CN216385794U

CN216385794U - Vibration and temperature integrated sensor

Info

Publication number: CN216385794U
Application number: CN202123111877.2U
Authority: CN
Inventors: 张勇涛; 向武; 黄亚琦
Original assignee: Xi'an Lingchuang Electronic Technology Co ltd
Current assignee: Xi'an Lingchuang Electronic Technology Co ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-04-26
Anticipated expiration: 2031-12-10

Abstract

The utility model provides a sensor of vibration temperature integral type belongs to mechanical equipment monitoring technology field. The sensor includes: casing, apron, temperature probe, vibration chip, data acquisition circuit board, data processing circuit board, group battery and communication module. The shell is provided with an accommodating groove, the bottom of the accommodating groove is provided with a first through hole, and the opening end of the shell is fixedly connected with the cover plate; the temperature probe, the vibration chip, the data acquisition circuit board, the data processing circuit board, the battery pack and the communication module are all fixed in the accommodating groove, and the detection end of the temperature probe extends into the first through hole. In the real-time mode, the vibration acceleration of the equipment to be tested can be detected through the vibration chip, so that the simultaneous detection of temperature and vibration is realized through the sensor integrating vibration and temperature. Because the sensor is provided with the battery component, the sensor can be mounted and used at any time, and therefore, the sensor can be conveniently used by a plurality of devices to be tested.

Description

Vibration and temperature integrated sensor

Technical Field

The utility model relates to a mechanical equipment monitoring technology field particularly, relates to a sensor of vibration temperature integral type.

Background

The diagnosis of mechanical equipment by using vibration and temperature signals measured by the sensors is the most common and effective method in mechanical fault diagnosis. Vibration, temperature and other information generated in the operation process of mechanical equipment are main signals reflecting the operation state of the mechanical equipment, and most of rotating equipment needs to measure the two parameters when carrying out state monitoring. The dynamic signals are obtained through various vibration sensors and temperature sensing chips, and the method is a main way for monitoring the state of mechanical equipment and diagnosing faults. The traditional discrete temperature sensing chip and the traditional discrete vibration sensor have many defects in the links of installation, fixation, signal transmission and the like, the installation workload is large, and the circuit arrangement is disordered.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a sensor of vibration temperature integral type can solve and install that work load is big, the mixed and disorderly problem of circuit arrangement when carrying out parameter detection to the equipment to be measured.

According to this disclosed sensor of vibration temperature integral type, include: the temperature measuring device comprises a shell, a cover plate, a temperature measuring probe, a vibration chip, a data acquisition circuit board, a data processing circuit board, a battery pack and a communication module;

the shell is provided with an accommodating groove, a first through hole is formed in the bottom of the accommodating groove, the opening end of the shell is fixedly connected with the cover plate, and the sealing end of the shell is fixedly connected with equipment to be tested;

the temperature measuring probe, the vibration chip, the data acquisition circuit board, the data processing circuit board, the battery pack and the communication module are all fixed in the accommodating groove, and the detection end of the temperature measuring probe extends into the first through hole;

the temperature measuring probe, the vibration chip and the battery pack are all electrically connected with the data acquisition circuit board, and the data acquisition circuit board and the communication module are all electrically connected with the data processing circuit board.

According to the sensor disclosed by the embodiment of the disclosure, the bottom of the accommodating groove is also provided with a second through hole, and the sensor further comprises a charging seat;

the charging seat is fixed at the bottom of the accommodating groove and extends into the second through hole, and the charging seat is electrically connected with the battery pack.

According to the sensor disclosed by the embodiment of the disclosure, the sensor further comprises a pressing sheet, and the hole wall of the second through hole is provided with a step surface facing the accommodating groove;

the charging seat is a magnetic charging seat, the magnetic charging seat is provided with a charging electrode which penetrates through the charging seat and extends out of one side of the charging seat, the magnetic charging seat is supported on the step surface, and the extending end of the charging electrode faces the accommodating groove;

the pressing piece is fixed at the bottom of the accommodating groove and provided with a notch, and the charging electrode penetrates through the notch and is electrically connected with the data acquisition circuit board.

