CN216351674U - Intelligent window panel and intelligent window motherboard - Google Patents

Intelligent window panel and intelligent window motherboard Download PDF

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Publication number
CN216351674U
CN216351674U CN202121422312.3U CN202121422312U CN216351674U CN 216351674 U CN216351674 U CN 216351674U CN 202121422312 U CN202121422312 U CN 202121422312U CN 216351674 U CN216351674 U CN 216351674U
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pad
motherboard
substrate
mother board
intelligent window
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王瑛
王春雷
张思凯
翟德深
梁鹏
李展
巨小倩
陈娟
王昌银
车春城
刘昊
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BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
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Priority to CN202121422312.3U priority Critical patent/CN216351674U/en
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Abstract

The utility model provides an intelligent window panel and an intelligent window motherboard, and belongs to the technical field of liquid crystal. The intelligent window mother board comprises a rectangular middle area and a rectangular peripheral area, and a rectangular first substrate mother board and a rectangular second substrate mother board which are arranged oppositely; a first conductive film layer is arranged on one side of the first substrate motherboard; a planar second conductive film layer is arranged on one side of the second substrate motherboard, and each edge of the second substrate motherboard is provided with at least one second PAD; in can equally divide into 2m regions of the middle part subregion of 2 x m rectangles with the middle part region of wisdom window mother board, the peripheral district portion that corresponds to every middle part subregion of wisdom window mother board all is provided with at least one first PAD and at least one second PAD. The utility model can improve the production efficiency of the multi-size intelligent window panel.

Description

Intelligent window panel and intelligent window motherboard
Technical Field
The present invention relates to the field of liquid crystal technology, and more particularly to an intelligent window panel and an intelligent window motherboard.
Background
Wisdom window panel includes two base plates of relative setting and the liquid crystal that is located between the base plate, can control the light that sees through wisdom window panel through drive liquid crystal deflection to realize adjusting luminance. The intelligent window panel product has the advantages of second-level response, stepless dimming, uniformity, permeability, oversized size and the like, and can be widely applied to the fields of high-speed rail side windows, passenger car skylights and side windows, ship portholes, building curtain walls, daylighting roofs and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides an intelligent window panel and an intelligent window motherboard, which can improve the production efficiency of a multi-size intelligent window panel.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, a smart window panel for cutting includes a rectangular central region and a peripheral region surrounding the central region, including:
the liquid crystal display panel comprises a rectangular first substrate mother board, a rectangular second substrate mother board and a liquid crystal layer, wherein the rectangular first substrate mother board and the rectangular second substrate mother board are arranged oppositely, and the liquid crystal layer is positioned between the first substrate mother board and the second substrate mother board;
a planar first conductive film layer is arranged on one side, facing the second substrate motherboard, of the first substrate motherboard, at least one first PAD is arranged on each edge of the first substrate motherboard, and the first PADs are electrically connected to the first conductive film layer;
a planar second conductive film layer is arranged on one side, facing the first substrate motherboard, of the second substrate motherboard, at least one second PAD is arranged on each edge of the second substrate motherboard, the second PADs are electrically connected to the second conductive film layer, and the orthographic projection of the first PAD on the second substrate motherboard is not overlapped with the second PAD;
in 2m areas capable of equally dividing the middle area of the intelligent window motherboard into 2 x m rectangular middle areas, the peripheral area part of the intelligent window motherboard corresponding to each middle area is provided with at least one first PAD and at least one second PAD; one first PAD and one second PAD corresponding to the same intelligent window panel can be matched and electrically connected with an external driving circuit so as to provide driving signals for the intelligent window panel; wherein m is an integer of 1 or more.
In some embodiments, m is equal to 2.
In some embodiments, the cutting line of the first substrate mother board is a cutting line along which the first substrate mother board is cut to expose the second PAD, and the cutting line of the second substrate mother board is a cutting line along which the second substrate mother board is cut to expose the first PAD.
In some embodiments, each edge of the first substrate mother board is further provided with at least one fool-proof mark, the fool-proof mark is different from the first PAD in shape and/or size, and the cutting line of the second substrate mother board further includes a line along which the second substrate mother board is cut to expose the fool-proof mark.
In some embodiments, the fool-proof marks are in one-to-one correspondence with the first PADs, and each fool-proof mark is adjacent to and spaced apart from the corresponding first PAD by a predetermined distance.
