CN216389287U - Semiconductor chip surface treatment equipment with scrap collecting function - Google Patents
Semiconductor chip surface treatment equipment with scrap collecting function Download PDFInfo
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- CN216389287U CN216389287U CN202123422809.8U CN202123422809U CN216389287U CN 216389287 U CN216389287 U CN 216389287U CN 202123422809 U CN202123422809 U CN 202123422809U CN 216389287 U CN216389287 U CN 216389287U
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- semiconductor chip
- surface treatment
- slide rail
- chip surface
- scrap
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 87
- 238000004381 surface treatment Methods 0.000 title claims abstract description 46
- 230000000694 effects Effects 0.000 abstract description 13
- 238000004140 cleaning Methods 0.000 abstract description 10
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Abstract
The utility model discloses semiconductor chip surface treatment equipment with a scrap collecting function, which comprises a workbench and supporting legs, wherein a collecting tank is arranged on the upper surface of the workbench, a receiving tank is arranged at the bottom of the workbench and positioned at the lower end of the collecting tank, a scrap drawer is arranged in the receiving tank, fixing plates are arranged on the upper surface of the workbench and positioned at two sides of the collecting tank, an angle adjusting device is arranged in each fixing plate, and a clamping device is arranged in each angle adjusting device. The semiconductor chip surface treatment device is simple in structure and novel in design, the semiconductor chip can be fixed in the air through the clamping device, the secondary pollution phenomenon of the worktable to the semiconductor chip after the surface treatment of the semiconductor chip is reduced, meanwhile, the angle adjusting device can facilitate the double-side treatment of the semiconductor chip, the surface changing time is saved, the cleaning efficiency is improved, the surface treatment device improves the surface treatment speed of the semiconductor chip and simultaneously enhances the cleaning effect of the waste chips on the surface of the semiconductor chip, and therefore the semiconductor chip surface treatment device is suitable for wide popularization.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip device production equipment, in particular to semiconductor chip surface treatment equipment with a scrap collecting function.
Background
The emergence of semiconductors has led to the way of being pioneered in the information age, and in recent years, the semiconductor chip manufacturing industry has rapidly developed, and some key technologies in the semiconductor chip manufacturing process have attracted great attention, and the surface polishing process is an important step in the semiconductor chip manufacturing process, and the automatic production of the process is gradually brought into the field of people. At present, semiconductor chips need to be subjected to operations such as dust removal and the like in the production process, but when the conventional semiconductor chip surface treatment equipment is used, the semiconductor chips are generally placed on the surface of a workbench for single-side treatment, and the other surface is replaced after the treatment is finished, so that the operation is complicated, the workbench easily causes secondary pollution to the semiconductors, and the cleaning effect is poor.
SUMMERY OF THE UTILITY MODEL
Objects of the utility model
In order to solve the technical problems in the background art, the utility model provides semiconductor chip surface treatment equipment with a scrap collecting function, the device is simple in structure and novel in design, the semiconductor chip can be fixed in the air through a clamping device, the secondary pollution phenomenon of a workbench to the semiconductor chip after the surface treatment of the semiconductor chip is reduced, meanwhile, an angle adjusting device can facilitate the double-side treatment of the semiconductor chip, the surface changing time is saved, the cleaning efficiency is improved, and the surface treatment device enhances the cleaning effect of the scrap on the surface of the semiconductor chip while improving the surface treatment speed of the semiconductor chip, so that the device is suitable for wide popularization.
(II) technical scheme
The utility model provides semiconductor chip surface treatment equipment with a scrap collecting function, which comprises a workbench and supporting legs, wherein a collecting tank is arranged on the upper surface of the workbench, a receiving tank is arranged at the bottom of the workbench and positioned at the lower end of the collecting tank, a scrap drawer is arranged in the receiving tank, fixing plates are arranged on the upper surface of the workbench and positioned at two sides of the collecting tank, an angle adjusting device is arranged in each fixing plate, a clamping device is arranged in each angle adjusting device, a supporting column is arranged on one side, far away from the collecting tank, of each fixing plate, and a surface treatment device is arranged on each supporting column.
