CN216337946U

CN216337946U - Gas uniform flow plate with adjustable gas inlet rate and distribution

Info

Publication number: CN216337946U
Application number: CN202122730826.1U
Authority: CN
Inventors: 顾千澜
Original assignee: Xiamen Hengguangxinrui Technology Co ltd
Current assignee: Xiamen Hengguangxinrui Technology Co ltd
Priority date: 2021-10-29
Filing date: 2021-11-09
Publication date: 2022-04-19
Anticipated expiration: 2031-11-09

Abstract

The utility model discloses a gas uniform flow plate with adjustable gas inlet rate and distribution, which is arranged in a process cavity and divides the process cavity into a uniform flow cavity and a process cavity, wherein the uniform flow cavity is positioned above the process cavity and is provided with a process gas inlet pipeline communicated with the uniform flow cavity. By adopting the flow equalizing plate in the semiconductor preparation equipment, because the plugging piece is detachable, a worker can arrange the plugging piece in the appointed flow equalizing hole according to different processes, adjust and set the air inlet distribution and speed of the process gas, and simultaneously install the plugging pieces with different apertures in the flow equalizing hole according to the requirements, thereby further meeting the air inlet process requirements.

Description

Gas uniform flow plate with adjustable gas inlet rate and distribution

Technical Field

The utility model relates to the field of semiconductor chip processing, in particular to a gas uniform flow plate with adjustable gas inlet rate and distribution.

Background

Semiconductor fabrication involves many process flows, such as chemical vapor deposition and atomic layer deposition. These process flows involve many gaseous reactions, require the use of high purity gases, and the like. Generally, the diffusion ventilation is directly performed, and a flow equalizing plate is not provided, so that the process gas easily flows into a process chamber at a time, the contact between the semiconductor raw material and the process gas is not uniform, the surface concentration of the semiconductor raw material is not uniform, parameters are inconsistent, and the product percent of pass is influenced.

In order to solve the above problems, in the prior art, a flow homogenizing plate is disposed in a process chamber, a plurality of diffusion holes are generally distributed on the flow homogenizing plate, and the distribution of the reaction gas can be adjusted by adjusting the size and distribution pattern of the diffusion holes. In process development, a plurality of uniform flow plates with different diffusion hole distribution patterns are generally required to be prepared for process uniformity optimization, and the diffusion hole distribution requirements of different process applications are different. This greatly increases the development costs and also causes waste of accessories and maintenance costs of the equipment.

In summary, there is a need for a gas uniform flow plate with adjustable gas inlet rate and distribution.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a gas uniform flow plate with adjustable gas inlet rate and distribution.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides an inlet velocity and distribution adjustable gaseous uniform flow board, the uniform flow board sets up in the process cavity, will the process cavity separates for uniform flow chamber, process chamber, the uniform flow chamber is located process chamber top to be equipped with the process gas admission line with the uniform flow chamber intercommunication, be provided with uniform flow hole on the uniform flow board, its characterized in that, uniform flow hole is provided with the shutoff piece, shutoff piece detachably sets up in the uniform flow hole for control process gas's inlet distribution and speed.

Furthermore, the plugging piece is provided with through holes with different apertures for further controlling the gas inlet rate of the process gas.

Furthermore, the uniform flow holes are uniformly distributed on the uniform flow plate, and the sizes of the openings at the two ends of the uniform flow holes are different.

Furthermore, the cross sections of the uniform flow holes and the blocking pieces are inverted trapezoids.

Further, the uniform flow hole is composed of a first stepped hole and a second stepped hole which are coaxially arranged and are communicated with each other, and the diameter of the first stepped hole is larger than that of the second stepped hole; the plugging piece is composed of a first plugging part and a second plugging part.

Furthermore, the second stepped hole is provided with an internal thread, and the surface of the second plugging portion is provided with an external thread matched with the internal thread.

Further, the flow equalizing plate is made of metal, the plugging piece is magnetic, and the plugging piece is adsorbed in the flow equalizing hole of the flow equalizing plate through magnetic force.

The utility model has the beneficial effects that:

by adopting the uniform flow plate in the semiconductor preparation equipment, because the plugging piece is detachable, a worker can arrange the plugging piece in the appointed uniform flow hole according to the requirements of different processes, adjust and set the air inlet distribution and the air inlet speed of the process gas, and simultaneously solve the problem that the yield of the semiconductor is reduced because the air inlet distribution and the efficiency of the process gas are influenced due to the falling of the high-temperature adhesive tape in the process of preparing the semiconductor in the prior art.