A sensor as in embodiments of the present disclosure, further comprising a battery holder;

the battery seat is positioned between the data acquisition circuit board and the data processing circuit board, and the data processing circuit board is positioned at one side close to the cover plate;

the battery holder is provided with a groove, the battery pack is limited in the groove, and the data processing circuit board, the battery holder and the data acquisition circuit board are integrally fixed at the bottom of the accommodating groove.

A sensor as in embodiments of the present disclosure, further comprising a key circuit board having a button switch;

the cover plate is provided with a pipe through hole, and the hole wall of the pipe through hole is provided with an annular convex edge;

the key circuit board is fixed on one side of the convex edge back to the containing groove, the button switch is back to the containing groove, and the key circuit board is electrically connected with the data processing circuit board.

A sensor as in embodiments of the present disclosure, further comprising a backing plate and an identification panel;

the base plate and the identification panel are both positioned on one side of the key circuit board, which is opposite to the convex edge, the base plate is positioned between the identification panel and the key circuit board, and the base plate and the identification panel are both fixedly connected with the convex edge;

the backing plate is in the region that button switch corresponds has the hole of dodging, button switch stretches into the hole of dodging, identification panel can take place elastic deformation under the exogenic action.

The sensor according to the embodiment of the present disclosure further includes a spherical spacer, and the spherical spacer can elastically deform under an external force;

the spherical spacer is fixed the identification panel with between the backing plate, and orthographic projection on the backing plate covers dodge the hole, the protruding side orientation of spherical spacer the identification panel.

A sensor as in embodiments of the present disclosure, the sensor further comprising a first sealing ring clamped between the ledge and the key circuit board.

A sensor as in embodiments of the present disclosure, further comprising a cushion supported between the data acquisition circuit board and the temperature probe.

A sensor as in embodiments of the present disclosure, further comprising a second sealing ring clamped between the open end of the housing and the cover plate.

The sensor further comprises a magnetic part, wherein the magnetic part is fixed on the end face of the sealing end of the shell, and the magnetic part is used for being fixed on the equipment to be tested in a magnetic attraction mode.

The disclosed embodiments include at least the following benefits:

when the equipment to be tested is diagnosed to determine whether the equipment to be tested has a fault, the sealing end of the shell can be fixedly connected with the equipment to be tested so as to fixedly connect the sensor with the equipment to be tested. Because the temperature probe stretches into first through-hole, also be towards the equipment to be tested to can detect the temperature of equipment to be tested, and at the equipment to be tested operation in-process, can detect the vibration acceleration of equipment to be tested through the vibration chip, thus detect when realizing temperature and vibration through the sensor of vibration and temperature integral type. And then the data acquisition circuit board acquires the detected temperature and vibration acceleration, transmits the detected temperature and vibration acceleration to the data processing circuit board, processes the temperature and vibration acceleration through the data processing circuit board, and then realizes wireless transmission of the processed parameters through the communication module, thereby further avoiding the problem of complex circuit layout. The sensor is provided with the battery component, so that the sensor can be mounted and used at any time, namely, the sensor is directly fixed on the equipment to be detected when the equipment to be detected is judged in advance, and the sensor is detached after the parameter detection of the equipment to be detected is completed, so that the sensor can be conveniently used by a plurality of pieces of equipment to be detected.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic front view of a vibration-temperature integrated sensor according to an embodiment of the present disclosure.

Fig. 2 is a schematic top view of a vibration-temperature integrated sensor according to an embodiment of the present disclosure.

Fig. 3 is a schematic bottom view of a vibration-temperature integrated sensor according to an embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of the vibration-temperature integrated sensor shown in fig. 2 along line AA.

Fig. 5 is a schematic cross-sectional view along line AA of another vibration-temperature integrated sensor shown in fig. 2.

