CN216389327U

CN216389327U - Ultra-thin TFT backlight unit backplate of high plane degree

Info

Publication number: CN216389327U
Application number: CN202122796631.7U
Authority: CN
Inventors: 李培; 吉庆; 焦兰
Original assignee: Guangdong Runsheng Technology Materials Co ltd
Current assignee: Guangdong Runsheng Technology Materials Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-04-26
Anticipated expiration: 2031-11-16

Abstract

The utility model discloses a high-flatness ultrathin TFT backlight module backboard, which comprises an installation box and a backboard body, wherein any one side of the installation box is provided with a groove, the top of the installation box is provided with an insertion hole which is arranged corresponding to the groove, the backboard body matched with the groove is inserted and arranged in the insertion hole, the inner wall of the groove is fixedly provided with a semiconductor refrigeration sheet, the cold end face of the semiconductor refrigeration piece is contacted and connected with the back plate body, one side of the inside of the installation box, which is adjacent to the groove, is fixedly provided with a radiating fin, and a plurality of heat conducting copper blocks which penetrate through the installation box and are connected with the hot end face of the semiconductor refrigeration piece are fixedly connected on the radiating fin, through the mutual matching of the semiconductor refrigeration sheet, the heat conduction copper block, the heat radiation sheet, the heat radiation fan and the heat radiation hole, thereby can dispel the heat fast to it to effectively prevent that the inside more thermal condition of gathering of backplate body from taking place.

Description

Ultra-thin TFT backlight unit backplate of high plane degree

Technical Field

The utility model relates to the technical field of display, in particular to a high-flatness ultrathin TFT backlight module backboard.

Background

The TFT is a thinfilm transistor, which is a main driving element in an AMOLED display device and is directly related to the development direction of a high-performance flat panel display device, in the prior art, a TFT backplane easily gathers more heat during long-time use in the use process, and the heat is volatilized and cannot be discharged, so that the internal elements are overheated and aged, and the service life of the whole device is short, and the use cost is high.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-flatness ultrathin TFT backlight module backboard, which is used for solving the problems that the traditional TFT backboard in the background art easily causes the backboard to gather more heat when being used for a long time, and the heat is volatilized and can not be removed, so that internal elements are overheated and aged, the service life of the whole backboard is short, and the use cost is high.

In order to achieve the purpose, the utility model provides the following technical scheme: a high-flatness ultra-thin TFT backlight module backboard comprises an installation box and a backboard body, a groove is arranged at any side of the installation box, a jack arranged corresponding to the groove is arranged at the top of the installation box, a back plate body matched with the groove is inserted in the jack, a semiconductor refrigerating sheet is fixedly arranged on the inner wall of the groove, the cold end face of the semiconductor refrigeration sheet is in contact connection with the back plate body, a radiating fin is fixedly arranged at one side of the inside of the installation box adjacent to the groove, a plurality of heat conducting copper blocks which penetrate through the installation box and are connected with the hot end surface of the semiconductor refrigeration piece are fixedly connected on the heat radiating piece, one side of the radiating fin, which deviates from the heat conduction copper block, is fixedly provided with a radiating fan, one side of the mounting box, which deviates from the groove, is provided with a radiating hole communicated with the inside of the mounting box, and a dustproof mechanism is fixedly arranged inside the radiating hole.

According to a preferred technical scheme, the dustproof mechanism comprises a dustproof net, two connecting blocks, two sliding blocks, two springs and two inserting rods, the connecting blocks are fixedly arranged at two ends of the dustproof net, sliding grooves are formed in the two connecting blocks, the sliding blocks are arranged in the two sliding grooves in a sliding mode, the springs fixedly connected with the side walls of the sliding grooves are fixedly connected to the bottoms of the two sliding blocks, the inserting rods are fixedly connected to the tops of the two sliding blocks, inserting grooves are formed in two sides of the inner wall of the radiating hole, and one ends, away from the sliding blocks, of the two inserting rods penetrate through the connecting blocks and are respectively connected with the two inserting grooves in a clamping mode.

