CN216376694U - Silicon chip inserted sheet conveyor - Google Patents
Silicon chip inserted sheet conveyor Download PDFInfo
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- CN216376694U CN216376694U CN202122325610.7U CN202122325610U CN216376694U CN 216376694 U CN216376694 U CN 216376694U CN 202122325610 U CN202122325610 U CN 202122325610U CN 216376694 U CN216376694 U CN 216376694U
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Abstract
The utility model relates to a silicon wafer inserting sheet conveying device which comprises a first conveying mechanism, a second conveying mechanism and a sliding mechanism, wherein the first conveying mechanism and the second conveying mechanism are sequentially arranged along a conveying direction; an accommodating space is formed at one end of the first conveying mechanism close to the second conveying mechanism, the second conveying mechanism is arranged on the sliding mechanism, and the second conveying mechanism enters or moves out of the accommodating space under the driving of the sliding mechanism; the conveying surfaces of the first conveying mechanism and the second conveying mechanism are positioned on the same plane, and the first conveying mechanism and the second conveying mechanism respectively and independently operate; the first conveying mechanism is configured to temporarily store the received silicon wafers and convey the silicon wafers to the second conveying mechanism; the second conveying mechanism is configured to receive the silicon wafers on the first conveying mechanism and convey the silicon wafers to the silicon wafer material basket. The sliding mechanism drives the second conveying mechanism to move the basket, so that the silicon wafers on the second conveying mechanism can be directly inserted into the silicon wafer material basket, the production efficiency is improved, and the quality of the silicon wafers is ensured.
Description
Technical Field
The utility model relates to solar cell production equipment, in particular to a silicon wafer inserting sheet conveying device.
Background
The traditional silicon wafer inserting device generally adopts a single-section telescopic conveying belt to insert the silicon wafer, and the speed of the conveying belt cannot be well matched with the silicon wafer conveying speed and the silicon wafer inserting speed of a front passage due to the fact that the single-section conveying belt is adopted in the mode, so that the inserting efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon wafer inserting sheet conveying device, aiming at the problem of low efficiency of the existing silicon wafer inserting sheet device.
The technical scheme of the utility model is as follows: a silicon wafer inserting sheet conveying device comprises a first conveying mechanism, a second conveying mechanism and a sliding mechanism, wherein the first conveying mechanism and the second conveying mechanism are sequentially arranged along a conveying direction; wherein: an accommodating space is formed at one end of the first conveying mechanism close to the second conveying mechanism, the second conveying mechanism is arranged on the sliding mechanism, and the second conveying mechanism enters or moves out of the accommodating space under the driving of the sliding mechanism; the conveying surfaces of the first conveying mechanism and the second conveying mechanism are positioned on the same plane, and the first conveying mechanism and the second conveying mechanism respectively and independently operate; the first conveying mechanism is configured to temporarily store the received silicon wafers and convey the silicon wafers to the second conveying mechanism; the second conveying mechanism is configured to receive the silicon wafers on the first conveying mechanism and convey the silicon wafers to the silicon wafer material basket.
By adopting the two mutually independent conveying mechanisms of the first conveying mechanism and the second conveying mechanism, the conveying speeds of the first conveying mechanism and the second conveying mechanism can be respectively adjusted, and the speed of the silicon wafer conveyed from the previous silicon wafer conveying line is accelerated or decelerated before the silicon wafer is inserted, so that the speed of the silicon wafer conveyed from the previous conveying line and the speed of the silicon wafer inserting are better adjusted, and the inserting efficiency is further improved.
Optionally, the first conveying mechanism includes two first conveying belts arranged in parallel and a first driving portion, and the first driving portion drives the two first conveying belts to synchronously operate; an accommodating space is formed between the two first conveying belts.
The silicon wafer conveying device has the advantages that silicon wafers are conveyed through the two first conveying belts which are arranged in parallel, the structure is simple, and the action is stable and reliable.
Optionally, a first mounting portion is arranged between the two first conveyor belts, and a first sensor for sensing whether silicon wafers exist on the two first conveyor belts is mounted on the first mounting portion.
