CN216357552U - Lamination jig of outer protection film of high-accuracy circuit board - Google Patents
Lamination jig of outer protection film of high-accuracy circuit board Download PDFInfo
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- CN216357552U CN216357552U CN202121888796.0U CN202121888796U CN216357552U CN 216357552 U CN216357552 U CN 216357552U CN 202121888796 U CN202121888796 U CN 202121888796U CN 216357552 U CN216357552 U CN 216357552U
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Abstract
A lamination jig for an outer protective film of a high-precision circuit board comprises an upper jig assembly, a lower jig assembly, a stamping device and a buffer assembly, wherein the upper jig assembly and the lower jig assembly are arranged oppositely from top to bottom, and the stamping device is arranged above the upper jig assembly and connected with the stamping device; a plurality of buffer assemblies are symmetrically and fixedly arranged between the upper jig assembly and the lower jig assembly; go up tool subassembly bottom surface and be provided with the busbar groove of stepping down, tool subassembly upper surface is provided with recessed holding tank down, the holding tank is used for holding the circuit board that has the busbar and has the clearance between the cell wall of holding tank and the busbar. The lamination jig for the outer-layer protective film of the high-precision circuit board is reasonable in structural design and convenient to operate, the buffer assembly is arranged, the circuit board is prevented from being damaged when the lamination force is too strong, the buffer assembly has a certain degree of buffer, the circuit board is convenient to protectively process, and the lamination jig is wide in application prospect.
Description
Technical Field
The utility model relates to the technical field of jigs, in particular to a lamination jig for an outer-layer protective film of a high-precision circuit board.
Background
The circuit board is also called as a circuit board, which enables the circuit to be miniaturized and visualized and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. Among them, the flexible wiring board is a printed circuit made of a flexible insulating base material, provides excellent electrical properties, can meet design requirements for smaller and higher density mounting, and also contributes to reduction in assembly processes and enhancement in reliability.
The conventional processing flow of the flexible circuit board product is etching the circuit, laminating a protective film, OSP (organic solderability preservative), punching the appearance, SMT welding a nickel sheet, NTC thermistor, laminating an outer protective film, laminating a connector reinforcement and SMT welding a connector. The jig is a tool for carpenters, ironmen, pincers, machines, electric control and other handicrafts, and is mainly used as a tool for assisting in controlling position or action (or both). The jig can be divided into a process assembly type jig, a project test type jig and a circuit board test type jig. In the step of laminating outer protection film, need to laminate the material, can cause the damage to the material when the machining power is too strong, so need add man-hour and carry out certain degree of buffering to it, conveniently carry out the protectiveness processing to the material, the lamination tool inefficiency and the unstable quality of outer protection film among the prior art, can't make outer protection film cover flexible line way board and busbar completely. Therefore, it is necessary to develop a lamination jig for the outer protective film of the high-precision circuit board to solve the above problems.
Chinese patent application No. CN201020574788.4 discloses a reinforcing and laminating jig for flexible circuit board, on which a reinforcing window for nesting the reinforcing position of the flexible circuit board is formed. The reinforcing window on the jig is aligned with the reinforcing and sleeved on the flexible circuit board attached with the reinforcing, and then the jig and the flexible circuit board are put into a laminating machine together for laminating, so that the problems that the laminating jig of the outer protective film is damaged due to excessive processing and the outer protective film is difficult to completely cover the shape are not solved.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: in order to overcome the defects, the utility model aims to provide the laminating jig for the outer-layer protective film of the high-precision circuit board, which has the advantages of reasonable structural design and wide application prospect, is convenient to operate, and can prevent the circuit board from being damaged when the laminating pressure is too high by arranging the buffer component, so that the buffer component can play a role in buffering to a certain extent, and is convenient to perform protective processing on the circuit board.
The technical scheme is as follows: a lamination jig for an outer protective film of a high-precision circuit board comprises an upper jig assembly, a lower jig assembly, a stamping device and a buffer assembly, wherein the upper jig assembly and the lower jig assembly are arranged oppositely from top to bottom, and the stamping device is arranged above the upper jig assembly and connected with the stamping device; a plurality of buffer assemblies are symmetrically and fixedly arranged between the upper jig assembly and the lower jig assembly; go up tool subassembly bottom surface and be provided with the busbar groove of stepping down, tool subassembly upper surface is provided with recessed holding tank down, the holding tank is used for holding the circuit board that has the busbar and has the clearance between the cell wall of holding tank and the busbar, the busbar groove of stepping down is used for holding the busbar and has the clearance between the cell wall of busbar groove and the busbar.
