CN216357570U

CN216357570U - SMT (surface mount technology) surface mount reflow soldering process equipment

Info

Publication number: CN216357570U
Application number: CN202123028345.2U
Authority: CN
Inventors: 牟松; 张金玺; 高洪青
Original assignee: Yantai Jiali Electronic Technology Co ltd
Current assignee: Yantai Jiali Electronic Technology Co ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-04-19
Anticipated expiration: 2031-12-03

Abstract

The utility model relates to the technical field of reflow soldering process, and discloses SMT (surface mount technology) mounting reflow soldering process equipment, which comprises two conveying lines, wherein connecting blocks are fixedly arranged on the two conveying lines, vertical bars are fixedly arranged at the ends of the two connecting blocks, sliding grooves are formed in the left sides of the two vertical bars, concave blocks are movably connected in the two sliding grooves, the two sliding blocks can be driven to move rightwards along with the rightward movement of a circuit board, when the two sliding blocks are respectively aligned with the concave parts of the two concave blocks, the two material receiving plate frames can drive the circuit board to move downwards, the circuit board is prevented from being damaged by buffering through the two material receiving plate frames, a plurality of material receiving plate frames and concave blocks are arranged in the two sliding grooves, when the first two material receiving plate frames move downwards, the next material receiving plate frame can move downwards, so that the two sliding blocks which are rebounded and moved back by a pressure spring are used for next material receiving protection, the circuit board can be prevented from falling and being damaged when the working personnel are not present.

Description

SMT (surface mount technology) surface mount reflow soldering process equipment

Technical Field

The utility model relates to the technical field of reflow soldering processes, in particular to SMT (surface mount technology) surface mount reflow soldering process equipment.

Background

Current publication number CN213888581U discloses a novel reflow soldering device for SMT pastes dress technology, including the reflow soldering machine body, the bottom fixedly connected with bottom plate of reflow soldering machine body, the equal fixedly connected with supporting seat in both sides of bottom plate bottom, the equal fixedly connected with universal wheel in front end and the rear end of supporting seat bottom. According to the utility model, through the matched use of the supporting seat, the sliding rail, the connecting rod, the mounting groove, the hydraulic telescopic rod and the spring, the use height of the reflow soldering machine body can be adjusted, so that the reflow soldering machine body can adapt to workers with different heights, and the vibration received by the reflow soldering machine body during working can be buffered and damped, so that the service life of the reflow soldering machine body is prolonged.

Although can make this device guarantee good stability at the during operation, the better stability of having guaranteed reflow soldering work goes on, but most reflow soldering device are placing the circuit board transportation welding back on the transfer chain, need the staff to connect the material in unloading department is manual to avoid the circuit board to drop and produce the damage to will lead to the circuit board to drop when the staff is not at easily and produce the damage.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides SMT (surface mount technology) mounting reflow soldering process equipment which has the advantages of being capable of preventing a circuit board from falling and being damaged when a worker is absent and the like, and solves the problem that after most reflow soldering devices place the circuit board on a conveying line for transportation and soldering, the worker needs to manually receive materials at a blanking position to prevent the circuit board from falling and being damaged, so that the circuit board is easily dropped and damaged when the worker is absent.

(II) technical scheme

In order to achieve the purpose of avoiding the circuit board from falling and being damaged when the worker is absent, the utility model provides the following technical scheme: the utility model provides a SMT pastes dress reflow soldering technology equipment, including two transfer chains, equal fixed mounting has the connecting block on two transfer chains, the equal fixed mounting in end of two connecting blocks has the vertical retort, the spout has all been seted up in the left side of two vertical retort, equal swing joint has concave block in two spouts, the equal fixed mounting in left side of two concave blocks connects material half frame, the cross slot has all been seted up to the right inner wall of two spouts, equal swing joint has the slider in two cross slots, the equal fixed mounting in right side of two sliders has pressure spring, two pressure spring respectively with two cross slot inner wall fixed connection.

Preferably, two the inner wall that the spout was kept away from each other has all been seted up and has been erected the groove, and two are erected equal swing joint in the inslot and have the fritter, two fritters respectively with two spill piece fixed connection.

Preferably, two the square groove has all been seted up to the downside of vertical retort, two square grooves communicate with two spouts respectively, and two equal swing joint in the square groove have the baffle.

