CN216348483U

CN216348483U - Semiconductor wafer thickness detection platform

Info

Publication number: CN216348483U
Application number: CN202122991110.7U
Authority: CN
Inventors: 王燕平; 秦志强; 刘锋
Original assignee: Tsugami Auto Intelligent Technology Jiangsu Co ltd
Current assignee: Tsugami Auto Intelligent Technology Jiangsu Co ltd
Priority date: 2021-12-01
Filing date: 2021-12-01
Publication date: 2022-04-19
Anticipated expiration: 2031-12-01

Abstract

The utility model discloses a semiconductor wafer thickness detection platform, which comprises a base and a detection platform, wherein a mounting plate is arranged on the side surface of the detection platform, a stabilizing plate, a motor and a screw rod are arranged on the mounting plate, the stabilizing plate is distributed between the motor and the screw rod, the motor is connected with one end of the screw rod, a sliding block is arranged on the outer side of the screw rod, a connecting rod is arranged on the sliding block, a cleaning barrel is sleeved on the outer side of the connecting rod, a lifting cylinder is arranged at the circle center of the detection platform, a connecting block is arranged at the top of the lifting cylinder, and a placing plate is arranged on the surface of the connecting block; the wafer is placed and is being placed the board, and the lift cylinder moves and places the board and shifts up, and wafer avris is unsettled, is convenient for take off the wafer, avoids detecting the friction that takes place between platform and the wafer, and the motor operation, the screw rod is rotatory, and connecting rod, a clearance section of thick bamboo slide along with the sliding block syntropy, and a clearance section of thick bamboo is cleaned the clearance and is detected the platform, place the board surface, avoids detecting the platform, places the impurity of board surface adhesion and the wafer friction of placing.

Description

Semiconductor wafer thickness detection platform

Technical Field

The utility model belongs to the technical field of wafer detection platforms, and particularly relates to a semiconductor wafer thickness detection platform.

Background

The wafer thickness detects, and the wafer is placed on detecting the round platform, and at the in-process of placing, when the wafer slope was placed, there was the friction between wafer and the detection round platform, can lead to the wafer to produce wearing and tearing, detects round platform surface adhesion impurity, and when taking the wafer, the wafer atress is not stable enough, and the wafer slides, has increased the wafer degree of wear.

The existing wafer thickness detection platform for detecting the wafer has the problems that the wafer taking and placing process is not stable enough, and the wafer and the detection platform are damaged due to friction, so that the semiconductor wafer thickness detection platform is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor wafer thickness detection platform to solve the problems that the wafer taking and placing process is not stable enough and the friction between the wafer and the detection platform is damaged in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor wafer thickness test platform, includes the base and examines test table, the side of examining test table is equipped with the mounting panel, be equipped with firm board, motor and screw rod on the mounting panel, firm board distributes between motor and screw rod, the one end of motor and screw rod is connected, the outside of screw rod is equipped with the sliding block, be equipped with the connecting rod on the sliding block, the outside cover of connecting rod is equipped with a clearance section of thick bamboo, the centre of a circle position of examining test table is equipped with the lift cylinder, the top of lift cylinder is equipped with the connecting block, the surface of connecting block is equipped with places the board.

Preferably, the screw rod is rotatably connected with the mounting plate, and the sliding block is rotatably connected with the screw rod through threads.

Preferably, the connecting rod is connected with the sliding block in a screwing mode through threads, a circular groove is formed in the side face of the cleaning barrel, and the connecting rod is matched with the circular groove.

Preferably, the cleaning cylinder is tangent to the surface of the detection table.

Preferably, the centre of a circle position of examining the test table is seted up standing groove and the annular of intercommunication, lift cylinder is located the standing groove, place board and annular cooperation, when placing the board and examining the test table block and being connected, place board top surface and examine test table top surface and be in on the same horizontal plane.

Preferably, the top surface of the connecting block is provided with a groove, a circle center of the bottom of the placing plate is provided with a limiting block in a '+' structure, and the limiting block is matched with the groove.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the lift cylinder, the connecting block that set up and place the board, the wafer is placed and is being placed the board, and the lift cylinder operation, when placing the board and shift up, wafer round edge avris is unsettled, is convenient for take off the wafer, avoids detecting and takes place the friction between platform and the wafer.

2. Through the mounting panel, motor, screw rod, sliding block, connecting rod and the clearance section of thick bamboo that sets up, the motor operation, the screw rod is rotatory, and the sliding block slides along the length direction of screw rod, and connecting rod, clearance section of thick bamboo slide along with the sliding block syntropy, and the clearance is cleaned to the clearance and is examined the platform, place the board surface, avoid examining the platform, place the impurity of board surface adhesion and the wafer friction of placing.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the fixing plate of the present invention;

FIG. 3 is a schematic cross-sectional view of the inspection station of the present invention;

