CN216354125U - Anti-deformation leveling mechanism for sucker module on wafer debonding and bonding equipment - Google Patents
Anti-deformation leveling mechanism for sucker module on wafer debonding and bonding equipment Download PDFInfo
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- CN216354125U CN216354125U CN202121587558.6U CN202121587558U CN216354125U CN 216354125 U CN216354125 U CN 216354125U CN 202121587558 U CN202121587558 U CN 202121587558U CN 216354125 U CN216354125 U CN 216354125U
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Abstract
The utility model discloses an anti-deformation leveling mechanism for a sucker module on wafer debonding and bonding equipment, which comprises a wafer upper sucker, a heating plate, a connecting plate, first pin holes, threaded holes, hollow leveling screws, second pin holes, connecting screws and leveling nuts, wherein the wafer upper sucker is arranged on the bottom surface of the heating plate, the heating plate is stacked below the connecting plate, four first pin holes which are centrosymmetric and distributed in a matrix are formed in the corners of the connecting plate, four threaded holes which are coaxial with the first pin holes are formed in the corners of the heating plate, and one hollow leveling screw with the leveling nut is inserted into each first pin hole. Through the mode, the anti-deformation leveling mechanism for the sucker module on the wafer bonding disassembling equipment, provided by the utility model, has the advantages that the hollow leveling screws, the leveling nuts and the connecting screws which are mutually overlapped are additionally arranged at the corners of the connecting plate, the problem of stress deformation of the heating plate is solved, the operation is simple and efficient, the service life is long, and the like.
Description
Technical Field
The utility model relates to the field of wafer bonding and debonding equipment, in particular to an anti-deformation leveling mechanism for a sucker module on wafer bonding and debonding equipment.
Background
The wafer debonding and bonding equipment realizes debonding and bonding operation on a wafer by utilizing negative pressure, the plane of the wafer needs to be kept in absolute level with the plane of a negative pressure sucker, the existing horizontal adjustment and calibration technical scheme of the negative pressure sucker comprises a screw column leveling mode, a central sphere leveling mode and the like, the screw leveling mode is difficult to realize absolute level due to the influence of thread precision, and the precision is low; the center sphere leveling mode has the problem of deformation of the connecting plate due to heating, and the service life is short and the center sphere leveling device is not durable.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing the anti-deformation leveling mechanism for the sucker module on the wafer bonding equipment, wherein hollow leveling screws, leveling nuts and connecting screws which are mutually overlapped are additionally arranged at the corners of the connecting plate, so that the problem of stress deformation of the heating plate is solved, and the anti-deformation leveling mechanism has the advantages of simplicity and high efficiency in operation, long service life and the like.
In order to solve the technical problems, the utility model adopts a technical scheme that: provides an anti-deformation leveling mechanism for a sucker module on wafer bonding equipment, which comprises a wafer sucker, a heating plate, a connecting plate, a first pin hole, a threaded hole, a hollow leveling screw, a second pin hole, a connecting screw and a leveling nut, the wafer upper sucker is arranged on the bottom surface of the heating plate, the heating plate is stacked below the connecting plate, four first pin holes which are centrosymmetric and distributed in a matrix are formed in the corner of the connecting plate, four threaded holes which are coaxial with the first pin holes are formed in the corner of the heating plate, a hollow leveling screw with a leveling nut is inserted in each first pin hole, the hollow leveling screw is provided with a second pin hole along the central axis, a connecting screw is inserted in the second pin hole, the connecting screw penetrates through the second pin hole and then is in threaded connection with the threaded hole, and the leveling nut is rotationally adjusted to enable the heating plate to be in locking fit with the upper surface of the connecting plate after being absolutely horizontal.
In a preferred embodiment of the utility model, the threaded bore diameter is smaller than the first pin bore diameter.
In a preferred embodiment of the present invention, the top end of the connecting screw is press-fitted on the upper end surface of the hollow leveling screw.
