CN216414696U - Novel multi-chip semiconductor packaging structure - Google Patents
Novel multi-chip semiconductor packaging structure Download PDFInfo
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- CN216414696U CN216414696U CN202122589231.9U CN202122589231U CN216414696U CN 216414696 U CN216414696 U CN 216414696U CN 202122589231 U CN202122589231 U CN 202122589231U CN 216414696 U CN216414696 U CN 216414696U
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Abstract
The utility model relates to the technical field of semiconductor packaging, and discloses a novel multi-chip semiconductor packaging structure which comprises a PCB, wherein a packaging mechanism is arranged outside the PCB and comprises a material storage box, a spring I, a piston and a winding wheel, the material storage box is connected with the piston, the piston is connected with the spring I, a rotating rod I is connected with the winding wheel, the rotating rod I is connected with a crank, the winding wheel is connected with a connecting rope, the connecting rope is connected with the piston, the rotating rod I is connected with a support frame, glue is filled in the material storage box, the inner wall of one side of the material storage box, which is in contact with the piston, is sealed, the purpose that the glue can be uniformly coated on the PCB is achieved by arranging the packaging mechanism, the packaging effect is better, the aim that the outer surface of the PCB can be uniformly coated with the glue is achieved by arranging an auxiliary mechanism, the packaging effect is better, more beautiful and simultaneously, the locking device can lock the sliding rod when not in use.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a novel multi-chip semiconductor packaging structure.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as computers, mobile phones or digital recorders, have very close association with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is one of the most influential applications of various semiconductor materials; when the existing PCB is packaged, the rubber tube is manually held by hand, and then the glue is extruded on the PCB, so that the thickness of the glue cannot be controlled to be consistent; there is therefore a need for a new multi-chip semiconductor package structure.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a novel multi-chip semiconductor package structure, which solves the above problems of the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel multi-chip semiconductor packaging structure, includes the PCB board, the outside of PCB board is provided with packaging mechanism, and packaging mechanism is including depositing magazine, spring one, piston, reel, dwang one, crank, deposits magazine and piston connection, and the piston is connected with spring one, and dwang one is connected with the reel, and dwang one is connected with the crank.
Preferably, the reel is connected with the connecting rope, the connecting rope is connected with the piston, the first spring is connected with the support frame, the first rotating rod is connected with the support frame, glue is filled in the material storage box, the inner wall of one side of the material storage box, which is in contact with the piston, is sealed, and the glue in the material storage box can flow out from the discharge port under the extrusion of the piston.
Preferably, the first rotating rod is connected with the driving wheel, the driving wheel is connected with the driven wheel through a belt, and the driven wheel is connected with the second rotating rod, so that the driving wheel can drive the driven wheel to rotate, and the conveying belt is driven to move.
Preferably, the outside of PCB board is provided with complementary unit, and complementary unit includes dwang two, conveyer belt, support frame, bracing piece, slide bar one, spring two, and dwang two is connected with the support frame, and the support frame is connected with the bracing piece, and the bracing piece is connected with the storage box for the storage box can obtain the holding power.
Preferably, the second rotating rod is connected with the first conveying wheel, the first conveying wheel is connected with the second conveying wheel through a conveying belt, and the conveying belt is connected with the PCB, so that the conveying belt can drive the PCB to move.
Preferably, the second conveying wheel is connected with the third rotating rod, the third rotating rod is connected with the support frame, and the first sliding rod is connected with the crank, so that the first sliding rod can limit the crank.
Preferably, the first sliding rod is connected with the support frame, the first sliding rod is connected with the second spring, and the second spring is connected with the crank, so that the second spring can provide elastic force to one side of the crank for the first sliding rod.
The utility model provides a novel multi-chip semiconductor packaging structure. The method has the following beneficial effects:
(1) according to the utility model, by arranging the packaging mechanism, the purposes that the glue can be uniformly coated on the PCB, the packaging effect is better and the appearance is more attractive are achieved.
(2) According to the utility model, by arranging the auxiliary mechanism, the purpose that the outer surface of the PCB can be uniformly coated with glue water, the packaging effect is better and more attractive, and meanwhile, the PCB is locked by the sliding rod when not in use is achieved.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a front cross-sectional view of the present invention;
FIG. 3 is a structural view of the driving wheel of the present invention;
fig. 4 is a structural view of the PCB panel of the present invention.