Preferably, the top of the supporting column is provided with a first slide rail, two a second slide rail is arranged between the first slide rails, a sliding block is sleeved on the outer wall of the second slide rail, a hydraulic press is arranged at the bottom of the sliding block, a hydraulic rod used for installing the surface treatment device is arranged at the bottom of the hydraulic press, the first slide rail, the second slide rail and the hydraulic press are all electrically connected with the outside, the second slide rail is connected with the first slide rail in a sliding manner, the sliding block is connected with the second slide rail in a sliding manner, and the first slide rail, the second slide rail, the sliding block and the hydraulic press are matched to drive the electric brush to perform reciprocating movement in front, back, left and right directions, so that the treatment effect on the surface of the semiconductor chip is improved.
Preferably, surface treatment device includes connecting plate, driving motor, blade and electric brush, driving motor and electric brush all with external electric connection, blade and driving motor fixed connection, connecting plate and hydraulic stem fixed connection, mutually supporting of electric brush and blade can strengthen the surface dust removal effect to semiconductor chip.
Preferably, the number of collecting grooves is two sets of, the collecting groove is trapezoidal design, the sweeps drawer and collecting groove be vertical distribution from top to bottom, sweeps drawer and receiving box sliding connection play the sweeps after semiconductor chip surface treatment and collect, reduce the pollution effect of sweeps to semiconductor chip.
Preferably, angle adjusting device includes spacing pipe, bearing and spacing groove, the inner and outer ring of bearing respectively with spacing pipe and fixed plate fixed connection, spacing pipe passes through the bearing and is connected with the fixed plate rotation, and spacing pipe and bearing are used for adjusting the semiconductor chip angle, save semiconductor chip's the face time of changing, improve the effect of cleaning efficiency.
Preferably, clamping device includes grip block, gag lever post, threaded rod and carousel, the centre gripping mouth has been seted up to the inside of grip block, and the centre gripping mouth is trapezoidal design, and the rubber material is adopted to the centre gripping mouth, the grip block passes through gag lever post and spacing groove sliding connection, be provided with reset spring between grip block and the fixed plate, and reset spring overlaps and establishes at the gag lever post outer wall, the carousel rotates with the threaded rod to be connected, and the grip block is used for semiconductor chip's fixed, reduces the contact of semiconductor chip and workstation, reduces the workstation to semiconductor chip's secondary pollution, and gag lever post and spacing groove play the size of adjusting two sets of grip block intervals, make things convenient for not unidimensional semiconductor chip's fixed action.
Compared with the prior art, the technical scheme of the utility model has the following beneficial technical effects:
1. the device is through setting up the fixed plate, clamping device and angle adjusting device, during the use, through carousel to one side pulling gag lever post and threaded rod, make the interval between two sets of grip blocks enlarge, interval is the same with the semiconductor chip width until between two sets of grip blocks, the inside fixed semiconductor chip of centre gripping mouth that sets up of accessible grip block this moment, and through rotating the carousel, make the carousel paste tightly with the fixed plate, and then keep the interval size of two sets of grip blocks, and the existence of bearing and spacing pipe, adjustable semiconductor chip's angle, adjust the clearance face when avoiding with the workstation contact, the secondary pollution of workstation to semiconductor chip has been reduced.
2. The device passes through surface treatment device, in the use, after semiconductor chip is fixed to be accomplished, start the hydraulic press this moment, driving motor and electric brush, the hydraulic stem drives the connecting plate and moves down gradually, reach the semiconductor chip surface until electric brush, electric brush clears up the semiconductor chip surface this moment, simultaneously first slide rail, second slide rail and slider can drive electric brush and carry out reciprocating motion all around, improve the treatment effect to semiconductor chip surface, the blade is under driving motor's drive, carry out secondary treatment to semiconductor chip surface, the dust after handling this moment falls into the sweeps drawer through the collecting vat inside, the sweeps after the semiconductor chip surface treatment of being convenient for are collected.
