CN216352310U

CN216352310U - Mainboard with high-efficient heat dissipation

Info

Publication number: CN216352310U
Application number: CN202123104230.7U
Authority: CN
Inventors: 李洁; 邹源源; 李鹏
Original assignee: Beijing Shenwanyue Technology Co ltd
Current assignee: Beijing Shenwanyue Technology Co ltd
Priority date: 2021-12-11
Filing date: 2021-12-11
Publication date: 2022-04-19
Anticipated expiration: 2031-12-11

Abstract

The utility model discloses a mainboard with high-efficiency heat dissipation, which comprises a mainboard body, wherein a dustproof mechanism is arranged on the mainboard body, an air blowing mechanism is arranged on the dustproof mechanism, buffer sleeves are arranged at corners of the mainboard body, the dustproof mechanism comprises stand columns and heat dissipation fins, the stand columns and the heat dissipation fins are arranged on the mainboard body, pipe sleeves are inserted on the stand columns, and cover plates are arranged on the pipe sleeves. The fan is convenient to disassemble, the blowing mechanism is arranged to match with the radiating fins, the purpose of blowing and radiating the main board body is achieved, the use of the main board body is facilitated, and the buffer sleeve is arranged to achieve the purpose of protecting corners of the main board body.

Description

Mainboard with high-efficient heat dissipation

Technical Field

The utility model relates to the technical field of mainboards, in particular to a mainboard with efficient heat dissipation.

Background

The motherboard is also called a motherboard, a system board, a logic board, a motherboard, a backplane, etc., and is a central or main circuit board constituting a complex electronic system such as an electronic computer.

Its surface of current mainboard exposes outside usually, and the dust adheres to easily to influence the use of mainboard, and usually indicate on the mainboard to have the fan to dispel the heat, nevertheless the fan dismantles convenience inadequately, and the corner of mainboard adopts the right angle design simultaneously, receives the damage easily, for this reason, we provide a mainboard that has high-efficient heat dissipation.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a mainboard with high-efficiency heat dissipation, and the mainboard is used for solving the problem that the existing mainboard is inconvenient to use.

In order to achieve the purpose, the utility model provides the following technical scheme: a mainboard with high-efficiency heat dissipation comprises a mainboard body, wherein a dustproof mechanism is arranged on the mainboard body, by arranging the dustproof mechanism, the purpose of dustproof protection of the main board body is achieved, dust is prevented from adhering to influence the use of the main board body, and the fan is convenient to disassemble through the dustproof mechanism, the dustproof mechanism is provided with the blowing mechanism, the blowing mechanism is arranged on the dustproof mechanism and matched with the radiating fins to achieve the purpose of blowing and radiating the main board body, the corners of the main board body are provided with the buffer sleeves, the buffer sleeves are made of elastic rubber, the purpose of protecting the corner of the main board body is achieved by arranging the buffer sleeve, the dustproof mechanism comprises an upright post and a radiating fin, the stand column and the radiating fins are both installed on the main board body, the stand column is spliced with a pipe sleeve, a cover plate is arranged on the pipe sleeve, and the stand column can be conveniently spliced by arranging the pipe sleeve.

Preferably, spring grooves are formed in the stand columns, the number of the stand columns is four, and the stand columns are arranged, so that the cover plate is convenient to support.

Preferably, a spring is arranged in the spring groove and is in a compressed state.

Preferably, the one end of spring is equipped with the stopper, stopper and spring groove sliding connection, the setting of stopper plays the spacing purpose of inserted block motion, also plays the purpose of applying the spring effort to the inserted block simultaneously.

Preferably, the limiting block is provided with an insertion block, one end of the insertion block penetrates through the upright column, the insertion block is semi-spherical, and the insertion block is convenient to insert into the slot.

