CN216391861U - Light-emitting diode circuit board heat radiation structure - Google Patents
Light-emitting diode circuit board heat radiation structure Download PDFInfo
- Publication number
- CN216391861U CN216391861U CN202122333070.7U CN202122333070U CN216391861U CN 216391861 U CN216391861 U CN 216391861U CN 202122333070 U CN202122333070 U CN 202122333070U CN 216391861 U CN216391861 U CN 216391861U
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- Prior art keywords
- circuit board
- heat
- heat dissipation
- ring
- conducting plate
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- 230000005855 radiation Effects 0.000 title claims description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 57
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 16
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 16
- 241001330002 Bambuseae Species 0.000 claims description 16
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 16
- 239000011425 bamboo Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 17
- 238000003466 welding Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a light-emitting diode circuit board heat dissipation structure which comprises a mounting ring, wherein a supporting cylinder is welded at the top end of the mounting ring, a heat conduction plate is arranged inside the supporting cylinder, a circuit board is arranged at the top end of the heat conduction plate, an air inlet and an air outlet are respectively formed in two sides of the supporting cylinder, a fan is arranged at the air inlet, a threaded cylinder is in threaded connection with the top of the supporting cylinder, a heat dissipation ring is welded at the top end of the threaded cylinder, a protection cover is arranged at the top end of the heat dissipation ring, and a plurality of fixing holes are formed in the top end of the mounting ring. According to the utility model, the heat emitted by the circuit board during working can be absorbed by the heat conducting plate, then, cold air can pass through the bottom of the heat conducting plate through the rotation of the fan, and the heat absorbed by the heat conducting plate can be taken away by the cold air, so that the circuit board is cooled, meanwhile, the top of the circuit board absorbs heat through the threaded cylinder and then radiates heat through the radiating ring, so that the top space of the circuit board is radiated, and the overall radiating performance of the circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of light emitting diodes, in particular to a heat dissipation structure of a light emitting diode circuit board.
Background
The light emitting diode is a common light emitting device, releases energy through the recombination of electrons and holes to emit light, has wide application in the field of illumination, can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like.
When the existing high-power light-emitting diode is used, because an internal circuit board is generally a sealing structure, the heat dissipation effect of the circuit board is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a heat dissipation structure of a light-emitting diode circuit board.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a LED circuit board heat radiation structure, includes the collar, the top welding of collar has a support section of thick bamboo, and the inside of a support section of thick bamboo is equipped with the heat-conducting plate, and the top of heat-conducting plate is equipped with the circuit board, the both sides of a support section of thick bamboo are equallyd divide and are do not seted up fresh air inlet and exhaust vent, and fresh air inlet department is equipped with the fan, the top threaded connection of a support section of thick bamboo has a screw thread section of thick bamboo, and the top welding of a screw thread section of thick bamboo has the cooling ring, and the top of cooling ring is equipped with the safety cover.
Furthermore, a plurality of fixing holes are formed in the top end of the mounting ring, and fixing screws are arranged inside the fixing holes.
Furthermore, a plurality of heat dissipation plates are welded at the bottom end of the heat conduction plate.
Furthermore, the top end of the heat conducting plate is provided with a rubber ring, and the rubber ring is positioned at the bottom end of the circuit board.
Furthermore, a plurality of convex blocks are welded on the outer portion of the heat dissipation ring.
Furthermore, the inner wall of the threaded cylinder is coated with a reflective material.
Furthermore, the welding of one side inner wall of a support section of thick bamboo has the retainer plate, and the retainer plate is located one side of fresh air inlet, the fan is in the inside of retainer plate, and the inside of fresh air inlet is equipped with the filter screen.
Furthermore, a rubber pad is bonded at the bottom of the mounting ring.
