CN216323610U

CN216323610U - Cleaning body structure

Info

Publication number: CN216323610U
Application number: CN202122925926.XU
Authority: CN
Inventors: 顾致安; 庄子彦; 赵宏杰; 张富强; 蔡明瑾
Original assignee: TUNG AN DEVELOPMENT Ltd
Current assignee: TUNG AN DEVELOPMENT Ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-04-19
Anticipated expiration: 2031-11-26

Abstract

A cleaning body structure comprises a carrier and a cleaning unit, wherein the cleaning unit is formed by positioning and arranging a plurality of cleaning beans on the surface of the carrier respectively, the cleaning beans are trapezoidal columnar bodies and are provided with a first end surface parallel to the surface of the carrier and two inclined planes facing the circumferential direction of the carrier and spaced between the two cleaning beans, the distance between the first end surface of each cleaning bean and the surface of the carrier is 6.5mm +/-10%, the included angle between the inclined planes at two sides is 50 +/-10%, when the cleaning beans initially contact a wafer, the inclined planes at one sides are firstly in deformation contact, so that the cleaning beans and the wafer are initially contacted and leave the wafer to form an area change trend, the wafer is stressed stably, and the cleaning capability of brushing and the stability of the friction force of the surface of the wafer are improved.

Description

Cleaning body structure

Technical Field

The present invention relates to a cleaning body structure, and more particularly, to a cleaning body structure capable of providing less and stable area variation when a wafer is in planar contact as compared with a wafer in curved contact, and more particularly, to a cleaning body structure capable of enhancing the cleaning ability of brushing and cleaning and more stable friction force on the surface of a wafer.

Background

Most of the commercially available semiconductor cleaning sponges are cylindrical cleaning beans, as shown in fig. 14. In the conventional sponge brush, the cleaning beans are not brushed by the front surface area during brushing, but the cleaning beans are deformed from the side edge to contact with the wafer, for example, by pressing down 1 millimeter (mm), the front surface area of the cleaning beans passing through the wafer when the contact reaches about 23 degrees beyond the rotation center point (fig. 15 and 15 a).

As shown in fig. 16 and 16a, when the area of the single cylindrical cleaning beam is microscopically analyzed from 0.1 degree in initial contact with the wafer to the front of the top surface, the area of the cylindrical cleaning beam from contact to separation is changed steeply, and since the area change is also a moment change, the change is steep from the moment to be unstable, and the wafer is easily scratched when being scrubbed, so that the cleaning capability is poor.

In view of the fact that the cylindrical cleaning beans on the market are all in contact with the wafer in an arc surface for cleaning, the cylindrical cleaning beans have the defects that the variation of the area from the contact to the separation of the cleaning beans from the wafer is steep, more area variation is generated, the stress on the wafer is unstable, and the cleaning capability of brushing and the stability of the friction force on the surface of the wafer are further reduced. Therefore, it is generally not suitable for the actual use of the user.

SUMMERY OF THE UTILITY MODEL

It is therefore an object of the present invention to overcome the above-mentioned problems encountered in the prior art and to provide a cleaning body structure, which contacts a wafer in a plane, and provides less and stable area variation compared to the conventional curved contact wafer, thereby enhancing the cleaning ability of the brush and the more stable surface friction of the wafer.

In order to achieve the above purposes, the utility model adopts the technical scheme that: a cleaning body structure comprises a carrier and a cleaning unit, wherein the carrier is in a round tube shape, and the center of the carrier is provided with a sleeving part which is assembled with an actuating mechanism; the cleaning unit is characterized in that a plurality of cleaning beans are respectively positioned and arranged on the surface of the carrier, the cleaning beans are trapezoidal columns and are provided with a first end face parallel to the surface of the carrier and two inclined planes which face the circumferential direction of the carrier and are spaced between the two cleaning beans, the distance between the first end face of each cleaning bean and the surface of the carrier is 6.5mm +/-10%, the included angle between the inclined planes on the two sides is 50 +/-10%, when each cleaning bean initially contacts a wafer, the inclined planes on one sides are firstly in deformation contact, so that the cleaning beans initially contact with the wafer and leave the wafer to form a gentle area change trend, the wafer is stably stressed, and the cleaning capacity of brushing and the stability of the friction force of the surface of the wafer are improved.