In some embodiments, each edge of the first substrate motherboard is provided with a plurality of the first PADs and a plurality of the fool-proof marks, and each edge of the second substrate motherboard is provided with a plurality of the second PADs;
and a first orthographic projection of each first PAD on the second substrate motherboard and a third orthographic projection of the corresponding foolproof mark on the second substrate motherboard form a projection group, and the projection groups and the second PADs are alternately arranged on each edge of the second substrate motherboard.
In some embodiments, the minimum separation between the first orthographic projection and the adjacent second PAD is 4-102 mm.
In some embodiments, the projection sets correspond to the second PADs one to one, each projection set is adjacent to and spaced apart from the corresponding second PAD by a predetermined distance, each projection set and the corresponding second PAD form a PAD set, and a distance between adjacent PAD sets is greater than 50 mm.
In some embodiments, 4 PAD groups are disposed on each edge of the second display substrate motherboard.
In some embodiments, the first PAD has a minimum length in a first direction of 40-60mm, the first direction is a direction extending from an edge thereof, the width in a second direction is 2.5-4.5mm, and the second direction is perpendicular to the first direction; and/or
The minimum length of the second PAD in the first direction is 40-60mm, the first direction is the extending direction of the edge where the second PAD is located, the width in the second direction is 2.5-4.5mm, and the second direction is perpendicular to the first direction.
In some embodiments, the first conductive film layer extends to the edge of the first display substrate motherboard to form the first PAD, where the thickness of the first conductive film layer is greater than a preset first threshold value and the step difference is not greater than a preset second threshold value; and/or
The second conductive film layer extends to the edge of the second display substrate motherboard to form the second PAD, the thickness of the second conductive film layer is larger than a preset first threshold value at the second PAD, and the section difference is not larger than a preset second threshold value.
The embodiment of the utility model also provides an intelligent window panel which is cut by the intelligent window motherboard and comprises at least one first PAD and at least one second PAD.
In some embodiments, the smart window panel includes a plurality of the first PADs and a plurality of the second PADs.
The embodiment of the utility model has the following beneficial effects:
among the above-mentioned scheme, carry out the normalized design to the wisdom window mother board, every edge at first base plate mother board all is provided with at least one first PAD, every edge at the second base plate mother board all is provided with at least one second PAD, PAD's position and quantity are fixed, the position that replaces PAD is along with the differentiation design of wisdom window panel size change, can greatly improve the production efficiency of many sizes wisdom window panel, the solution is long because debugging time is long when many sizes wisdom window panel is produced, it is many to produce line equipment and occupy serious and personnel's demand, consuming time long, the inefficiency scheduling problem.
Drawings
FIG. 1 is a diagram illustrating a prior art smart window panel;
FIGS. 2 a-2 d are schematic diagrams of an intelligent window motherboard according to an embodiment of the present invention;
FIG. 3 is a diagram of a first substrate motherboard according to an embodiment of the utility model;
FIG. 4 is a diagram of a second substrate motherboard according to an embodiment of the utility model;
FIG. 5 is a diagram illustrating an intelligent window panel according to an embodiment of the present invention;
fig. 6 and 7 are schematic views of the PAD dimensions according to an embodiment of the utility model.
Reference numerals
01 intelligent window mother board
06 intelligent window panel
02 conductive film layer
03 first PAD
04 fool-proof mark
05 second PAD
011 first base plate mother board
012 second substrate motherboard
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
In the related art, when a multi-size smart window panel is manufactured, the smart window motherboard is cut into one or more smart window panels, and then the PAD sizes are customized for the smart window panels of different sizes.
As shown in fig. 1, after the smart window motherboard is cut into one smart window panel by the first cutting method or the second cutting method, into two smart window panels by the third cutting method or the fourth cutting method, into three smart window panels by the fifth cutting method, and into four smart window panels by the sixth cutting method, a corresponding set of PADs (shown in the dashed line) is designed for each smart window panel. This kind of mode all has great challenge to producing the debugging and the personnel of line equipment and correspond, and debugging time is long when having many sizes wisdom window panel production, produces that line equipment occupies seriously and personnel's demand is many, consuming time long, inefficiency scheduling problem.
The embodiment of the utility model provides an intelligent window panel and an intelligent window motherboard, which can improve the production efficiency of a multi-size intelligent window panel.
