CN216334105U - Constant temperature oscillation storage box - Google Patents
Constant temperature oscillation storage box Download PDFInfo
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- CN216334105U CN216334105U CN202122279186.7U CN202122279186U CN216334105U CN 216334105 U CN216334105 U CN 216334105U CN 202122279186 U CN202122279186 U CN 202122279186U CN 216334105 U CN216334105 U CN 216334105U
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Abstract
The application relates to the technical field of medical instruments and discloses a constant-temperature oscillation storage box, which comprises a box body; the semiconductor temperature adjusting device is arranged in the box body and comprises a first surface and a second surface which are opposite, and the first surface faces the inside of the box body; the vibration device is arranged in the box body and comprises a bearing part for bearing the stored objects and a vibration part which is connected with the bearing part and applies vibration to the bearing part; the temperature sensor is arranged in the box body; and the microcontroller is electrically connected with the semiconductor temperature adjusting device, the vibrating device and the temperature sensor respectively and is configured to control the vibrating device to run or stop, and receive the temperature in the box detected by the temperature sensor and control the first surface of the semiconductor temperature adjusting device to refrigerate or heat or power off so as to enable the temperature in the box to be in a preset temperature range. By controlling the operation of the vibration device and the semiconductor temperature adjusting device, constant-temperature oscillation storage is realized, and the semiconductor temperature adjusting device is small in size, so that miniaturized constant-temperature oscillation storage is realized.
Description
Technical Field
The application relates to the technical field of medical equipment, for example, relate to a constant temperature oscillation case of saving.
Background
At present, the blood platelets cannot be stored for a long time at normal temperature, the suitable storage temperature is 22 +/-2 ℃, and the blood platelets are easy to agglomerate and cause necrosis when being placed statically, so that the blood platelet bags need to be placed in a special constant-temperature oscillation storage box.
The constant temperature control system occupies a large space and can only be used for a large-scale storage box generally. For small storage cases, there is currently no suitable constant temperature oscillating storage solution.
SUMMERY OF THE UTILITY MODEL
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a constant temperature oscillation storage box, which is used for realizing miniaturization and providing constant temperature oscillation storage.
In some embodiments, the constant temperature oscillation storage tank comprises: a box body; the semiconductor temperature adjusting device is arranged in the box body and comprises a first surface and a second surface which are opposite, and the first surface faces the inside of the box body; the vibration device is arranged in the box body and comprises a bearing part for bearing the stored objects and a vibration part which is connected with the bearing part and applies vibration to the bearing part; the temperature sensor is arranged in the box body; and the microcontroller is electrically connected with the semiconductor temperature adjusting device, the vibrating device and the temperature sensor respectively.
Optionally, the semiconductor temperature adjusting device further comprises a first radiator, which is arranged on the first surface of the semiconductor temperature adjusting device and absorbs and diffuses cold or heat generated by the first surface of the semiconductor temperature adjusting device into the box body.
Optionally, the first heat sink comprises: a first substrate; the first radiating fin is arranged on one surface of the first substrate, which faces the box body; and one end of the heat conductor is connected to the other surface of the first substrate, and the other end of the heat conductor is arranged on the first surface of the semiconductor temperature regulating device.
Alternatively, the cross-sectional area of the heat conductor is gradually reduced in a direction from the first substrate toward the first face of the semiconductor temperature adjustment device.
Optionally, the first heat sink is vertically disposed on a surface of the first substrate.
Optionally, the heat radiator further comprises a first fan, the first fan is arranged in the box body, and cold or heat absorbed by the first heat radiator is transferred into the box body.
Optionally, the semiconductor temperature adjusting device further comprises a second radiator, which is arranged on the second surface of the semiconductor temperature adjusting device and absorbs and diffuses heat or cold generated by the second surface of the semiconductor temperature adjusting device to the outside of the box body.
Optionally, the second heat sink comprises: a second substrate having one surface disposed on a second surface of the semiconductor temperature control device; and a second heat sink disposed on the other surface of the second substrate.
Optionally, the second heat sink is vertically disposed on a surface of the second substrate.
Optionally, the heat radiator further comprises a second fan, the second fan is arranged outside the box body, and the second fan transmits heat or cold absorbed by the second radiator to the outside of the box body.
