CN216323610U - clean body structure - Google Patents

Abstract

A cleaning body structure comprises a carrier and a cleaning unit, wherein the cleaning unit is formed by positioning and arranging a plurality of cleaning beans on the surface of the carrier respectively, the cleaning beans are trapezoidal columnar bodies and are provided with a first end surface parallel to the surface of the carrier and two inclined planes facing the circumferential direction of the carrier and spaced between the two cleaning beans, the distance between the first end surface of each cleaning bean and the surface of the carrier is 6.5mm +/-10%, the included angle between the inclined planes at two sides is 50 +/-10%, when the cleaning beans initially contact a wafer, the inclined planes at one sides are firstly in deformation contact, so that the cleaning beans and the wafer are initially contacted and leave the wafer to form an area change trend, the wafer is stressed stably, and the cleaning capability of brushing and the stability of the friction force of the surface of the wafer are improved.

Description

Clean body structure

technical field

The utility model relates to a cleaning body structure, in particular to a cleaning body structure that can provide less and stable area variation compared to the surface contacting wafer with a plane contacting the wafer, especially a cleaning body structure that can enhance brushing Cleaner structure with cleaning power and more stable wafer surface friction.

Background technique

Most of the semiconductor cleaning sponges sold in the market are cylindrical cleaning beans, as shown in Figure 14. The single cleaning bean of this traditional sponge brush does not use the frontal area to brush the contact wafer, but firstly starts to deform and contact the side of the cleaning bean. Press 1 mm (mm) below as an example. The frontal area of the cleaning bean does not pass through the wafer until approximately beyond the center of rotation (23 degrees), as shown in Figure 15 and Figure 15a.

As shown in Fig. 16 and Fig. 16a, microscopic analysis of the area change of a single cylindrical cleaning bean from the initial contact of 0.1 degrees to the wafer before passing through the top can be seen. Because of the change of torque, the change of torque is steep and unstable, and scratches are more likely to be caused when the wafer is washed, which makes the cleaning ability poor.

In view of the current cylindrical cleaning beans on the market, the initial contact with the wafer is cleaned by arc surface contact. , which makes the wafer stress unstable, thereby reducing the cleaning ability of the brush and the stability of the friction force on the wafer surface. Therefore, it generally cannot meet the needs of users in actual use.

Utility model content

The main purpose of the present invention is to overcome the above-mentioned problems encountered in the prior art and provide a cleaning body structure, which contacts the wafer with a flat surface, which can provide a smaller and more stable area compared to the traditional curved surface contacting the wafer. The amount of change, in turn, enhances the cleaning power of the brush and more stable friction on the wafer surface.

In order to achieve the above purpose, the technical scheme adopted by the present utility model is: a cleaning body structure, which includes a carrier and a cleaning unit, the carrier is in the shape of a circular tube, and has a socket at the center, and the socket is connected with the cleaning unit. The actuating mechanism is assembled; it is characterized in that, the cleaning unit consists of several cleaning beans positioned and arranged on the surface of the carrier respectively, and the cleaning beans are trapezoidal cylindrical bodies with a first end face parallel to the surface of the carrier , and two inclined planes facing the circumferential direction of the carrier and spaced between two cleaning beans, the distance between the first end face of the cleaning beans and the surface of the carrier is 6.5mm±10%, and the distance between the inclined planes on both sides is 6.5mm±10%. The included angle is 50°±10%. When each of the cleaning beans initially contacts the wafer, the inclined plane on one side begins to deform and contact, so that the cleaning beans and the wafer initially contact with the wafer and leave the wafer with a gentle curve. The changing trend of the area can stabilize the force of the wafer, so as to improve the cleaning ability of brushing and the stability of the friction force on the surface of the wafer.

In the above-mentioned embodiments of the present invention, the cleaning beans are isosceles trapezoid cylinders.

In the above-mentioned embodiment of the present invention, the first end surface of the cleaning bean has a concave arc portion with a concave center, and the curvature of the concave arc portion is between 70% and 99%.

In the above-mentioned embodiments of the present invention, there is a gap between the cleaning beans.

In the above-mentioned embodiments of the present invention, the gaps between the two cleaning beans are any one of equal spacing or unequal spacing, or a combination thereof.