Reference numerals:

1. a housing; 2. a cover plate; 3. a temperature measuring probe; 4. vibrating the chip; 5. a data acquisition circuit board; 6. a data processing circuit board; 7. a battery pack; 8. a communication module; 9. a charging seat; 10. a compression sheet; 11. a battery holder; 12. a key circuit board; 13. a base plate; 14. an identification panel; 15. a spherical spacer; 16. a first seal ring; 17. a cushion pad; 18. a second seal ring; 19. a magnetic member; 20. soaking a cotton pad;

101. a containing groove; 102. a first through hole; 103. a second through hole;

201. a through hole; 202. a convex edge;

901. a charging electrode; 1201. a push button switch; 1301. avoiding the hole.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

The sensor of this vibration temperature integral type of this disclosed embodiment, this sensor can be used to detect the temperature and the vibration parameter of the equipment that awaits measuring to treat equipment through the temperature and the vibration parameter that detect and judge in advance, and then carry out maintenance in advance when taking place slight trouble, avoid the equipment that awaits measuring to cause because of major failure maintenance consuming time, equipment damage, the condition of personal injury etc.. In addition, it is apparent that the use of the sensor can reduce the amount of mounting work and wiring compared to a sensor that detects temperature and a vibration parameter separately.

The equipment to be tested can be power equipment such as an engine and a pump body, and can also be transmission equipment such as a gear.

As shown in fig. 1, 2, 3 and 4, the sensor includes: the temperature measurement device comprises a shell 1, a cover plate 2, a temperature measurement probe 3, a vibration chip 4, a data acquisition circuit board 5, a data processing circuit board 6, a battery pack 7 and a communication module 8.

The shell 1 is provided with a containing groove 101, the bottom of the containing groove 101 is provided with a first through hole 102, the opening end of the shell 1 is fixedly connected with the cover plate 2, and the sealing end of the shell 1 is used for being fixedly connected with equipment to be tested; the temperature probe 3, the vibration chip 4, the data acquisition circuit board 5, the data processing circuit board 6, the battery pack 7 and the communication module 8 are all fixed in the accommodating groove 101, and the detection end of the temperature probe 3 extends into the first through hole 102; the temperature measuring probe 3, the vibration chip 4 and the battery pack 7 are electrically connected with the data acquisition circuit board 5, and the data acquisition circuit board 5 and the communication module 8 are electrically connected with the data processing circuit board 6.

In the embodiment of the present disclosure, when the device to be tested is diagnosed to determine whether the device to be tested has a fault, the sealed end of the housing 1 may be fixedly connected to the device to be tested, so as to fixedly connect the sensor to the device to be tested. Because the temperature probe 3 extends into the first through hole 102, namely faces the device to be tested, the temperature of the device to be tested can be detected, and in the running process of the device to be tested, the vibration acceleration of the device to be tested can be detected through the vibration chip 4, so that the simultaneous detection of temperature and vibration can be realized through the sensor integrating vibration and temperature. And then the data acquisition circuit board 5 acquires the detected temperature and vibration acceleration, transmits the detected temperature and vibration acceleration to the data processing circuit board 6, processes the temperature and vibration acceleration through the data processing circuit board 6, and then realizes wireless transmission of the processed parameters through the communication module 8, thereby further avoiding the problem of complex circuit layout. The sensor is provided with the battery pack 7, so that the sensor can be used at any time, namely, the sensor is directly fixed on the equipment to be detected when the equipment to be detected is judged in advance, and the sensor is detached after the parameter detection of the equipment to be detected is completed, so that the sensor can be conveniently used by a plurality of pieces of equipment to be detected.

The processing of the data processing circuit board 6 to the temperature and vibration acceleration includes: and determining vibration parameters such as the rotating speed, the angular speed, the displacement, the inclination angle, the vibration frequency and the rotation angle of the equipment to be tested according to the vibration acceleration, and performing noise reduction, correction and the like on the parameters such as the temperature, the vibration acceleration, the rotating speed, the angular speed, the displacement, the inclination angle, the vibration frequency and the rotation angle. Illustratively, the data processing circuit board 6 undergoes fast fourier transform according to the vibration acceleration to convert from a time domain to a frequency domain, i.e., a vibration frequency can be obtained; obtaining the rotating speed by integrating the vibration acceleration once, and obtaining the displacement by integrating the rotating speed once; and performing Kalman filtering and data fusion calculation on the vibration acceleration to obtain the inclination angle.