The utility model has the beneficial effects that:
1. by arranging the heat conducting plate, the fan and the heat dissipation ring, the heat conducting plate can absorb heat emitted by the circuit board during working, then cold air can pass through the bottom of the heat conducting plate through the rotation of the fan, the heat absorbed by the heat conducting plate can be taken away by the cold air, so that the circuit board is cooled, meanwhile, the top of the circuit board absorbs heat through the threaded cylinder and then radiates heat through the heat dissipation ring, so that the top space of the circuit board is radiated, and the overall heat radiation performance of the circuit board is improved;
2. by arranging the heat dissipation plates, cold air can pass through gaps among the heat dissipation plates, so that the heat dissipation effect of the cold air on the heat conduction plate is improved, and the heat dissipation efficiency of the device is improved;
3. by arranging the threaded cylinder and the rubber ring, the threaded cylinder can be moved downwards by rotating the threaded cylinder, so that the circuit board is fixed on the heat conducting plate, and the rubber ring can protect the circuit board and prevent the circuit board from being damaged by pressing;
4. by arranging the convex block, on one hand, the convex block can increase the contact area between the radiating ring and the air so as to increase the radiating effect of the radiating ring, and on the other hand, the convex block can increase the friction force of the radiating ring so as to facilitate the rotation of the threaded cylinder through the radiating ring and fix the circuit board;
5. by arranging the reflective material, the reflective material on the inner wall of the threaded cylinder is convenient for the light-emitting diode on the circuit board to emit light, so that the lighting effect of the light-emitting diode is improved;
6. by arranging the filter screen, external dust can be prevented from entering, so that the heat dissipation effect of the heat conduction plate is influenced;
7. through setting up the rubber pad, the collar of being convenient for installs, stability after the installation of hoisting device.
Drawings
Fig. 1 is a front view structural cross-sectional view of a heat dissipation structure of a circuit board of a light emitting diode provided in embodiment 1;
fig. 2 is a schematic cross-sectional structural view of a heat dissipation structure of a circuit board of a light emitting diode according to embodiment 1;
fig. 3 is a schematic cross-sectional structural diagram of a heat dissipation structure of a circuit board of a light emitting diode in embodiment 2.
In the figure: the heat dissipation device comprises a mounting ring 1, a fixing hole 2, an air outlet hole 3, a supporting cylinder 4, a heat dissipation plate 5, a heat conduction plate 6, a circuit board 7, a protective cover 8, a heat dissipation ring 9, a bump 10, a threaded cylinder 11, a rubber ring 12, a fixing ring 13, an air inlet hole 14, a fan 15, a filter screen 16 and a rubber pad 17.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-2, a light emitting diode circuit board heat dissipation structure, including a mounting ring 1, a supporting cylinder 4 welded on the top of the mounting ring 1, a heat conducting plate 6 arranged inside the supporting cylinder 4, a circuit board 7 arranged on the top of the heat conducting plate 6, an air inlet 14 and an air outlet 3 respectively arranged on both sides of the supporting cylinder 4, a fan 15 arranged at the air inlet 14, a threaded cylinder 11 connected with the top of the supporting cylinder 4 by screw thread, a heat dissipation ring 9 welded on the top of the threaded cylinder 11, a protective cover 8 arranged on the top of the heat dissipation ring 9, the heat dissipated by the circuit board 7 during operation can be absorbed by the heat conducting plate 6, then the cold air can pass through the bottom of the heat conducting plate 6 by the rotation of the fan 15, the heat absorbed by the heat conducting plate 6 can be taken away by the cold air, thereby cooling the circuit board 7, meanwhile, the top can absorb heat by the threaded cylinder 11 and dissipate heat by the heat dissipation ring 9, thereby radiating the top space of the circuit board 7 and improving the overall heat radiation performance of the circuit board 7.
Wherein, a plurality of fixed orificess 2 have been seted up on the top of collar 1, and the inside of fixed orificess 2 is equipped with set screw, can install fixedly the device through set screw.