In the above embodiments of the present invention, the cleaning bean is an isosceles trapezoid cylinder.

In the above embodiment of the present invention, the first end surface of the cleaning bean has a concave arc portion with a concave center, and the curvature of the concave arc portion is between 70% and 99%.

In the above embodiments of the present invention, a gap is formed between every two of the cleaning beans.

In the above embodiments, the gap between every two cleaning beans is any one of equal spacing or unequal spacing or a combination thereof.

In the above embodiments of the present invention, the cleaning beans are arranged in a honeycomb type, an equidistant type, a spiral type or a bidirectional spiral type.

In the above embodiments of the present invention, the carrier and the cleaning unit are integrally formed by foaming soft foam.

In the above embodiment of the present invention, a rotation included angle is formed between the central extending axis of the cleaning bean and a connecting line from the center of the carrier to the wafer, when the cleaning bean starts to deform and contact from an inclined plane at one side, and if the cleaning unit is driven by the carrier to contact and rotate to exceed the rotation included angle by pressing down 1 mm, the cleaning bean will pass through the wafer by the area of the first end surface.

In the above embodiments of the present invention, the peripheral shape of the first end surface of the cleaning bean is a square, rounded and rectangular shape.

In the above embodiments, the cleaning bean further has a second end surface connected to the surface of the carrier, and the distance from the center point of the second end surface to the inclined plane is 4mm ± 10%.

Drawings

Fig. 1 is a schematic side view of an embodiment of the present invention.

Fig. 2 is a schematic structural view of a trapezoidal column-shaped cleaning bean according to an embodiment of the utility model.

FIG. 3 is a schematic view of the structural analysis of the cleaning beans of the present invention.

FIG. 4 is a schematic view of the initial contact of a single trapezoidal pillar shaped cleaning beam with a wafer to the change in the area away from the wafer for a microanalysis cleaning body in accordance with the present invention.

Fig. 4a is an enlarged view of a portion of fig. 4.

FIG. 5 is a schematic diagram illustrating the area change from initial contact of a single trapezoid pillar-shaped cleaning bean with a wafer to the time before the single trapezoid pillar-shaped cleaning bean passes through the first end surface according to the present invention.

Fig. 5a is a graph of the area shown in fig. 5 as a function of contact angle.

FIG. 6 is a schematic diagram illustrating the variation of the contact angle between a single cleaning bean and a wafer according to the present invention.

Fig. 7 is a schematic diagram comparing the contact area and contact angle of the cleaning bean of the present invention with those of the conventional cleaning bean.

FIG. 8 is a second schematic view comparing the contact area and contact angle of the cleaning bean of the present invention with those of the conventional cleaning bean.

Fig. 9 is a third schematic view comparing the present invention with the conventional cleaning bean in increasing the contact area and contact angle.

Fig. 10 is a fourth schematic view comparing the contact area and contact angle of the cleaning bean of the present invention with the conventional cleaning bean.

FIG. 11 is a fifth comparison of the contact area and contact angle between the present invention and conventional cleaning beans.

Fig. 12 is a sixth schematic view comparing the present invention with conventional cleaning beans in increasing contact area and contact angle.

Fig. 13 is a seventh schematic view comparing the present invention with the conventional cleaning bean in increasing the contact area and contact angle.

Fig. 14 is a schematic view of a known cylindrical cleaning bean structure.

FIG. 15 is a schematic diagram illustrating the change in area from initial contact of a single patterned cleaning beam with a wafer to the wafer area in a known brush based micro-analysis.

Fig. 15a is a partial enlarged view of fig. 15.

FIG. 16 is a schematic representation of the change in area from initial contact of a single cylindrical cleaning beam with the wafer to 0.1 degree before passing over the top surface as known from microscopic analysis.

Fig. 16a is a graph of the area shown in fig. 16 as a function of contact angle.

Reference numbers refer to:

cleaning body structure 100

Carrier 10

Sleeve joint part 11

Cleaning unit 20

Cleaning bean 21

First end face 211

Second end face 212

Inclined plane 213

Wafer 30

Central extension axis A

Line B is connected.

