CN216378452U

CN216378452U - Anode assembly for wafer electroplating

Info

Publication number: CN216378452U
Application number: CN202122363930.1U
Authority: CN
Inventors: 谢信韦; 曾宪兰; 黄金; 张奇飞
Original assignee: Suzhou Jidao Electrode Technology Co ltd
Current assignee: Suzhou Jidao Electrode Technology Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-04-26
Anticipated expiration: 2031-09-28

Abstract

The utility model discloses an anode device for wafer electroplating, which comprises an electroplating pool, wherein a distributor is fixedly connected in the electroplating pool, an air inlet of the distributor is respectively communicated with a liquid adding pipe and a liquid return pipe, the liquid adding pipe is arranged on the left side of a water pump a, the water pump a is communicated with a filter a, the filter a is communicated with an electroplating liquid tank, an electric push rod is arranged on the right side of the electroplating pool, the top end of the electric push rod is fixedly connected with a support frame, the bottom end of the support frame is fixedly connected with a positioning frame, a rotating frame is rotationally connected with the positioning frame, a brush is embedded and connected on the surface of the rotating frame, an ultrasonic vibrator is arranged in the middle of the rotating frame, and the brush is positioned on the left side of an anode. The motor drives the brush on the rotating frame to rotate and the ultrasonic vibrator to cooperate to clean the surface of the anode, so that the influence of impurities such as anode mud on electroplating is avoided; the filter and the motor b are matched to filter the original electroplating solution added in the electroplating pool, so that impurities and the like in the electroplating solution are prevented from being adhered to the surface of the wafer.

Description

Anode assembly for wafer electroplating

Technical Field

The utility model relates to an anode device for wafer electroplating, in particular to an anode device for wafer electroplating, and belongs to the technical field of wafer electroplating.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.

The patent No. CN 209128574U discloses a wafer electroplating device, wherein an electroplating bath is divided into a first chamber for accommodating electroplating solution and a second chamber for accommodating anode metal, when the anode metal needs to be replaced, the first chamber and the second chamber are isolated by a partition part, the anode metal is taken out of and put into the side door of the second chamber, other parts in the electroplating bath do not need to be dismounted, and the replacement efficiency of the anode metal is improved; in addition, the electroplating solution in the whole electroplating bath does not need to be discharged, the waste of raw materials is reduced, and the cost of wafer electroplating is reduced.

Wafer plating of the prior art has the following disadvantages: 1. during the electroplating process, anode mud is easily adhered to the surface of an anode substrate or impurities are easily adhered to the surface of the anode, so that the electroplating effect is influenced; 2. impurities and the like in the electroplating solution are easily adhered to the surface of the wafer in the electroplating process, and the electroplating quality of the wafer is influenced, so that the problems are improved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems and provide the anode device for wafer electroplating, wherein a motor drives a brush on a rotating stand to rotate and is matched with an ultrasonic vibrator to clean the surface of an anode, so that impurities such as anode mud and the like are prevented from influencing electroplating; the filter and the motor b are matched to filter the original electroplating solution added in the electroplating pool, so that impurities and the like in the electroplating solution are prevented from being adhered to the surface of the wafer.

The utility model realizes the purpose through the following technical scheme, and the anode device for wafer electroplating comprises an electroplating pool, wherein a distributor is fixedly connected in the electroplating pool, an air inlet of the distributor is respectively communicated with a liquid adding pipe and a liquid returning pipe, the liquid adding pipe is arranged on the left side of a water pump a, the water pump a is communicated with a filter a, the filter a is communicated with an electroplating liquid tank, an electric push rod is arranged on the right side of the electroplating pool, the top end of the electric push rod is fixedly connected with a support frame, the bottom end of the support frame is fixedly connected with a positioning frame, a rotating frame is rotationally connected with the positioning frame, a brush is embedded and connected on the surface of the rotating frame, an ultrasonic vibrator is arranged in the middle of the rotating frame, and the brush is positioned on the left side of an anode.

Preferably, a wafer is arranged in the electroplating pool and is positioned behind the permeable membrane, and an anode is arranged in the electroplating pool.

Preferably, a clear liquid pipe and a branch pipe are installed on the right side of the electroplating pool, the clear liquid pipe is communicated with the branch pipe, an air inlet of the clear liquid pipe extends to the inside of a filter b, the filter b is located on the right side of a water pump b, and activated carbon layers are installed in the filter a and the filter b.