Wherein, the bottom welding of heat-conducting plate 6 has a plurality of heating panels 5, and the cold air can pass through the space between the heating panel 5 to promote the radiating effect of cold air to heat-conducting plate 6, with hoisting device's radiating efficiency.
Wherein, the top of heat-conducting plate 6 is equipped with rubber circle 12, and rubber circle 12 is in the bottom of circuit board 7, can make a screw thread section of thick bamboo 11 move down through rotating a screw thread section of thick bamboo 11 to fix circuit board 7 on heat-conducting plate 6, rubber circle 12 can protect circuit board 7, avoids circuit board 7 to press the damage.
Wherein, the outside welding of heat dissipation ring 9 has a plurality of lugs 10, and lug 10 can promote the area of contact of heat dissipation ring 9 and air on the one hand to promote the radiating effect of heat dissipation ring 9, on the other hand can promote the frictional force of heat dissipation ring 9, thereby be convenient for rotate threaded cylinder 11 through heat dissipation ring 9, fix circuit board 7.
The inner wall of the threaded cylinder 11 is coated with a reflective material, so that the light-emitting diode on the circuit board 7 can emit light conveniently through the reflective material, and the lighting effect of the light-emitting diode is improved.
Wherein, the welding of one side inner wall of a support section of thick bamboo 4 has retainer plate 13, and retainer plate 13 is in one side of air inlet 14, and fan 15 is in the inside of retainer plate 13, and the inside of air inlet 14 is equipped with filter screen 16, can avoid outside dust to get into through filter screen 16 to influence the radiating effect of heat-conducting plate 6.
The working principle is as follows: the heat conducting plate 6 can absorb the heat emitted by the circuit board 7 during working, then the fan 15 rotates, cold air can pass through the bottom of the heat conducting plate 6, the heat absorbed by the heat conducting plate 6 can be taken away by the cold air, so that the circuit board 7 is cooled, meanwhile, the top of the circuit board 7 absorbs the heat through the threaded cylinder 11 and then radiates the heat through the radiating ring 9, so that the top space of the circuit board 7 is radiated, and the overall radiating performance of the circuit board 7 is improved;
the cold air can pass through the gaps between the heat dissipation plates 5, so that the heat dissipation effect of the cold air on the heat conduction plate 6 is improved, and the heat dissipation efficiency of the device is improved;
the threaded cylinder 11 can be moved downwards by rotating the threaded cylinder 11, so that the circuit board 7 is fixed on the heat conducting plate 6, and the rubber ring 12 can protect the circuit board 7 and prevent the circuit board 7 from being damaged by pressing;
the convex block 10 can increase the contact area of the heat dissipation ring 9 and air, so as to increase the heat dissipation effect of the heat dissipation ring 9, and can increase the friction force of the heat dissipation ring 9, so as to facilitate the rotation of the threaded cylinder 11 through the heat dissipation ring 9, and fix the circuit board 7;
the light-emitting diodes on the circuit board 7 can emit light conveniently through the reflective material, so that the lighting effect of the light-emitting diodes is improved;
the filter screen 16 can prevent external dust from entering, thereby affecting the heat dissipation effect of the heat conducting plate 6.
Example 2
Referring to fig. 3, in this embodiment, compared with embodiment 1, in order to increase the practicability of the device, a rubber pad 17 is bonded to the bottom of the mounting ring 1, and the mounting ring 1 is convenient to mount through the rubber pad 17, so that the stability of the device after being mounted is improved.