An embodiment of the present invention provides an intelligent window motherboard for cutting to obtain an intelligent window panel, which includes a rectangular middle area and a peripheral area surrounding the functional area, as shown in fig. 2a, 2b, 3 and 4, and includes:
the liquid crystal display panel comprises a first rectangular substrate mother board 011, a second rectangular substrate mother board 012 and a liquid crystal layer between the first substrate mother board 011 and the second substrate mother board 012, wherein the first substrate mother board 011 and the second substrate mother board 012 are arranged oppositely;
a planar first conductive film layer is arranged on one side, facing the second substrate motherboard, of the first substrate motherboard, at least one first PAD03 is arranged on each edge of the first substrate motherboard 011, and the first PADs are electrically connected to the first conductive film layer;
a planar second conductive film layer is arranged on one side, facing the first substrate motherboard, of the second substrate motherboard, at least one second PAD05 is arranged on each edge of the second substrate motherboard, the second PADs are electrically connected to the second conductive film layer, and the orthographic projection of the first PAD on the second substrate motherboard is not overlapped with that of the second PAD;
wherein the orthographic projection of the first PAD03 on the second substrate motherboard 012 does not overlap with the second PAD 05;
in 2m areas capable of equally dividing the middle area of the intelligent window motherboard into 2 x m rectangular middle areas, the peripheral area part of the intelligent window motherboard corresponding to each middle area is provided with at least one first PAD and at least one second PAD; one first PAD and one second PAD corresponding to the same intelligent window panel can be matched and electrically connected with an external driving circuit so as to provide driving signals for the intelligent window panel; wherein m is an integer of 1 or more.
In the first substrate mother board 011 and the second substrate mother board 012, the corners of the rectangles may be rounded or chamfered.
The middle area and the peripheral area of the rectangle are distinguished for description, and actually, there is not necessarily a completely consistent structural boundary. The middle partition is a middle partition for description, and the middle partition is not necessarily cut according to the method in the smart window motherboard product.
In the manufacturing process of the intelligent window panel, a whole piece of large intelligent window mother board formed by box-connecting a first substrate mother board and a second substrate mother board needs to be cut, so that independent intelligent window panels are formed, and in order to expose PAD on the first substrate mother board, the corresponding part of the second substrate mother board needs to be cut off; to expose the PAD on the second substrate motherboard, the corresponding portion of the first substrate motherboard needs to be cut away.
The cutting line of the first substrate mother board 011 is a cutting line along which the first substrate mother board 011 is cut to expose the second PAD05, and the cutting line of the second substrate mother board 012 is a cutting line along which the second substrate mother board 012 is cut to expose the first PAD 03.
In this embodiment, carry out the normalized design to the wisdom window mother board, every edge at first base plate mother board all is provided with at least one first PAD, every edge at the second base plate mother board all is provided with at least one second PAD, PAD's position and quantity are fixed, the position that replaces PAD is along with the differentiation design of wisdom window panel size change, can greatly improve the production efficiency of many sizes wisdom window panel, solve because debugging time is long when many sizes wisdom window panel is produced, it is many that production line equipment occupies serious and personnel's demand, consuming time is long, inefficiency scheduling problem.
In some embodiments, m is equal to 2, as shown in fig. 2c, one central region is within each dashed box, and it can be seen that the peripheral region corresponding to each central region is provided with at least one first PAD and at least one second PAD.
In a specific example, m is 3, and as shown in fig. 2d, one middle region is located inside each dashed box, and it can be seen that at least one first PAD and at least one second PAD are disposed on the portion of the peripheral region corresponding to each middle region.
As shown in fig. 2a and 2b, a planar conductive film layer 02 (i.e., a first conductive film layer) is disposed on the first substrate motherboard 011, and the planar conductive film layer 02 extends to an edge of the first substrate motherboard 011 to form a first PAD; a planar conductive film layer 02 (i.e., a second conductive film layer) is arranged on the second substrate motherboard 012, and the planar conductive film layer 02 extends to the edge of the second substrate motherboard 012 to form a second PAD; the planar conductive film layer 02 serves as an electrode.
In order to ensure the reliability of the electrical connection, the first PAD and the second PAD need to be disposed in the conductive film stable region, as shown in fig. 2a and 2b, the conductive film stable region is provided with a uniform conductive film 02, such as a metal film, and the film thickness of the conductive film 02 meets the requirement and has good uniformity.