Detailed Description

Please refer to fig. 1 to 13, as shown: the present invention relates to a cleaning body structure 100, which comprises a carrier 10 and a cleaning unit 20, wherein the carrier 10 and the cleaning unit 20 can be integrally formed by different soft foam foams such as composite material, sponge, Polyurethane (PU), polyvinyl alcohol (PVA) or polymer material, etc. according to the requirement.

The carrier 10 is cylindrical, and has a socket 11 at the center, and the socket 11 is assembled with an actuating mechanism (not shown).

The cleaning unit 20 is disposed at the outer edge of the carrier 10, and a plurality of cleaning beans 21 are respectively positioned and arranged on the surface of the carrier 10. The cleaning beans 21 are trapezoidal columns (e.g., isosceles trapezoidal columns, as shown in fig. 2), each having a first end surface 211 parallel to the surface of the carrier 10, a second end surface 212 connected to the surface of the carrier 10, and two inclined planes 213 facing the circumferential direction of the carrier 10 and spaced between the two cleaning beans 21. The peripheral shape of the first end surface 211 of the cleaning bean 21 is a rectangle with four rounded corners, the distance between the first end surface 211 and the surface of the carrier 10 is 6.5mm, the distance between the center point of the second end surface 212 and the inclined plane 213 on one side is 4mm, and the included angle between the inclined planes 213 on both sides is 50 °, as shown in fig. 3. Thus, a novel cleaning body structure 100 is formed by the above-disclosed device.

In one embodiment, the first end surfaces 211 of the cleaning beams 21 respectively have a concave arc portion (not shown) with a concave center, and the curvature of the concave arc portion is between 70% and 99%.

In one embodiment, the cleaning beans 21 have a gap therebetween, and the gap may be one of or a combination of an equal interval and an unequal interval, so that the cleaning beans 21 can be disposed on the surface of the carrier 10 in a honeycomb, equidistant, spiral, or bidirectional spiral arrangement.

When in use, one or more carriers 10 can be assembled with the associated actuating mechanism (not shown) by the sleeve portion 11, so that the actuating mechanism can drive the carriers 10 in a rolling manner, and move the actuating mechanism according to the required cleaning state and position, so that the cleaning beans 21 of the cleaning unit 20 on the outer edge of the carrier 10 can contact the surface of the associated precision electronic component for the required cleaning. In a preferred embodiment, during the horizontal cleaning motion, assuming that the precision electronic components (e.g., the wafer 30) rotate clockwise or counterclockwise in situ, the cylindrical carrier 10 with the cleaning unit 2 also rotates clockwise as shown in fig. 4, when each cleaning beam 21 initially contacts the wafer 30, each cleaning beam 21 does not necessarily brush the area of the first end surface 211 when brushing the contact wafer 30, but starts to deform and contact from the inclined plane 213 on one side, for example, pressing down by 1 mm, the carrier 10 drives the cleaning unit 20 to rotate to exceed a rotation angle, that is, when the angle between the central extension axis a of each cleaning beam 21 and the connection line B between the center of the carrier 10 and the wafer 30 is 17.64 degrees, the area of the first end surface 211 of each cleaning beam 21 passes through the wafer 30. As shown in fig. 5, the initial contact between the cleaning beans 21 and the wafer 30 and the initial contact between the cleaning beans and the wafer 30 have a gentle area change trend, so that the force applied to the wafer 30 is stabilized, thereby improving the cleaning ability of the brushing and the stability of the friction force on the surface of the wafer 30.

Compare traditional cylinder formula clean beans and the trapezoidal column clean beans that this creation proposed, as shown in fig. 6, show that 30 transport angle degree area changes in the picture, seem from preceding 0 ~ 3 degrees that cylinder formula clean beans are more slow (see white end dotted line), behind the middle section then the trapezoidal column clean beans that this creation proposed are more slow (see black end solid line). Therefore, compared with the traditional cylindrical cleaning beans, the cleaning beans with the trapezoidal cylindrical structure provided by the creation have the advantages that the change of the area from contact to separation is gradual, the cylindrical cleaning beans are steep, the change is gradual and stable in the aspect of torque (torque), scratches are not easily caused when the wafer is washed, and better cleaning capability is provided.

In view of the above, the larger the included angle between the inclined planes at the two sides of the cleaning beans, the gentler the moment reaction, so the present creation can make up to about 50 degrees with 16 rows of cleaning beans commonly available in the market.