The constant temperature oscillation storage box that this disclosed embodiment provided can realize following technological effect:
through the operation of the first surfaces of the vibration device and the semiconductor temperature adjusting device, the storage object in the constant-temperature oscillation storage box can be oscillated and stored, the temperature in the constant-temperature oscillation storage box can be in a preset temperature range, constant-temperature storage is realized, and the semiconductor temperature adjusting device is small in size, so that constant-temperature oscillation storage is provided while miniaturization is realized.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
FIG. 1 is a schematic structural diagram of a constant temperature oscillation storage box provided by an embodiment of the disclosure;
FIG. 2 is a schematic structural diagram of another constant temperature oscillation storage box provided by the embodiment of the disclosure;
fig. 3 is a schematic structural diagram of a first heat sink provided in the embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of another first heat sink provided in the embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of another first heat sink provided in the embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram of another constant temperature oscillation storage box provided by the embodiment of the disclosure;
FIG. 7 is a schematic structural diagram of another constant temperature oscillation storage box provided by the embodiment of the disclosure;
fig. 8 is a schematic structural diagram of a second heat sink provided in the embodiment of the present disclosure;
FIG. 9 is a schematic structural diagram of another constant temperature oscillation storage box provided by the embodiment of the disclosure;
fig. 10 is a schematic structural diagram of a vibrating portion according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a vibration device according to an embodiment of the present disclosure.
Reference numerals:
1: a box body; 2: a semiconductor temperature adjusting device; 3: a vibrating device; 4: a temperature sensor; 5: a first heat sink; 6: a second heat sink; 7: a first fan; 8: a second fan; 9: a direct current power supply; 10: a universal wheel; 11: an accommodating chamber; 12: a storage chamber; 13: a spacer section; 14: a box door; 31: a bearing part; 32: a vibrating section; 51: a first substrate; 52: a first heat sink; 53: a heat conductor; 61: a second substrate; 62: a second heat sink; 321: an air charging and discharging device; 322: vibrating the base; 323: an inflatable air bag; 324: a damping spring.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.
The term "plurality" means two or more unless otherwise specified.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
Referring to fig. 1, an embodiment of the present disclosure provides a constant temperature oscillation storage box, which includes a box body 1, a semiconductor temperature adjustment device 2, a vibration device 3, a temperature sensor 4, and a microcontroller. The box body 1 comprises a spacing part 13, and a second air guide opening is formed in the outer surface of the box body 1. The partition part 13 partitions the interior of the box body 1 into the accommodating cavity 11 and the storage cavity 12, and the partition part 13 is provided with a first air guiding opening. The semiconductor temperature adjusting device 2 is arranged in the accommodating cavity 11 and comprises a first face and a second face which are opposite to each other, the first face faces the storage cavity 12, cold or heat is transmitted to the storage cavity 12 through the first air guide opening, and the second face transmits the heat or the cold to the outside of the box body 1 through the second air guide opening. The vibration device 3 is provided in the storage chamber 12, and includes a support portion 31 for supporting the stored material, and a vibration portion 32 connected to the support portion 31 and applying vibration to the support portion 31. The temperature sensor 4 is provided in the storage chamber 12. The microcontroller is electrically connected with the semiconductor temperature adjusting device 2, the vibrating device 3 and the temperature sensor 4 respectively. The microcontroller is configured to control the vibration device 3 to operate or stop, and receive the temperature of the storage chamber 12 detected by the temperature sensor 4 and control the first side of the semiconductor temperature adjusting device 2 to cool or heat or power off so that the temperature of the storage chamber 12 is within a preset temperature range.
The semiconductor temperature adjusting device 2 includes a semiconductor cooling plate and a drive circuit. When the temperature does not need to be adjusted, the microcontroller controls the driving circuit to disconnect the semiconductor refrigerating sheet from the power supply. When the temperature needs to be reduced, the microcontroller controls the driving circuit to enable the anode of the semiconductor refrigeration piece to be connected with the anode of the power supply, the cathode of the semiconductor refrigeration piece is connected with the cathode of the power supply, and the first surface of the semiconductor refrigeration piece absorbs heat and works in a refrigeration mode. When the temperature needs to be raised, the microcontroller controls the driving circuit to enable the anode of the semiconductor refrigerating sheet to be connected with the cathode of the power supply, the cathode of the semiconductor refrigerating sheet is connected with the anode of the power supply, and the first surface of the semiconductor refrigerating sheet emits heat to work in a heating mode. The output power of the first surface of the semiconductor refrigerating piece can be changed by adjusting the working time of the semiconductor refrigerating piece or adjusting the current flowing through the semiconductor refrigerating piece.