Preferably, the activated carbon layer is located on the outer side of the filter cloth, a motor a is installed at the top end of the electroplating liquid tank, and the power output end of the motor a is connected with the power input end of the stirring shaft.

Preferably, the water pump b is communicated with a liquid return pipe, the liquid return pipe is communicated with the electroplating pool through a side pipe, a sealing frame is fixedly connected to the left side of the support frame, a motor b is installed on the sealing frame, a power output end of the motor b is connected with a power input end of a rotating rod, and the rotating rod is connected with a rotating shaft through belt transmission.

Preferably, pivot fixedly connected with revolving rack, the current input end of water pump a, motor a, electric putter, water pump b, motor b and ultrasonic vibrator passes through wire electric connection with external power supply.

The utility model has the beneficial effects that:

1. the motor drives the brush on the rotating frame to rotate and the ultrasonic vibrator to cooperate to clean the surface of the anode, so that the influence of impurities such as anode mud on electroplating is avoided; after a certain time of electroplating, an electric push rod arranged on the right side of the electroplating pool is shortened, the electric push rod is shortened to drive a connected support frame to move downwards, a positioning frame is fixed at the bottom end of the support frame, the support frame moves downwards to drive a rotary frame in the connected positioning frame to move downwards, the rotary frame continuously moves downwards to a proper position, a brush on the surface of the rotary frame is contacted with the surface of an anode arranged in the electroplating pool, a motor b on a sealing frame is started to drive a connected rotary rod to rotate, the rotary rod is connected with a rotary shaft through a belt, the rotary rod rotates to drive the belt and the rotary shaft to rotate synchronously, the rotary shaft is fixed on the outer side of the rotary frame, namely, the rotary shaft rotates to drive the connected rotary frame to rotate, the brush on the rotary frame rotates along the surface of the anode to brush the surface of the anode, meanwhile, an ultrasonic vibrator arranged in the middle of the rotary frame sends ultrasonic waves to the anode after being electrified to generate cavitation, and the impact force generated by continuous breakage of bubbles in the electroplating solution can separate impurities such as anode mud on the surface of the anode, the brush rotates the brush after the separation and gets and can make the positive pole surface resume clean, and accessible motor drives the revolving rack and goes up the brush rotation and clean the positive pole surface with the cooperation of ultrasonic vibrator, avoids the whole electroplating effect of impurity influences such as the positive pole mud of positive pole surface adhesion.

2. The filter and the motor b are matched to filter the original electroplating solution added in the electroplating pool, so that impurities and the like in the electroplating solution are prevented from being adhered to the surface of the wafer; the motor a in the electroplating solution tank is started to drive the connected stirring shaft to rotate, the stirring shaft can drive the electroplating solution in the electroplating solution tank to rotate, impurities can be prevented from being separated out after the electroplating solution is kept stand for a long time, when the electroplating solution in the electroplating tank is supplemented, the water pump a is started, the valve on the liquid adding pipe is opened, the valve on the liquid return pipe is closed, the water pump a is started to extract the electroplating solution in the electroplating solution tank and convey the electroplating solution into the filter a for filtering, the electroplating solution enters the filter a to be firstly contacted with the filter cloth, small particle impurities and the like are remained on the surface of the filter cloth without passing through the filter cloth, the electroplating solution continuously moves through the activated carbon layer, the activated carbon layer has larger surface area and adsorption performance and can adsorb and remove the small impurities in the electroplating solution, the filtered electroplating solution is conveyed into the liquid adding pipe under the action of the water pump a and conveyed into the electroplating tank through the distributor connected with the liquid adding pipe, and impurities are easily generated in the electroplating solution in the electroplating process, a first cavity is formed between the rear part of the electroplating pool and the permeable membrane, a second cavity is formed between the permeable membrane and the front part of the electroplating pool, when electroplating solution in the first cavity is filtered, the upper valves of the side pipe and the branch pipe are closed, the upper valves of the clear liquid pipe and the liquid return pipe are opened, the water pump b is started to pump the electroplating solution near the wafer into the clear liquid pipe through the clear liquid pipe, impurities in the electroplating solution enter the clear liquid pipe along with the electroplating solution, the electroplating solution is conveyed into the filter b through the clear liquid pipe, the filter a and the filter b have the same structure and can filter the electroplating solution to remove the impurities carried in the electroplating solution, the filtered electroplating solution is conveyed into the distributor through the liquid return pipe connected with the water pump b and is conveyed back into the electroplating pool through the distributor, similarly, when the electroplating solution in the second cavity is cleaned, the upper valves of the side pipe and the branch pipe are opened, the upper valves of the liquid return pipe and the clear liquid return pipe are closed, the water pump b is started to pump b to pump the electroplating solution at the anode through the branch pipe and is conveyed into the filter b, impurity such as anode mud filters in getting into filter b along with the plating solution in the anode department, and in the plating solution after the filtration carried back the second cavity through the side pipe, accessible motor an waited the plating solution stirring of interpolation and avoided it to separate out impurity, and water pump and filter cooperation are simultaneously waited the interpolation and are filtered the original plating solution in the electrolytic bath, can make the plating solution resume clean, avoid impurity adhesion to influence the wafer cladding material on wafer surface.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention in partial section;

