CN216323038U - Electroplating mold glue pouring equipment - Google Patents
Electroplating mold glue pouring equipment Download PDFInfo
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- CN216323038U CN216323038U CN202122754343.5U CN202122754343U CN216323038U CN 216323038 U CN216323038 U CN 216323038U CN 202122754343 U CN202122754343 U CN 202122754343U CN 216323038 U CN216323038 U CN 216323038U
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- glue pouring
- electroplating mold
- electric heater
- glue
- lifting plate
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Abstract
The utility model provides electroplating mold glue pouring equipment which comprises a base, wherein a glue pouring device is arranged on the base; the lifting plate is slidably mounted on the base; the electric heater is fixedly arranged on the lifting plate; the glue pouring nozzle is arranged at the bottom of the electric heater; the encapsulating mouth includes the casing, the casing is linked together with the electric heater, the bottom symmetry of casing is rotated and is installed two baffles, two the switching can be realized to the baffle. The glue pouring equipment for the electroplating mould provided by the utility model has the advantages that glue drawing can be effectively prevented, glue is saved, and the cleanness and tidiness of the mould are ensured.
Description
Technical Field
The utility model relates to the technical field of molds, in particular to a glue pouring device for an electroplating mold.
Background
Electroplating grinding apparatus is the mould that uses when electroplating, and electroplating grinding apparatus is in the use, because the work piece needs partial region to insulate, consequently, carries out the encapsulating in needs, realizes insulating through the insulating cement, among the prior art, utilizes encapsulating equipment to carry out the encapsulating.
However, in the prior art, after the glue filling is completed, the glue filling nozzle can generate drawn wires, on one hand, the drawn wires drip to cause the pollution of the mold and the difficulty in cleaning, and on the other hand, the glue solution is wasted.
Therefore, there is a need to provide a new glue pouring device for electroplating mold to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model solves the technical problem of providing the glue pouring equipment for the electroplating mould, which can effectively prevent glue solution from drawing, save glue solution and ensure that the mould is clean and tidy.
In order to solve the technical problem, the utility model provides electroplating mold glue pouring equipment which comprises: a base; the lifting plate is slidably mounted on the base; the electric heater is fixedly arranged on the lifting plate; the glue pouring nozzle is arranged at the bottom of the electric heater; the encapsulating mouth includes the casing, the casing is linked together with the electric heater, the bottom symmetry of casing is rotated and is installed two baffles, two the switching can be realized to the baffle.
Preferably, the top of the base is symmetrically and fixedly provided with two screw rods, the lifting plate is symmetrically and rotatably provided with two threaded sleeves, and the threaded sleeves are in threaded connection with the screw rods.
Preferably, a worm wheel is fixedly mounted on the threaded sleeve, a worm is rotatably mounted on the lifting plate, and the worm is meshed with the worm wheel.
Preferably, a motor is fixedly mounted on the lifting plate and fixedly connected with the worm.
Preferably, a sealing ring is fixedly mounted in the shell, a support is fixedly mounted in the shell, a sliding rod is slidably mounted on the support, a sealing plate is fixedly mounted on the sliding rod, and the sealing plate is movably connected with the sealing ring in a sealing manner.
Preferably, the sliding rod is sleeved with a spring in a sliding mode, and two ends of the spring are fixedly connected with the support and the sealing plate respectively.
Preferably, the bottom fixed mounting of slide bar has the connecting rod, slidable mounting has the slider on the baffle, the slider rotates with the connecting rod to be connected.
Preferably, a rubber inlet pipe is arranged on the electric heater.
Compared with the prior art, the glue pouring equipment for the electroplating mould provided by the utility model has the following beneficial effects:
the device can cut off the glue solution after the encapsulating is ended through setting up the baffle that can the switching, prevents the wire drawing, and simultaneously, the device sets up the electric heater, can heat the glue solution when the encapsulating on the one hand, prevents that the glue solution from solidifying, makes the encapsulating smooth and easy, and on the other hand can prevent that the glue solution from staying to solidify and cause the jam.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of a glue pouring apparatus for an electroplating mold according to the present invention;
FIG. 2 is a schematic view of the structure of the glue pouring nozzle when the device stops pouring glue;
fig. 3 is a schematic structural view of a glue pouring nozzle during glue pouring of the device.
Reference numbers in the figures: 1. a base; 2. a lifting plate; 3. an electric heater; 4. pouring a glue nozzle; 401. a housing; 402. a baffle plate; 403. a seal ring; 404. a support; 405. a slide bar; 406. a sealing plate; 407. a spring; 408. a connecting rod; 409. a slider; 5. a screw rod; 6. a threaded bushing; 7. a worm gear; 8. a worm; 9. an electric motor.