The working principle is as follows: the heat conducting plate 6 can absorb the heat emitted by the circuit board 7 during working, then the fan 15 rotates, cold air can pass through the bottom of the heat conducting plate 6, the heat absorbed by the heat conducting plate 6 can be taken away by the cold air, so that the circuit board 7 is cooled, meanwhile, the top of the circuit board 7 absorbs the heat through the threaded cylinder 11 and then radiates the heat through the radiating ring 9, so that the top space of the circuit board 7 is radiated, and the overall radiating performance of the circuit board 7 is improved;
the cold air can pass through the gaps between the heat dissipation plates 5, so that the heat dissipation effect of the cold air on the heat conduction plate 6 is improved, and the heat dissipation efficiency of the device is improved;
the threaded cylinder 11 can be moved downwards by rotating the threaded cylinder 11, so that the circuit board 7 is fixed on the heat conducting plate 6, and the rubber ring 12 can protect the circuit board 7 and prevent the circuit board 7 from being damaged by pressing;
the convex block 10 can increase the contact area of the heat dissipation ring 9 and air, so as to increase the heat dissipation effect of the heat dissipation ring 9, and can increase the friction force of the heat dissipation ring 9, so as to facilitate the rotation of the threaded cylinder 11 through the heat dissipation ring 9, and fix the circuit board 7;
the light-emitting diodes on the circuit board 7 can emit light conveniently through the reflective material, so that the lighting effect of the light-emitting diodes is improved;
the filter screen 16 can prevent external dust from entering, thereby affecting the heat dissipation effect of the heat conduction plate 6;
the rubber pad 17 is convenient for the installation of the installation ring 1, and the stability of the device after installation is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (8)
1. The utility model provides a LED circuit board heat radiation structure, includes collar (1), its characterized in that, the top fixedly connected with of collar (1) supports a section of thick bamboo (4), and the inside of a support section of thick bamboo (4) is equipped with heat-conducting plate (6), and the top of heat-conducting plate (6) is equipped with circuit board (7), intake (14) and exhaust vent (3) have respectively been seted up to the both sides of a support section of thick bamboo (4) are equallyd divide, and intake (14) department is equipped with fan (15), the top threaded connection of a support section of thick bamboo (4) has a screw thread section of thick bamboo (11), the top fixedly connected with radiating ring (9) of a screw thread section of thick bamboo (11), and the top of radiating ring (9) is equipped with safety cover (8).
2. The heat dissipation structure of the LED circuit board according to claim 1, wherein the top end of the mounting ring (1) is provided with a plurality of fixing holes (2), and fixing screws are arranged inside the fixing holes (2).
3. The heat dissipation structure for LED circuit board as claimed in claim 1, wherein the bottom end of the heat conducting plate (6) is fixedly connected with a plurality of heat dissipation plates (5).
4. The heat dissipation structure of the LED circuit board as claimed in claim 1, wherein a rubber ring (12) is disposed at the top end of the heat conducting plate (6), and the rubber ring (12) is disposed at the bottom end of the circuit board (7).
5. The LED circuit board heat dissipation structure of claim 1, wherein a plurality of bumps (10) are fixedly connected to the outside of the heat dissipation ring (9).
6. The heat dissipation structure of the LED circuit board as claimed in claim 1, wherein the inner wall of the screw cylinder (11) is coated with a reflective material.
7. The LED circuit board heat dissipation structure of claim 1, wherein a fixing ring (13) is fixedly connected to an inner wall of one side of the support cylinder (4), the fixing ring (13) is located at one side of the air inlet hole (14), the fan (15) is located inside the fixing ring (13), and a filter screen (16) is arranged inside the air inlet hole (14).
8. The heat dissipation structure of LED circuit board as claimed in claim 1, wherein a rubber pad (17) is bonded to the bottom of the mounting ring (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122333070.7U CN216391861U (en) | 2021-09-26 | 2021-09-26 | Light-emitting diode circuit board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122333070.7U CN216391861U (en) | 2021-09-26 | 2021-09-26 | Light-emitting diode circuit board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216391861U true CN216391861U (en) | 2022-04-26 |
Family
ID=81241956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122333070.7U Expired - Fee Related CN216391861U (en) | 2021-09-26 | 2021-09-26 | Light-emitting diode circuit board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216391861U (en) |
-
2021
- 2021-09-26 CN CN202122333070.7U patent/CN216391861U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220426 |