Whether the silicon wafers exist on the first conveying belt or not is sensed through the first sensor, and the first sensor can be connected with a control system to realize automatic operation.
Optionally, the second conveying mechanism includes two second conveying belts arranged in parallel and a second driving portion, and the second driving portion drives the two second conveying belts to synchronously operate; the outer side interval of the two second conveying belts is smaller than the width of the accommodating space.
The silicon wafers are conveyed by the two second conveying belts which are arranged in parallel, so that the silicon wafer conveying device is simple in structure and stable and reliable in action; the outer side distance between the two second conveying belts is smaller than the width of the accommodating space, so that the interference between the second conveying mechanism and the first conveying mechanism can be avoided.
Optionally, a second mounting portion is arranged between the two second conveyor belts, and a second sensor for sensing whether silicon wafers exist on the two second conveyor belts is mounted on the second mounting portion.
Whether the second conveying belt is provided with the silicon wafers or not is sensed through the second sensor, and the second conveying belt can be connected with a control system to realize automatic operation.
Optionally, a third sensor is further installed on the second installation portion, the second sensor and the third sensor are respectively arranged at the first end and the second end of the second installation portion, the second sensor is used for sensing whether the silicon wafer is at the feeding end of the second conveying mechanism, and the third sensor is used for sensing whether the silicon wafer is at the discharging end of the second conveying mechanism.
Through installing second sensor and third sensor on the second installation department, can respond to the silicon chip respectively when the silicon chip gets into second conveying mechanism's feed end and discharge end, through judging the time difference and the predetermined time difference that the silicon chip was sensed by second sensor and third sensor, can judge whether the silicon chip has inserted into the silicon chip basket.
Optionally, the sliding mechanism includes a sliding frame, a sliding block, a sliding rail, and a sliding frame driving portion, the second conveying mechanism is mounted on the sliding frame, the sliding frame is slidably fitted on the sliding rail through the sliding block, and the sliding frame driving portion is connected to the sliding frame and drives the sliding frame to move along the sliding rail.
The sliding mechanism adopts a sliding block and a sliding rail, and has simple structure and low cost.
Alternatively, the carriage driving section employs an air cylinder.
The sliding frame driving part adopts the air cylinder, so that the arrangement is convenient and the cost is low.
Optionally, a third conveying mechanism is further installed at the feed end of the first conveying mechanism, the third conveying mechanism includes two third conveying belts arranged in parallel and a third driving portion, and the third driving portion drives the two third conveying belts to run synchronously.
The third conveying mechanism is used for temporarily storing the silicon wafers, so that the conveying efficiency of the second conveying mechanism can be improved.
Optionally, the silicon wafer inserting sheet conveying device further comprises a regulating mechanism, and the regulating mechanism is arranged on two sides of the first conveying mechanism and/or the second conveying mechanism; and the regulating mechanism regulates the silicon wafers on the first conveying mechanism and/or the second conveying mechanism.
The silicon wafers are arranged regularly through the arranging mechanism, so that the silicon wafers can be smoothly inserted into the silicon wafer material basket, and the silicon wafers are prevented from being damaged.
Optionally, the regulating mechanism comprises two regulating parts, each regulating part comprising a rolling member and a rolling member driving mechanism, respectively; the two rolling part driving mechanisms respectively drive the two rolling parts to be close to or far away from the first conveying mechanism and/or the second conveying mechanism between the two rolling parts.
The regulating mechanism adopts a rolling structure, has a simple structure and cannot be blocked when regulating the silicon wafers.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention.
Fig. 2 is a perspective view of fig. 1 from another perspective.
Fig. 3 is a schematic perspective view of a second embodiment of the present invention.
Fig. 4 is a perspective view of fig. 3 from another perspective.
