CN216329270U - Crystal support degumming tool and degumming system - Google Patents

Abstract

The application provides a brilliant frock and the system that comes unstuck of holding in palm, brilliant holds in the palm the frock that comes unstuck and is used for holding in the palm the brilliant fixedly, and brilliant holds in the palm including brilliant support base plate and two protruding portions, and two protruding portions are respectively outstanding to be set up in the both ends that brilliant held in the palm the base plate. The crystal support degumming tool comprises a tool body and two fixing devices, wherein the tool body comprises a support, and the support is provided with a first end and a second end. Each fixing device comprises a fixing piece and two protruding pieces arranged on the fixing piece at intervals, and a fixing groove is formed between the two protruding pieces. One fixing piece is arranged at the first end of the support, the other fixing piece is arranged at the second end of the support, and the two fixing grooves are used for bearing and fixing the two protruding parts respectively. The degumming system comprises a crystal support and a crystal support degumming tool. The protruding portion is born fixedly by the fixing groove, the phenomenon that the crystal support moves relatively is avoided, the risk that the crystal support and the crystal support degumming tool are damaged due to the fact that the crystal support collides with the degumming tool is reduced, and the yield of the silicon wafer is improved.

Description

Crystal support degumming tool and degumming system

Technical Field

The application relates to the field of photoelectric technology, particularly, relate to a crystal support frock and system of coming unstuck.

Background

Solar silicon wafers are typically cut from silicon rods on a cutting machine. Before cutting, the silicon rod needs to be bonded on the crystal support through glue, and after cutting, the silicon rod needs to be subjected to degumming treatment so as to separate the silicon wafer formed after cutting from the crystal support for subsequent production. Before degumming, putting the crystal support bonded with the silicon wafer into a degumming tool together, fixing the crystal support and the degumming tool, and then sending the degumming tool into a degumming machine to carry out degumming treatment on the silicon wafer.

The existing method for fixing the crystal support bonded with the silicon wafer and the degumming tool generally comprises the steps of arranging a transverse through hole on the crystal support, manually penetrating an iron rod through the through hole, and erecting and fixing the iron rod on the degumming tool. However, this method has many defects, for example, the transverse through hole is easy to be filled with impurities, and the impurities may fall off during cutting and degumming treatment to affect the cutting or degumming effect; after the iron rod passes through the transverse through hole and is erected and fixed on the degumming tool, the degumming tool slides along the width direction of the iron rod in the moving process, the crystal support can slide along the iron rod, relative motion is generated between the crystal support and the degumming tool, the crystal support has the risk of colliding the degumming tool, on one hand, the device can be damaged, and on the other hand, the silicon wafer can also collide the degumming tool to cause the rejection of the silicon wafer.

SUMMERY OF THE UTILITY MODEL

A first aim at of this application provides a brilliant support frock of coming unstuck, and it can bear fixed brilliant support, and the while restriction is brilliant to be held in the palm along its ascending motion of width direction.

A second object of the present application is to provide a degumming system which reduces the risk of damage to the system.

In order to achieve the purpose, the following technical means are adopted in the application:

the first aspect of the application provides a brilliant frock of coming unstuck that holds in palm for hold in the palm to the brilliant and bear fixedly, the brilliant support including brilliant support base plate and two protruding portions, two protruding portions respectively outstanding the setting in the both ends that the brilliant support base plate. The crystal support degumming tool comprises a tool body and two fixing devices, wherein the tool body comprises a support, and the support is provided with a first end and a second end. Each fixing device comprises a fixing piece and two protruding pieces arranged on the fixing piece at intervals, and a fixing groove is formed between the two protruding pieces. The fixing part of one fixing device is arranged at the first end of the support, the fixing part of the other fixing device is arranged at the second end of the support, and the fixing grooves of the two fixing devices are respectively used for bearing and fixing the two protruding parts.

The fixing parts of the two fixing devices are respectively arranged at the first end and the second end of the support, the two fixing devices are respectively arranged at the two ends of the support, the two protruding parts of the crystal support are respectively arranged between the two protruding parts on the fixing parts at the two ends of the support, the two protruding parts are fixedly supported by utilizing the fixing grooves formed between the protruding parts, the crystal support is fixedly supported on the two fixing devices, and the crystal support degumming tool can finish the fixation of the crystal support with the protruding parts at the two ends. The protruding portion that the fixed slot held in the palm the brilliant is fixed, has restricted the brilliant support and has held in the palm the motion along its width direction, has reduced the brilliant support and has hit the brilliant risk that holds in the palm the frock that comes unstuck of sticking, and then has reduced the brilliant and held in the palm the silicon chip that bonds and the risk that the frock that comes unstuck bumps and damage, has improved the yields of silicon chip.