In some embodiments, at the first PAD, the thickness of the first conductive film layer is greater than a preset first threshold, and the step difference is not greater than a preset second threshold; and/or
At the second PAD, the thickness of the second conductive film layer is larger than a preset first threshold value, and the section difference is not larger than a preset second threshold value.
The values of the first threshold value and the second threshold value can be set according to practical application, the thickness and the uniformity of the first conductive film layer at the first PAD are guaranteed to meet requirements, and the thickness and the uniformity of the second conductive film layer at the second PAD are guaranteed to meet requirements.
After the first substrate mother board 011 and the second substrate mother board 012 are aligned with each other, the second substrate mother board 012 is cut along the cutting line of the second substrate mother board 012 to expose the first PAD, and the first substrate mother board 011 is cut along the cutting line of the first substrate mother board 011 to expose the second PAD, thereby forming the intelligent window panel. Binding a Flexible Printed Circuit (FPC) with a first PAD, and inputting an electric signal to a conductive film layer 02 serving as an electrode through the first PAD; bind flexible circuit board and second PAD, through the second PAD to the electrically conductive rete 02 input signal of telecommunication as the electrode, produce the electric field between the electrically conductive rete 02 of first base plate motherboard 011 and the electrically conductive rete 02 of second base plate motherboard 012 like this, the liquid crystal deflection in the drive liquid crystal layer to change the transmissivity of wisdom window panel.
In some embodiments, each edge of the first substrate motherboard is provided with a plurality of first PADs, and the plurality of first PADs arranged on each edge are arranged at equal intervals; and/or
Each edge of the second substrate mother board is provided with a plurality of second PADs, and the second PADs are arranged on each edge at equal intervals.
In this embodiment, set up a plurality of first PADs at every edge of first base plate motherboard, set up a plurality of second PADs at every edge of second base plate motherboard, through the quantity of controlling first PAD and second PAD, can be so that after cutting the wisdom window motherboard, every wisdom window panel has a plurality of first PADs and a plurality of second PAD to correspond, and the later stage can carry out the selectivity to bind or all bind a plurality of first PADs and a plurality of second PAD when carrying out FPC and binding. If carry out FPC to a plurality of first PADs and a plurality of second PAD and bind, if there is FPC to drop in the back end technology, also can reduce the risk that wisdom window panel became invalid.
In order to distinguish the first display substrate mother board from the second display substrate mother board in the manufacturing process, in some embodiments, as shown in fig. 2a to 3, each edge of the first substrate mother board 011 is further provided with at least one fool-proof mark 04, the fool-proof mark 04 is different from the first PAD03 in shape and/or size, and the cutting line of the second substrate mother board further includes a line along which the second substrate mother board is cut to expose the fool-proof mark. The first display substrate motherboard and the second display substrate motherboard can be distinguished in the subsequent binding and sheet combination process through the fool-proof mark.
In this embodiment, the number of the fool-proof marks 04 and the number of the first PADs 03 may be the same or different, as long as the first display substrate mother board 011 and the second display substrate mother board 012 can be distinguished.
In some embodiments, as shown in fig. 2 a-3, the fool-proof marks 04 are in one-to-one correspondence with the first PADs 03, each fool-proof mark 04 being adjacent to and spaced a predetermined distance from a corresponding first PAD 03. The fool-proof mark 04 may be slightly smaller in size than the first PAD 03.
In some embodiments, as shown in fig. 2a, each edge of the first substrate mother board 011 is provided with a plurality of the first PADs 03 and a plurality of the fool-proof marks 04, and each edge of the second substrate mother board 012 is provided with a plurality of the second PADs 05;
the first orthographic projection of each first PAD03 on the second substrate motherboard 012 and the third orthographic projection of the corresponding fool-proof mark 04 on the second substrate motherboard 012 form a projection group, and on each edge of the second substrate motherboard 012, the projection groups and the second PADs 05 are alternately arranged.
In some embodiments, it may also be that the second PAD05 is located between the first orthographic projection and the third orthographic projection.
In some embodiments, the minimum separation between the first orthographic projection and the adjacent second PAD05 may be 4-102 mm. Of course, the minimum distance between the first orthographic projection and the adjacent second PAD05 is not limited to 4-102mm, and can be adjusted according to the size of the smart window panel.