In the above embodiments of the present invention, the cleaning beans are arranged in a honeycomb, equidistant, spiral or bidirectional spiral arrangement.

In the above-mentioned embodiments of the present invention, the carrier and the cleaning unit are integrally formed with a soft foam.

In the above-mentioned embodiments of the present invention, the central extension axis of the cleaning bean and the connection line from the center of the carrier to the wafer form a rotational angle. Press 1 mm, when the carrier drives the cleaning unit to contact and rotate beyond the rotation angle, the cleaning bean will pass through the wafer with the first end surface area.

In the above-mentioned embodiment of the present invention, the outer shape of the first end surface of the cleaning bean is a rectangle with four squares and rounded corners.

In the above-mentioned embodiment of the present invention, the cleaning bean further has a second end surface connected to the surface of the carrier, and the distance from the center point of the second end surface to one side of the inclined plane is 4mm±10%.

Description of drawings

FIG. 1 is a schematic side view of the structure of an embodiment of the present invention.

2 is a schematic structural diagram of a trapezoidal columnar cleaning bean according to an embodiment of the present invention.

3 is a schematic diagram of the structural analysis of the cleaning bean of the present invention.

4 is a schematic diagram of the change in the area of a single trapezoidal columnar cleaning bean of the microscopic analysis cleaning body of the present invention from the initial contact with the wafer to the time it leaves the wafer.

FIG. 4a is a partial enlarged view of FIG. 4 .

FIG. 5 is a schematic diagram of the microscopic analysis of the area change of a single trapezoidal columnar cleaning bean and a wafer from an initial contact of 0.1 degrees to before passing through the first end of the present invention.

FIG. 5a is a graph of the area shown in FIG. 5 as a function of contact angle.

FIG. 6 is a schematic diagram of the area change of the contact angle between the present invention and the conventional single cleaning bean and the wafer.

FIG. 7 is a schematic diagram comparing the contact area and the contact angle between the utility model and the conventional cleaning beans.

FIG. 8 is a schematic diagram 2 comparing the contact area and the contact angle between the utility model and the traditional cleaning beans.

9 is a schematic diagram 3 comparing the increase of the contact area and the contact angle between the utility model and the traditional cleaning beans.

FIG. 10 is a schematic diagram 4 comparing the contact area and the contact angle between the utility model and the traditional cleaning beans.

Fig. 11 is a schematic diagram 5 comparing the contact area and the contact angle between the utility model and the conventional cleaning beans.

FIG. 12 is a schematic diagram 6 comparing the increase of the contact area and the contact angle between the utility model and the traditional cleaning beans.

FIG. 13 is a seventh schematic diagram comparing the increase of the contact area and the contact angle between the utility model and the traditional cleaning beans.

Figure 14 is a schematic diagram of the structure of a known cylindrical cleaning bean.

FIG. 15 is a schematic diagram showing the change of the area from the initial contact with the wafer to the area of leaving the wafer, known from the microscopic analysis.

FIG. 15a is a partial enlarged view of FIG. 15 .

Fig. 16 is a schematic diagram showing the area change of a single cylindrical cleaning bean and the wafer from the initial contact of 0.1 degrees before passing through the top of the wafer known by microscopic analysis.

FIG. 16a is a graph of the area shown in FIG. 16 as a function of contact angle.

Label comparison:

Cleaner Structure 100

carrier 10

Socket 11

cleaning unit 20

Clean Beans 21

first end face 211

second end face 212

Inclined plane 213

Wafer 30

Center extension axis A

Connection B.

Detailed ways

Please refer to FIG. 1 to FIG. 13, as shown in the figures: the present invention is a cleaning body structure 100, which includes a carrier 10 and a cleaning unit 20, and the carrier 10 and the cleaning unit 20 can be as required. It is made of different soft foams such as composite materials, sponges, polyurethane (PU), polyvinyl alcohol (PVA) or polymer materials.

The above-mentioned carrier 10 is cylindrical, and has a socket portion 11 at the center thereof, and the socket portion 11 is assembled with an actuating mechanism (not shown in the figure).