Further, the fixing piece can be movably arranged at the first end or the second end, so that the protruding piece is abutted against the end part of the crystal support substrate, wherein the protruding part is arranged on the end part.

The portable setting of mounting is held at the first end or the second of support, thus, can remove the regulation mounting, thereby adjust the distance between two fixing device, can make brilliant both ends that hold in the palm the base plate fix between two fixing device, protruding piece supports with the brilliant tip that sets up the protruding portion of holding in the palm the base plate and leans on, make the protruding portion fix between two protruding pieces of same fixing device simultaneously, when the brilliant support of restriction is moving on its width direction, can also restrict brilliant support and be fixing along its ascending motion of length direction, further fix brilliant support, avoid brilliant support and brilliant support relative motion that takes place between the frock of coming unstuck, the brilliant risk of hitting brilliant support frock of coming unstuck is held in the palm in better reduction.

Further, the support includes two horizontal poles, and the extending direction of two horizontal poles is unanimous, and the extending direction of horizontal pole is perpendicular with the extending direction of mounting, and two ends of mounting are erect respectively in two horizontal poles.

The two ends of the fixing piece are erected on two cross rods with the same extending direction, the fixing piece is perpendicular to the cross rods, and the fixing piece can move along the extending direction of the cross rods. The fixed part is adjusted in a sliding mode, so that the protruding parts abut against the end part, provided with the protruding parts, of the crystal support base plate, the protruding parts are fixed between the two protruding parts, and the crystal support degumming tool is suitable for fixing crystal supports with different lengths.

Further, the mounting includes crossbeam and two ears, and two ears set up respectively in the both ends of crossbeam, form the depressed area on the ear, and the horizontal pole sets up and makes the ear erect in the horizontal pole in the depressed area.

The horizontal pole sets up in the depressed area, when conveniently removing the mounting, can also give the preliminary restriction of mounting, when its extending direction along the horizontal pole removes, is difficult for breaking away from the horizontal pole.

Further, the ears are provided with fasteners to secure the cross-bar between the ears and the fasteners.

When the fixing piece is moved to enable the protruding pieces to abut against the end part, provided with the protruding parts, of the crystal support substrate and the protruding parts are fixed between the two protruding pieces, the ear parts are fixed by using the fastening pieces, and the ear parts and the cross rod can be simply and effectively fixed in a movable mode.

Further, the fastener is spirally disposed on the ear portion, so that the cross bar is fixed between the ear portion and the fastener.

When the fixing piece needs to move, the fastening piece is screwed to enable the fastening piece to be far away from the cross rod; when the fixing piece and the cross rod are required to be fixed, the fastener is reversely rotated to enable the fastener to abut against the cross rod until the cross rod is fixed between the lug part and the fastener. By using the mode, the fixing piece can be simply and conveniently fixed in a movable mode.

Further, the fastener spiral sets up the side of the ear far away from the crossbeam. When the fastener is adjusted, the limitation of a protruding piece and a crystal support during operation is avoided, and the operation space is large.

Furthermore, the protruding piece is conical, and the sectional area of the protruding piece is gradually reduced along the direction far away from the fixing piece.

Generally speaking, the crystal support is placed on the crystal support degumming tool from top to bottom, and the cross section area of the protruding piece is gradually reduced along the direction far away from the fixing piece. When the protruding part of the crystal support is placed in the fixing groove formed between the two protruding parts from top to bottom, the opening of the fixing groove is gradually increased from bottom to top, so that the larger fault-tolerant rate can be given in the process of placing the protruding part, and the crystal support is more convenient to place.

The second aspect of the application still provides a system of coming unstuck, hold in the palm and brilliant the frock of coming unstuck including brilliant, brilliant holds in the palm and holds in the palm base plate and two protruding portions including brilliant, and two protruding portions are protruding respectively and are set up in the both ends that brilliant held in the palm the base plate, and two protruding portions can be dismantled respectively and bear the weight of and be fixed in two fixing device's fixed slot.