The laminating jig for the outer protective film of the high-precision circuit board is reasonable in structural design and convenient to operate, the upper jig assembly is driven by the punching device to punch downwards, when the upper jig assembly is pressed on the lower jig assembly, one outer protective film layer covers the lower surfaces of the circuit board and the bus bar at the bottom of the accommodating groove, the other outer protective film layer covers the upper surface of the bus bar at the bottom of the bus bar receding groove, and the outer protective film layer covers the upper surface of the circuit board except the bus bar at the lower surface of the upper jig assembly corresponding to the accommodating groove. Through be provided with the buffering subassembly at last tool subassembly, between the tool subassembly down, can cause the damage to the circuit board when avoiding lamination pressure degree too strong, play the buffering of certain degree, conveniently carry out the protection processing to the circuit board.
The bottom of the accommodating groove, the lower surface of the upper jig component and the bottom of the bus bar abdicating groove are made of soft materials.
Further, foretell lamination tool of outer protection film of high-accuracy circuit board, it includes that tool and third go up the tool to go up the tool subassembly, tool and third go up the tool on tool, tool and third go up tool from the bottom up overlapping in proper order establish on the first tool, second, tool is equipped with first fretwork district and second fretwork district respectively on the first tool, the second fretwork district and the third lower surface of going up the tool enclose jointly and close and form the busbar groove of stepping down.
The first upper jig and the third upper jig are made of soft materials, and the second upper jig is made of hard materials and plays a supporting role.
Further, foretell lamination tool of outer protection film of high-accuracy circuit board, tool subassembly includes tool under first tool, second and the tool under the third, tool and the third are folded from bottom to top under first tool, the second in proper order and the third tool, the tool is provided with the third fretwork district under the third, the third fretwork district encloses jointly with the upper surface of tool under the second and forms the holding tank.
The first lower jig and the third lower jig are made of hard materials, the first lower jig is used as a bearing disc of the whole jig, the second lower jig is made of soft materials, and a third hollow-out area of the third lower jig and the upper surface of the second lower jig jointly enclose to form a containing groove.
Further, foretell high accuracy circuit board outer layer protection film's lamination tool, the tank bottom in groove of stepping down of busbar still is equipped with the first bending groove that runs through supreme tool subassembly top, the tank bottom of holding tank is provided with the second bending groove that runs through to tool subassembly bottom down.
The first bending groove is used for enabling the bending area of the bus bar to extend out of the first bending groove, and the second bending groove is also used for enabling the bending area of the bus bar to extend out of the second bending groove.
Further, foretell lamination jig of outer protection film of high-accuracy circuit board, the buffering subassembly includes sliding sleeve, stand, a plurality of the even fixed mounting of stand is at the upper surface of tool subassembly down, every the sliding sleeve has all been cup jointed in the outside of stand, every the equal fixed mounting in one end of sliding sleeve is in the bottom surface of last tool subassembly.
Further, foretell lamination jig of outer protection film of high-accuracy circuit board, the buffering subassembly still includes the spring, hinders and moves the piece, the one end fixed mounting of stand hinders and moves the piece, the spring has been cup jointed in the outside of sliding sleeve and stand, the both ends of spring respectively with the bottom surface of last tool subassembly, the last fixed surface of lower tool subassembly is connected.
The sliding sleeve and the stand column are matched with each other, so that the buffer assembly is fixedly mounted, the stop block is convenient to realize the operation stability of the stand column, and the spring is convenient to realize the buffer of the laminating jig.
Furthermore, in the lamination jig for the outer layer protective film of the high-precision circuit board, the upper jig component and the lower jig component are respectively provided with a plurality of jig positioning holes, and jig positioning pins are movably arranged in the jig positioning holes in a penetrating manner; the upper jig assembly and the lower jig assembly are also respectively provided with a plurality of busbar positioning holes corresponding to busbars of the circuit board, and busbar positioning pins can movably penetrate through the busbar positioning holes; go up tool subassembly, lower tool subassembly and still seted up a plurality of and the locating hole that the circuit board corresponds respectively, the dowel pin movably wears to establish in the locating hole.