In conclusion, the device is simple in structure and novel in design, the semiconductor chip can be fixed in the air through the clamping device, the secondary pollution phenomenon of the workbench to the semiconductor chip after the surface treatment of the semiconductor chip is reduced, meanwhile, the angle adjusting device can facilitate the double-side treatment of the semiconductor chip, the surface changing time is saved, the cleaning efficiency is improved, the surface treatment device improves the surface treatment speed of the semiconductor chip, meanwhile, the cleaning effect of the waste chips on the surface of the semiconductor chip is enhanced, and therefore the device is suitable for wide popularization.
Drawings
Fig. 1 is a schematic view of an overall structure of a semiconductor chip surface treatment apparatus having a scrap collecting function according to the present invention.
Fig. 2 is a schematic view of an internal structure of a fixing plate of a semiconductor chip surface treatment apparatus with a scrap collecting function according to the present invention.
FIG. 3 is a schematic structural diagram of a clamping device of a semiconductor chip surface treatment apparatus with a scrap collecting function according to the present invention.
FIG. 4 is a schematic structural diagram of an angle adjustment device of a semiconductor chip surface treatment apparatus with a scrap collecting function according to the present invention.
FIG. 5 is a schematic structural diagram of a surface treatment device of a semiconductor chip surface treatment apparatus with a scrap collecting function according to the present invention.
Reference numerals; 1. a work table; 2. a support leg; 3. collecting tank; 4. a receiving box; 5. a scrap drawer; 6. a fixing plate; 7. an angle adjusting device; 701. a limiting pipe; 702. a bearing; 703. a limiting groove; 8. a clamping device; 801. a clamping block; 802. a limiting rod; 803. a threaded rod; 804. a turntable; 9. a support pillar; 10. a first slide rail; 11. a second slide rail; 12. a slider; 13. a hydraulic press; 14. a hydraulic lever; 15. a surface treatment device; 1501. a connecting plate; 1502. a drive motor; 1503. a blade; 1504. an electric brush.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
The first embodiment is as follows:
as shown in fig. 1-5, the semiconductor chip surface treatment equipment with a scrap collecting function provided by the utility model comprises a workbench 1 and supporting legs 2, wherein a collecting tank 3 is arranged on the upper surface of the workbench 1, a receiving tank 4 is arranged at the bottom of the workbench 1 and at the lower end of the collecting tank 3, scrap drawers 5 are arranged in the receiving tank 4, the collecting tanks 3 are in two groups, the collecting tanks 3 are in a trapezoidal design, the scrap drawers 5 and the collecting tanks 3 are vertically and vertically distributed, the scrap drawers 5 are in sliding connection with the receiving tank 4, the scrap collecting after the semiconductor chip surface treatment is performed, the pollution of the scrap to the semiconductor chip is reduced, fixing plates 6 are arranged on the upper surface of the workbench 1 and at the two sides of the collecting tank 3, an angle adjusting device 7 is arranged in the fixing plates 6, the angle adjusting device 7 comprises a limiting pipe 701, a bearing 702 and a limiting groove 703, the inner ring and the outer ring of the bearing 702 are respectively and fixedly connected with the limiting pipe 701 and the fixing plates 6, the limiting pipe 701 is rotatably connected with the fixing plate 6 through the bearing 702, the limiting pipe 701 and the bearing 702 are used for adjusting the angle of the semiconductor chip, the surface changing time of the semiconductor chip is saved, and the cleaning efficiency is improved.