FIG. 2 is a schematic view of a partially sectioned plating tank according to the present invention;

FIG. 3 is a schematic view, partly in section, of a side view of the present invention;

fig. 4 is a schematic structural view of the rotating stand of the present invention.

In the figure: 1. a liquid adding pipe; 2. an electroplating pool; 3. a water pump a; 4. a wafer; 5. a filter a; 6. an activated carbon layer; 7. filtering cloth; 8. an electroplating solution tank; 9. a clear liquid tube; 10. a motor a; 11. a branch pipe; 12. a filter b; 13. an electric push rod; 14. an anode; 15. a water pump b; 16. A liquid return pipe; 17. a side tube; 18. a permeable membrane; 19. a distributor; 20. a motor b; 21. a seal holder; 22. a support frame; 23. a brush; 24. an ultrasonic vibrator; 25. rotating the frame; 26. a rotating shaft; 27. a stirring shaft; 28. a rotating rod; 29. a positioning frame; 30. a belt.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Embodiment 1, please refer to fig. 1-4, an anode apparatus for wafer plating comprises a plating tank 2, a distributor 19 is fixedly connected to the plating tank 2, the air inlet of the distributor 19 is communicated with a liquid feeding tube 1 and a liquid returning tube 16, the plating solution in the liquid feeding tube 1 and the plating solution in the liquid returning tube 16 can be uniformly fed back to the plating tank 2 through the distributor 19, the liquid feeding tube 1 is installed at the left side of a water pump a3, a water pump a3 is started to pump the filtered plating solution into the liquid feeding tube 1, the water pump a3 is communicated with a filter a5, a water pump a3 is started to pump the plating solution into a filter a5 for filtering, a filter a5 is communicated with a plating solution tank 8, the plating solution in the plating solution tank 8 is fed into a filter a5 for filtering, an electric push rod 13 is installed at the right side of the plating tank 2, a support frame 22 is fixedly connected to the top end of the electric push rod 13, electric putter 13 is flexible to drive support frame 22 of connecting and is reciprocated, support frame 22 bottom fixedly connected with locating rack 29, the locating rack 29 position can be fixed to support frame 22, the 29 internal rotations of locating rack are connected with revolving rack 25, and revolving rack 25 can be at the 29 internal rotations of locating rack, revolving rack 25 surface is inlayed and is connected with brush 23, and brush 23 is the fluff, can be to positive pole 14 surface cleaning, revolving rack 25 mid-mounting has ultrasonic vibrator 24, brush 23 is located the left side of positive pole 14.

Specifically, clear liquid pipe 9 and branch pipe 11 are installed on the right side of electroplating pond 2, clear liquid pipe 9 and branch pipe 11 intercommunication, the air inlet of clear liquid pipe 9 extends to the inside of filter b12, filter b12 is located the right side of water pump b15, all install activated carbon layer 6 in filter a5 and the filter b12, filter a5 and the interior structure of filter b12 are the same, all filter through filter cloth 7 and the cooperation of activated carbon layer 6.

Specifically, activated carbon layer 6 is located the outside of filter cloth 7, motor a10 is installed on electroplating liquid tank 8 top, and electroplating liquid tank 8 provides the mounting platform for motor a10, motor a 10's power take off end is connected with the power input of (mixing) shaft 27, and motor a10 rotates the (mixing) shaft 27 that drives the connection and rotates and stir the plating solution.