In some embodiments, as shown in fig. 2a, the projection sets correspond to the second PADs 05 one-to-one, each of the projection sets is adjacent to and spaced apart from the corresponding second PAD05 by a predetermined distance, the first PAD03 and the fool-proof mark 04 corresponding to each of the projection sets and the corresponding second PAD form a PAD set, and the distance between the adjacent PAD sets may be greater than 50 mm. Certainly, adjacent interval between the PAD group is not restricted to being greater than 50mm, can also adjust according to the size of the mother board of wisdom window.
After cutting the wisdom window mother board, every wisdom window panel corresponds there is at least one PAD group, and every group PAD group includes first PAD and second PAD, can also include and prevent slow-witted mark.
As shown in fig. 5, the smart window motherboard can be cut into a smart window panel 06 by the first cutting method or the second cutting method, and the smart window panel 06 includes a plurality of PAD sets.
As shown in fig. 5, a smart window motherboard can be further cut into two smart window panels 06 by a third cutting method or a fourth cutting method, and it can be seen that each smart window panel 06 includes a plurality of PAD sets.
As shown in fig. 5, an intelligent window motherboard can be further cut into three intelligent window panels 06 by a fifth cutting method, and each intelligent window panel 06 includes one or two PAD sets.
As shown in fig. 5, the smart window motherboard can be further cut into four smart window panels 06 by a sixth cutting method, and each smart window panel 06 includes a PAD set.
As shown in fig. 5, the intelligent window motherboard can be further cut into six intelligent window panels 06 by a seventh cutting method, and each intelligent window panel 06 includes a PAD set.
As can be seen from fig. 5, the smart window motherboard of the present embodiment is suitable for various cutting methods, and can obtain smart window panels with various specifications and sizes.
Like this through PAD to the wisdom window mother board carry out the normalization design, can guarantee the cutting mode of same kind of mother board adaptation multiple difference to obtain different specification and dimension's function panel, thereby can make things convenient for production management, improve the production efficiency of many sizes wisdom window panel, solve because debugging time is long when many sizes wisdom window panel is produced, produce that line equipment occupies seriously and personnel's demand many, consuming time long, inefficiency scheduling problem.
In addition, if wisdom window panel includes multiunit PAD group, the later stage can carry out the selectivity to a plurality of PAD groups and bind or all bind when carrying out FPC and tie. If a plurality of PAD groups are bound by FPC, if FPC falls off in the back-end process, the risk of failure of the intelligent window panel can be reduced.
In some embodiments, each edge of the second display substrate motherboard may be provided with 4 PAD groups, and of course, each edge of the second display substrate motherboard is not limited to be provided with 4 PAD groups, and other number of PAD groups may be provided.
In this embodiment, the PAD size mainly considers the FPC bonding area, the bonding precision, and the process equipment limitation. The binding area of the FPC is mainly used for ensuring the binding reliability, and the width of the FPC bound in the related technology is about 21.5 mm; the process equipment limit is dependent on the size of the ram of the binding equipment, the ram size used in the related art is about 40 mm; in summary, the minimum length of the first PAD03 in the first direction may be 40-60mm, and particularly may be 50mm, the first direction is an extending direction of the edge, the width in the second direction may be 2.5-4.5mm, and particularly may be 3.5mm, and the second direction is perpendicular to the first direction; and/or the second PAD05 may have a minimum length in a first direction of 40-60mm, in particular 50mm, the first direction being the direction in which the edge extends, and a width in a second direction of 2.5-4.5mm, in particular 3.5mm, the second direction being perpendicular to the first direction.
In a specific example, the PAD may have a bound portion size of 3.5mm by 50 mm. The first PAD03 can be rectangular, and the second PAD05 can also be rectangular; due to the process limit limitation and the use requirement, the process difficulty of the rectangular PAD is high, and in order to realize binding, arc-angle cutting lines are additionally arranged on the two sides of the PAD on the basis of ensuring the length of the PAD, so that the cutting equipment is favorably cut, and the binding area is ensured to be 50mm x 3.5 mm.
In some embodiments, as shown in fig. 6 and 7, the obtuse angle of the first PAD03 may be an arc angle; and/or the obtuse angle of the second PAD05 may be an arc angle.
As shown in fig. 6 and 7, the minimum length of the first PAD is S1, the minimum length of the second PAD is S2, the minimum distance between the fool-proof mark 04 and the first PAD03 is d1, the minimum distance between the first PAD03 and the second PAD05 is d2, the widths of the first PAD03, the second PAD05 and the fool-proof mark 04 are H, and the total length of the PAD group consisting of the first PAD03, the second PAD05 and the fool-proof mark 04 is d 3. In a specific example, the value of d1 may be 25.34mm, the value of d2 is 4mm, the value of d3 is 197.26mm, and the values of S1 and S2 are both 50 mm. In another specific example, the value of d1 may be 25.53mm, the value of d2 may be 102.13mm, the value of d3 may be 295.19mm, the values of S1 and S2 are both 50mm, and the value of H may be 3.5 mm.