In addition, the staff can install the plugging piece with different through hole apertures in the uniform flow hole according to the requirements, and the technological requirements of air inlet are further met.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the utility model, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic view of a heating chamber of the present invention;

FIG. 2 is a schematic view of an even flow plate according to the present invention;

FIG. 3 is a schematic view of an inverted trapezoidal shaped orifice and plug of the present invention;

FIG. 4 is a schematic view of the utility model with coaxially arranged stepped uniform flow holes and plugging members;

FIG. 5 is a schematic view of a flow homogenizing hole and a plugging member having threads according to the present invention;

FIG. 6 is a schematic view of a plug having a through hole according to the present invention;

Detailed Description

The present invention is described in detail below with reference to fig. 1 to 5.

FIG. 1 shows the flow equalizer 40 dividing the process chamber 30 into a flow equalizer chamber 301 and a process chamber 302, and the gas inlet conduit 50 is connected to the flow equalizer chamber by a fitting 401. The uniform flow plate 40 is uniformly distributed with uniform flow holes 402, and corresponding plugging pieces 403 are detachably mounted in the uniform flow holes 402. The blanking member 403 is used to seal the uniform flow holes 402 so that the process gas cannot flow through the vent holes 202. The plugging member 403 may be directly clamped in the uniform flow hole 402 by interference fit, or threads may be provided on the uniform flow hole 402 and the plugging member 403, so that the plugging member 403 is detachably fixed in the uniform flow hole 402 by thread fit, or may be adsorbed on the uniform flow hole 402 by magnetic force.

Fig. 3 shows an inverted trapezoidal shaped uniform flow orifice 402 and a corresponding blocking member 403. The surface of the block piece 403 is tightly coupled to the surface of the uniform flow orifice 402 to organize the process gases into the process chamber 302.

Fig. 4 shows a uniform flow hole 402 composed of a first stepped hole 4021 and a second stepped hole 4022 which are coaxially arranged and communicate with each other, and a corresponding block piece 403 having a first blocking portion 4031 and a second blocking portion 4032. The diameter of the first stepped bore 4021 is greater than the diameter of the second stepped bore 4022. The first blocking portion 4031 is tightly coupled to the first stepped hole 4021, and the second blocking portion 4032 is tightly coupled to the second stepped hole 4022, so that the entire smoothing hole 402 is sealed, and it is ensured that no process gas passes through the smoothing hole 402.

Fig. 5 shows a uniform flow hole 402, a plug 403, which is composed of a threaded fit. The side wall of the second stepped hole 4022 of the uniform flow hole 402 is provided with an internal thread, the second plugging portion 4032 of the plugging piece 403 is provided with an external thread corresponding to the internal thread, and the plugging piece 403 is firmly fixed in the uniform flow hole 402 through thread matching, so that the plugging piece 403 is prevented from moving up and down in the uniform flow hole 402 to seal the whole uniform flow hole 402, and no process gas passes through the uniform flow hole 402.

In addition, the flow distribution plate 40 may be made of a metal material, and the block piece 403 has magnetism, and the block piece 403 is attracted in the flow distribution holes 402 of the flow distribution plate 40 by magnetic force.

When the uniform flow plate 40 with the uniform flow holes 402 with different apertures is required, the through hole 4033 can be formed in the blocking piece 403 according to the requirement, and the blocking pieces with different apertures can be mounted on the corresponding uniform flow holes 402 according to the air inlet distribution requirement, so that the air inlet distribution requirement is met.

The above embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. The utility model provides an inlet velocity and distribution adjustable gaseous uniform flow board, the uniform flow board sets up in the process cavity, will the process cavity separates for uniform flow chamber, process chamber, the uniform flow chamber is located process chamber top to be equipped with the process gas admission line with the uniform flow chamber intercommunication, be provided with uniform flow hole on the uniform flow board, its characterized in that, uniform flow hole is provided with the shutoff piece, shutoff piece detachably sets up in the uniform flow hole for control process gas's inlet distribution and speed.

2. The adjustable gas flow equalizer of claim 1, wherein the plugging member has through holes with different diameters for further controlling the gas flow rate of the process gas.

3. The adjustable gas flow equalizer according to claim 1, wherein the flow equalizer holes are uniformly distributed on the flow equalizer, and the openings at the two ends of the flow equalizer holes have different sizes.

4. The adjustable gas flow equalizer of claim 3, wherein the cross-section of the flow equalizer holes and the plugs is inverted trapezoid.

5. The adjustable gas flow equalizer according to claim 3, wherein the equalizing hole is composed of a first stepped hole and a second stepped hole which are coaxially arranged and communicated with each other, and the diameter of the first stepped hole is larger than that of the second stepped hole; the plugging piece is composed of a first plugging part and a second plugging part.

6. The adjustable gas flow distribution plate according to claim 5, wherein the second stepped hole has an internal thread, and the second blocking portion has an external thread matching the internal thread.

7. The adjustable gas flow distribution plate according to claim 3, wherein the flow distribution plate is made of metal, and the blocking member is magnetic, and the blocking member is magnetically attracted to the flow distribution holes of the flow distribution plate.