The utility model has the beneficial effects that: according to the anti-deformation leveling mechanism for the sucker module on the wafer debonding and bonding equipment, the hollow leveling screws, the leveling nuts and the connecting screws which are mutually overlapped are additionally arranged at the corners of the connecting plate, so that the problem of stress deformation of the heating plate is solved, and the anti-deformation leveling mechanism has the advantages of simplicity and high efficiency in operation, long service life and the like.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a structural diagram of a preferred embodiment of an anti-deformation leveling mechanism for a chuck module of a wafer debonding apparatus according to the present invention;
FIG. 2 is a structural diagram of a preferred embodiment of an anti-deformation leveling mechanism for a chuck module of a wafer debonding apparatus according to the present invention;
fig. 3 is a structural diagram of a second pin hole of a preferred embodiment of an anti-deformation leveling mechanism for a chuck module of a wafer debonding apparatus according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, embodiments of the present invention include:
an anti-deformation leveling mechanism for a sucker module on wafer debonding and bonding equipment comprises a sucker 1, a heating plate 2, a connecting plate 3, a first pin hole 4, a threaded hole 5, a hollow leveling screw 6, a second pin hole 7, a connecting screw 8 and a leveling nut 9 on a wafer, wherein the sucker 1 is installed on the bottom surface of the heating plate 2 on the wafer, the heating plate 2 is stacked below the connecting plate 3, four first pin holes 4 which are centrosymmetric and distributed in a matrix are formed in the corners of the connecting plate 3, four threaded holes 5 which are coaxial with the first pin holes 4 are formed in the corners of the heating plate 2, one hollow leveling screw 6 with the leveling nut 9 is inserted into each first pin hole 4, the second pin hole 7 is formed in the hollow leveling screw 6 along the central axis, one connecting screw 8 is inserted into each second pin hole 7, the connecting screw 8 is in threaded connection with the threaded hole 5 after penetrating through the second pin hole 7, the leveling nut 9 is rotationally adjusted to enable the heating plate 2 to be absolutely level and then to be locked and matched on the upper surface of the connecting plate 3.
Wherein the diameter of the threaded hole 5 is smaller than that of the first pin hole 4.
Furthermore, the top end of the connecting screw 8 is in press fit with the upper end surface of the hollow leveling screw 6.
As shown in fig. 2, the wafer bonding removal device is provided, the anti-deformation leveling mechanism 100 of the present application is installed at the lower end of the lifting mechanism 101 shown in the figure, before wafer bonding removal operation is performed, a level gauge should be used to adjust the levelness of the heating plate 2, the connecting screws 8 are all locked into the threaded holes 5, then the leveling nuts 9 are rotated to make the heating plate 2 tightly attached to the bottom surface of the connecting plate 3, and finally the length of each hollow leveling screw 6 is finely adjusted by means of the level gauge, the adjustment operation is simple and convenient, and rapid leveling can be achieved only by manually rotating the leveling nuts 9.
In conclusion, the utility model provides the anti-deformation leveling mechanism for the sucker module on the wafer bonding equipment, the hollow leveling screws 6, the leveling nuts 9 and the connecting screws 8 which are mutually overlapped are additionally arranged at the corners of the connecting plate 3, the problem of stress deformation of the heating plate 2 is solved, and the anti-deformation leveling mechanism has the advantages of simplicity and high efficiency in operation, long service life and the like.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (3)
1. An anti-deformation leveling mechanism for a sucker module on wafer debonding and bonding equipment is characterized by comprising a wafer upper sucker, a heating plate, a connecting plate, a first pin hole, a threaded hole, a hollow leveling screw, a second pin hole, a connecting screw and a leveling nut, the wafer upper sucker is arranged on the bottom surface of the heating plate, the heating plate is stacked below the connecting plate, four first pin holes which are centrosymmetric and distributed in a matrix are formed in the corner of the connecting plate, four threaded holes which are coaxial with the first pin holes are formed in the corner of the heating plate, a hollow leveling screw with a leveling nut is inserted in each first pin hole, the hollow leveling screw is provided with a second pin hole along the central axis, a connecting screw is inserted in the second pin hole, the connecting screw penetrates through the second pin hole and then is in threaded connection with the threaded hole, and the leveling nut is rotationally adjusted to enable the heating plate to be in locking fit with the upper surface of the connecting plate after being absolutely horizontal.
2. The anti-deformation leveling mechanism for the chuck module on the wafer debonding apparatus according to claim 1, wherein the diameter of the threaded hole is smaller than the diameter of the first pin hole.
3. The anti-deformation leveling mechanism for the chuck module of the wafer debonding apparatus according to claim 1, wherein the top end of the connecting screw is press-fitted on the upper end surface of the hollow leveling screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121587558.6U CN216354125U (en) | 2021-07-13 | 2021-07-13 | Anti-deformation leveling mechanism for sucker module on wafer debonding and bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121587558.6U CN216354125U (en) | 2021-07-13 | 2021-07-13 | Anti-deformation leveling mechanism for sucker module on wafer debonding and bonding equipment |
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| CN216354125U true CN216354125U (en) | 2022-04-19 |
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| CN202121587558.6U Active CN216354125U (en) | 2021-07-13 | 2021-07-13 | Anti-deformation leveling mechanism for sucker module on wafer debonding and bonding equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542785A (en) * | 2023-11-13 | 2024-02-09 | 魅杰光电科技(上海)有限公司 | Reflector chuck for wafer detection |
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2021
- 2021-07-13 CN CN202121587558.6U patent/CN216354125U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542785A (en) * | 2023-11-13 | 2024-02-09 | 魅杰光电科技(上海)有限公司 | Reflector chuck for wafer detection |
| CN117542785B (en) * | 2023-11-13 | 2024-06-18 | 魅杰光电科技(上海)有限公司 | Reflector chuck for wafer detection |
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