The housing 1 may be made of a material having a relatively high hardness, and may be made of an aluminum alloy material. Because the shell 1 can be made of metal materials, at this time, in order to avoid static electricity generated by the shell 1, the accommodating groove 101 can be filled with insulating materials so as to realize insulation between the shell 1 and the components in the accommodating groove 101, and in addition, the filled insulating materials can further limit the components in the accommodating groove 101, so that the deviation of the detected vibration parameters caused by the vibration of the components of the sensor is avoided. Illustratively, the insulating material is an epoxy resin.

The cover plate 2 may be made of a non-conductive material, and may be made of a nylon material, for example. Since the cover plate 2 is made of non-conductive material, the communication module 8 can avoid signal shielding when communicating with external communication equipment. The communication module 8 can now be located close to one side of the cover plate 2. In addition, in order to avoid the damage of the cover plate 2 when being connected with the shell 1, one side of the cover plate 2, which is back to the shell 1, is provided with a 'city wall' type bayonet in a clockwise direction and a 'city wall' type bayonet in an anticlockwise direction, so that the installation, the disassembly, the installation and the disassembly of the cover plate 2 can be realized through the bayonet in the clockwise direction and the bayonet in the anticlockwise direction.

The specific acquisition circuit and processing circuit on the data acquisition circuit board 5 and the data processing circuit board 6 refer to the related art, and the embodiment of the present disclosure does not limit this, as long as the data acquisition circuit board 5 can acquire the temperature detected by the temperature probe 3 and the vibration acceleration detected by the vibration chip 4, and the data processing circuit board 6 can process the acquired temperature and vibration acceleration. The data acquisition circuit board 5 and the data processing circuit board 6 can be electrically connected in a pin inserting mode to ensure the stability of the electrical connection between the two.

The temperature probe 3 can be an infrared probe, and certainly can also be other types of temperature probes 3, and the temperature probe 3 includes a detection end and an electric connection end. The vibrating chip 4 can be referred to the related art.

The communication module 8 may be a bluetooth module, and certainly, may also be another communication module 8 as long as communication with a mobile phone terminal, a computer terminal, and the like can be achieved. Exemplarily, the communication module 8 is an NFC module.

In some embodiments, as shown in fig. 4, the sensor further comprises a second sealing ring 18, the second sealing ring 18 being clamped between the open end of the housing 1 and the cover plate 2. Thus, after the cover plate 2 is fixedly connected with the opening end of the shell 1, the sealing performance between the cover and the shell 1 can be ensured,

in some embodiments, the sensor further comprises a sealing rubber sheet, which is sleeved on the detection end of the temperature probe 3 and seals the gap between the detection end of the temperature probe 3 and the first through hole 102. Therefore, through the sealing of the sealing rubber sheet, the sealing performance between the detection end of the temperature measuring probe 3 and the hole wall of the first through hole 102 is ensured, and external sundries or water vapor and the like are prevented from entering the accommodating groove 101.

In one embodiment, the data acquisition circuit board 5, the battery pack 7 and the data processing circuit board 6 are sequentially arranged along the direction from the depth to the depth of the accommodating groove 101, and in order to facilitate the electrical connection between the data acquisition circuit board 5 and the data processing circuit board 6, the front surface of the data acquisition circuit board 5 faces away from the bottom of the accommodating groove 101, so that the temperature measuring probe 3 and the vibration chip 4 are both located at the back side of the data acquisition circuit board 5. In addition, in order to fix the temperature probe 3 and the vibration chip 4 and simultaneously realize the electrical connection between the temperature probe 3 and the vibration chip 4 and the data acquisition circuit board 5, the electrical connection end of the temperature probe 3 is welded on the back side of the data acquisition circuit board 5, and the vibration chip 4 is welded on the back side of the data acquisition circuit board 5.