In the figure: the automatic packaging machine comprises a PCB (printed circuit board) 1, a packaging mechanism 2, an auxiliary mechanism 3, a crank 201, a first 202 rotating rod, a 203 reel, a 204 piston, a first 205 spring, a first 206 storage box, a 207 driving wheel, a 208 belt, a 209 driven wheel, a second 301 rotating rod, a 302 conveying belt, a 303 supporting frame, a 304 supporting rod, a first 305 sliding rod and a second 306 spring.
Detailed Description
As shown in fig. 1 to 4, the present invention provides a technical solution: a novel multi-chip semiconductor packaging structure comprises a PCB (printed circuit board) 1, wherein a packaging mechanism 2 is arranged outside the PCB 1, the packaging mechanism 2 comprises a storage box 206, a spring I205, a piston 204, a reel 203, a rotating rod I202 and a crank 201, the inner wall of the storage box 206 is in sliding connection with the outer wall of the piston 204, the outer wall of the piston 204 is fixedly connected with one end of the spring I205, the outer wall of the rotating rod I202 is fixedly connected with the inner wall of the reel 203, the outer wall of the rotating rod I202 is fixedly connected with the outer wall of the crank 201, the outer wall of the reel 203 is fixedly connected with one end of a connecting rope, the connecting rope is wound on the reel 203, the other end of the connecting rope is fixedly connected with the outer wall of the piston 204, the outer wall of the spring I205 is fixedly connected with the outer wall of a support frame 303, the outer wall of the rotating rod I202 is movably connected with the inner wall of the support frame 303 through a bearing I, glue is filled in the storage box 206, deposit the sealed setting of one side inner wall that magazine 206 and piston 204 contacted, the outer wall of dwang 202 and the outer wall fixed connection of action wheel 207, action wheel 207 with pass through belt 208 transmission from driving wheel 209 and be connected, the outer wall of follow driving wheel 209 and the outer wall fixed connection of dwang two 301, through setting up packaging mechanism 2, through rotating crank 201, crank 201 drives dwang 202 and rotates, dwang 202 drives reel 203 and rotates, reel 203 drives the connection rope and removes, make the connection rope loosen from the reel, drive piston 204 downstream under the effect of spring 205, make piston 204 will deposit the glue in the magazine 206 and extrude along the discharge gate, make glue at the uniform velocity extrude, even coating is on the surface of PCB board 1, reached and made the even coating of glue on PCB board 1, make the encapsulation effect better, more pleasing to the eye purpose.
The outer part of the PCB 1 is provided with an auxiliary mechanism 3, the auxiliary mechanism 3 comprises a second rotating rod 301, a conveying belt 302, a supporting frame 303, a supporting rod 304, a first sliding rod 305 and a second spring 306, the outer wall of the second rotating rod 301 is movably connected with the inner wall of the supporting frame 303 through a second bearing, the outer wall of the supporting frame 303 is fixedly connected with one end of the supporting rod 304, the other end of the supporting rod 304 is fixedly connected with the outer wall of the material storage box 206, the outer wall of the second rotating rod 301 is fixedly connected with the inner wall of a first conveying wheel, the first conveying wheel and the second conveying wheel are in transmission connection through the conveying belt 302, the outer wall of the conveying belt 302 is in sliding connection with the outer wall of the PCB 1, the inner wall of the second conveying wheel is fixedly connected with the outer wall of a third rotating rod, the outer wall of the third rotating rod is movably connected with the inner wall of the supporting frame 303 through a third bearing, the outer wall of the first sliding rod 305 is in sliding connection with the inner wall of the crank 201, and the outer wall of the first sliding rod 305 is in sliding connection with the inner wall of the supporting frame 303, the outer surface of the support frame 303 is provided with a limit groove, the inner wall of the limit groove is in sliding connection with the outer wall of the first sliding rod 305, the outer wall of the first sliding rod 305 is fixedly connected with one end of the second spring 306, the other end of the second spring 306 is fixedly connected with the outer wall of the crank 201, an auxiliary mechanism 3 is arranged, the rotating rod 202 rotates to drive the driving wheel 207 to rotate, the driving wheel 207 is in transmission connection with the driven wheel 209 through a belt 208, the driven wheel 209 drives the rotating rod 301 to rotate, the rotating rod 301 drives the conveying wheel to rotate, the conveying wheel I and the conveying wheel II are in transmission connection through a conveying belt 302, so that the PCB 1 can move while glue flows out from the material storage box 206, the glue can be uniformly coated on the surface of the PCB 1, after the glue is coated, the first sliding rod 305 is loosened, and the first sliding rod 305 can be clamped into the outer surface of the support frame 303 under the action of the second spring 306, make a slide bar 305 can carry on spacingly to crank 201, reached the coating glue that makes the surface of PCB board 1 can be even for the encapsulation effect is better, and is more pleasing to the eye, when not using, carries out the purpose of locking to it through a slide bar 305 simultaneously.