The cleaning unit 20 is arranged on the outer edge of the carrier 10 , and consists of several cleaning beans 21 positioned and arranged on the surface of the carrier 10 respectively. The cleaning beans 21 are trapezoidal cylinders (eg, isosceles trapezoidal cylinders, as shown in FIG. 2 ), and each has a first end face 211 parallel to the surface of the carrier 10 , and a second end face 211 connected to the surface of the carrier 10 . The end surface 212 and the two inclined planes 213 facing the circumferential direction of the carrier 10 and spaced between the two cleaning beans 21 . The outer shape of the first end surface 211 of the cleaning bean 21 is a rectangle with square rounded corners, the distance between it and the surface of the carrier 10 is 6.5 mm, and the distance from the center point of the second end surface 212 to the inclined plane 213 on one side is 4 mm. mm, and the included angle between the inclined planes 213 on both sides is 50°, as shown in FIG. 3 . In this case, a brand-new cleaning body structure 100 is formed by the device disclosed above.

In one embodiment, the first end surfaces 211 of the cleaning beans 21 respectively have a concave arc portion (not shown in the figure) with a concave center, and the curvature of the concave arc portion is between 70% and 99%.

In one embodiment, there is a gap between the cleaning beans 21, and the gap can be any one of equal spacing, unequal spacing, or a combination thereof, so that the cleaning beans 21 can be honeycomb, equidistant, A helical or bidirectional helical arrangement is arranged on the surface of the carrier 10 .

When in use, one or more carriers 10 can be assembled using their socket parts 11 and related actuating mechanisms (not shown in the figure), so that the actuating mechanisms can drive the carriers 10 in a rolling manner and clean as required The state and position movement actuation mechanism makes the cleaning beans 21 of the cleaning unit 20 on the outer edge of the carrier 10 contact the surface of the relevant precision electronic components to perform the required cleaning. In a preferred embodiment, during the horizontal cleaning movement, it is assumed that the precision electronic components (such as the wafer 30 ) rotate clockwise or counterclockwise in the original position, and the cylindrical carrier 10 with the cleaning unit 2 also rotates. It rotates, clockwise as shown in FIG. 4 , when each cleaning bean 21 initially contacts the wafer 30 , each cleaning bean 21 must not use the area of the first end face 211 when brushing and contacting the wafer 30 . To brush, firstly, the inclined plane 213 on one side starts to deform and contact, and the lower pressure is 1 mm as an example. When the carrier 10 drives the cleaning unit 20 to contact and rotate to more than one rotation angle, that is, when it exceeds the center of each cleaning bean 21 When the included angle between the extension axis A and the connecting line B from the center of the carrier 10 to the wafer 30 is 17.64 degrees, the area of the first end face 211 of each cleaning bean 21 will pass through the wafer 30 . As shown in FIG. 5 , each cleaning bean 21 and the wafer 30 have a gentle area change trend when they initially contact the wafer 30 to leave the wafer 30 , so that the force on the wafer 30 is stable, so as to improve the cleaning ability of brushing and the friction force on the surface of the wafer 30 of stability.

Comparing the traditional cylindrical cleaning beans with the trapezoidal cylindrical cleaning beans proposed in this work, as shown in Figure 6, the figure shows the area changes of 30 operating angles. See the dashed line on the white background), and after the middle section, the trapezoidal columnar clean beans mentioned in this creation tend to slow down (see the solid line on the black background). It can be seen that, compared with the traditional cylindrical cleaning beans, the cleaning beans with the trapezoidal column structure proposed in this work have a slower change in area from contact to separation, while the cylindrical cleaning beans are steeper, and the change trend in terms of torque Slow and stable, it is less likely to cause scratches when washing the wafer, and provides better cleaning ability.

Based on the above, in view of the larger the angle between the inclined planes on both sides of the cleaning beans, the smoother the torque response will be. Therefore, this creation can be made with 16 rows of common cleaning beans in the market to a maximum of about 50 degrees.