The model of the temperature sensor 4 may be LTM8871, or LTM 8877. The microcontroller may be of the PIC16F1824 or AT89S 51.
By adopting the constant-temperature oscillation storage box provided by the embodiment of the disclosure, through controlling the operation of the first surfaces of the vibrating device and the semiconductor temperature adjusting device, the storage objects in the constant-temperature oscillation storage box can be oscillated and stored, the temperature in the constant-temperature oscillation storage box can be in a preset temperature range, constant-temperature storage is realized, and the semiconductor temperature adjusting device is small in size, so that constant-temperature oscillation storage is provided while miniaturization is realized.
After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage chamber 12 is within the preset temperature range, the microcontroller controls the semiconductor temperature adjusting device 2 to be powered off, and the microcontroller acquires the temperature of the storage chamber 12 detected by the temperature sensor 4 again. If the temperature of the storage chamber 12 is outside the preset temperature range, the microcontroller controls the semiconductor temperature adjustment device 2 to operate in the cooling mode or the heating mode, so that the temperature of the storage chamber 12 reaches and is maintained at the target temperature.
Specifically, the proper storage temperature of the platelets is 22 +/-2 ℃, and the environment temperature is 5-35 ℃. The preset minimum temperature of the constant-temperature oscillation storage box is 21 ℃, the maximum temperature is 23 ℃, and the target temperature is 22 ℃. After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage cavity 12 is 21-23 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 to be powered off, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4 again. When the ambient temperature is 10 ℃, if the temperature of the storage chamber 12 is lower than 21 ℃, the microcontroller controls the semiconductor temperature regulating device 2 to work in the heating mode. When the temperature of the storage chamber 12 reaches 21 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃. When the temperature environment is 30 ℃, if the temperature of the storage cavity 12 is higher than 23 ℃, the microcontroller controls the semiconductor temperature regulating device 2 to work in a cooling mode. When the temperature of the storage chamber 12 reaches 23 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃.
Referring to fig. 2, another constant temperature oscillation storage box provided in the embodiment of the present disclosure includes a box body 1, a semiconductor temperature adjustment device 2, a vibration device 3, a temperature sensor 4, a microcontroller, and a first heat sink 5. The case 1, the semiconductor temperature adjusting device 2, the vibrating device 3, the temperature sensor 4, and the microcontroller are described above and will not be described in detail. The first radiator 5 is arranged on the first surface of the semiconductor temperature adjusting device 2, absorbs cold or heat generated by the first surface of the semiconductor temperature adjusting device 2 and diffuses the cold or heat to the storage cavity 12 through the first air guiding opening. Therefore, cold or heat generated by the first surface of the semiconductor temperature adjusting device can be concentrated on the first radiator, and the cold or heat is diffused to the storage cavity through the first radiator, so that the temperature transmission efficiency is improved.
As shown in fig. 3, optionally, the first heat sink 5 includes a first substrate 51, a first heat sink 52, and a heat conductor 53. The first heat sink 52 is provided on a surface of the first substrate 51 facing the case 1. One end of the heat conductor 53 is connected to the other surface of the first substrate 51, and the other end is provided on the first surface of the semiconductor temperature control device 2. Therefore, cold or heat generated by the first surface of the semiconductor temperature adjusting device is transferred to the first substrate through the heat conductor and then transferred to the first radiating fin, so that the cold or heat transfer area is increased, and the temperature transfer speed is increased.
As shown in conjunction with fig. 4, the cross-sectional area of the thermal conductor 53 may alternatively be gradually reduced in a direction toward the first face of the semiconductor temperature adjustment device 2 along the first substrate 51. Thus, the outer side of the heat conductor has a space filled with a material.
As shown in connection with fig. 5, the thermal conductor 53 is optionally a rectangular body structure.
Alternatively, one surface of the heat conductor 53 is connected to the middle portion of the first substrate 51 in a T-shaped configuration.
As shown in fig. 3, optionally, the first heat sink 52 is vertically disposed on the surface of the first substrate 51.
Referring to fig. 6, another constant temperature oscillation storage box provided in the embodiment of the present disclosure includes a box body 1, a semiconductor temperature adjustment device 2, a vibration device 3, a temperature sensor 4, a microcontroller, a first heat sink 5, and a first fan 7. The box 1, the semiconductor temperature adjusting device 2, the vibrating device 3, the temperature sensor 4, the microcontroller and the first heat sink 5 are described above and will not be described in detail. The first fan 7 is arranged at the spacing part 13, is positioned in the storage cavity 12, transfers the cold or heat absorbed by the first radiator 5 to the storage cavity 12 through the first air guide opening, and is electrically connected with the microcontroller.