The protruding portion of brilliant support bears and is fixed in the fixed slot, makes brilliant support be fixed in brilliant support frock that comes unstuck, and brilliant support frock that comes unstuck form the system that comes unstuck, and in the in-process that carries out the processing that comes unstuck with this system to the device that comes unstuck, avoid brilliant support along its width direction motion, reduce the brilliant risk that holds in the palm and hit brilliant support frock that comes unstuck, and then reduce the risk that the system that comes unstuck damaged.

Further, the width of the two fixing grooves is consistent with the width of the two protruding parts respectively. The two protruding parts can be respectively clamped in the two fixing grooves, and the fixing grooves just limit the protruding parts, so that the protruding parts are more favorably and fixedly supported.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments are briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive efforts and also belong to the protection scope of the present application.

Fig. 1 is a schematic structural diagram of a wafer holder provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a wafer support degumming tool provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a fixing device according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a degumming system provided in an embodiment of the present application.

Icon: 100-crystal support; 110-a crystal support substrate; 120-a protrusion; 200-crystal support degumming tooling; 210-a tool body; 211-a cross bar; 220-a fixture; 221-a fixing piece; 222-a projection; 223-fixed groove; 224-a cross beam; 225-ear; 226-a recessed region; 227-a fastener; 300-a degumming system; 400-silicon wafer.

Detailed Description

At present, the silicon rod is generally processed into a silicon wafer by wire cutting, before cutting, the silicon rod needs to be adhered to one side of a resin plate or a glass plate through a special adhesive, and then the other side of the resin plate or the glass plate is adhered to a crystal support through the same adhesive, so that an integrated structure of the silicon rod, the resin plate or the glass plate and the crystal support is formed. And then the integrated structure is sent into a cutting device to cut the crystal bar to form a silicon wafer. After the cutting is finished, the silicon wafer and the resin plate or the glass plate, the resin plate or the glass plate and the crystal support are needed to be degummed so as to separate the silicon wafer from the resin plate or the glass plate, the resin plate or the glass plate and the crystal support.

Before the degumming process, the silicon rod, the resin plate or the glass plate and the crystal support are required to be fixed on the degumming device, and the degumming device fixed with the integrated structure is sent into the degumming device for degumming.

Next, the fixing process of the integrated structure and the degumming tool will be described in detail.

Fig. 1 is a schematic structural diagram of a wafer support provided in an embodiment of the present application. Referring to fig. 1, the wafer holder 100 is a symmetrical part, and includes a wafer holder substrate 110 and two protrusions 120, and a cut silicon wafer 400 (not shown) is bonded to the wafer holder substrate 110 through a resin plate or a glass plate. The two protrusions 120 are respectively protruded from two ends of the substrate 110, and the width of the two protrusions 120 is smaller than the width of the substrate 110, so that a right-angle surface or an included angle surface is formed between the substrate 110 and the protrusions 120.

Based on the wafer holder 100 with the protruding portions 120 at the two ends of the wafer holder substrate 110, the inventor designs a wafer holder degumming tool 200, which can not only bear and fix the wafer holder 100, but also limit the movement of the wafer holder 100.

Fig. 2 is a schematic structural diagram of a wafer support degumming tool provided in an embodiment of the present application, and fig. 3 is a schematic structural diagram of a fixing device provided in the embodiment of the present application. Referring to fig. 1-3, an embodiment of the present disclosure provides a wafer carrier de-bonding tool 200 for carrying and fixing the wafer carrier 100 shown in fig. 1.

The wafer support degumming tool 200 comprises a tool body 210 and two fixing devices 220, wherein in the embodiment, the tool body 210 is of a frame structure and is formed with a containing groove capable of containing the silicon wafer 400. The tool body 210 includes a bracket having a first end and a second end. The fixing device 220 includes a fixing member 221 and two protrusion members 222 spaced apart from the fixing member 221, and a fixing groove 223 is formed between the two protrusion members 222.

Before the wafer support 100 and the wafer support degumming tool 200 are carried and fixed, the fixing members 221 of the two fixing devices 220 are respectively erected on the bracket of the tool body 210 and respectively moved to the first end and the second end of the bracket, the distance between the two fixing members 221 is consistent with the length of the wafer support substrate 110, the positions of the two fixing grooves 223 correspond to the two protruding parts 120, then the fixing members 221 are fixed on the bracket, and the fixing grooves 223 of the two fixing devices 220 are respectively used for carrying and fixing the two protruding parts 120.

