CN216378465U

CN216378465U - Roller structure of diode plating bath and plating bath

Info

Publication number: CN216378465U
Application number: CN202122733080.XU
Authority: CN
Inventors: 薛明峰; 胡园
Original assignee: Yangzhou Hy Technology Development Co Ltd
Current assignee: Yangzhou Hy Technology Development Co Ltd
Priority date: 2021-11-09
Filing date: 2021-11-09
Publication date: 2022-04-26
Anticipated expiration: 2031-11-09

Abstract

The utility model discloses a roller structure of a diode electroplating bath and the electroplating bath, wherein the roller structure comprises a roller (1), a conductive roller (2) which is positioned in the roller (1) and arranged along the axial direction of the roller (1) and a plurality of conductive rings (3) which are positioned on the conductive roller (2), the conductive rings (3) comprise a ring body (31) and a plurality of blades (32) which are fixed on the ring body (31), the bottoms of the blades (32) are inclined to the axial line of the ring body (31), and the blades (32) are twisted into a spiral shape from inside to outside. According to the utility model, the conductive roller is fixed in the roller, the roller rotates along with the roller, then the conductive roller drives the conductive ring to rotate together, and in the rotating process, the blades on the conductive ring roll the diode product, so that the diode material uniformly receives conduction, and the effect of improving the uniformity of a coating is obvious.

Description

Roller structure of diode plating bath and plating bath

Technical Field

The utility model relates to diode production equipment, in particular to a roller structure of a diode electroplating bath. In addition, the utility model also relates to a plating bath of the roller structure of the diode plating bath.

Background

At present, due to social development, requirements on the attractiveness and performance of plated parts are higher and higher, electroplating methods are more and more, common electroplating methods include rack plating, barrel plating, composite plating, vacuum plating and the like, barrel plating is an electroplating method for plating the plated parts by adopting a roller, and common barrel plating methods in electroplating production are divided into three categories, namely horizontal barrel plating, inclined barrel plating, vibration electroplating and the like.

Electronic component electrotinning in the market mainly adopts matte electroplating, but for diodes, because the special structure of the diodes can not carry out rack plating, barrel plating is usually adopted.

Chinese patent with publication number CN 212865050U discloses nickel barrel plating device, it includes the electroplating bath and is located the support frame on the electroplating bath, be provided with at least two sets of conductive joints that communicate with the negative pole on the framed panel of electroplating bath, be provided with two piece at least conductive rods on the support frame, conductive rod and conductive joint correspond the setting, and conductive rod erects on conductive joint, still rotate on the support frame and be connected with the cylinder, be provided with drive drum pivoted drive assembly on the support frame, be provided with two sets of conductive discs in the cylinder, two sets of conductive discs are close to the both ends setting of cylinder respectively, and conductive disc passes through coupling assembling and conductive rod intercommunication, connect through a plurality of groups copper line between two sets of conductive discs, the copper line is the heliciform setting, and the copper line both ends are connected with conductive disc respectively. According to the barrel plating device with the structure, the diode rotates along with the roller in the roller so as to realize the uniformity of a plating layer through the rotation of the roller, but the uniformity is improved to a limited extent, and the barrel plating device is not suitable for the condition that the number of products is large.

SUMMERY OF THE UTILITY MODEL

Aiming at the problem that the improvement of the electroplating uniformity of the diode is limited, the utility model provides a roller structure of a diode electroplating bath and the diode electroplating bath.

In order to achieve the above object, in one aspect, the present invention provides a drum structure of a diode electroplating bath, the drum structure includes a drum, a conductive rod located in the drum and arranged along an axial direction of the drum, and a plurality of conductive rings located on the conductive rod, each conductive ring includes a ring body and a plurality of blades fixed on the ring body, the bottom of each blade is arranged obliquely to an axis of the ring body, and the blades are twisted into a spiral shape from inside to outside.

Preferably, the connecting line of the two ends of the bottom of each blade and the axis of the ring body form an included angle of 45-60 degrees.

Preferably, the line of the tip both ends of blade and the contained angle of the axis of ring body is 75 ~ 90.