In conjunction with the above embodiment, as shown in fig. 4, the sensor further includes a cushion 17, and the cushion 17 is supported between the data acquisition circuit board 5 and the temperature probe 3. Therefore, through the arrangement of the cushion pad 17, the vibration of the temperature measuring probe 3 when the sensor and the equipment to be measured synchronously vibrate is slowed down, and the deviation of the vibration parameters of the sensor, which are detected due to the vibration of the self component, is avoided. In addition, the height of the temperature measuring probe 3 is raised through the cushion pad 17, the light beam emitted by the temperature measuring probe 3 is prevented from being influenced by the shell 1, and the accuracy of the temperature detected by the temperature measuring probe 3 is improved.

In the embodiment of the disclosure, when the sensor is fixed on the device to be tested, a fixing frame can be installed on the device to be tested, and then the sensor is fixed on the fixing frame. Of course, in order to avoid the unstable connection between the fixing frame and the device under test and/or the sensor, which may cause the deviation of the vibration acceleration detected by the vibration chip 4, the sensor may be directly fixed on the housing of the device under test.

When the sensor is directly fixed with the equipment to be tested, the sensor is fixed on the equipment to be tested through the fixing bolt, namely, the sealing end of the shell 1 is fixed on the equipment to be tested through the fixing bolt; or because the shell of the device to be tested is usually a metal piece and can be attracted to the magnet, the sensor is fixed on the device to be tested in a magnetic attraction manner, that is, as shown in fig. 2 or fig. 4, the sensor further includes a magnetic piece 19, and the magnetic piece 19 is fixed on the end surface of the sealing end of the housing 1, so that the sealing end of the housing 1 can be fixed on the device to be tested in a magnetic attraction manner through the magnetic attraction between the magnetic piece 19 and the device to be tested. And the installation efficiency of the sensor can be improved by a magnetic adsorption mode.

Wherein, magnetic part 19 includes magnetism and inhales base and magnet, and magnet is fixed on magnetism and inhales the base, and magnetism inhales the terminal surface fixed connection of the sealed end of base and casing 1. Exemplarily, the terminal surface of the sealed end of casing 1 has the screw hole, and the base is inhaled to magnetism has the screw thread post, through the threaded connection of screw thread post with the screw hole, and it has the screw thread to fill between screw thread post and the screw hole to guarantee the stability of base and casing 1 connection are inhaled to magnetism.

In the embodiment of the present disclosure, when the sensor is used to detect the temperature and vibration parameters of the device under test, the longer the sensor is used, the smaller the amount of electricity of the battery pack 7. In order to avoid the replacement of the battery pack 7 by detaching the sensor, as shown in fig. 2 and 5, the bottom of the receiving groove 101 further has a second through hole 103, the sensor further includes a charging seat 9, the charging seat 9 is fixed at the bottom of the receiving groove 101 and extends into the second through hole 103, and the charging seat 9 is electrically connected to the battery pack 7. Thus, when the electric quantity of the battery pack 7 is small, the charging stand 9 can be connected to the external power supply to charge the battery pack 7 by the external power supply, thereby avoiding the problem that the battery pack 7 is replaced due to the small electric quantity of the battery pack 7. The battery pack 7 is a rechargeable battery. The battery pack 7 is illustratively a lithium battery.

The charging socket 9 is a charging socket 9 having a USB interface, so that the battery pack 7 can be charged through a data line having the USB interface on site. Certainly, in order to avoid water vapor from entering the accommodating groove 101 along the USB interface, as shown in fig. 5, the sensor further includes a pressing sheet 10, the hole wall of the second through hole 103 has a step surface facing the accommodating groove 101, the charging seat 9 is a magnetic charging seat, the magnetic charging seat has a charging electrode 901 penetrating through and extending out on one side, the magnetic charging seat is supported on the step surface, the extending end of the charging electrode 901 faces the accommodating groove 101, the pressing sheet 10 is fixed at the bottom of the accommodating groove 101, the pressing sheet 10 has a notch, and the charging electrode 901 penetrates through the notch to be electrically connected with the data acquisition circuit board 5.