In fig. 1 to 4, the present invention includes:
a silicon wafer insert conveying device 30;
a first conveying mechanism 31, a first conveying belt 311, a first driving portion 312, a first mounting portion 313, and an accommodating space 315;
a second conveying mechanism 32, a second conveyor belt 321, a second driving unit 322, a second mounting unit 323, a second sensor 324, and a third sensor 325;
a slide mechanism 33, a carriage 331, a slider 332, a slide rail 333, and a carriage drive unit 334;
the regulating mechanism 34, the regulating section 341, the rolling member 342, and the rolling member driving mechanism 343;
a third conveying mechanism 35, a third conveying belt 351, and a third driving unit 352;
a silicon wafer basket 36.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 1 and 2 show a first alternative embodiment of a silicon wafer insert feeding device 30, wherein fig. 1 is a perspective view of the device from one perspective, and fig. 2 is a perspective view of the device from another perspective.
As shown in fig. 1 and 2, the silicon wafer inserting and conveying apparatus 30 includes a first conveying mechanism 31 and a second conveying mechanism 32, which are sequentially arranged along a conveying direction, and a sliding mechanism 33. The wafer insert transport apparatus 30 in this embodiment can be referred to as a two-stage transport apparatus.
Wherein: an accommodating space 315 is formed at one end of the first conveying mechanism 31 close to the second conveying mechanism 32, the second conveying mechanism 32 is mounted on the sliding mechanism 33, and the second conveying mechanism 32 enters or moves out of the accommodating space 315 under the driving of the sliding mechanism 33; the conveying surfaces of the first conveying mechanism 31 and the second conveying mechanism 32 are in the same plane, and the first conveying mechanism 31 and the second conveying mechanism 32 respectively and independently operate; the first conveying mechanism 31 is configured to temporarily store the received silicon wafer and transport the silicon wafer to the second conveying mechanism 32; the second conveying mechanism 32 is configured to receive the silicon wafers on the first conveying mechanism 31 and convey the silicon wafers to the silicon wafer basket 36. The structure of the silicon wafer basket 36 is shown in FIG. 4.
By adopting two mutually independent conveying mechanisms of the first conveying mechanism 31 and the second conveying mechanism 32, the conveying speeds of the first conveying mechanism 31 and the second conveying mechanism 32 can be respectively adjusted, and the speed of the silicon wafer conveyed from the previous silicon wafer conveying line is accelerated or decelerated before the silicon wafer is inserted, for example, when the conveying speed of the previous silicon wafer conveying line is very high and is far greater than the speed of the silicon wafer insertion, if the speed of the silicon wafer insertion is increased to the same high speed, fragments are easy to generate during the silicon wafer insertion; if the insert speed is lower than the conveying speed of the silicon wafer conveying line, the silicon wafers conveyed continuously cannot be inserted one by one, and the silicon wafers are inevitably stacked on the conveying mechanism to cause fragments. At this time, the first conveying mechanism 31 can be properly decelerated to form a buffer between the silicon wafer conveying line and the second conveying mechanism 32, so that the speed of the silicon wafer conveyed by the front conveying line and the speed of inserting the silicon wafer can be better adjusted, and the inserting efficiency can be further improved.
As an alternative embodiment, the first conveying mechanism 31 includes two first conveying belts 311 arranged in parallel and a first driving portion 312, and the first driving portion 312 drives the two first conveying belts 311 to run synchronously; an accommodating space 315 is formed between the two first conveying belts 311. Alternatively, the first driving part 312 generally employs a motor.
The silicon wafers are conveyed by the two first conveying belts 311 which are arranged in parallel, the structure is simple, and the action is stable and reliable.
In this embodiment, a first mounting portion 313 (not shown) is provided between the two first conveyor belts 311, and a first sensor for sensing whether or not silicon wafers are present on the two first conveyor belts 311 is mounted on the first mounting portion 313.
Whether the silicon chip is on the first conveying belt 311 is sensed through the first sensor, and the first sensor can be connected with a control system to realize automatic operation.
As an alternative embodiment, the second conveying mechanism 32 includes two second conveying belts 321 arranged in parallel and a second driving portion 322, and the second driving portion 322 drives the two second conveying belts 321 to run synchronously; the outer interval between the two second conveyor belts 321 is smaller than the width of the accommodating space 315. Alternatively, the second driving part 322 generally employs a motor.