In this embodiment, the wafer holder 100 is a symmetrical member, and the protrusions 120 at the two ends are correspondingly disposed, so the two fixing devices 220 have the same structure.

However, in other embodiments, if the wafer holder 100 is an asymmetrical piece, the two fixing devices 220 may have different structures if the protrusions 120 at the two ends are not correspondingly disposed. At this time, the positions of the protruding parts 222 on the fixing devices 220 need to be adjusted accordingly, so that the two protruding parts 120 can fall between the two protruding parts 222 of each fixing device 220.

The fixing part 221 of one fixing device 220 is movably arranged at the first end of the bracket, the fixing part 221 of the other fixing device 220 is movably arranged at the second end of the bracket, the two fixing devices 220 are respectively arranged at the first end and the second end of the bracket, and the two fixing devices 220 are connected with the bracket in the same way and are only arranged at different positions of the bracket.

Therefore, the connection and fixation between one of the fixation devices 220 and the first end of the bracket will be described in detail below.

The support comprises two cross bars 211, and the extending directions of the two cross bars 211 are consistent.

The fixing member 221 is configured to include a cross beam 224 and two ears 225, the two ears 225 are respectively disposed at two ends of the cross beam 224, a recessed area 226 is formed on the ears 225, and a fastening member 227 is spirally disposed on the ears 225, in this embodiment, the fastening member 227 is a screw. The two cross bars 211 are respectively disposed in the two recessed areas 226, the ear portions 225 are erected on the cross bars 211, and then the two ends of the fixing member 221 are respectively movably erected on the two cross bars 211, and the extending direction of the cross bars 211 is perpendicular to the extending direction of the fixing member 221.

When the fixing element 221 needs to be moved, the fastening element 227 is rotated to make the fastening element 227 far away from the cross bar 211, i.e. the ear 225 can be moved along the extending direction of the cross bar 211, and the recessed area 226 makes the fixing element 221 not easily separated from the cross bar 211 when the fixing element 221 is moved along the extending direction of the cross beam 224. When the distance between the two fixing parts 221 is equal to the length of the wafer support substrate 110, the fastening parts 227 are rotated reversely to make the fastening parts 227 abut against the cross bars 211 to fix the ears 225 and the cross bars 211, and the cross bars 211 are fixed between the ears 225 and the fastening parts 227. This completes the movement and fixation between a fixing device 220 and the bracket.

In other embodiments, the fixing element 221 may also be a fastening element, which may be disposed on one side of the ear 225, and when the ear 225 needs to be fixed to the cross bar 211, the fastening element may be fastened to the cross bar 211 to fix the ear 225 to the cross bar 211.

Referring to fig. 1-3, after the fixing between the fixing device 220 and the support is completed, the two protrusions 120 of the wafer holder 100 are respectively placed between the two fixing devices 220 from top to bottom, so that the protrusions 120 at the two ends of the wafer holder 100 respectively fall into the two fixing grooves 223, and the silicon wafer 400 falls into the accommodating groove of the tool body 210. Two protruding pieces 222 of one fixing device 220 are respectively located in two abutting areas on the same side of the crystal support substrate 110, the protruding pieces 222 abut against the end part of the crystal support substrate 110 where the protruding parts 120 are arranged, and the fixing grooves 223 of the two fixing devices 220 respectively bear and fix the two protruding parts 120, so that the crystal support 100, the resin plate or the glass plate and the silicon wafer 400 are fixed with the crystal support degumming tool 200, and then the crystal support degumming tool 200 is sent into a degumming device to perform degumming operation on the silicon wafer 400 and the resin plate or the glass plate, the resin plate or the glass plate and the crystal support 100.

The two protrusions 120 are supported and fixed by the fixing grooves 223 formed between the protruding members 222, and then the wafer support 100 is supported and fixed on the two fixing devices 220, so that the wafer support degumming tool 200 can complete the supporting and fixing of the wafer support 100 with the protrusions 120 at the two ends. The protruding portion 120 of the crystal support 100 is fixed by the fixing groove 223, and the protruding part 222 abuts against the end portion, provided with the protruding portion 120, of the crystal support substrate 110, so that the movement of the crystal support 100 in the width direction of the crystal support is limited, the movement of the crystal support 100 in the length direction of the crystal support can be limited, the risk that the crystal support 100 collides with the crystal support degumming tool 200 is reduced, the risk that the silicon wafer 400 bonded on the crystal support 100 collides with the degumming tool to be damaged is reduced, and the yield of the silicon wafer 400 is improved.