So, not only can realize charging to group battery 7 through magnetism charging seat, can also guarantee the leakproofness, avoid steam to get into the condition of storage tank 101. In addition, the magnetic suction connector of the magnetic suction charging seat can avoid the situation that the external power supply is reversely connected with the magnetic suction charging seat, and the situation that the sensor is burnt down due to the fact that the sensor is connected with the external power supply is avoided.

In the embodiment of the present disclosure, when the position limitation of the battery pack 7 in the accommodating groove 101 is implemented, because the battery pack 7 may have a cylindrical structure, in order to facilitate the position limitation of the battery pack 7 at this time, as shown in fig. 4 or fig. 5, the sensor further includes a battery holder 11, the battery holder 11 is located between the data acquisition circuit board 5 and the data processing circuit board 6, and the data processing circuit board 6 is located at a side close to the cover plate 2; the battery holder 11 is provided with a groove, the battery pack 7 is limited in the groove, and the data processing circuit board 6, the battery holder 11 and the data acquisition circuit board 5 are fixed at the bottom of the accommodating groove 101 as a whole.

Therefore, the battery pack 7 can be limited by the battery holder 11, and the stability of the battery pack 7 fixed in the accommodating groove 101 is ensured. The bottom of the accommodating groove 101 is provided with a threaded hole, and the fixing bolt can sequentially penetrate through the data processing circuit board 6, the battery seat 11, the data acquisition circuit board 5 and be fixedly connected with the threaded hole at the bottom of the accommodating groove 101.

In addition, in order to ensure the stability of the battery pack 7 being retained in the groove, as shown in fig. 4 or 5, a foam pad 20 is provided in the groove to absorb vibration that may be generated in the battery pack 7 by the foam pad 20.

In a real-time mode of the present disclosure, in order to avoid waste of electric quantity when the sensor is not used, as shown in fig. 5, the sensor further includes a key circuit board 12 having a button switch 1201, the cover plate 2 has a through hole 201, a hole wall of the through hole 201 has an annular convex edge 202, the key circuit board 12 is fixed on a side of the convex edge 202 facing away from the accommodating groove 101, the button switch 1201 faces away from the accommodating groove 101, and the key circuit board 12 is electrically connected to the data processing circuit board 6.

Since the button switch 1201 faces away from the receiving groove 101, the user can manually operate the button switch 1201, so that the data processing circuit board 6 can receive the opening signal or the closing signal, and then start to operate when receiving the opening signal, and stop operating when receiving the closing signal, so as to achieve the effect of saving power.

In order to ensure the sealing performance after the key circuit board 12 is connected to the ledge 202, as shown in fig. 5, the sensor further includes a first sealing ring 16, and the first sealing ring 16 is clamped between the ledge 202 and the key circuit board 12. Therefore, the first sealing ring 16 can be extruded after the key circuit board 12 is connected with the convex edge 202, and the sealing performance between the key circuit board 12 and the convex edge 202 is ensured.

In addition, in order to facilitate the user to know whether the battery pack 7 is low in power and whether the connection of the communication module 8 with the terminal device is successful, the key circuit board 12 further has a power indicator lamp and a communication indicator lamp. The power indicator and the communication indicator are located on a side of the key circuit board 12 opposite to the receiving groove 101 for a user to view.

When the residual electric quantity of the battery pack 7 is low, the electric quantity indicator lamp is controlled to display red, and when the residual electric quantity of the battery pack 7 is high, the electric quantity indicator lamp is controlled to be green; when the communication module 8 is not connected with the terminal equipment, the communication indicator lamp is controlled to be red, and when the communication module 8 is successfully connected with the terminal equipment, the communication indicator lamp is controlled to be green. The main execution body for controlling the color of the electric quantity indicator light and the color of the communication indicator light is the data processing circuit board 6, namely the data processing circuit controls the color of the electric quantity indicator light by monitoring the electric quantity of the battery pack 7, and controls the color of the communication knowledge light by monitoring the connection state of the communication module 8 and the terminal equipment.