After the preparation of the wisdom window mother board of this embodiment is accomplished, can follow the cutting line of first base plate mother board and the cutting line of second base plate mother board and cut in order to expose second PAD with first PAD because PAD on the wisdom window mother board is the normalization design, consequently, is applicable to the wisdom window panel of any size, binds the back at PAD, cuts the wisdom window mother board once more according to the size demand of wisdom window panel, accomplishes the manufacturing process of wisdom window panel.
The embodiment of the utility model also provides an intelligent window panel which is cut by the intelligent window motherboard and comprises at least one first PAD and at least one second PAD.
In this embodiment, carry out the normalization design to wisdom window mother board, all be provided with at least one first PAD at every edge of first base plate mother board, all be provided with at least one second PAD at every edge of second base plate mother board, the position and the quantity of PAD are fixed, cutting the back to wisdom window mother board, wisdom window panel includes at least one first PAD and at least one the second PAD can satisfy the demand of binding. The position that this embodiment replaces PAD is along with the differentiation design of wisdom window panel size change, can greatly improve the production efficiency of many sizes wisdom window panel, solves because debugging time is long when many sizes wisdom window panel produces, produces that line equipment occupies seriously and personnel's demand many, consuming time long, the inefficiency scheduling problem.
The wisdom window panel of this embodiment can use in the field of adjusting luminance, is provided with the electrically conductive rete of whole face on first base plate mother board and the second base plate mother board respectively, and after forming wisdom window panel to the cutting of liquid crystal display panel mother board, also be provided with the electrically conductive rete of whole face on the first base plate of wisdom window panel and the second base plate respectively, as the electrode. The first PAD is connected with the conductive film layer on the whole surface of the first substrate, and particularly, the first PAD and the conductive film layer on the first substrate can be of an integrated structure; the second PAD is connected with the whole conductive film layer on the second substrate, and specifically, the second PAD and the conductive film layer on the second substrate can be of an integrated structure.
After the first substrate mother board 011 and the second substrate mother board 012 are aligned with each other, the second substrate mother board 012 is cut along the cutting line of the second substrate mother board 012 to expose the first PAD, and the first substrate mother board 011 is cut along the cutting line of the first substrate mother board 011 to expose the second PAD, thereby forming the intelligent window panel. Binding a Flexible Printed Circuit (FPC) with a first PAD, and inputting an electric signal to a conductive film layer 02 serving as an electrode through the first PAD; bind flexible circuit board and second PAD, through the second PAD to the electrically conductive rete 02 input signal of telecommunication as the electrode, produce the electric field between the electrically conductive rete 02 of first base plate motherboard 011 and the electrically conductive rete 02 of second base plate motherboard 012 like this, the liquid crystal deflection in the drive liquid crystal layer to change the transmissivity of wisdom window panel, the adjustment passes through the light of wisdom window panel.
In some embodiments, the smart window panel includes a plurality of the first PADs and a plurality of the second PADs.
And when the FPC (flexible circuit board) is bound in the later period, the plurality of first PADs and the plurality of second PADs can be selectively bound or completely bound. If carry out FPC to a plurality of first PADs and a plurality of second PAD and bind, if there is FPC to drop in the back end technology, also can reduce the risk that wisdom window panel became invalid.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (13)

1. An intelligent window mother board, which is used for cutting to obtain an intelligent window panel and comprises a rectangular middle area and a peripheral area surrounding the middle area, and is characterized by comprising:
the liquid crystal display panel comprises a rectangular first substrate mother board, a rectangular second substrate mother board and a liquid crystal layer, wherein the rectangular first substrate mother board and the rectangular second substrate mother board are arranged oppositely, and the liquid crystal layer is positioned between the first substrate mother board and the second substrate mother board;
a planar first conductive film layer is arranged on one side, facing the second substrate motherboard, of the first substrate motherboard, at least one first PAD is arranged on each edge of the first substrate motherboard, and the first PADs are electrically connected to the first conductive film layer;
a planar second conductive film layer is arranged on one side, facing the first substrate motherboard, of the second substrate motherboard, at least one second PAD is arranged on each edge of the second substrate motherboard, the second PADs are electrically connected to the second conductive film layer, and the orthographic projection of the first PAD on the second substrate motherboard is not overlapped with the second PAD;
in 2m areas capable of equally dividing the middle area of the intelligent window motherboard into 2 x m rectangular middle areas, the peripheral area part of the intelligent window motherboard corresponding to each middle area is provided with at least one first PAD and at least one second PAD; one first PAD and one second PAD corresponding to the same intelligent window panel can be matched and electrically connected with an external driving circuit so as to provide driving signals for the intelligent window panel; wherein m is an integer of 1 or more.
2. The intelligent window motherboard of claim 1, wherein m is equal to 2.
3. The intelligent window motherboard as recited in claim 1, wherein the cutting line of the first substrate motherboard is a cutting line along which the first substrate motherboard is cut to expose the second PAD, and the cutting line of the second substrate motherboard is a cutting line along which the second substrate motherboard is cut to expose the first PAD.
4. The intelligent window motherboard of claim 1, wherein,
each edge of the first substrate mother board is also provided with at least one fool-proof mark, the shape and/or size of the fool-proof mark is different from that of the first PAD, and the cutting line of the second substrate mother board further comprises a cutting line which cuts the second substrate mother board along the cutting line so as to expose the fool-proof mark.
5. The motherboard of claim 4, wherein the fool-proof marks are corresponding to the first PADs one-to-one, and each fool-proof mark is adjacent to and spaced apart from the corresponding first PAD by a predetermined distance.
6. The intelligent window motherboard of claim 5, wherein,
each edge of the first substrate motherboard is provided with a plurality of first PADs and a plurality of fool-proof marks, and each edge of the second substrate motherboard is provided with a plurality of second PADs;
and a first orthographic projection of each first PAD on the second substrate motherboard and a third orthographic projection of the corresponding foolproof mark on the second substrate motherboard form a projection group, and the projection groups and the second PADs are alternately arranged on each edge of the second substrate motherboard.
7. The smart window motherboard of claim 6, wherein the minimum distance between the first orthographic projection and the adjacent second PAD is 4-102 mm.
8. The motherboard of claim 6, wherein the projection sets correspond to the second PADs one by one, each projection set is adjacent to and spaced apart from the corresponding second PAD by a predetermined distance, each projection set and the corresponding second PAD form a PAD set, and the distance between the adjacent PAD sets is greater than 50 mm.
9. The intelligent window motherboard of claim 8, wherein each edge of the second substrate motherboard has 4 PAD sets.
10. The intelligent window motherboard of claim 1, wherein,
the minimum length of the first PAD in the first direction is 40-60mm, the first direction is the extending direction of the edge where the first PAD is located, the width in the second direction is 2.5-4.5mm, and the second direction is perpendicular to the first direction; and/or
The minimum length of the second PAD in the first direction is 40-60mm, the first direction is the extending direction of the edge where the second PAD is located, the width in the second direction is 2.5-4.5mm, and the second direction is perpendicular to the first direction.
11. The intelligent window motherboard of any one of claims 1-10,
the first conductive film layer extends to the edge of the first substrate motherboard to form the first PAD, the thickness of the first conductive film layer at the first PAD is larger than a preset first threshold, and the section difference is not larger than a preset second threshold; and/or
The second conductive film layer extends to the edge of the second substrate motherboard to form the second PAD, the thickness of the second conductive film layer is larger than a preset first threshold value at the second PAD, and the section difference is not larger than a preset second threshold value.
12. An intelligent window panel cut from the motherboard of any one of claims 1-11, said intelligent window panel comprising at least one said first PAD and at least one said second PAD.
13. The smart window panel of claim 12, wherein the smart window panel comprises a plurality of the first PADs and a plurality of the second PADs.
CN202121422312.3U 2021-06-24 2021-06-24 Intelligent window panel and intelligent window motherboard Active CN216351674U (en)

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Application Number Priority Date Filing Date Title
CN202121422312.3U CN216351674U (en) 2021-06-24 2021-06-24 Intelligent window panel and intelligent window motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121422312.3U CN216351674U (en) 2021-06-24 2021-06-24 Intelligent window panel and intelligent window motherboard

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Publication Number Publication Date
CN216351674U true CN216351674U (en) 2022-04-19

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