When the packaging mechanism 2 is used, the crank 201 is rotated, the crank 201 drives the rotating rod 202 to rotate, the rotating rod 202 drives the reel 203 to rotate, the reel 203 drives the connecting rope to move, the connecting rope is loosened from the reel, the piston 204 is driven to move downwards under the action of the spring I205, the piston 204 extrudes glue in the material storage box 206 along the discharge port, the glue is extruded at a constant speed and evenly coated on the outer surface of the PCB 1, the glue can be evenly coated on the PCB 1, the packaging effect is better, the purpose of being more attractive is achieved, the auxiliary mechanism 3 is arranged, the rotating rod I202 rotates to drive the driving wheel 207 to rotate, the driving wheel 207 is in transmission connection with the driven wheel 209 through a belt 208, the driven wheel 209 drives the rotating rod II 301 to rotate, the rotating rod II 301 drives the conveying wheel to rotate, and the conveying wheel I is in transmission connection with the conveying wheel II through the conveying belt 302, make PCB board 1 can remove when glue flows out from the material storage box 206, make the coating that glue can be even on the surface of PCB board 1, after scribbling, loosen slide bar 305, make slide bar 305 can block into the surface of support frame 303 under the effect of spring two 306, make slide bar 305 can carry on spacingly to crank 201, reached the coating glue that makes the surface of PCB board 1 can be even, make the encapsulation effect better, and is more pleasing to the eye, when not used simultaneously, carry out the purpose of locking to it through slide bar 305.
In conclusion, although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made herein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A novel multi-chip semiconductor packaging structure comprises a PCB (1), and is characterized in that: the packaging mechanism (2) is arranged outside the PCB (1), the packaging mechanism (2) comprises a material storage box (206), a first spring (205), a piston (204), a reel (203), a first rotating rod (202) and a crank (201), the material storage box (206) is connected with the piston (204), the piston (204) is connected with the first spring (205), the first rotating rod (202) is connected with the reel (203), and the first rotating rod (202) is connected with the crank (201).
2. The novel multi-chip semiconductor package structure of claim 1, wherein: the reel (203) is connected with the connecting rope, the connecting rope is connected with the piston (204), the first spring (205) is connected with the support frame (303), the first rotating rod (202) is connected with the support frame (303), glue is filled in the material storage box (206), and the inner wall of one side, in contact with the piston (204), of the material storage box (206) is sealed.
3. The novel multi-chip semiconductor package structure of claim 2, wherein: the first rotating rod (202) is connected with the driving wheel (207), the driving wheel (207) is connected with the driven wheel (209) through a belt (208), and the driven wheel (209) is connected with the second rotating rod (301).
4. The novel multi-chip semiconductor package structure of claim 3, wherein: the outer portion of PCB board (1) is provided with complementary unit (3), and complementary unit (3) includes dwang two (301), conveyer belt (302), support frame (303), bracing piece (304), slide bar one (305), spring two (306), and dwang two (301) are connected with support frame (303), and support frame (303) are connected with bracing piece (304), and bracing piece (304) are connected with material storage box (206).
5. The novel multi-chip semiconductor package structure of claim 4, wherein: and the rotating rod II (301) is connected with the conveying wheel I, the conveying wheel I is connected with the conveying wheel II through the conveying belt (302), and the conveying belt (302) is connected with the PCB (1).
6. The novel multi-chip semiconductor package structure of claim 5, wherein: the second conveying wheel is connected with the third rotating rod, the third rotating rod is connected with the support frame (303), and the first sliding rod (305) is connected with the crank (201).
7. The novel multi-chip semiconductor package structure of claim 6, wherein: the first sliding rod (305) is connected with the support frame (303), the first sliding rod (305) is connected with the second spring (306), and the second spring (306) is connected with the crank (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122589231.9U CN216414696U (en) | 2021-10-25 | 2021-10-25 | Novel multi-chip semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122589231.9U CN216414696U (en) | 2021-10-25 | 2021-10-25 | Novel multi-chip semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216414696U true CN216414696U (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122589231.9U Active CN216414696U (en) | 2021-10-25 | 2021-10-25 | Novel multi-chip semiconductor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216414696U (en) |
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2021
- 2021-10-25 CN CN202122589231.9U patent/CN216414696U/en active Active
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