In some real-time modes, as shown in fig. 5, the sensor further includes a pad 13 and an identification panel 14, the pad 13 and the identification panel 14 are both located on a side of the key circuit board 12 opposite to the convex edge 202, the pad 13 is located between the identification panel 14 and the key circuit board 12, and both the pad 13 and the identification panel 14 are fixedly connected to the convex edge 202; the backing plate 13 is provided with an avoiding hole 1301 in a region corresponding to the button switch 1201, the button switch 1201 extends into the avoiding hole 1301, and the identification panel 14 can be elastically deformed under the action of external force. In this way, the side of the key circuit board 12 facing away from the receiving groove 101 is flattened by the backing plate 13 to form a plane, thereby facilitating the installation of the identification panel 14. In order to ensure that the pad 13 can pad the side of the key circuit board 12 facing away from the receiving groove 101, the thickness of the pad 13 is equal to the maximum value among the height of the button switch 1201, the height of the power indicator lamp and the height of the communication indicator lamp.

The pad 13 has a relief hole 1301 in a region corresponding to the button switch 1201, and has a relief hole 1301 in a region corresponding to the power indicator and the communication indicator, and for the convenience of a user to determine corresponding positions of the button switch 1201, the power indicator and the communication indicator, for example, as shown in fig. 3 or fig. 5, the identification panel 14 has an icon of a switch in a position corresponding to the button switch 1201, and has a "communication" character in a position corresponding to the communication indicator, and has a "charging" character in a position corresponding to the power indicator.

When a user operates the push button switch 1201 through the identification panel 14, since the thickness of the identification panel 14 is generally thin, after the push button switch 1201 is operated for multiple times, the identification panel 14 may be damaged at a position corresponding to the push button switch 1201 due to interaction of the push button switch 1201. In order to avoid the situation that the identification panel 14 is damaged, as shown in fig. 5, the sensor further includes a spherical gasket 15, and the spherical gasket 15 can be elastically deformed under the action of an external force; the spherical spacer 15 is fixed between the sign panel 14 and the backing plate 13, and the orthographic projection on the backing plate 13 covers the avoidance hole 1301, and the convex side of the spherical spacer 15 faces the sign panel 14. Illustratively, the spherical washer 15 is a snap-dome.

Because the convex side of the spherical spacer 15 faces the identification panel 14, when the button switch 1201 is operated through the identification panel 14, the problem of stress concentration between the identification panel 14 and the switch button key can be avoided under the action of the spherical spacer 15, so that the situation that the position on the identification panel 14 corresponding to the button switch 1201 is damaged is avoided.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A vibrating temperature integrated sensor, comprising: the temperature measuring device comprises a shell, a cover plate, a temperature measuring probe, a vibration chip, a data acquisition circuit board, a data processing circuit board, a battery pack and a communication module;

2. The sensor of claim 1, wherein the bottom of the receiving well further has a second through-hole, the sensor further comprising a charging dock;

3. The sensor according to claim 2, further comprising a pressing piece, wherein the hole wall of the second through hole has a step surface facing the accommodating groove;

4. The sensor of claim 1, further comprising a battery holder;

5. The sensor of claim 1, further comprising a key circuit board having a push button switch;

6. The sensor of claim 5, further comprising a pad and an identification panel;

7. The sensor of claim 6, further comprising a spherical spacer that is elastically deformable under an external force;

8. The sensor of claim 5, further comprising a first seal ring clamped between the ledge and the key circuit board.

9. The sensor of any one of claims 1-8, further comprising a cushion supported between the data acquisition circuit board and the temperature probe.

10. The sensor of any one of claims 1-8, further comprising a second sealing ring clamped between the open end of the housing and the cover plate.

11. The sensor of any one of claims 1-8, further comprising a magnetic member fixed to an end surface of the sealed end of the housing, the magnetic member configured to be magnetically attached to the device under test.