The silicon wafers are conveyed by the two second conveying belts 321 which are arranged in parallel, so that the silicon wafer conveying device is simple in structure and stable and reliable in action; the distance between the two second conveyor belts 321 is smaller than the width of the accommodating space 315, so that interference between the second conveyor mechanism 32 and the first conveyor mechanism 31 can be avoided.
In this embodiment, a second mounting portion 323 is provided between the two second conveyor belts 321, and a second sensor 324 for sensing whether or not silicon wafers are present on the two second conveyor belts 321 is mounted on the second mounting portion 323.
The second sensor 324 senses whether the second conveyor belt 321 has silicon chips, and can be connected with the control system to realize automatic operation.
In order to detect whether the silicon wafer is smoothly inserted into the silicon wafer basket after being conveyed by the second conveyor belt 321, as shown in fig. 2, a third sensor 325 is further mounted on the second mounting portion 323, the second sensor 324 and the third sensor 325 are respectively disposed at the first end and the second end of the second mounting portion 323, the second sensor 324 is used for sensing whether the silicon wafer is at the feeding end of the second conveying mechanism 32, and the third sensor 325 is used for sensing whether the silicon wafer is at the discharging end of the second conveying mechanism 32.
The detection principle of the second sensor 324 and the third sensor 325 is as follows: setting a time difference, and if the time difference of the silicon wafers detected by the second sensor 324 and the third sensor 325 is within the set time range, indicating that the silicon wafers are successfully inserted into the silicon wafer basket; if the time exceeds the predetermined time range, it indicates that the silicon wafer has failed after entering the second conveyor 321, and does not enter the detection area of the second sensor 324 located at the leading end.
As an alternative embodiment, the slide mechanism 33 includes a carriage 331, a slider 332, a slide rail 333, and a carriage driving section 334, see fig. 3. The second conveying mechanism 32 is mounted on a carriage 331, the carriage 331 is slidably engaged with a slide rail 333 through a slider 332, and a carriage driving unit 334 is connected to the carriage 331 and drives the carriage 331 to move along the slide rail 333.
The sliding mechanism 33 adopts the sliding block 332 and the sliding rail 333, and has simple structure and low cost.
In this embodiment, the carriage drive unit 334 employs an air cylinder.
The carriage driving part 334 adopts a cylinder, so that the arrangement is convenient and the cost is low.
As an alternative embodiment, as shown in fig. 3 and 4, a third conveying mechanism 35 is further installed at the feeding end of the first conveying mechanism 31. The silicon wafer inserting sheet conveying device 30 comprising three conveying mechanisms can be called a three-stage conveying device.
Alternatively, the third conveying mechanism 35 includes two third conveying belts 351 arranged in parallel and a third driving portion 352, and the third driving portion 352 drives the two third conveying belts 351 to run synchronously. Alternatively, the third driving part 352 also employs a motor.
The third conveying mechanism 35 temporarily stores the silicon wafers, so that the conveying efficiency of the second conveying mechanism 32 can be improved.
As shown in fig. 1 and fig. 2, in an embodiment, optionally, the silicon wafer insert conveying device 30 further includes a regulating mechanism 34, and the regulating mechanism 34 is disposed on both sides of the first conveying mechanism 31 and/or the second conveying mechanism 32; the regulating mechanism 34 regulates the silicon wafers on the first conveying mechanism 31 and/or the second conveying mechanism 32.
The silicon wafers are regulated by the regulating mechanism 34, so that the silicon wafers can be smoothly inserted into the silicon wafer material basket 36, and the silicon wafers are prevented from being damaged.
Alternatively, the regulating mechanism 34 includes two regulating portions 341, each regulating portion 341 includes a roller 342 and a roller driving mechanism 343, respectively; the two rolling member driving mechanisms 343 respectively drive the two rolling members 342 to approach or separate from the first conveying mechanism 31 and/or the second conveying mechanism 32 between the two rolling members 342.
The regulating mechanism 34 adopts a rolling structure, has a simple structure, and cannot be blocked when regulating the silicon wafers.