The extending direction of the fixing members 221 is perpendicular to the extending direction of the cross bar 211, and the fixing members 221 are movable, so that the fixing members 221 can move along the extending direction of the cross bar 211, the distance between the two fixing members 221 can be adjusted according to the length of the wafer support substrate 110, and the wafer support degumming tool 200 can be suitable for fixing wafer supports 100 with different lengths.

In other embodiments, the extending direction of the cross bar 211 may be the same as the extending direction of the fixing element 221, in this case, the ear 225 of one fixing element 221 is mounted at both ends of the same cross bar 211, the ear 225 is moved, and the fixing element 221 moves along the extending direction of the cross bar 211, which is suitable for the case that the wafer holder 100 is an asymmetric piece, and the protruding portions 120 at both ends are not correspondingly disposed.

With continued reference to fig. 1-3, in order to facilitate adjustment of the fastening member 227 and avoid the limitation of the protrusion 222 during operation of the fastening member 227, the fastening member 227 is disposed spirally on a side of the ear portion 225 away from the cross beam 224.

In order to more conveniently place the protrusion 120 of the wafer holder 100, the protrusion 222 is tapered, and the cross-sectional area of the protrusion 222 is gradually reduced in a direction away from the fixing member 221. When the protrusion 120 of the wafer holder 100 is placed in the fixing groove 223 formed between the two protrusions 222 from top to bottom, the opening of the fixing groove 223 gradually increases from bottom to top, which can give a large fault tolerance to the protrusion 120 during the placement process.

In other embodiments, the protrusion 222 may be configured as a cylinder or a square cylinder.

Fig. 4 is a degumming system 300 according to an embodiment of the present disclosure, which includes a wafer holder 100 and a wafer holder degumming tool 200 according to an embodiment of the present disclosure. The wafer support 100 includes a wafer support substrate 110 and two protruding portions 120, wherein a cut silicon wafer 400 is bonded to one side of the wafer support substrate 110, and the two protruding portions 120 are respectively disposed at two ends of the wafer support substrate 110 in a protruding manner. Firstly, two fixing pieces 221 are erected on two cross rods 211 and fixed with a first end and a second end respectively according to the method, then the crystal support 100 is placed into the degumming tool from top to bottom, the two protruding parts 120 are detachably supported and fixed in the fixing grooves 223 of the two fixing devices 220 respectively, the widths of the two fixing grooves 223 are respectively consistent with the widths of the two protruding parts 120, the two protruding parts 120 are just clamped in the two fixing grooves 223 respectively, so that the crystal support 100 is better fixed on the crystal support degumming tool 200, and the silicon wafer 400 falls into the accommodating groove of the tool body 210 to form the degumming system 300. And then the degumming system 300 is sent into a degumming device for degumming treatment.

In the process of conveying the system to a degumming device for degumming, the probability of relative movement of the crystal support 100 relative to the crystal support degumming tool 200 is reduced, the crystal support 100 is prevented from colliding with the crystal support degumming tool 200, the risk of damage to the crystal support 100 and the crystal support degumming tool 200 is reduced, the risk of damage to the degumming system 300 is further reduced, the silicon wafer 400 bonded on the crystal support 100 can be prevented from colliding with the degumming tool and being damaged, and the yield of the silicon wafer 400 is improved.

One or/and combination of a plurality of technical schemes in the embodiment of the application has the following beneficial effects:

(1) the two fixing devices 220 are respectively arranged at two ends of the bracket, the two protruding parts 120 of the crystal support 100 are supported and fixed by using the fixing grooves 223 formed between the protruding parts 222, the crystal support 100 is supported and fixed on the two fixing devices 220, and the crystal support degumming tool 200 can complete the supporting and fixing of the crystal support 100 with the protruding parts 120 arranged at two ends; the fixing groove 223 fixes the protruding part 120 of the crystal support 100, so that the movement of the crystal support 100 in the width direction of the crystal support is limited, the risk that the crystal support 100 collides with the crystal support degumming tool 200 is reduced, the risk that the silicon wafer 400 bonded on the crystal support 100 collides with the degumming tool to be damaged is reduced, and the yield of the silicon wafer 400 is improved;