Through setting up tool locating hole, converging and arranging locating hole, locating hole and being used for the location, location flexibility and precision have been improved. During operation, through tool locating pin in proper order the location place first tool, tool under the second, tool under the third, place outer protection film after that, flexible line way board (bottom surface down) and outer protection film that have the busbar, then through busbar locating pin and locating pin location busbar and flexible line way board position, place first tool on, tool and third tool on the second again in proper order, take out tool locating pin at last, busbar locating pin and locating pin, under stamping device's drive, go up tool subassembly punching press downwards, carry out the pressfitting.
The utility model has the beneficial effects that: the lamination jig for the outer protective film of the high-precision circuit board is reasonable in structural design and convenient to operate, the buffer assembly is arranged, the circuit board is prevented from being damaged when the lamination pressure is too high, the buffer assembly has a certain degree of buffer effect, the circuit board is convenient to protectively process, the covering effect of the outer protective film is good, and the application prospect is wide.
Drawings
FIG. 1 is a schematic structural diagram of a lamination jig for an outer layer protective film of a high-precision circuit board according to the present invention;
FIG. 2 is a schematic structural diagram of a buffer assembly of the lamination jig for the outer protective film of the high-precision circuit board according to the utility model;
FIG. 3 is a schematic view of a first upper jig structure of the lamination jig for the outer protective film of the high-precision circuit board according to the present invention;
FIG. 4 is a schematic structural view of a second upper jig of the lamination jig for the outer protective film of the high-precision circuit board according to the present invention;
FIG. 5 is a schematic structural view of a third upper jig of the lamination jig for the outer protective film of the high-precision circuit board according to the present invention;
FIG. 6 is a first lower jig structure diagram of the lamination jig for the outer layer protective film of the high-precision circuit board according to the present invention;
FIG. 7 is a second lower jig structure of the lamination jig for the outer protective film of the high-precision circuit board according to the present invention;
in the figure: the jig comprises an upper jig assembly 1, a busbar abdicating groove 11, a first bending groove 111, a first upper jig 12, a first hollowed-out area 121, a second upper jig 13, a second hollowed-out area 131, a third upper jig 14, a jig positioning hole 15, a busbar positioning hole 16, a positioning hole 17, a lower jig assembly 2, a containing groove 21, a second bending groove 211, a first lower jig 22, a second lower jig 23, a third lower jig 24, a buffer assembly 4, a sliding sleeve 41, a stand column 42, a spring 43, a blocking block 44, an outer-layer protective film a, a circuit board b, a busbar c, a jig positioning pin d, a busbar positioning pin e and a positioning pin f.
Detailed Description
The utility model will be further elucidated with reference to the accompanying figures 1-7 and specific examples.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The lamination jig for the high-precision circuit board outer layer protective film with the structure shown in fig. 1-7 comprises an upper jig component 1, a lower jig component 2, a stamping device and a buffer component 4, wherein the upper jig component 1 and the lower jig component 2 are arranged in an up-down opposite manner, and the stamping device is arranged above the upper jig component 1 and is connected with the stamping device; a plurality of buffer components 4 are symmetrically and fixedly arranged between the upper jig component 1 and the lower jig component 2; go up 1 bottom surface of tool subassembly and be provided with the busbar groove of stepping down 11, 2 upper surfaces of tool subassembly are provided with recessed holding tank 21 down, holding tank 21 is used for holding the circuit board that has the busbar and has the clearance between the cell wall of holding tank 21 and the busbar, the busbar groove of stepping down 11 is used for holding the busbar and has the clearance between the cell wall of busbar groove 11 and the busbar.
In addition, go up tool subassembly 1 and include tool 12 on the first tool 12, tool 13 on the second and tool 14 on the third, tool 14 is folded from the bottom up in proper order on the first tool 12, the second, tool 13 and the third, tool 12 is gone up on the first tool 12, the second is gone up tool 13 and is equipped with first fretwork area 121 and second fretwork area 131 respectively, the lower surface of tool 14 encloses jointly and closes and form busbar groove 11 of stepping down in first fretwork area 121 and second fretwork area 131 and the third.
In addition, lower tool subassembly 2 includes tool 22, second lower tool 23 and tool 24 under the third, tool 22, second lower tool 23 and tool 24 are folded in proper order from bottom to top under the first, tool 24 is provided with the third hollow area under the third, the third hollow area encloses jointly with the upper surface of second lower tool 23 and forms holding tank 21.