Preferably, an annular groove is formed in the conductive rod, the ring body comprises two half rings, inner rings of the half rings are matched in the annular groove, and two ends of each half ring are respectively provided with corresponding connecting pieces, so that the two half rings can be detachably connected.

Specifically, two ends of the half rings are respectively provided with a groove and a tenon, and the two half rings are connected into a whole through the grooves and the tenons in an interference fit manner; or

The two ends of the semi-rings are provided with corresponding steps, the steps are provided with threaded holes, the steps at the ends of the two semi-rings are matched with each other, and the threaded holes correspond to fix the ends of the two semi-rings through bolts.

Further, one of the threaded holes in the half ring is a countersunk hole.

Preferably, at least one protrusion is arranged on the inner ring of one of the half rings, and a groove matched with the protrusion is arranged in the annular groove.

Preferably, the non-connection part of the conductive stick and the ring body is coated with an insulating layer.

In a second aspect, the present invention provides a plating tank, which includes the above-mentioned roller structure.

Through the technical scheme, the utility model has the following beneficial effects:

1. according to the utility model, the conductive roller is fixed in the roller, the roller rotates along with the roller, then the conductive roller drives the conductive ring to rotate together, and in the rotating process, the blades on the conductive ring roll the diode product, so that the diode material uniformly receives conduction, and the effect of improving the uniformity of a coating is obvious.

2. In a preferred technical scheme of the utility model, the ring body of the conducting ring is detachably connected with the conducting rod, so that the conducting ring is convenient to detach and maintain.

Drawings

FIG. 1 is a schematic structural view of a first embodiment of the present invention;

FIG. 2 is a schematic view of a half ring according to a first embodiment of the present invention;

FIG. 3 is a schematic structural view of a second embodiment of the present invention;

FIG. 4 is a schematic view of a half ring according to a second embodiment of the present invention;

FIG. 5 is a schematic view of the structure of the conductive roller of the present invention.

Description of the reference numerals

1 roller

2 conductive rod, 21 annular groove

3 conductive ring, 31 ring body, 311 groove, 312 tenon, 313 step, 314 threaded hole, 315 bulge and 32 blades

Detailed Description

The following detailed description of embodiments of the utility model refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.

It should be noted that, in the following description, for the purpose of clearly explaining the technical solution of the present invention, some directional terms, such as "outer", "inner", etc., are used according to the meaning of the components in the drum structure, such as the position pointing to the center of the drum is inner and the opposite direction is outer, which are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or the element to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, either internally or in any combination thereof. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

As shown in fig. 1 and 3, the drum structure of the diode plating bath of the present invention includes a drum 1, a conducting rod 2 located in the drum 1 and arranged along an axial direction of the drum 1, and a plurality of conducting rings 3 located on the conducting rod 2, wherein the conducting rings 3 include a ring 31 and a plurality of blades 32 fixed on the ring 31, the bottom of the blades 32 is arranged obliquely to an axis of the ring 31, and the blades 32 are twisted into a spiral shape from inside to outside.

According to the utility model, the conductive rod 2 is fixed in the roller 1, the conductive rod 2 rotates along with the roller 1 when the roller 1 rotates, then the conductive ring 3 is driven to rotate, in the rotating process, the blades 32 on the conductive ring 3 roll diode products, the diode materials are uniformly subjected to conduction, and the effect of improving the uniformity of a plating layer is obvious.

In order to ensure that the blades 32 drive the product to roll effectively and avoid the blockage between the blades, the included angle between the connecting line of the two ends of the bottom of each blade 32 and the axis of the ring body 31 is preferably 45-60 degrees. The connecting line of the two ends of the end of the blade 32 and the axis of the ring body 31 form an included angle of 75-90 degrees.

As some embodiments of the present invention, the ring 31 may be fixed to the conductive rod 2 by welding, but for convenience of detachment and maintenance, the ring 31 and the conductive rod 2 are preferably detachably connected.

Specifically, as shown in fig. 5, an annular groove 21 is formed on the conductive rod 2, the ring body 31 includes two half rings, inner rings of the half rings are fitted in the annular groove 21, and two ends of the half rings are respectively provided with corresponding connecting members, so that the two half rings can be detachably connected.