The utility model has been described above with a certain degree of particularity. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that come within the true spirit and scope of the utility model are desired to be protected. The scope of the utility model is defined by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The silicon wafer inserting sheet conveying device is characterized by comprising a first conveying mechanism, a second conveying mechanism and a sliding mechanism, wherein the first conveying mechanism and the second conveying mechanism are sequentially arranged along the conveying direction; wherein:
an accommodating space is formed at one end, close to the second conveying mechanism, of the first conveying mechanism, the second conveying mechanism is installed on the sliding mechanism, and the second conveying mechanism enters or moves out of the accommodating space under the driving of the sliding mechanism;
the conveying surfaces of the first conveying mechanism and the second conveying mechanism are positioned on the same plane, and the first conveying mechanism and the second conveying mechanism respectively and independently operate;
the first conveying mechanism is configured to temporarily store the received silicon wafers and convey the silicon wafers to the second conveying mechanism;
the second conveying mechanism is configured to receive the silicon wafers on the first conveying mechanism and convey the silicon wafers to a silicon wafer material basket.
2. The silicon wafer inserting sheet conveying device according to claim 1, wherein the first conveying mechanism comprises two first conveying belts arranged in parallel and a first driving part, and the first driving part drives the two first conveying belts to run synchronously; the accommodating space is formed between the two first conveying belts.
3. The silicon wafer inserting sheet conveying device according to claim 2, wherein a first mounting part is arranged between the two first conveying belts, and a first sensor for sensing whether the silicon wafer is on the two first conveying belts is mounted on the first mounting part.
4. The silicon wafer inserting sheet conveying device according to claim 1, wherein the second conveying mechanism comprises two second conveying belts arranged in parallel and a second driving part, and the second driving part drives the two second conveying belts to run synchronously; the outer side distance between the two second conveying belts is smaller than the width of the accommodating space.
5. The silicon wafer inserting and conveying device according to claim 4, wherein a second mounting portion is arranged between the two second conveying belts, and a second sensor for sensing whether the silicon wafers exist on the two second conveying belts is mounted on the second mounting portion.
6. The silicon wafer inserting sheet conveying device according to claim 5, wherein a third sensor is further installed on the second installation part, the second sensor and the third sensor are respectively arranged at the first end and the second end of the second installation part, the second sensor is used for sensing whether a silicon wafer is arranged at the feeding end of the second conveying mechanism, and the third sensor is used for sensing whether a silicon wafer is arranged at the discharging end of the second conveying mechanism.
7. The silicon wafer inserting sheet conveying device according to claim 1, wherein the sliding mechanism comprises a carriage, a slider, a slide rail and a carriage driving portion, the second conveying mechanism is mounted on the carriage, the carriage is slidably fitted on the slide rail through the slider, and the carriage driving portion is connected with the carriage and drives the carriage to move along the slide rail.
8. The silicon wafer inserting and conveying device according to claim 1, wherein a third conveying mechanism is further installed at the feeding end of the first conveying mechanism, the third conveying mechanism comprises two third conveying belts arranged in parallel and a third driving portion, and the third driving portion drives the two third conveying belts to run synchronously.
9. The silicon wafer insert conveying device according to claim 1, further comprising a warping mechanism disposed on both sides of the first conveying mechanism and/or the second conveying mechanism; and the regulating mechanism regulates the silicon wafers on the first conveying mechanism and/or the second conveying mechanism.
10. The silicon wafer inserting sheet conveying device according to claim 9, wherein the regulating mechanism comprises two regulating parts, each regulating part comprises a rolling member and a rolling member driving mechanism; the two rolling part driving mechanisms respectively drive the two rolling parts to be close to or far away from the first conveying mechanism and/or the second conveying mechanism between the two rolling parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122325610.7U CN216376694U (en) | 2021-09-24 | 2021-09-24 | Silicon chip inserted sheet conveyor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122325610.7U CN216376694U (en) | 2021-09-24 | 2021-09-24 | Silicon chip inserted sheet conveyor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216376694U true CN216376694U (en) | 2022-04-26 |
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ID=81241963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122325610.7U Active CN216376694U (en) | 2021-09-24 | 2021-09-24 | Silicon chip inserted sheet conveyor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216376694U (en) |
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2021
- 2021-09-24 CN CN202122325610.7U patent/CN216376694U/en active Active
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