In addition, the tank bottom of the bus bar abdicating groove 11 is also provided with a first bending groove 111 penetrating through the top of the upper jig component 1, and the tank bottom of the accommodating groove 21 is provided with a second bending groove 211 penetrating through the bottom of the lower jig component 2.
Further, the buffer component 4 includes a sliding sleeve 41, a stand column 42, and a plurality of the stand column 42 is uniformly and fixedly installed on the upper surface of the lower jig component 2, and each sliding sleeve 41 is sleeved on the outer side of the stand column 42, and each sliding sleeve 41 is fixedly installed on the bottom surface of the upper jig component 1 at one end.
Further, the buffer assembly 4 further includes a spring 43 and a blocking block 44, the blocking block 44 is fixedly mounted at one end of the upright post 42, the spring 43 is sleeved on the outer sides of the sliding sleeve 41 and the upright post 42, and two ends of the spring 43 are fixedly connected with the bottom surface of the upper jig assembly 1 and the upper surface of the lower jig assembly 2 respectively.
In addition, the upper jig component 1 and the lower jig component 2 are respectively provided with a plurality of jig positioning holes 15, and jig positioning pins d are movably arranged in the jig positioning holes 15 in a penetrating manner; the upper jig component 1 and the lower jig component 2 are also respectively provided with a plurality of busbar positioning holes 16 corresponding to busbars of the circuit board, and busbar positioning pins e can movably penetrate through the busbar positioning holes 16; the upper jig assembly 1 and the lower jig assembly 2 are further respectively provided with a plurality of positioning holes 17 corresponding to the circuit board, and the positioning pins f are movably arranged in the positioning holes 17 in a penetrating manner.
Examples
Based on the above structural basis, as shown in fig. 1-7.
The lamination jig for the high-precision circuit board outer protective film is reasonable in structural design and convenient to operate, the upper jig assembly 1 is driven by the punching device to punch downwards, when the upper jig assembly 1 is pressed on the lower jig assembly 3, one outer protective film a covers the lower surfaces of the circuit board b and the bus bar c at the bottom of the accommodating groove 21, the other outer protective film a covers the upper surface of the bus bar c at the bottom of the bus bar abdicating groove 11, and the outer protective film a covers the upper surface of the circuit board b except the bus bar c at the lower surface of the upper jig assembly 1 corresponding to the accommodating groove 21. Through be provided with buffering subassembly 4 between last tool subassembly 1, lower tool subassembly 2, can cause the damage to circuit board b when avoiding the lamination degree too strong, played the buffering of certain degree, conveniently carry out the protective machining to circuit board b.
The bottom of the accommodating groove 21, the lower surface of the upper jig component 1 and the bottom of the bus bar receding groove 11 are made of soft materials.
Further, the first upper jig 12 and the third upper jig 14 are made of soft materials, and the second upper jig 13 is made of hard materials and plays a supporting role. The first lower jig 22 and the third lower jig 24 are made of hard materials, the first lower jig 22 is used as a bearing disc of the whole jig, the second lower jig 23 is made of soft materials, and a third hollow area of the third lower jig 23 and the upper surface of the second lower jig 23 enclose together to form the accommodating groove 21.
The first bending groove 111 is used for extending the bending region of the bus bar c from the first bending groove 111, and the second bending groove 211 is also used for extending the bending region of the bus bar c from the second bending groove 211.
In addition, the sliding sleeve 41 and the upright post 42 of the buffer assembly 4 are matched with each other, so that the fixed installation of the buffer assembly 4 is realized, the blocking block 44 is used for realizing the operation stability of the upright post 42, and the spring 43 is used for realizing the buffering of the lamination jig.
Furthermore, the jig positioning hole 14, the confluence row positioning hole 16 and the positioning hole 17 are arranged for positioning, so that the positioning flexibility and the positioning precision are improved. During operation, a first lower jig 22, a second lower jig 23 and a third lower jig 24 are sequentially positioned and placed through the jig positioning pins d, then the outer protective film a, the circuit board b (with the bottom surface facing downwards) with the busbar c and the outer protective film a are placed, then the busbar c and the circuit board b are positioned through the busbar positioning pins e and the positioning pins f, then the first upper jig 22, the second upper jig 23 and the third upper jig 24 are sequentially placed, finally the jig positioning pins d, the busbar positioning pins e and the positioning pins f are taken out, and under the driving of the punching device, the upper jig assembly 1 is punched downwards to be pressed and pressed.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the utility model is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination between the embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the idea of the present invention.