Preferably, slots are formed in the pipe sleeves, the number of the pipe sleeves is four, dust screens are arranged between the pipe sleeves and on the cover plate, the dust screens are arranged to be matched with the cover plate, the purpose of dust protection of the mainboard body is achieved, meanwhile, circulation of airflow on the mainboard body is facilitated, and heat dissipation of the mainboard body is facilitated.

Preferably, the blowing mechanism comprises a through hole, the through hole is formed in the cover plate, a fan is arranged in the through hole, and the fan has a blowing function.

Compared with the prior art, the utility model has the beneficial effects that:

1. the dustproof mechanism is arranged, so that the purpose of dustproof protection of the main board body is achieved, dust is prevented from attaching to influence the use of the main board body, and the fan is convenient to disassemble through the dustproof mechanism.

2. The blowing mechanism is arranged and matched with the radiating fins, so that the purpose of blowing and radiating the main board body is achieved, and the main board body is favorably used.

3. The buffer sleeve is arranged, so that the purpose of protecting the corner of the main board body is achieved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a top view of the main board body of the present invention;

FIG. 3 is a bottom view of the cover of the present invention;

FIG. 4 is a cross-sectional view of a shroud according to the present invention.

In the figure: 1. a main board body; 2. a buffer sleeve; 3. a cover plate; 4. a dust screen; 5. a fan; 6. a column; 7. a heat dissipating fin; 8. inserting a block; 9. pipe sleeve; 10. a slot; 11. a spring; 12. a spring slot; 13. a limiting block; 14. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1, 2, 3 and 4, a motherboard with high heat dissipation efficiency in the figures comprises a motherboard body 1, a dustproof mechanism is arranged on the motherboard body 1, the purpose of protecting the motherboard body 1 from dust is achieved by arranging the dustproof mechanism, dust adhesion is prevented, the use of the motherboard body 1 is affected, a fan 5 is convenient to disassemble by the dustproof mechanism, a blowing mechanism is arranged on the dustproof mechanism, the purpose of blowing and heat dissipation is achieved by arranging the blowing mechanism in cooperation with heat dissipation fins 7, the corners of the motherboard body 1 are provided with buffer sleeves 2, the buffer sleeves 2 are made of elastic rubber, the purpose of protecting the corners of the motherboard body 1 is achieved by arranging the buffer sleeves 2, the dustproof mechanism comprises upright posts 6 and heat dissipation fins 7, the upright posts 6 and the heat dissipation fins 7 are both arranged on the motherboard body 1, and sleeve sleeves 9 are inserted on the upright posts 6, the cover plate 3 is arranged on the pipe sleeve 9, and the pipe sleeve 9 is arranged to facilitate the insertion of the upright post 6.

Wherein, the upright post 6 is internally provided with four spring grooves 12, the upright post 6 is provided for supporting the cover plate 3, the spring 11 is arranged in the spring groove 12, the spring 11 is in a compressed state, one end of the spring 11 is provided with a limit block 13, the limit block 13 is connected with the spring groove 12 in a sliding way, the limit block 13 is arranged for limiting the movement of the insert block 8 and exerting the acting force of the spring 11 on the insert block 8, the limit block 13 is provided with the insert block 8, one end of the insert block 8 penetrates through the upright post 6, the insert block 8 is in a semi-spherical shape and is conveniently inserted into the slot 10 by being provided with the insert block 8, the slot 10 is arranged in the pipe sleeve 9, the slot 10 is in a semi-spherical shape, the number of the pipe sleeves 9 is four, the dust screens 4 are respectively arranged between the pipe sleeves 9 and on the cover plate 3, and the dust screens 4 are arranged for matching with the cover plate 3 to achieve the purpose of dust protection for the mainboard body 1, meanwhile, the circulation of airflow on the main board body 1 is facilitated, and the heat dissipation of the main board body 1 is facilitated.