In addition, the present inventors compared a series of conventional cylindrical cleaning beans with the trapezoidal cylindrical cleaning beans proposed by the present inventors, as shown in fig. 7-13. In comparison, when the length of the conventional cylindrical cleaning bean is the same as that of the trapezoidal cylindrical cleaning bean provided by the present invention, the total amount of the area change of the trapezoidal cylindrical cleaning bean is smaller than that of the cylindrical cleaning bean, and a more stable brushing rotation speed change (or torque change) can be provided, as shown in fig. 12. Moreover, in terms of the variation of each angular area difference, the maximum variation of the trapezoidal cylindrical cleaning beans provided by the present invention is significantly smaller than that of the conventional cylindrical cleaning beans, so that a more stable brushing rotation speed variation (or torque variation) can be provided, as shown in fig. 9.

Therefore, the technical characteristics of the cleaning body structure provided by the creation are that the initial contact is cleaned by surface contact, the variation from the contact to the area of the wafer cleaning bean is gentle, and the stress of the wafer is stable. The above experimental data prove that the present creation uses a planar contact wafer to provide less and stable area variation compared to a conventional curved contact wafer, thereby enhancing the cleaning ability of brushing and more stable surface friction of the wafer.

In summary, the cleaning body structure of the present invention can effectively improve various defects of the prior art, and the planar contact wafer can provide less and stable area variation compared with the curved contact wafer, so as to enhance the cleaning capability of brushing and more stable surface friction of the wafer, so that the present invention can be further developed, more practical, and more suitable for the needs of users, and indeed meets the requirements of the new patent application, and the patent application is proposed by law.

However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby; therefore, all the equivalent changes and modifications made in the claims and the contents of the new specification should be covered by the present patent.

Claims

1. A cleaning body structure comprises a carrier and a cleaning unit, wherein the carrier is in a circular tube shape, the center of the carrier is provided with a sleeve joint part, and the sleeve joint part is assembled with an actuating mechanism; the cleaning unit is characterized in that a plurality of cleaning beans are respectively positioned and arranged on the surface of the carrier, the cleaning beans are trapezoidal columnar bodies and are provided with a first end face parallel to the surface of the carrier and two inclined planes which face the circumferential direction of the carrier and are spaced between the two cleaning beans, the distance between the first end face of each cleaning bean and the surface of the carrier is 6.5mm +/-10%, the included angle between the inclined planes on the two sides is 50 +/-10%, when the cleaning beans initially contact a wafer, the cleaning beans are firstly deformed and contacted by the inclined plane on one side, so that the cleaning beans and the wafer are initially contacted to be separated from the wafer to have a gentle area change trend, and the wafer is stably stressed.

2. The cleaning body structure of claim 1, wherein the cleaning beans are isosceles trapezoidal cylinders.

3. The cleaning body structure of claim 1, wherein the first end surface of the cleaning beam has a concave arc portion with a concave center, and the curvature of the concave arc portion is between 70% and 99%.

4. The cleaning body structure of claim 1, wherein there is a gap between each pair of cleaning beans.

5. The cleaning body structure of claim 4, wherein the gap between every two cleaning beans is any one or a combination of equal spacing or unequal spacing.

6. The cleaning body structure of claim 1, wherein the cleaning beans are arranged in a honeycomb, equidistant, spiral, or bidirectional spiral arrangement.

7. The cleaning body structure of claim 1, wherein the carrier and the cleaning unit are integrally formed by foaming soft foam.

8. The cleaning body structure of claim 1, wherein the central extension axis of the cleaning beam and the connecting line from the carrier center to the wafer have a rotation angle, and when the cleaning beam starts to deform from a side inclined plane to contact, and the carrier drives the cleaning unit to contact and rotate beyond the rotation angle assuming a downward pressing of 1 mm, the cleaning beam will pass through the wafer with the first end surface area.

9. The cleaning body structure of claim 1, wherein the peripheral shape of the first end surface of the cleaning bean is a square, rounded rectangle.

10. The cleaning body structure according to claim 1, wherein the cleaning beam further has a second end surface connected to the carrier surface, and the distance from the center point of the second end surface to the inclined plane on one side is 4mm ± 10%.