This creation also makes a series of comparisons between the traditional cylindrical cleaning beans and the trapezoidal cylindrical cleaning beans proposed in this creation, as shown in Figure 7-Figure 13. Among them, when comparing the traditional cylindrical cleaning beans and the trapezoidal cylindrical cleaning beans proposed in this work with the same length (the length of the trapezoidal cylindrical cleaning beans and the diameter of the cylindrical cleaning beans), the total area change of the trapezoidal cylindrical cleaning beans is smaller than that of the cylindrical cleaning beans. Cleaning beans can provide a relatively stable brush speed change (or torque change), as shown in Figure 12. In addition, in terms of the variation of the area difference of each angle, the maximum variation of the trapezoidal cylindrical cleaning beans proposed in this creation is significantly smaller than that of the traditional cylindrical cleaning beans, so it can provide a relatively stable brushing speed change (or torque change), As shown in Figure 9.

Therefore, the technical feature of the cleaning body structure proposed in this creation is that the initial contact is cleaned by surface contact, and the advantage is that the change in the area of the cleaning bean from contacting to leaving the wafer is relatively gentle, and the force on the wafer is relatively stable. According to the above experimental data, it can be proved that compared with the traditional surface contact wafer, the flat contact wafer can provide less and stable area change, thereby enhancing the cleaning ability of brushing and more stable wafer surface friction .

In conclusion, the cleaning body structure of the present invention can effectively improve various shortcomings of the prior art, and the planar contact wafer can provide less and stable area variation than the curved contact wafer, thereby enhancing the cleaning ability of brushing. With a more stable frictional force on the wafer surface, the utility model can be more advanced, more practical, and more in line with the needs of users. It has indeed met the requirements for a new patent application, and a patent application is filed in accordance with the law.

But the above are only the preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention; therefore, any simple equivalent changes made according to the patent scope of the invention and the contents of the description of the new model and the Modifications should still fall within the scope of this creative patent.

Claims (10)

1. A cleaning body structure, comprising a carrier and a cleaning unit, the carrier is in the shape of a circular tube, and has a socket portion at the center, and the socket portion is assembled with an actuating mechanism; it is characterized in that, the cleaning unit is A plurality of cleaning beans are respectively positioned and arranged on the surface of the carrier. These cleaning beans are trapezoidal columnar bodies with a first end face parallel to the surface of the carrier, and two facing the circumferential direction of the carrier and spaced between the two cleaning beans. The distance between the first end face of the cleaning beans and the surface of the carrier is 6.5mm±10%, and the angle between the inclined planes on both sides is 50°±10%. When the cleaning beans initially contact When the wafer is in contact with one side of the inclined plane, deformation and contact are made first, so that each cleaning bean and the wafer have a gentle area change trend when they initially contact the wafer and leave the wafer, so that the force of the wafer is stable. 2 . The cleaning body structure according to claim 1 , wherein the cleaning beans are isosceles trapezoid cylindrical bodies. 3 . 3 . The cleaning body structure according to claim 1 , wherein the first end surface of the cleaning bean has a concave arc portion with a concave center, and the curvature of the concave arc portion is between 70% and 99%. 4 . between. 4 . The cleaning body structure according to claim 1 , wherein there is a gap between the two cleaning beans. 5 . 5 . The cleaning body structure according to claim 4 , wherein the gap between the two cleaning beans is any one of equal spacing or unequal spacing or a combination thereof. 6 . 6 . The cleaning body structure according to claim 1 , wherein the cleaning beans are arranged in a honeycomb, equidistant, spiral or bidirectional spiral arrangement. 7 . 7 . The cleaning body structure according to claim 1 , wherein the carrier and the cleaning unit are integrally formed with soft foam. 8 . 8 . The cleaning body structure of claim 1 , wherein the central extension axis of the cleaning bean and the connection line from the center of the carrier to the wafer form a rotational angle, and when the cleaning bean is inclined from one side to the plane Deformation contact is started. Assuming a downward pressure of 1 mm, when the carrier drives the cleaning unit to contact and rotate beyond the rotation angle, the cleaning bean will pass through the wafer with the first end surface area. 9 . The cleaning body structure according to claim 1 , wherein the peripheral shape of the first end face of the cleaning bean is a rectangle with square rounded corners. 10 . 10 . The cleaning body structure of claim 1 , wherein the cleaning bean further has a second end surface connected to the surface of the carrier, and the distance from the center point of the second end surface to the inclined plane on one side is 4 mm. 11 . ±10%.

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