When this mainboard with high-efficient radiating uses: through being provided with

pipe box

9, 3 quick-witted dust screens 4 of apron,

pipe box

9, 3 quick-witted dust screens 4 of apron cover mainboard body 1 to prevent adhering to of dust, play the purpose to the dustproof protection of mainboard body 1, prevent that the dust from adhering to on mainboard body 1, thereby influence mainboard body 1's use, simultaneously through being provided with buffer sleeve 2, play the purpose at protection mainboard body 1 turning.

Example 2

Referring to fig. 1, 2, 3 and 4, the embodiment further illustrates an embodiment 1, in which a motherboard with high heat dissipation efficiency is shown, and includes a motherboard body 1, a dust-proof mechanism is disposed on the motherboard body 1, the dust-proof mechanism protects the motherboard body 1 from dust and prevents dust from adhering to the motherboard body 1, and the dust-proof mechanism facilitates the detachment of the fan 5, the dust-proof mechanism is provided with a blowing mechanism, and the blowing mechanism is disposed to cooperate with the heat dissipation fins 7 to perform the blowing and heat dissipation of the motherboard body 1, corners of the motherboard body 1 are both provided with buffer sleeves 2, the buffer sleeves 2 are made of elastic rubber, the buffer sleeves 2 are disposed to protect corners of the motherboard body 1, the dust-proof mechanism includes upright posts 6 and heat dissipation fins 7, the upright posts 6 and the heat dissipation fins 7 are both mounted on the motherboard body 1, the upright post 6 is spliced with the pipe sleeve 9, the cover plate 3 is arranged on the pipe sleeve 9, and the splicing of the upright post 6 is facilitated by the arrangement of the pipe sleeve 9.

Wherein, the mechanism of blowing includes through-hole 14, and on apron 3 was seted up to through-hole 14, be equipped with fan 5 in the through-hole 14, fan 5 had the function of blowing.

In this embodiment, when mainboard body 1 uses, open fan 5, fan 5 will blow the heat dissipation to mainboard body 1's surface, cooperation radiating fin 7, play the purpose that improves mainboard body 1 radiating effect, when fan 5 needs to be dismantled, upwards stimulate apron 3, apron 3 will drive pipe box 9 and slide along the surface of stand 6, the inner wall of pipe box 9 extrudees inserted block 8 back to spring groove 12 in, leave stand 6 until pipe box 9, can separate apron 3 and mainboard body 1, reach the purpose of dismantling fan 5.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A motherboard with efficient heat dissipation, comprising:

mainboard body (1), be equipped with dustproof mechanism on mainboard body (1), the last mechanism of blowing that is equipped with of dustproof mechanism, the turning of mainboard body (1) all is equipped with cushion collar (2), dustproof mechanism includes stand (6) and radiating fin (7), stand (6) and radiating fin (7) are all installed on mainboard body (1), it has pipe box (9) to peg graft on stand (6), be equipped with apron (3) on pipe box (9).

2. A motherboard with efficient heat dissipation as recited in claim 1, wherein: spring grooves (12) are formed in the upright columns (6), and the number of the upright columns (6) is four.

3. A motherboard with efficient heat dissipation as recited in claim 2, wherein: a spring (11) is arranged in the spring groove (12).

4. A motherboard with efficient heat dissipation as recited in claim 3, wherein: one end of the spring (11) is provided with a limiting block (13), and the limiting block (13) is connected with the spring groove (12) in a sliding mode.

5. The main board with high heat dissipation efficiency of claim 4, wherein: the limiting block (13) is provided with an inserting block (8), and one end of the inserting block (8) penetrates through the upright post (6).

6. A motherboard with efficient heat dissipation as recited in claim 1, wherein: slots (10) are formed in the pipe sleeves (9), the number of the pipe sleeves (9) is four, and dust screens (4) are arranged between the pipe sleeves (9) and on the cover plate (3).

7. A motherboard with efficient heat dissipation as recited in claim 1, wherein: the blowing mechanism comprises a through hole (14), the through hole (14) is formed in the cover plate (3), and a fan (5) is arranged in the through hole (14).