Therefore, the first fan transmits the cold quantity or the heat quantity of the first radiator to the storage cavity through the first air guide opening, so that the air in the storage cavity flows circularly, the transmission speed of the cold quantity or the heat quantity is accelerated, the uniformity is improved, and the temperature of the storage cavity is convenient to maintain at the target temperature.
After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage cavity 12 is within the preset temperature range, the microcontroller controls the semiconductor temperature adjusting device 2 and the first fan 7 to be powered off, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4 again. If the temperature of the storage cavity 12 is outside the preset temperature range, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a cooling mode or a heating mode, and the microcontroller controls the first fan 7 to operate so that the temperature of the storage cavity 12 reaches and is maintained at the target temperature.
Specifically, the proper storage temperature of the platelets is 22 +/-2 ℃, and the environment temperature is 5-35 ℃. The preset minimum temperature of the constant-temperature oscillation storage box is 21 ℃, the maximum temperature is 23 ℃, and the target temperature is 22 ℃. After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage cavity 12 is 21-23 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 and the first fan 7 to be powered off, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4 again. When the ambient temperature is 10 ℃, if the temperature of the storage cavity 12 is lower than 21 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a heating mode, and the microcontroller controls the first fan 7 to operate. When the temperature of the storage chamber 12 reaches 21 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃. When the temperature environment is 30 ℃, if the temperature of the storage cavity 12 is higher than 23 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a refrigerating mode, and the microcontroller controls the first fan 7 to operate. When the temperature of the storage chamber 12 reaches 23 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃.
Referring to fig. 7, another constant temperature oscillation storage box provided in the embodiment of the present disclosure includes a box body 1, a semiconductor temperature adjustment device 2, a vibration device 3, a temperature sensor 4, a microcontroller, a first heat sink 5, a second heat sink 6, and a first fan 7. The box body 1, the semiconductor temperature adjusting device 2, the vibrating device 3, the temperature sensor 4, the microcontroller, the first radiator 5 and the first fan 7 are explained in the foregoing, and are not described in detail. The second heat sink 6 is disposed on the second surface of the semiconductor temperature control device 2, and absorbs and diffuses heat or cold generated from the second surface of the semiconductor temperature control device 2 to the outside of the case 1. Therefore, the heat or cold energy generated by the second surface of the semiconductor temperature adjusting device can be concentrated on the second radiator, and the heat or cold energy is diffused outside the box body through the second radiator, so that the heat dissipation or cold dissipation speed is increased, and the refrigerating or heating capacity of the first surface of the semiconductor temperature adjusting device is improved.
As shown in connection with fig. 8, optionally, the second heat sink 6 includes a second substrate 61 and a second heat sink 62. One surface of the second substrate 61 is provided on the second surface of the semiconductor temperature control device 2. The second heat sink 62 is provided on the other surface of the second substrate 61. Therefore, heat or cold generated by the second surface of the semiconductor temperature adjusting device is transferred to the second radiating fin through the second substrate, the radiating or cold radiating area is increased, and the refrigerating or heating capacity of the first surface of the semiconductor temperature adjusting device is improved.
Alternatively, the second heat sink 62 is vertically disposed on the surface of the second substrate 61.
Referring to fig. 9, another constant temperature oscillation storage box provided in the embodiment of the present disclosure includes a box body 1, a semiconductor temperature adjustment device 2, a vibration device 3, a temperature sensor 4, a microcontroller, a first heat sink 5, a second heat sink 6, a first fan 7, and a second fan 8. The box body 1, the semiconductor temperature adjusting device 2, the vibrating device 3, the temperature sensor 4, the microcontroller, the first radiator 5, the second radiator 6 and the first fan 7 are explained in the foregoing, and are not described in detail again. The second fan 8 is arranged outside the box body 1, transfers the heat or cold absorbed by the second radiator 6 to the outside of the box body 1, and is electrically connected with the microcontroller.
Therefore, the second fan transmits the heat or cold absorbed by the second radiator to the outside of the box body through the second air guide opening, so that the heat dissipation or cold dissipation speed is accelerated, and the refrigerating or heating capacity of the first surface of the semiconductor temperature adjusting device is improved.