in the figure: 1. a base; 2. a detection table; 3. mounting a plate; 4. a connecting rod; 5. cleaning the cylinder; 6. a lifting cylinder; 7. connecting blocks; 8. placing the plate; 9. a stabilizing plate; 10. a motor; 11. a screw; 12. and a slider.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1 to 3, the present invention provides a technical solution: a semiconductor wafer thickness detection platform comprises a base 1 and a detection platform 2, wherein a mounting plate 3 is arranged on the side face of the detection platform 2, a stabilizing plate 9, a motor 10 and a screw 11 are arranged on the mounting plate 3, the stabilizing plate 9 is distributed between the motor 10 and the screw 11, the motor 10 is connected with one end of the screw 11, a sliding block 12 is arranged on the outer side of the screw 11, the sliding block 12 is connected with the screw 11 in a screwing mode through threads, the motor 10 runs, the screw 11 rotates, the sliding block 12 slides along the length direction of the screw 11 to facilitate the adjustment of the position of the sliding block 12, a connecting rod 4 is arranged on the sliding block 12, the connecting rod 4 is connected with the sliding block 12 in a screwing mode through threads, a cleaning barrel 5 is sleeved on the outer side of the connecting rod 4, the cleaning barrel 5 is made of sponge materials, the cleaning barrel 5 cleans the detection platform 2 and places the surface of a plate 8, and a lifting cylinder 6 is arranged at the circle center of the detection platform 2, the top of lift cylinder 6 is equipped with connecting block 7, and the surface of connecting block 7 is equipped with places board 8, and lift cylinder 6 moves, and lift cylinder 6 is by shortening the state and sliding to vertical extension state, is convenient for adjust the position of placing board 8, and when placing board 8 and move up, wafer round edge side is unsettled, is convenient for take off the wafer, avoids examining taking place the friction between test table 2 and the wafer.

In this embodiment, rotate between screw rod 11 and the mounting panel 3 and be connected, close soon through the screw thread between sliding block 12 and the screw rod 11 and be connected, motor 10 operation, screw rod 11 is rotatory, sliding block 12 slides along screw rod 11's length direction, be convenient for adjust sliding block 12's position, close soon through the screw thread between connecting rod 4 and the sliding block 12 and be connected, the circular slot has been seted up to the side of a clearance section of thick bamboo 5, connecting rod 4 and circular slot cooperation, clearance section of thick bamboo 5 is tangent with detecting 2 surfaces of platform, be convenient for change clearance section of thick bamboo 5, clearance section of thick bamboo 5 is made by sponge material, connecting rod 4, clearance section of thick bamboo 5 slides along with sliding block 12 syntropy, clearance detection platform 2 is cleaned to clearance section of thick bamboo 5, place 8 surfaces of board.

In this embodiment, examine the centre of a circle position of test table 2 and set up standing groove and the annular of intercommunication, lift cylinder 6 is located the standing groove, place board 8 and annular cooperation, lift cylinder 6 moves, lift cylinder 6 slides to vertical extension state by shortening the state, be convenient for adjust the position of placing board 8, place board 8 and examine test table 2 block when being connected, place board 8 top surface and examine test table 2 top surface and be in on the same horizontal plane, the top surface of connecting block 7 has seted up the recess, the centre of a circle position of placing board 8 bottom is equipped with the stopper of "+" type structure, stopper and recess cooperation, be convenient for get put place board 8.

The working principle and the using process of the utility model are as follows:

when the thickness of a semiconductor wafer is detected, the lifting cylinder 6 runs, the lifting cylinder 6 slides from a shortened state to a vertically extended state, the position of the placing plate 8 is convenient to adjust, the wafer is placed on the placing plate 8, the circle center of the wafer is opposite to that of the placing plate 8, the lifting cylinder 6 runs to the shortened state, the placing plate 8 is connected with the detection table 2 in a clamping manner, when the placing plate 8 moves upwards, the side of the round edge of the wafer is suspended, the wafer is convenient to take down, and friction between the detection table 2 and the wafer is avoided;

the 5 covers of a clearance section of thick bamboo are established in the outside of connecting rod 4, are convenient for change a clearance section of thick bamboo 5, and a clearance section of thick bamboo 5 is made by sponge material, and motor 10 moves, and screw rod 11 is rotatory, and sliding block 12 slides along screw rod 11's length direction, and connecting rod 4, a clearance section of thick bamboo 5 slide along with sliding block 12 syntropy, and a clearance section of thick bamboo 5 is cleaned the clearance and is examined test table 2, place board 8 surface, avoids examining test table 2, places the impurity of board 8 surface adhesion and the wafer friction of placing.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor wafer thickness testing platform, includes base (1) and detects platform (2), its characterized in that: the side of examining test table (2) is equipped with mounting panel (3), be equipped with on mounting panel (3) and stabilize board (9), motor (10) and screw rod (11), stabilize board (9) and distribute between motor (10) and screw rod (11), the one end of motor (10) and screw rod (11) is connected, the outside of screw rod (11) is equipped with sliding block (12), be equipped with connecting rod (4) on sliding block (12), the outside cover of connecting rod (4) is equipped with clearance section of thick bamboo (5), the centre of a circle position of examining test table (2) is equipped with lift cylinder (6), the top of lift cylinder (6) is equipped with connecting block (7), the surface of connecting block (7) is equipped with places board (8).

2. The platen as claimed in claim 1, wherein: the screw rod (11) is rotatably connected with the mounting plate (3), and the sliding block (12) is connected with the screw rod (11) in a screwing mode through threads.

3. The platen as claimed in claim 1, wherein: the connecting rod (4) is connected with the sliding block (12) in a screwing mode through threads, a circular groove is formed in the side face of the cleaning barrel (5), and the connecting rod (4) is matched with the circular groove.

4. The platen as claimed in claim 1, wherein: the cleaning cylinder (5) is tangent to the surface of the detection table (2).

5. The platen as claimed in claim 1, wherein: examine the centre of a circle position of test table (2) and offer standing groove and the annular of intercommunication, lift cylinder (6) are located the standing groove, place board (8) and annular cooperation, place board (8) and examine when test table (2) block is connected, place board (8) top surface and examine test table (2) top surface and be located same horizontal plane.

6. The platen as claimed in claim 1, wherein: the top surface of the connecting block (7) is provided with a groove, the circle center of the bottom of the placing plate (8) is provided with a limiting block in a '+' structure, and the limiting block is matched with the groove.