The following are two specific detachable connection modes:

as shown in fig. 1 and 2, two ends of the half rings are respectively provided with a groove 311 and a tenon 312, and the two half rings are connected into a whole through the groove 311 and the tenon 312 in an interference fit manner. In this connection, one half ring is first placed in the annular groove 21, and then the groove 311 and the tongue 312 of the other half ring are aligned with the first half ring, and the two half rings are interference-fitted together by using an external force.

As shown in fig. 3 and 4, the two ends of the half rings are formed with corresponding steps 313, the steps 313 are provided with screw holes 314, the steps 313 of the two ends of the half rings are matched with each other, and the two screw holes 314 correspond to each other, so that the ends of the two half rings are fixed by bolts. In this connection, one half ring is first placed in the annular groove 21, the step of the other half ring is aligned with the first half ring, the corresponding threaded holes 314 are aligned, and the two half rings are fixed by bolts. In this way, in order to avoid interference of the end of the bolt with the product, one of the threaded holes 314 in the half ring is a countersunk hole, and after the bolt is tightened, the end is flush with the surface of the half ring.

In the above technical solution, in order to increase the reliability of the connection between the conductive ring 3 and the conductive rod 2, at least one protrusion 315 is disposed on the inner ring of one of the half rings, and a recess matched with the protrusion 315 is disposed in the annular groove 21, so as to effectively prevent the conductive ring 3 from shaking in the axial direction of the conductive rod 2.

In addition, the non-connection part of the conductive rod 2 and the ring body 31 is coated with an insulating layer. The phenomenon that the thickness of an electroplating material is influenced on the contrary because electroplating ions are greatly deposited on the surface of the conductive rod due to the overlarge conductive area is avoided.

The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.

It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the utility model is not described in any way for the possible combinations in order to avoid unnecessary repetition.

In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims

1. The utility model provides a cylinder structure of diode plating bath, characterized in that, includes cylinder (1), is located cylinder (1) and along electrically conductive rod (2) and a plurality of electrically conductive ring (3) that are located on electrically conductive rod (2) that cylinder (1) axial set up, electrically conductive ring (3) include ring body (31) and multi-disc are fixed in blade (32) on ring body (31), the bottom of blade (32) slope in the axis setting of ring body (31), just blade (32) twist reverse from inside to outside and be the heliciform.

2. The roller structure of the diode plating tank as claimed in claim 1, wherein an included angle between a connecting line of two ends of the bottom of the blade (32) and an axis of the ring body (31) is 45-60 °.

3. The roller structure of the diode plating tank as claimed in claim 1, wherein an included angle between a connecting line of two ends of the end of the blade (32) and an axis of the ring body (31) is 75-90 °.

4. The drum structure of diode plating bath according to claim 1, wherein the conductive rod (2) is provided with an annular groove (21), the ring body (31) comprises two half rings, the inner rings of the half rings are fitted in the annular groove (21), and the two ends of the half rings are respectively provided with corresponding connecting members, so that the two half rings can be detachably connected.

5. The drum structure of the diode plating tank as claimed in claim 4, wherein two ends of the half-rings are respectively provided with a groove (311) and a tenon (312), and the two half-rings are connected into a whole through the interference fit of the groove (311) and the tenon (312); or

The two ends of the half rings are provided with corresponding steps (313), the steps (313) are provided with threaded holes (314), the steps (313) of the ends of the two half rings are matched with each other, and the two threaded holes (314) correspond to each other so as to fix the ends of the two half rings through bolts.

6. The barrel structure of the diode plating tank as claimed in claim 5, wherein one of the threaded holes (314) of the half ring is a counter-bore.

7. The barrel structure of the diode plating tank as claimed in claim 4, wherein the inner ring of one of the half rings is provided with at least one protrusion (315), and the annular groove (21) is provided with a groove matched with the protrusion (315).

8. The barrel structure of the diode plating tank as claimed in any one of claims 1 to 7, wherein the non-connection part of the conductive rod (2) and the ring body (31) is coated with an insulating layer.

9. A plating tank, characterized in that the plating tank comprises the drum structure according to any one of claims 1 to 8.