Specifically, the water pump b15 and the liquid return pipe 16 are communicated, water pumped by the water pump b15 is conveyed into the liquid return pipe 16, the liquid return pipe 16 is communicated with the electroplating pool 2 through the side pipe 17, electroplating solution in the liquid return pipe 16 is conveyed into the electroplating pool 2 through the side pipe 17, the left side of the support frame 22 is fixedly connected with the sealing frame 21, the sealing frame 21 is fixed at the outer sides of the support frame 22 and the positioning frame 29, the sealing frame 21 is provided with the motor b20, the sealing frame 21 provides an installation platform for the motor b20, the power output end of the motor b20 is connected with the power input end of the rotating rod 28, the motor b20 rotates to drive the connected rotating rod 28 to rotate, the rotating rod 28 is connected with the rotating shaft 26 through the belt 30 in a transmission manner, and the rotating rod 28 rotates to drive the connected belt 30 and the rotating shaft 26 to rotate synchronously.

Specifically, the rotating shaft 26 is fixedly connected with the rotating frame 25, the rotating shaft 26 rotates to drive the connected rotating frame 25 to rotate, the current input ends of the water pump a3, the motor a10, the electric push rod 13, the water pump b15, the motor b20 and the ultrasonic vibrator 24 are electrically connected with an external power supply through wires, and the external power supply respectively provides power for the water pump a3, the motor a10, the electric push rod 13 and the like.

In embodiment 2, referring to fig. 4, the difference between this embodiment and embodiment 1 is: install wafer 4 in the electroplating pool 2, wafer 4 fixes and electroplates in electroplating pool 2, wafer 4 is located the rear of osmotic membrane 18, and positive ion accessible osmotic membrane 18 is close to wafer 4 and electroplates, install positive pole 14 in the electroplating pool 2, can electroplate after wafer 4 and positive pole 14 circular telegram.

When the utility model is used, an external power supply supplies power, after a certain time of electroplating, an electric push rod 13 (a motor in the electric push rod drives a pair of screw nuts after being decelerated by a gear, the rotary motion of the motor is changed into linear motion, the push rod action is completed by utilizing the positive and negative rotation of the motor) arranged at the right side of an electroplating pool 2 is shortened, the model of the electric push rod 13 is XTL50, the electric push rod 13 is shortened to drive a connected support frame 22 to move downwards, a positioning frame 29 is fixed at the bottom end of the support frame 22, the support frame 22 moves downwards to drive a rotating frame 25 in the connected positioning frame 29 to move downwards, a brush 23 on the surface of the rotating frame 25 is continuously moved downwards to a proper position to be contacted with the surface of an anode 14 arranged in the electroplating pool 2, a motor b20 (the motor realizes the conversion of electric energy into mechanical energy according to electromagnetic induction) on a sealing frame 21 is started to drive the rotation of the connected rotating rod 28, the model of a motor b20 is Y90L-4, the rotating rod 28 is connected with the rotating shaft 26 through a belt 30, the rotating rod 28 rotates to drive the belt 30 and the rotating shaft 26 to synchronously rotate, the rotating shaft 26 is fixed at the outer side of the rotating frame 25, namely the rotating shaft 26 rotates to drive the rotating frame 25 connected with the rotating frame to rotate, the rotating frame 25 rotates to drive the brush 23 on the rotating frame 25 to rotate along the surface of the anode 14, the surface of the anode 14 can be brushed, meanwhile, the ultrasonic vibrator 24 arranged in the middle of the rotating frame 25 is electrified to send ultrasonic waves to the anode 14, the model of the ultrasonic vibrator 24 is KMD-2860, cavitation is generated, impurities such as anode mud and the like on the surface of the anode 14 can be separated from the anode 14 by impact force generated by continuous breakage of bubbles in electroplating solution, after separation, the brush 23 rotates to brush and brush to enable the surface of the anode 14 to be recovered to be clean, a motor a10 in the electroplating solution tank 8 near the electroplating pool 2 is started to drive the stirring shaft 27 connected with the motor a10 being Y90L-4, the stirring shaft 27 rotates to drive the electroplating solution in the electroplating solution tank 8 to rotate, can avoid the impurities from being separated out after the plating solution is kept stand for a long time, when the plating solution in the plating tank 2 is supplemented, the water pump a3 is started, the model of the water pump a3 is WQD, the valve on the liquid adding pipe 1 is opened, the valve on the liquid return pipe 16 is closed, the water pump a3 is started to extract the plating solution in the plating solution tank 8 and convey the plating solution into the filter a5 for filtering, the plating solution enters the filter a5 to be firstly contacted with the filter cloth 7, small particle impurities and the like are remained on the surface of the filter cloth 7 without passing through the filter cloth 7, the plating solution continuously moves through the activated carbon layer 6, the activated carbon layer 6 has larger surface area and adsorption performance and can adsorb and remove the small impurities in the plating solution, the filtered plating solution is conveyed into the liquid adding pipe 1 under the action of the water pump a3 and conveyed into the plating tank 2 through the distributor 19 connected with the liquid adding pipe 1, the impurities are easily generated in the plating solution during the plating process, a first cavity is formed between the back of the plating tank 2 and the permeable membrane 18, a second cavity is formed between the permeable membrane 18 and the front part of the plating tank 2, when the plating solution in the first cavity is filtered, the valves on the side pipe 17 and the branch pipe 11 are closed, the valves on the clear liquid pipe 9 and the liquid return pipe 16 are opened, the water pump b15 is started to pump the plating solution near the wafer 4 into the clear liquid pipe 9 through the clear liquid pipe 9, the model of the water pump b15 is WQD, impurities in the plating solution enter the clear liquid pipe 9 along with the plating solution, the plating solution is conveyed into the filter b12 through the clear liquid pipe 9, the filter a5 and the filter b12 have the same structure, the plating solution can be filtered to remove the impurities carried in the plating solution, the filtered plating solution is conveyed into the distributor 19 through the liquid return pipe 16 connected with the water pump b15 and is conveyed back into the plating tank 2 through the distributor 19, and the valves on the side pipe 17 and the branch pipe 11 are opened and the valves on the liquid return pipe 16 and the clear liquid return pipe 9 are closed, the water pump b15 is started to pump the plating solution at the anode 14 through the branch pipe 11 and deliver the plating solution into the filter b12, impurities such as anode mud at the anode 14 enter the filter b12 along with the plating solution to be filtered, and the filtered plating solution is delivered back into the second cavity through the side pipe 17.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An anode device for wafer electroplating comprises an electroplating pool (2), and is characterized in that: a distributor (19) is fixedly connected in the electroplating pool (2), the air inlet of the distributor (19) is respectively communicated with the liquid adding pipe (1) and the liquid return pipe (16), the liquid adding pipe (1) is arranged at the left side of a water pump a (3), the water pump a (3) is communicated with a filter a (5), the filter a (5) is communicated with the electroplating solution tank (8), the right side of the electroplating pool (2) is provided with an electric push rod (13), the top end of the electric push rod (13) is fixedly connected with a supporting frame (22), the bottom end of the supporting frame (22) is fixedly connected with a positioning frame (29), a rotating frame (25) is rotationally connected in the positioning frame (29), a brush (23) is embedded and connected on the surface of the rotating frame (25), the middle part of the rotating frame (25) is provided with an ultrasonic vibrator (24), and the brush (23) is positioned on the left side of the anode (14).