Claims (7)
1. A lamination jig for a high-precision circuit board outer layer protective film is characterized by comprising an upper jig component (1), a lower jig component (2), a stamping device and a buffer component (4), wherein the upper jig component (1) and the lower jig component (2) are arranged in an up-and-down opposite mode, and the stamping device is arranged above the upper jig component (1) and connected with the stamping device; a plurality of buffer components (4) are symmetrically and fixedly arranged between the upper jig component (1) and the lower jig component (2); go up tool subassembly (1) bottom surface and be provided with busbar groove (11) of stepping down, tool subassembly (2) upper surface is provided with recessed holding tank (21) down, holding tank (21) are used for holding the circuit board that has the busbar and have the clearance between the cell wall of holding tank (21) and the busbar, busbar groove (11) of stepping down is used for holding the busbar and the busbar has the clearance between the cell wall of busbar groove (11) and the busbar.
2. The lamination jig for the outer protective film of the high-precision circuit board according to claim 1, wherein the upper jig assembly (1) comprises a first upper jig (12), a second upper jig (13) and a third upper jig (14), the first upper jig (12), the second upper jig (13) and the third upper jig (14) are sequentially stacked from bottom to top, the first upper jig (12) and the second upper jig (13) are respectively provided with a first hollow area (121) and a second hollow area (131), and the lower surfaces of the first hollow area (121), the second hollow area (131) and the third upper jig (14) jointly enclose to form a busbar relief groove (11).
3. The lamination jig for the outer protective film of the high-precision circuit board according to claim 2, wherein the lower jig assembly (2) comprises a first lower jig (22), a second lower jig (23) and a third lower jig (24), the first lower jig (22), the second lower jig (23) and the third lower jig (24) are sequentially stacked from bottom to top, the third lower jig (24) is provided with a third hollow area, and the third hollow area and the upper surface of the second lower jig (23) jointly enclose to form the accommodating groove (21).
4. The lamination jig for the outer protective film of the high-precision circuit board according to claim 3, wherein the bottom of the bus bar receding groove (11) is further provided with a first bending groove (111) penetrating through the top of the upper jig component (1), and the bottom of the accommodating groove (21) is provided with a second bending groove (211) penetrating through the bottom of the lower jig component (2).
5. The lamination jig for the outer protective film of the high-precision circuit board according to claim 1, wherein the buffer assembly (4) comprises a sliding sleeve (41) and a plurality of columns (42), the columns (42) are uniformly and fixedly mounted on the upper surface of the lower jig assembly (2), the sliding sleeve (41) is sleeved on the outer side of each column (42), and one end of each sliding sleeve (41) is fixedly mounted on the bottom surface of the upper jig assembly (1).
6. The lamination jig for the outer layer of the high-precision circuit board according to claim 5, wherein the buffer assembly (4) further comprises a spring (43) and a stopping block (44), the stopping block (44) is fixedly installed at one end of the upright post (42), the spring (43) is sleeved on the outer sides of the sliding sleeve (41) and the upright post (42), and two ends of the spring (43) are respectively and fixedly connected with the bottom surface of the upper jig assembly (1) and the upper surface of the lower jig assembly (2).
7. The lamination jig for the outer protective film of the high-precision circuit board according to claim 4, wherein the upper jig component (1) and the lower jig component (2) are respectively provided with a plurality of jig positioning holes (15), and jig positioning pins are movably inserted into the jig positioning holes (15); the upper jig component (1) and the lower jig component (2) are respectively provided with a plurality of busbar positioning holes (16) corresponding to busbars of the circuit board, and busbar positioning pins can movably penetrate through the busbar positioning holes (16); go up tool subassembly (1), down tool subassembly (2) and still seted up a plurality of locating hole (17) that correspond with the circuit board respectively, the dowel pin movably wears to establish in locating hole (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121888796.0U CN216357552U (en) | 2021-08-10 | 2021-08-10 | Lamination jig of outer protection film of high-accuracy circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121888796.0U CN216357552U (en) | 2021-08-10 | 2021-08-10 | Lamination jig of outer protection film of high-accuracy circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN216357552U true CN216357552U (en) | 2022-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121888796.0U Active CN216357552U (en) | 2021-08-10 | 2021-08-10 | Lamination jig of outer protection film of high-accuracy circuit board |
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| CN (1) | CN216357552U (en) |
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2021
- 2021-08-10 CN CN202121888796.0U patent/CN216357552U/en active Active
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