After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage cavity 12 is within the preset temperature range, the microcontroller controls the semiconductor temperature adjusting device 2, the first fan 7 and the second fan 8 to be powered off, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4 again. If the temperature of the storage cavity 12 is outside the preset temperature range, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a cooling mode or a heating mode, and the microcontroller controls the first fan 7 and the second fan 8 to operate, so that the temperature of the storage cavity 12 reaches and is maintained at the target temperature.
Specifically, the proper storage temperature of the platelets is 22 +/-2 ℃, and the environment temperature is 5-35 ℃. The preset minimum temperature of the constant-temperature oscillation storage box is 21 ℃, the maximum temperature is 23 ℃, and the target temperature is 22 ℃. After the constant-temperature oscillation storage box is started, the microcontroller controls the vibration device 3 to operate, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4. If the temperature of the storage cavity 12 is 21-23 ℃, the microcontroller controls the semiconductor temperature adjusting device 2, the first fan 7 and the second fan 8 to be powered off, and the microcontroller acquires the temperature of the storage cavity 12 detected by the temperature sensor 4 again. When the ambient temperature is 10 ℃, if the temperature of the storage cavity 12 is lower than 21 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a heating mode, and the microcontroller controls the first fan 7 and the second fan 8 to operate. When the temperature of the storage chamber 12 reaches 21 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃. When the temperature environment is 30 ℃, if the temperature of the storage cavity 12 is higher than 23 ℃, the microcontroller controls the semiconductor temperature adjusting device 2 to work in a refrigerating mode, and the microcontroller controls the first fan 7 and the second fan 8 to run. When the temperature of the storage chamber 12 reaches 23 ℃, the microcontroller searches for the output power range of the semiconductor temperature regulating device 2 which enables the temperature of the storage chamber 12 to reach and maintain 22 ℃ according to the working time of the semiconductor temperature regulating device 2 and the temperature change of the storage chamber 12, and continuously adjusts the output power of the semiconductor temperature regulating device 2 to enable the temperature of the storage chamber 12 to reach and maintain 22 ℃.
Alternatively, the support portion 31 of the vibration device 3 is a storage rack or a storage tray.
An alternative configuration of the vibrating portion 32 of the vibrating device 3 is a vibrating motor, which is disposed at the bottom of the storage chamber 12. After the constant temperature oscillation storage box is started, the microcontroller controls the vibration motor to operate, and the vibration motor drives the storage object on the bearing part 31 to vibrate. Therefore, the vibration motor is simple to mount, small in size, light in weight and strong in vibration performance, and is suitable for a small constant-temperature oscillation storage box.
An alternative structure of the vibrating portion 32 of the vibrating device 3 is shown in fig. 10, and the vibrating portion 32 includes an inflation/deflation device 321, a vibrating base 322, an inflatable air bag 323 and a damper spring 324. An inflation/deflation device 321 is provided at the bottom of the storage chamber 12 and is electrically connected to the microcontroller. The vibration base 322 is disposed at the bottom of the storage chamber 12. The two inflatable air bags 323 are respectively arranged at two ends of the upper end surface of the vibration base 322 and are respectively connected with the inflation and deflation device 321. The upper end surface of each inflatable air bag 323 is provided with a damping spring 324, and the damping spring 324 plays a role of buffering the oscillation of the stored object. Referring to fig. 11, after the constant temperature oscillation storage box is started, the microcontroller controls the inflation/deflation device 321 to inflate one of the inflatable air bags 323 and deflate the other inflatable air bag 323, and the support portion 31 disposed at the upper end of the damping spring 324 drives the stored object to move in one direction. After the set time, the microcontroller controls the inflation/deflation device 321 to deflate the inflated inflatable air bag 323, inflates the deflated inflatable air bag 323, and the supporting part 31 drives the stored object to move in the other direction to reciprocate cyclically. The alternate inflation and deflation of the two inflatable bladders 323 drive the stored material on the support portion 31 to oscillate. Therefore, the vibration of the stored objects is realized in an inflation and deflation mode, the structure is simple, and the cost is low.
As shown in connection with fig. 9, the receiving chamber 11 is optionally filled with a foaming material. Therefore, the influence of the external environment on the temperature of the storage cavity can be reduced, the temperature change of the stored object can be small, the output power of the semiconductor temperature adjusting device can be reduced, the input power of the semiconductor temperature adjusting device can be reduced, and the electric energy can be saved.
Optionally, the constant temperature oscillation storage tank further comprises a dc power supply 9. In this way, the output current of the direct current power supply is unidirectional, and the design of the drive circuit of the semiconductor temperature adjustment device can be simplified compared with the design of the alternating current power supply.
