

the interior of the first L-shaped air inlet pipe 18 is heated by starting the semiconductor refrigerating sheet 22, the interior of the second L-shaped air inlet pipe 20 is refrigerated, when the temperature in the device is higher than the set value of the temperature sensor 25, the second electromagnetic valve 21 is started, the second L-shaped air inlet pipe 20 is conducted, the fan 24 is started to generate suction force on the interior of the storage box main body 1, then the air enters the interior of the second L-shaped air inlet pipe 20 for refrigeration, the refrigerated air enters the interior of the storage box main body 1 for cooling, finally the refrigerated air is discharged from the exhaust pipe 23, when the temperature in the device is lower than the set value of the temperature sensor 25, the first L-shaped air inlet pipe 18 is conducted by starting the first electromagnetic valve 19, the fan 24 is started to generate suction force on the interior of the storage box main body 1, and then the air enters the interior of the first L-shaped air inlet pipe 18 for heating, the heated gas enters the storage box body 1 to be heated and is finally discharged from the exhaust pipe 23, when the temperature in the device reaches the set value of the temperature sensor 25, the first electromagnetic valve 19, the second electromagnetic valve 21, the semiconductor refrigerating sheet 22 and the fan 24 are all stopped to operate, the temperature in the device can be effectively regulated at constant temperature, and a good storage environment is provided for semiconductors.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor storage device includes a storage box body (1), characterized in that: the upper end of the storage box body (1) is rotatably connected with an outer cover (2), two planar snap fasteners (3) are arranged on one side of the upper end of the storage box body (1) and close to the outer cover (2), the lower end of the storage box body (1) is slidably connected with a buffer box (4), and a plurality of wheels (17) are fixed at the lower end of the buffer box (4);

the lower end of the storage box main body (1) is fixed with a plurality of U-shaped fixed blocks (5), the two ends of each U-shaped fixed block (5) are connected with a U-shaped connecting rod (6) in a rotating mode, one end, far away from the U-shaped fixed blocks (5), of each U-shaped connecting rod (6) is connected with a connecting support rod (7) in a rotating mode, one end, far away from the U-shaped connecting rods (6), of each connecting support rod (7) is fixed with a first round block (9), the circumferential side of each connecting support rod (7) is connected with a first round barrel (8) in a sliding mode, the first round blocks (9) are connected with the first round barrels (8) in a sliding mode, the circumferential side of each connecting support rod (7) is sleeved with a first spring (10), the first springs (10) are located between the first round blocks (9) and the first round barrels (8), one end, far away from the connecting support rods (7), of each round barrel (8) is fixed with a rectangular fixed block (15), the rectangular fixing blocks (15) are all fixed with the buffer box (4), and hydraulic oil is arranged inside the first round cylinder (8) and on one side, far away from the connecting support rod (7), of the first round block (9);

the lower extreme of U-shaped fixed block (5) all is fixed with circular slide bar (11), the equal sliding connection in all sides of circular slide bar (11) has the circular section of thick bamboo of second (13), just the circular section of thick bamboo of second (13) all is fixed with baffle-box (4), the lower extreme of circular slide bar (11) all is fixed with the circular piece of second (12), just circular piece of second (12) all with the circular section of thick bamboo of second (13) sliding connection, the upper end of the circular section of thick bamboo of second (13) and the side all is provided with second spring (14) that is located circular slide bar (11).

2. The semiconductor storage device according to claim 1, wherein a first L-shaped air inlet pipe (18) is fixed at one end of the storage box body (1), a first electromagnetic valve (19) is installed at a position, close to the storage box body (1), of the first L-shaped air inlet pipe (18), a second L-shaped air inlet pipe (20) is fixed at one end of the storage box body (1) and a position, close to the first L-shaped air inlet pipe (18), of the second L-shaped air inlet pipe (20), a second electromagnetic valve (21) is installed at a position, close to the storage box body (1), of the second L-shaped air inlet pipe (20), a semiconductor refrigeration piece (22) is fixed between the second L-shaped air inlet pipe (20) and the first L-shaped air inlet pipe (18), a hot end of the semiconductor refrigeration piece (22) is located inside the first L-shaped air inlet pipe (18), and a cold end of the semiconductor refrigeration piece (22) is located inside the second L-shaped air inlet pipe (20), the lower part of one end of the storage box main body (1) is fixed with an exhaust pipe (23), a fan (24) is arranged inside the exhaust pipe (23), and a temperature sensor (25) is arranged inside the storage box main body (1).

3. A semiconductor storage device as claimed in claim 1, wherein hinges are fixed to the storage box body (1) at a position away from the flat snap fastener (3) and close to the outer lid (2), and the storage box body (1) and the outer lid (2) are rotatably connected by the hinges.

4. A semiconductor storage device as claimed in claim 1, wherein a handle is fixed to the other end of the storage box body (1).

5. The semiconductor storage device as claimed in claim 4, wherein a sponge case is fitted around the peripheral side of the handle.

6. A semiconductor storage device as claimed in claim 1, wherein a battery (16) is fixed to the inside of the buffer tank (4).

7. A semiconductor storage device as claimed in claim 2, wherein the first L-shaped air inlet pipe (18), the second L-shaped air inlet pipe (20) and the air outlet pipe (23) are provided with a filter screen at the ends thereof far away from the storage box body (1).