Preferably, two the equal fixed mounting of baffle upside has the connecting strip, and the spread groove has all been seted up to inner wall on two square grooves, two connecting strips respectively with two spread groove swing joint.

Preferably, the lower sides of the two receiving half frames are fixedly provided with buffer plates.

(III) advantageous effects

Compared with the prior art, the utility model provides SMT (surface mount technology) surface mount reflow soldering process equipment, which has the following beneficial effects:

1. the SMT mounting reflow soldering process equipment can convey the circuit board to the two material receiving half frames by conveying the circuit board to the right through the two conveying lines, therefore, the front edge and the rear edge of the circuit board are respectively movably connected with the two material receiving plate frames, the two sliding blocks can be driven to move rightwards along with the circuit board moving rightwards, when the two sliding blocks are respectively aligned with the concave parts of the two concave blocks, the two material receiving plate frames can drive the circuit board to move downwards, simultaneously, the two material receiving plate frames are used for buffering to avoid the damage of the circuit board, a plurality of material receiving plate frames and concave blocks are arranged in the two chutes, so that when the first two receiving plate frames move downwards, the next receiving plate frame can move downwards, therefore, the two sliding blocks which are rebounded by the pressure spring to move back block the next material receiving protection, and the circuit board can be prevented from falling to be damaged when the working personnel are not at the moment.

2. This SMT pastes dress reflow soldering process equipment can avoid two concave blocks to drop through two vertical grooves and two fritters to can avoid connecing the material half frame to take place to drop, just can take out the circuit board that falls down with connecing the material half frame to having the removal to handle through removing the baffle, thereby can improve device's practicality.

3. This SMT pastes dress reflow soldering process equipment can convenience of customers' installation dismantlement baffle through two connecting strips and two spread grooves, can reduce two impact that connect the material sheet frame through the buffer board to can further improve the buffering effect to the circuit board, just so can improve the protection effect to the circuit board.

Drawings

FIG. 1 is a schematic front perspective view of the present invention;

FIG. 2 is a schematic front perspective view of the vertical bar of FIG. 1 according to the present invention;

FIG. 3 is a schematic front sectional perspective view of the vertical bar of FIG. 1 according to the present invention.

In the figure: 1. a conveying line; 2. connecting blocks; 3. receiving a material half frame; 4. vertical bars; 5. a vertical slot; 6. small blocks; 7. a chute; 8. a concave block; 9. a square groove; 10. a baffle plate; 11. a pressure spring; 12. connecting grooves; 13. a connecting strip; 14. a slider; 15. a transverse groove; 16. a buffer plate.

Detailed Description

The present invention will be described in further detail with reference to the drawings, wherein like elements are designated by like reference numerals, wherein the terms "front", "rear", "left", "right", "upper" and "lower", "bottom" and "top" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular element.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1-3, the present invention provides a technical solution: an SMT surface mounting reflow soldering process device comprises two conveying lines 1, wherein connecting blocks 2 are fixedly arranged on the two conveying lines 1, vertical bars 4 are fixedly arranged at the ends of the two connecting blocks 2, sliding grooves 7 are formed in the left sides of the two vertical bars 4, concave blocks 8 are movably connected in the two sliding grooves 7, receiving half frames 3 are fixedly arranged on the left sides of the two concave blocks 8, transverse grooves 15 are formed in the right inner walls of the two sliding grooves 7, sliding blocks 14 are movably connected in the two transverse grooves 15, pressure springs 11 are fixedly arranged on the right sides of the two sliding blocks 14, the two pressure springs 11 are respectively fixedly connected with the inner walls of the two transverse grooves 15, a circuit board is conveyed rightwards through the two conveying lines 1 and can be conveyed into the two receiving half frames 3, so that the front edge and the rear edge of the circuit board are respectively movably connected with the two receiving frame 3 and move rightwards along with the circuit board, the two sliders 14 can be driven to move rightwards, when the two sliders 14 are respectively aligned with the concave parts of the two concave blocks 8, the two material receiving plate frames 3 can drive the circuit board to move downwards, the two material receiving plate frames 3 can buffer to avoid circuit board damage, a plurality of material receiving plate frames 3 and the concave blocks 8 are arranged in the two chutes 7, so that when the first group of the two material receiving plate frames 3 move downwards, the next group of the material receiving plate frames 3 can move downwards, the two sliders 14 rebounded and moved back by the pressure spring 11 can block to carry out next material receiving protection, the circuit board can be prevented from falling to be damaged when a worker is absent, the inner walls of the two chutes 7, which are far away from each other, are respectively provided with vertical grooves 5, the two small blocks 6 are movably connected in the two vertical grooves 5, the two small blocks 6 are respectively fixedly connected with the two concave blocks 8, the lower sides of the two vertical strips 4 are respectively provided with square grooves 9, two square grooves 9 communicate with two spouts 7 respectively, and equal swing joint has baffle 10 in two square grooves 9, can avoid two concave blocks 8 to drop through two perpendicular grooves 5 and two fritters 6 to can avoid connecing material half frame 3 to take place to drop, just can take out the circuit board that falls and connect material half frame 3 to having the removal to handle through removing baffle 10, thereby can improve device's practicality.