As shown in fig. 3, the angle adjusting device 7 is internally provided with a clamping device 8, the clamping device 8 includes a clamping block 801, a limiting rod 802, a threaded rod 803 and a turntable 804, a clamping opening is formed in the clamping block 801, the clamping opening is designed in a trapezoidal shape, the clamping opening is made of rubber, the clamping block 801 is slidably connected with the limiting groove 703 through the limiting rod 802, a reset spring is arranged between the clamping block 801 and the fixing plate 6, the reset spring is sleeved on the outer wall of the limiting rod 802, the turntable 804 is rotatably connected with the threaded rod 803, the clamping block 801 is used for fixing a semiconductor chip, contact between the semiconductor chip and the workbench 1 is reduced, secondary pollution of the workbench 1 to the semiconductor chip is reduced, and the limiting rod 802 and the limiting groove 703 play a role in adjusting the distance between the two sets of clamping blocks 801, and convenience is brought for fixing the semiconductor chips of different sizes.
Example two:
as shown in fig. 1, on the basis of the first embodiment, a supporting column 9 is disposed on one side of the fixing plate 6, which is away from the collecting tank 3, a first slide rail 10 is disposed at the top of the supporting column 9, a second slide rail 11 is disposed between the two first slide rails 10, a slider 12 is sleeved on the outer wall of the second slide rail 11, a hydraulic machine 13 is disposed at the bottom of the slider 12, a hydraulic rod 14 for mounting a surface treatment device 15 is disposed at the bottom of the hydraulic machine 13, the first slide rail 10, the second slide rail 11 and the hydraulic machine 13 are all electrically connected with the outside, the second slide rail 11 is slidably connected with the first slide rail 10, the slider 12 is slidably connected with the second slide rail 11, and the first slide rail 10, the second slide rail 11, the slider 12 and the hydraulic machine 13 are used in cooperation to drive the electric brush 1504 to perform reciprocating movement in front, back, left and right directions, so as to improve the treatment effect on the surface of the semiconductor chip.
As shown in fig. 5, the supporting column 9 is provided with the surface treatment device 15, the surface treatment device 15 includes a connecting plate 1501, a driving motor 1502, a blade 1503 and an electric brush 1504, the driving motor 1502 and the electric brush 1504 are both electrically connected with the outside, the blade 1503 is fixedly connected with the driving motor 1502, the connecting plate 1501 is fixedly connected with the hydraulic rod 14, and the electric brush 1504 and the blade 1503 are matched with each other, so that the surface dust removal effect on the semiconductor chip can be enhanced.
In the utility model, when in use, the limiting rod 802 and the threaded rod 803 are pulled to one side through the turntable 804, so that the distance between the two groups of clamping blocks 801 is expanded until the distance between the two groups of clamping blocks 801 is the same as the width of a semiconductor chip, at the moment, the semiconductor chip can be fixed through the clamping ports formed in the clamping blocks 801, the turntable 804 is tightly attached to the fixing plate 6 by rotating the turntable 804, so that the distance between the two groups of clamping blocks 801 is maintained, the angle of the semiconductor chip can be adjusted by the existence of the bearing 702 and the limiting pipe 701, the cleaning surface is prevented from being contacted with the worktable 1, the secondary pollution of the worktable 1 to the semiconductor chip is reduced, and after the semiconductor chip is fixed, the hydraulic press 13, the driving motor 1502 and the electric brush 1504 are started, the hydraulic rod 14 drives the connecting plate 1501 to gradually move downwards until the electric brush 1504 reaches the surface of the semiconductor chip, electronic brush 1504 clears up the semiconductor chip surface this moment, and first slide rail 10, second slide rail 11 and slider 12 can drive electronic brush 1504 simultaneously and carry out reciprocating motion all around, improve the treatment effect to the semiconductor chip surface, and blade 1503 carries out secondary treatment to the semiconductor chip surface under driving motor 1502's drive, and the dust after handling this moment falls into inside sweeps drawer 5 through collecting vat 3, and the sweeps after the semiconductor chip surface treatment of being convenient for is collected.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the utility model and are not to be construed as limiting the utility model. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such changes and modifications that fall within the scope and bounds of the appended claims, or equivalents of such scope and bounds.