Optionally, the constant temperature oscillation storage tank further comprises universal wheels 10. The universal wheels 10 are arranged at the bottom outside the box body 1. Thus, the user can conveniently move the box body.
Optionally, the cabinet 1 is opened with a door 14. Therefore, the user can conveniently access the stored articles.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A constant temperature oscillation storage box, characterized by comprising:
a box body (1);
the semiconductor temperature adjusting device (2) is arranged in the box body (1) and comprises a first surface and a second surface which are opposite, and the first surface faces the inside of the box body (1);
the vibration device (3) is arranged on the box body (1) and comprises a bearing part (31) for bearing the stored objects and a vibration part (32) which is connected with the bearing part (31) and applies vibration to the bearing part (31);
the temperature sensor (4) is arranged on the box body (1);
and the microcontroller is electrically connected with the semiconductor temperature adjusting device (2), the vibrating device (3) and the temperature sensor (4) respectively and is configured to control the vibrating device (3) to run or stop, and receive the temperature in the box body (1) detected by the temperature sensor (4) and control the first surface of the semiconductor temperature adjusting device (2) to refrigerate or heat or power off so that the temperature in the box body (1) is in a preset temperature range.
2. The constant temperature oscillation storage tank of claim 1 further comprising:
and a first radiator (5) which is arranged on the first surface of the semiconductor temperature adjusting device (2) and absorbs and diffuses the cold or heat generated by the first surface of the semiconductor temperature adjusting device (2) into the box body (1).
3. The thermostatic oscillation storage tank of claim 2 wherein the first heat sink (5) comprises:
a first substrate (51);
a first heat sink (52) provided on one surface of the first substrate (51) facing the case (1);
one end of the heat conductor (53) is connected to the other surface of the first substrate (51), and the other end is provided on the first surface of the semiconductor temperature control device (2).
4. The constant-temperature oscillation storage tank according to claim 3, wherein the cross-sectional area of the heat conductor (53) is gradually reduced in a direction from the first base plate (51) toward the first surface of the semiconductor temperature adjustment device (2).
5. The constant-temperature oscillation storage box according to claim 3, wherein the first heat radiating fins (52) are provided vertically on the surface of the first base plate (51).
6. The constant temperature oscillation storage tank of claim 2 further comprising:
and the first fan (7) is arranged in the box body (1) and is used for transferring the cold or heat absorbed by the first radiator (5) into the box body (1).
7. The constant temperature oscillation storage tank of any one of claims 1 to 6, further comprising:
and the second radiator (6) is arranged on the second surface of the semiconductor temperature adjusting device (2) and absorbs and diffuses heat or cold generated by the second surface of the semiconductor temperature adjusting device (2) to the outside of the box body (1).
8. The thermostatted oscillation storage tank as defined in claim 7, characterized in that the second radiator (6) comprises:
a second substrate (61) having one surface provided on a second surface of the semiconductor temperature control device (2);
and a second heat sink (62) provided on the other surface of the second substrate (61).
9. The constant-temperature oscillation storage box according to claim 8, wherein the second heat radiating fins (62) are provided vertically on the surface of the second base plate (61).
10. The constant temperature oscillation storage tank of claim 9 further comprising:
and the second fan (8) is arranged outside the box body (1) and transmits the heat or cold absorbed by the second radiator (6) to the outside of the box body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122279186.7U CN216334105U (en) | 2021-09-18 | 2021-09-18 | Constant temperature oscillation storage box |
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| CN202122279186.7U CN216334105U (en) | 2021-09-18 | 2021-09-18 | Constant temperature oscillation storage box |
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| CN216334105U true CN216334105U (en) | 2022-04-19 |
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Address after: No. 280, Fengyuan Road, high tech Zone, Qingdao, Shandong 266100 Patentee after: Qingdao Haier Biomedical Technology Co.,Ltd. Patentee after: Haier Blood Technology Chongqing Co.,Ltd. Patentee after: QINGDAO HAIER BIOMEDICAL Co.,Ltd. Address before: No. 280, Fengyuan Road, high tech Zone, Qingdao, Shandong 266100 Patentee before: Qingdao Haier Biomedical Technology Co.,Ltd. Patentee before: CHONGQING SANDA WEIYE PHARMACEUTICAL Co.,Ltd. Patentee before: QINGDAO HAIER BIOMEDICAL Co.,Ltd. |