2. The anode assembly according to claim 1, wherein: install wafer (4) in electroplating pond (2), wafer (4) are located the rear of osmotic membrane (18), install positive pole (14) in electroplating pond (2).

3. The anode assembly according to claim 1, wherein: clear liquid pipe (9) and branch pipe (11) are installed to electroplating pond (2) right side, clear liquid pipe (9) and branch pipe (11) intercommunication, the air inlet of clear liquid pipe (9) extends to the inside of filter b (12), filter b (12) are located the right side of water pump b (15), all install activated carbon layer (6) in filter a (5) and the filter b (12).

4. The anode assembly as claimed in claim 3, wherein: the activated carbon layer (6) is located on the outer side of the filter cloth (7), a motor a (10) is installed at the top end of the electroplating liquid tank (8), and the power output end of the motor a (10) is connected with the power input end of the stirring shaft (27).

5. The anode assembly as claimed in claim 4, wherein: the water pump b (15) and the liquid return pipe (16) are communicated, the liquid return pipe (16) is communicated with the electroplating pool (2) through a side pipe (17), a sealing frame (21) is fixedly connected to the left side of the supporting frame (22), a motor b (20) is installed on the sealing frame (21), the power output end of the motor b (20) is connected with the power input end of a rotating rod (28), and the rotating rod (28) is connected with a rotating shaft (26) through a belt (30) in a transmission mode.

6. The anode assembly as claimed in claim 5, wherein: the rotating shaft (26) is fixedly connected with a rotating frame (25), and the current input ends of the water pump a (3), the motor a (10), the electric push rod (13), the water pump b (15), the motor b (20) and the ultrasonic vibrator (24) are electrically connected with an external power supply through a wire.