As a preferable technical scheme of the utility model, one end of the top of the jack is hinged with a sealing plug.

As a preferred technical scheme of the utility model, the bottom of the groove is provided with a clamping groove, and the clamping groove is connected with the bottom of the back plate body in a clamping manner.

As a preferable technical scheme of the utility model, one sides of the two sliding blocks, which are far away from the sliding groove, are fixedly connected with poke rods, and one ends of the two poke rods respectively extend to the outside from the two connecting blocks.

Compared with the prior art, the utility model has the beneficial effects that: the insertion hole, the sealing plug, the groove, the clamping groove and the visual glass are mutually matched, so that the back plate body is conveniently inserted into the groove along the insertion hole, the bottom of the back plate body is inserted into the clamping groove for limiting and fixing, and the back plate body is conveniently and quickly installed; in the use, through mutually supporting of semiconductor refrigeration piece, heat conduction copper billet, fin, radiator fan and louvre to can dispel the heat fast to it, thereby effectively prevent that the inside more heat of gathering of backplate body from leading to the component ageing, the higher condition of whole use cost takes place.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

fig. 2 is a side sectional structural schematic view of the present invention.

In the figure: 1. installing a box; 2. a back plate body; 3. a groove; 4. a card slot; 5. a jack; 6. a semiconductor refrigeration sheet; 7. a heat-conducting copper block; 8. a heat sink; 9. a heat radiation fan; 10. a slot; 11. a dust screen; 12. connecting blocks; 13. a spring; 14. a slider; 15. inserting a rod; 16. a sealing plug; 17. a poke rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the utility model provides a high-flatness ultrathin TFT backlight module backboard, comprising an installation box 1 and a backboard body 2, wherein any one side of the installation box 1 is provided with a groove 3, the top of the installation box 1 is provided with an insertion hole 5 corresponding to the groove 3, the inside of the insertion hole 5 is inserted with the backboard body 2 matched with the groove 3, the backboard body 2 is inserted into the groove 3 along an insertion slot 10, the inner wall of the groove 3 is fixedly provided with a semiconductor refrigeration sheet 6, the cold end surface of the semiconductor refrigeration sheet 6 is in contact connection with the backboard body 2, one side of the installation box 1 adjacent to the groove 3 is fixedly provided with a heat sink 8, the heat sink 8 is fixedly connected with a plurality of heat-conducting copper blocks 7 penetrating through the installation box 1 and connected with the hot end surface of the semiconductor refrigeration sheet 6, one side of the heat sink 8 departing from the heat-conducting copper blocks 7 is fixedly provided with a heat-dissipating fan 9, the heat transfer is absorbed with the heat that produces backplate body 2 to the cold junction face of semiconductor refrigeration piece 6 to transmit to hot terminal surface, be conducting the heat to fin 8 through the heat dissipation copper billet fast, utilize radiator fan 9 to dispel the heat to it, effective inside high temperature causes the component of backplate body 2 to age, install bin 1 deviates from one side of recess 3 offered with the inside communicating louvre of install bin 1, the fixed dustproof mechanism that is provided with in inside of louvre.

Preferably, dustproof mechanism includes dust screen 11, two connecting blocks 12, two sliders 14, two springs 13 and two inserted bars 15, the equal fixed connecting block 12 that is provided with in both ends of dust screen 11, the spout has all been seted up to the inside of two connecting blocks 12, the inside of two spouts is all slided and is provided with slider 14, the equal fixedly connected with in bottom of two sliders 14 and spout lateral wall fixed connection's spring 13, the equal fixedly connected with inserted bar 15 in top of two sliders 14, slot 10 has all been seted up to the both sides of radiating hole inner wall, two inserted bars 15 deviate from the one end of slider 14 and all pass connecting block 12 and be connected with two slot 10 blocks respectively, thereby it fixes dust screen 11 to drive inserted bar 15 to insert slot 10 through spring 13's tension, prevent that external dust from getting into 1 insidely of install bin.

Preferably, one end at the top of the jack 5 is hinged with a sealing plug 16, so that the jack 5 is conveniently plugged, and the back plate body 2 is fixedly arranged in the groove 3.