Claims (6)
1. The utility model provides a semiconductor chip surface treatment equipment with function is collected to sweeps, includes workstation (1) and landing leg (2), its characterized in that, collecting vat (3) have been seted up to workstation (1) upper surface, workstation (1) bottom is located collecting vat (3) lower extreme and is provided with receiving box (4), receiving box (4) inside is provided with sweeps drawer (5), workstation (1) upper surface is located collecting vat (3) both sides and is provided with fixed plate (6), fixed plate (6) inside is provided with angle adjusting device (7), angle adjusting device (7) inside is provided with clamping device (8), one side that fixed plate (6) kept away from collecting vat (3) is provided with support column (9), be equipped with surface treatment device (15) on support column (9).
2. The semiconductor chip surface treatment equipment with the scrap collecting function according to claim 1, wherein a first slide rail (10) is arranged at the top of the supporting column (9), a second slide rail (11) is arranged between the two first slide rails (10), a slide block (12) is sleeved on the outer wall of the second slide rail (11), a hydraulic machine (13) is arranged at the bottom of the slide block (12), a hydraulic rod (14) used for installing the surface treatment device (15) is arranged at the bottom of the hydraulic machine (13), the first slide rail (10), the second slide rail (11) and the hydraulic machine (13) are all electrically connected with the outside, the second slide rail (11) is slidably connected with the first slide rail (10), and the slide block (12) is slidably connected with the second slide rail (11).
3. The semiconductor chip surface treatment apparatus with the scrap collecting function according to claim 2, wherein the surface treatment device (15) comprises a connecting plate (1501), a driving motor (1502), a blade (1503) and an electric brush (1504), the driving motor (1502) and the electric brush (1504) are both electrically connected with the outside, the blade (1503) is fixedly connected with the driving motor (1502), and the connecting plate (1501) is fixedly connected with the hydraulic rod (14).
4. The semiconductor chip surface treatment equipment with the scrap collecting function according to claim 1, wherein the collection grooves (3) are two groups, the collection grooves (3) are trapezoidal in design, the scrap drawers (5) and the collection grooves (3) are vertically distributed, and the scrap drawers (5) are slidably connected with the receiving box (4).
5. The semiconductor chip surface treatment equipment with the scrap collecting function according to claim 1, wherein the angle adjusting device (7) comprises a limiting pipe (701), a bearing (702) and a limiting groove (703), the inner ring and the outer ring of the bearing (702) are fixedly connected with the limiting pipe (701) and the fixing plate (6) respectively, and the limiting pipe (701) is rotatably connected with the fixing plate (6) through the bearing (702).
6. The semiconductor chip surface treatment equipment with the scrap collecting function according to claim 1 or 5, wherein the clamping device (8) comprises a clamping block (801), a limiting rod (802), a threaded rod (803) and a rotary table (804), a clamping opening is formed in the clamping block (801), the clamping opening is in a trapezoidal design and is made of rubber, the clamping block (801) is connected with the limiting groove (703) in a sliding mode through the limiting rod (802), a reset spring is arranged between the clamping block (801) and the fixing plate (6) and sleeved on the outer wall of the limiting rod (802), and the rotary table (804) is connected with the threaded rod (803) in a rotating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123422809.8U CN216389287U (en) | 2021-12-31 | 2021-12-31 | Semiconductor chip surface treatment equipment with scrap collecting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123422809.8U CN216389287U (en) | 2021-12-31 | 2021-12-31 | Semiconductor chip surface treatment equipment with scrap collecting function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389287U true CN216389287U (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123422809.8U Active CN216389287U (en) | 2021-12-31 | 2021-12-31 | Semiconductor chip surface treatment equipment with scrap collecting function |
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| Country | Link |
|---|---|
| CN (1) | CN216389287U (en) |
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2021
- 2021-12-31 CN CN202123422809.8U patent/CN216389287U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Semiconductor Chip Surface Treatment Equipment with Scrap Collection Function Effective date of registration: 20230424 Granted publication date: 20220426 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: Shenzhen Zhongbao Group Co.,Ltd. Registration number: Y2023980038926 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220426 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: Shenzhen Zhongbao Group Co.,Ltd. Registration number: Y2023980038926 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |