CN216350900U - High-voltage direct current acquisition module - Google Patents
High-voltage direct current acquisition module Download PDFInfo
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- CN216350900U CN216350900U CN202122179934.4U CN202122179934U CN216350900U CN 216350900 U CN216350900 U CN 216350900U CN 202122179934 U CN202122179934 U CN 202122179934U CN 216350900 U CN216350900 U CN 216350900U
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Abstract
The utility model relates to a high-voltage direct current acquisition module which is low in cost and small in size and meets the insulation requirement, and the high-voltage direct current acquisition module comprises a resistance voltage division circuit, an active isolation module and a differential circuit, wherein the resistance voltage division circuit is provided with a plurality of voltage division resistors connected in series to divide external high voltage; each voltage division resistor on the resistor voltage division circuit is formed by connecting N sub-resistors in parallel, wherein N is a positive integer greater than 1; the resistances of the sub-resistors are the same, wherein the sub-resistors are welded on the PCB in a patch mode, branches formed by series connection of the divider resistors are distributed on the PCB in an S-shaped continuous bending shape, and the inner side of each bent channel in continuous bending is provided with an insulating partition plate to increase the creepage distance between the divider resistors on two sides of the insulating partition plate.
Description
Technical Field
The utility model relates to the field of direct-current high-voltage acquisition, in particular to a high-voltage direct-current acquisition module.
Background
The existing high-voltage direct current acquisition module is formed by sequentially connecting a resistance voltage division circuit, an active isolation module, a differential circuit and a follower, wherein input voltage is converted into low voltage through the resistance voltage division circuit, isolated by the active isolation module, sent into the differential circuit for differentiation, and then sent to an external control device through the follower for parameter acquisition. The resistor in the resistor voltage-dividing circuit is generally implemented by a high-voltage-resistant metal resistor tube due to the fact that the resistor bears high voltage, so that the whole volume of the high-voltage direct-current acquisition module is always high, and the manufacturing cost of the module is also high.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-voltage direct current acquisition module which is low in cost and small in size and meets the insulation requirement in order to solve the problem of high voltage acquisition.
According to one aspect of the utility model, a high-voltage direct current acquisition module is provided, which comprises a resistance voltage division circuit, an active isolation module and a differential circuit, wherein the resistance voltage division circuit is provided with a plurality of voltage division resistors connected in series to divide external high voltage; each voltage division resistor on the resistor voltage division circuit is formed by connecting N sub-resistors in parallel, wherein N is a positive integer greater than 1; the resistances of the sub-resistors are the same, wherein the sub-resistors are welded on the PCB in a patch mode, branches formed by series connection of the divider resistors are distributed on the PCB in an S-shaped continuous bending shape, and the inner side of each bent channel in continuous bending is provided with an insulating partition plate to increase the creepage distance between the divider resistors on two sides of the insulating partition plate.
The two sides of the bend are mutually parallel straight sides, the insulating partition plates in the bend are parallel to the straight sides, and the intervals among the insulating partition plates are equidistant.
The PCB is contained in a shell, and one side of the insulating partition board close to the opening of the bend is embedded into the inner side wall of the shell.
A plurality of clamping grooves which are arranged side by side at equal intervals are formed in the inner side wall of the shell, and one side, close to the opening of the bend, of the insulating partition plate is embedded into and fixed with the clamping grooves.
One side of the insulating partition plate close to the opening of the bend is embedded into the clamping groove in an interference fit mode to realize the fixation.
Wherein, the insulating partition plate is perpendicular to the PCB.
Wherein, the insulating separator is an epoxy plate.
The circuit also comprises a follower, and the output of the differential circuit is transmitted to external equipment through the follower.
The sub-resistors are welded on the PCB in a patch mode, a branch formed by serially connecting the divider resistors is distributed on the PCB in an S-shaped continuous bent mode, the insulating partition plates are arranged to separate the voltage between the divider resistors on the two sides of the insulating partition plates so as to increase the insulating gap, and the insulating grade is increased so as to prevent creepage of the ground step gap.
The above description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the description and other objects, features, and advantages of the present invention more comprehensible.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Also, like reference numerals are used to refer to like elements throughout the drawings.
In the drawings:
FIG. 1 illustrates the topology of the resistive divider circuit of the present invention;
FIG. 2 illustrates the topology of the active isolation module, differential circuit, follower of the present invention;
FIG. 3 shows a wiring diagram of the PCB of the present invention;
fig. 4 shows a schematic structural view of the PCB panel of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The high-voltage direct current acquisition module disclosed by the utility model is composed of a resistance voltage division circuit shown in figure 1, an active isolation module, a differential circuit and a follower which are shown in figure 2 on the aspect of circuit topology.
The resistance voltage division circuit is formed by connecting a plurality of voltage division resistors in series and is used for dividing external high voltage. The active isolation module is composed of a chip TE5550CN, acquires partial voltage from partial voltage dividing resistors, outputs the partial voltage to a differential circuit for differential output, and sends the partial voltage to an external control device for parameter sampling after secondary isolation of a follower.
For the risk of high-voltage breakdown, each voltage-dividing resistor on the resistor voltage-dividing circuit is formed by connecting N sub-resistors in parallel, wherein N is a positive integer greater than 1. In the embodiment, N is 2, and chip damage and personnel safety accidents caused by the fact that high voltage completely enters the active isolation module due to the fact that one resistor is damaged and opened are prevented mainly by adopting a resistor parallel connection mode. Furthermore, in order to reduce the risk of open circuit of the resistors, the resistances of the sub-resistors are set to be the same, so that the voltage sharing mode is adopted among the voltage dividing resistors, and high-voltage acquisition can be reliably carried out.
In order to reduce the physical examination of the module, as shown in fig. 3-4, in this embodiment, each sub-resistor is arranged and soldered to the PCB 1 in the form of a patch, and a branch formed by series connection of voltage dividing resistors is distributed on the PCB 1 in an S-shaped continuous curved shape, wherein an insulating spacer 2 is disposed on the inner side of each curve in the continuous curve to separate the voltages between the voltage dividing resistors on both sides of the insulating spacer 2, and the separated places are nested inside the insulating spacer 2 to increase the insulating gap and increase the insulating grade, thereby preventing the creepage in the ground step gap.
Furthermore, the two sides of the bend are parallel straight sides, the insulating partition plates 2 in the bend are parallel to the straight sides, the structure can facilitate nesting of the insulating partition plates 2 by workers, meanwhile, the equal distance between every two insulating partition plates 2 is controlled, and the same creepage distance between voltage dividing resistors on the two sides of any insulating partition plate 2 is achieved.
Referring to fig. 4, the high voltage dc acquisition module of the present invention further includes a sealed housing 3, the PCB 1 is accommodated in the sealed housing 3, wherein a plurality of slots are formed in the inner sidewall of the sealed housing 3, and one side of the insulating partition 2 close to the opening of the curved channel is inserted into the slots in an interference fit manner, so as to simply and conveniently fix the insulating partition 2 and the slots, and the insulating partition is erected to increase the creepage distance in the vertical direction. Further, set up insulating barrier and PCB board mutually perpendicular to make things convenient for insulating barrier 2 to imbed the installation to the draw-in groove.
In this embodiment, the insulating partition 2 is made of epoxy board to achieve the characteristics of insulation, corrosion resistance, high temperature resistance, sound absorption, heat insulation, flame retardance and the like, and provides a certain hardness to support the side wall of the housing 1 so that the housing is not easy to sink.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the utility model may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Claims (8)
1. A high voltage direct current acquisition module comprises a resistance voltage division circuit, an active isolation module and a differential circuit,
the resistance voltage division circuit is provided with a plurality of voltage division resistors connected in series to divide external high voltage, and the active isolation module acquires divided voltage from part of the voltage division resistors and outputs the divided voltage to the differential circuit for differential output;
the method is characterized in that:
each voltage division resistor on the resistor voltage division circuit is formed by connecting N sub-resistors in parallel, wherein N is a positive integer greater than 1;
the resistances of the sub-resistors are the same, wherein the sub-resistors are welded on the PCB in a patch mode, branches formed by series connection of the divider resistors are distributed on the PCB in an S-shaped continuous bending shape, and the inner side of each bent channel in continuous bending is provided with an insulating partition plate to increase the creepage distance between the divider resistors on two sides of the insulating partition plate.
2. The high voltage direct current acquisition module of claim 1, wherein: the two sides of the bend are mutually parallel straight sides, the insulating partition plates in the bend are parallel to the straight sides, and the intervals among the insulating partition plates are equidistant.
3. The high voltage direct current acquisition module of claim 2, wherein: the PCB is contained in a shell, and one side of the insulating partition plate close to the opening of the bend is embedded into the inner side wall of the shell.
4. The high voltage direct current acquisition module of claim 3, wherein: a plurality of clamping grooves which are arranged side by side at equal intervals are formed in the inner side wall of the shell, and one side, close to the opening of the bend, of the insulating partition plate is embedded into and fixed with the clamping grooves.
5. The high voltage direct current acquisition module of claim 4, wherein: one side of the insulating partition plate close to the opening of the bend is embedded into the clamping groove in an interference fit mode to realize the fixation.
6. The high voltage direct current acquisition module of claim 3, wherein: the insulating partition plate is perpendicular to the PCB.
7. The high voltage direct current acquisition module of any one of claims 1 to 6, wherein: the insulating partition plate is an epoxy plate.
8. The high voltage direct current acquisition module of claim 1, wherein: the output of the differential circuit is transmitted to an external device through the follower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122179934.4U CN216350900U (en) | 2021-09-09 | 2021-09-09 | High-voltage direct current acquisition module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122179934.4U CN216350900U (en) | 2021-09-09 | 2021-09-09 | High-voltage direct current acquisition module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216350900U true CN216350900U (en) | 2022-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122179934.4U Active CN216350900U (en) | 2021-09-09 | 2021-09-09 | High-voltage direct current acquisition module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216350900U (en) |
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2021
- 2021-09-09 CN CN202122179934.4U patent/CN216350900U/en active Active
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