In use, the first step: the circuit board is conveyed to the right by the two conveying lines 1, the circuit board can be conveyed into the two material receiving half frames 3, therefore, the front edge and the rear edge of the circuit board are respectively movably connected with the two material receiving plate frames 3, the two sliding blocks 14 can be driven to move rightwards along with the circuit board moving rightwards, when the two sliders 14 are respectively aligned with the concave parts of the two concave blocks 8, the two material receiving plate frames 3 can drive the circuit board to move downwards, meanwhile, the two material receiving plate frames 3 are used for buffering to avoid the damage of the circuit board, a plurality of material receiving plate frames 3 and concave blocks 8 are arranged in the two chutes 7, so that when the first two receiving plate frames 3 move downwards, the next receiving plate frame 3 can move downwards, therefore, the two sliding blocks 14 which are rebounded by the pressure spring 11 and move back block the next material receiving protection, and therefore the circuit board can be prevented from falling and being damaged when a worker is not at present.

The second step is that: can avoid two concave blocks 8 to drop through two riser grooves 5 and two fritters 6 to can avoid connecing material half frame 3 to take place to drop, just can take out the circuit board that falls and connect material half frame 3 to having the removal to handle through removing baffle 10, thereby can improve the practicality of device.

Example two

Referring to fig. 1-3 on the basis of the first embodiment, the upper sides of the two baffles 10 are both fixedly installed with connecting strips 13, the upper inner walls of the two square grooves 9 are both opened with connecting grooves 12, the two connecting strips 13 are respectively movably connected with the two connecting grooves 12, and the lower sides of the two material receiving half-frames 3 are both fixedly installed with buffer plates 16.

When the connecting structure is used, the baffle 10 can be assembled and disassembled by a user conveniently through the two connecting strips 13 and the two connecting grooves 12, and the impact force of the two material receiving plate frames 3 can be reduced through the buffer plate 16, so that the buffer effect on the circuit board can be further improved, and the protection effect on the circuit board can be improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a SMT pastes dress reflow soldering technology equipment, includes two transfer chain (1), its characterized in that: two equal fixed mounting has connecting block (2) on transfer chain (1), the equal fixed mounting of the right-hand member of two connecting blocks (2) has vertical retort (4), spout (7) have all been seted up in the left side of two vertical retort (4), equal swing joint has concave block (8) in two spout (7), the equal fixed mounting in left side of two concave block (8) connects material half frame (3), cross slot (15) have all been seted up to the right inner wall of two spout (7), equal swing joint has slider (14) in two cross slot (15), the equal fixed mounting in right side of two slider (14) has pressure spring (11), two pressure spring (11) respectively with two cross slot (15) inner wall fixed connection.

2. An SMT reflow soldering process equipment according to claim 1, wherein: two the inner wall that spout (7) kept away from each other has all been seted up and has been erect groove (5), and equal swing joint has fritter (6) in two perpendicular grooves (5), two fritters (6) respectively with two concave piece (8) fixed connection.

3. An SMT reflow soldering process equipment according to claim 1, wherein: two square grooves (9) have all been seted up to the downside of vertical retort (4), and two square grooves (9) communicate with two spout (7) respectively, and equal swing joint has baffle (10) in two square grooves (9).

4. An SMT reflow soldering process equipment according to claim 3, wherein: two equal fixed mounting in baffle (10) upside has connecting strip (13), and spread groove (12) have all been seted up to inner wall on two square grooves (9), two connecting strip (13) respectively with two spread groove (12) swing joint.

5. An SMT reflow soldering process equipment according to claim 1, wherein: and buffer plates (16) are fixedly arranged on the lower sides of the two material receiving half frames (3).