Preferably, the bottom of the groove 3 is provided with a clamping groove 4, and the clamping groove 4 is connected with the bottom of the backboard body 2 in a clamping manner, so that the backboard is limited and fixed, and is convenient to mount.

Preferably, two sliders 14 deviate from equal fixedly connected with poker rod 17 in one side of spout, and the one end of two poker rods 17 is followed respectively and is passed two connecting blocks 12 and extend to the external world, stirs poker rod 17 through manual and drives 14 extrusion springs 13 of slider to make inserted bar 15 break away from slot 10, thereby the convenience is dismantled the washing to dust screen 11.

When in use, the ultrathin TFT backlight module backboard with high flatness is used, firstly, the backboard body 2 is installed, the backboard body 2 is inserted into the groove 3 along the jack 5 until the bottom of the backboard body 2 is inserted into the clamping groove 4, so that the backboard body 2 is limited and fixed, when the sealing plug 16 is plugged, in the working process of the backboard body 2, the heat gathered by the backboard body 2 and the cold end surface of the semiconductor refrigeration sheet 6 exchange heat rapidly, the heat absorbed by the cold end surface of the semiconductor refrigeration sheet 6 is transferred to the hot end surface rapidly, on conducting the heat to fin 8 fast through heat conduction copper billet 7, cooling through starting radiator fan 9 heat on to fin 8, whole cooling is effectual, thereby effectively prevents that the inside more heat of gathering of backplate body 2 from leading to the component ageing, and the higher condition of whole use cost takes place.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides an ultra-thin type TFT backlight unit backplate of high plane degree, includes install bin (1) and backplate body (2), its characterized in that: arbitrary one side of install bin (1) is seted up flutedly (3), jack (5) that correspond the setting with recess (3) are seted up at the top of install bin (1), the inside interlude of jack (5) is provided with backplate body (2) that match with recess (3), the fixed semiconductor refrigeration piece (6) that are provided with in inner wall of recess (3), just the cold terminal surface and backplate body (2) contact connection of semiconductor refrigeration piece (6), install bin (1) inside is fixed with fin (8) with one side that recess (3) is adjacent, fixedly connected with is a plurality of heat conduction copper billet (7) of passing install bin (1) and being connected with semiconductor refrigeration piece (6) hot terminal surface on fin (8), one side fixed mounting that fin (8) deviate from heat conduction copper billet (7) has radiator fan (9), install bin (1) one side that deviates from recess (3) is seted up with install bin (1) inside communicating heat dissipation hole And a dustproof mechanism is fixedly arranged inside the heat dissipation hole.

2. The high-flatness ultra-thin TFT backlight module backboard of claim 1, wherein: dustproof mechanism includes dust screen (11), two connecting blocks (12), two sliders (14), two springs (13) and two inserted bars (15), the both ends of dust screen (11) are all fixed and are provided with connecting block (12), two the spout has all been seted up to the inside of connecting block (12), two the inside of spout all slides and is provided with slider (14), two the equal fixedly connected with in bottom of slider (14) and spout lateral wall fixed connection's spring (13), two the equal fixedly connected with inserted bar (15) in top of slider (14), slot (10), two have all been seted up to the both sides of radiating hole inner wall the one end that inserted bar (15) deviate from slider (14) all passes connecting block (12) and is connected with two slot (10) blocks respectively.

3. The high-flatness ultra-thin TFT backlight module backboard of claim 1, wherein: one end of the top of the jack (5) is hinged with a sealing plug (16).

4. The high-flatness ultra-thin TFT backlight module backboard of claim 2, wherein: the bottom of the groove (3) is provided with a clamping groove (4), and the clamping groove (4) is connected with the bottom of the backboard body (2) in a clamping manner.

5. The high-flatness ultra-thin TFT backlight module backboard of claim 2, wherein: two equal fixedly connected with poker rod (17) in one side that slider (14) deviate from the spout, two the one end of poker rod (17) passes two connecting blocks (12) respectively and extends to the external world.