(2) the two ends of the fixing piece 221 are movably erected on the cross bar 211 and are perpendicular to each other, the fixing piece 221 can move along the extending direction of the cross bar 211, the protruding pieces 222 are abutted to the end parts, provided with the protruding parts 120, of the crystal support substrate 110 by moving the adjusting fixing piece 221, the protruding parts 120 are fixed between the two protruding pieces 222, the movement of the crystal support 100 along the width direction of the crystal support 100 is limited, meanwhile, the movement of the crystal support 100 along the length direction of the crystal support 100 is limited, and the crystal support 100 is further fixed; the crystal support degumming tool 200 can be suitable for fixing crystal supports 100 with different lengths;

(3) the ear parts 225 of the fixing piece 221 are provided with the recessed areas 226, the cross bar 211 is arranged in the recessed areas 226, the fixing piece 221 can be conveniently moved, initial limitation can be given to the fixing piece 221, and the fixing piece is not easy to separate from the cross bar 211 when moving along the extending direction of the cross bar 211;

(4) the fastening piece 227 is spirally arranged on the ear part 225, so that the ear part 225 and the cross bar 211 can be loosened and fixed by rotating the fastening piece 227, and the movable fixation between the fixing piece 221 and the cross bar 211 can be simply and effectively realized;

(5) fasteners 227 are helically disposed on the side of ears 225 away from cross-beam 224. When the fastener 227 is adjusted, the limitation of the bulge piece 222 and the crystal support 100 during operation is avoided, and the operation space is large;

(6) the protruding part 222 is set to be conical, the sectional area of the protruding part 222 is gradually reduced along the direction far away from the fixing part 221, when the protruding part 120 of the crystal support 100 is placed in the fixing groove 223 formed between the two protruding parts 222 from top to bottom, the opening of the fixing groove 223 is gradually increased from bottom to top, a large fault tolerance rate can be given to the protruding part 120 in the placing process, and the placing is more convenient.

The above description is only a few examples of the present application and is not intended to limit the present application, and various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A crystal support degumming tool is used for bearing and fixing a crystal support, the crystal support comprises a crystal support substrate and two protruding parts, and the two protruding parts are respectively arranged at two ends of the crystal support substrate in a protruding mode;

the tool body comprises a support, and the support is provided with a first end and a second end;

each fixing device comprises a fixing piece and two protruding pieces arranged on the fixing piece at intervals, and a fixing groove is formed between the two protruding pieces; the fixing piece of one fixing device is arranged at the first end of the bracket, the fixing piece of the other fixing device is arranged at the second end of the bracket, and the fixing grooves of the two fixing devices are respectively used for bearing and fixing the two protruding parts.

2. The wafer support degumming tool according to claim 1, wherein the fixing member is movably arranged at the first end or the second end, so that the protruding member abuts against the end part of the wafer support substrate where the protruding part is arranged.

3. The crystal support degumming tool according to claim 2, wherein the support comprises two cross rods, the extending directions of the two cross rods are consistent, the extending directions of the cross rods are perpendicular to the extending direction of the fixing piece, and two ends of the fixing piece are respectively erected on the two cross rods.

4. The crystal support degumming tool according to claim 3, wherein the fixing member comprises a cross beam and two ears, the two ears are respectively arranged at two ends of the cross beam, recessed areas are formed on the ears, and the cross rod is arranged in the recessed areas to enable the ears to be erected on the cross rod.

5. The crystal support degumming tool according to claim 4, wherein the ears are provided with fasteners to fix the cross bar between the fasteners and the ears.

6. The crystal support degumming tool according to claim 5, wherein the fasteners are spirally arranged on the ears, so that the cross rod is fixed between the ears and the fasteners.

7. The wafer support degumming tool according to claim 6, wherein the fasteners are spirally arranged on one side of the ear part far away from the cross beam.

8. The wafer support degumming tool according to claim 1, wherein the protrusion is conical, and the cross-sectional area of the protrusion is gradually reduced along the direction away from the fixing member.

9. A degumming system is characterized by comprising a crystal support and the crystal support degumming tool according to any one of claims 1 to 8, wherein the crystal support comprises a crystal support substrate and two protruding parts, the two protruding parts are respectively arranged at two ends of the crystal support substrate in a protruding mode, and the two protruding parts are respectively detachably supported and fixed in the fixing grooves of the two fixing devices.

10. The degumming system according to claim 9, wherein the width of the two fixation grooves corresponds to the width of the two protrusions, respectively.

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