Detailed Description
The utility model is further described with reference to the following figures and embodiments.
Referring to fig. 1-3, the electroplating mold glue-pouring apparatus includes: a base 1; the lifting plate 2 is slidably mounted on the base 1; an electric heater 3, wherein the electric heater 3 is fixedly arranged on the lifting plate 2; the glue pouring nozzle 4 is arranged at the bottom of the electric heater 3; the glue filling nozzle 4 comprises a shell 401, the shell 401 is communicated with the electric heater 3, two baffle plates 402 are symmetrically and rotatably mounted at the bottom of the shell 401, and the baffle plates 402 can be opened and closed.
Two screw rods 5 are symmetrically and fixedly installed at the top of the base 1, two threaded sleeves 6 are symmetrically and rotatably installed on the lifting plate 2, and the threaded sleeves 6 are in threaded connection with the screw rods 5; a worm wheel 7 is fixedly arranged on the threaded sleeve 6, a worm 8 is rotatably arranged on the lifting plate 2, and the worm 8 is meshed with the worm wheel 7; fixed mounting has motor 9 on lifter plate 2, motor 9 and worm 8 fixed connection can make encapsulating mouth 4 realize going up and down, and then realize and stop the encapsulating.
A sealing ring 403 is fixedly installed in the shell 401, a support 404 is fixedly installed in the shell 401, a sliding rod 405 is slidably installed on the support 404, a sealing plate 406 is fixedly installed on the sliding rod 405, and the sealing plate 406 is movably connected with the sealing ring 403 in a sealing manner; a spring 407 is slidably sleeved on the sliding rod 405, and two ends of the spring 407 are respectively fixedly connected with the bracket 404 and the sealing plate 406; the bottom fixed mounting of slide bar 405 has connecting rod 408, slidable mounting has slider 409 on the baffle 402, slider 409 rotates with connecting rod 408 to be connected, can control baffle 402 switching through encapsulating pressure, does not need peripheral hardware power, the energy saving.
And a rubber inlet pipe is arranged on the electric heater 3.
The working principle of the electroplating mold glue pouring equipment provided by the utility model is as follows:
when the device is used, a mold needing glue pouring is placed on the base 1, the motor 9 is started, the motor 9 drives the threaded sleeve 6 to rotate through the worm 8 and the worm wheel 7, the lifting plate 2 moves downwards under the action of the lead screw 5, the glue pouring nozzle 4 is further connected with a glue pouring opening of the mold to be glued, glue is poured into the electric heater 3 through the glue inlet pipe, the glue is heated by the electric heater 3 and then enters the glue pouring nozzle 4, the sealing plate 406 moves downwards under the pressure of the glue, the sealing plate 406 drives the sliding rod 405 to move downwards, the sliding rod 405 drives the baffle 402 to rotate through the connecting rod 408 to open, as shown in the attached drawing 3, glue can be poured at the moment, and the spring 407 is in a compression energy storage state;
after the glue is poured, the baffle 402 is closed under the action of the elastic force of the spring 407, and when the baffle 402 is closed, the glue solution can be cut off in time;
simultaneously, when the completion of encapsulating was idle, the glue solution in encapsulating mouth 4 and the electric heater 3 can take place to solidify, can heat the glue solution through electric heater 3 and make it melt when using again, can not take place to block up.
Compared with the prior art, the glue pouring equipment for the electroplating mould provided by the utility model has the following beneficial effects:
the device can cut off the glue solution after the encapsulating is ended through setting up the baffle 402 that can open and close, prevents the wire drawing, and simultaneously, the device sets up electric heater 3, can heat the glue solution when the encapsulating on the one hand, prevents that the glue solution from solidifying, makes the encapsulating smooth and easy, and on the other hand can prevent that the glue solution from staying to solidify and cause the jam.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides an electroplating mold encapsulating equipment which characterized in that includes:
a base;
the lifting plate is slidably mounted on the base;
the electric heater is fixedly arranged on the lifting plate;
the glue pouring nozzle is arranged at the bottom of the electric heater; the encapsulating mouth includes the casing, the casing is linked together with the electric heater, the bottom symmetry of casing is rotated and is installed two baffles, two the switching can be realized to the baffle.
2. The electroplating mold glue pouring device according to claim 1, wherein two screw rods are symmetrically and fixedly installed at the top of the base, two threaded sleeves are symmetrically and rotatably installed on the lifting plate, and the threaded sleeves are in threaded connection with the screw rods.
3. An electroplating mold glue pouring device according to claim 2, characterized in that a worm wheel is fixedly arranged on the threaded sleeve, a worm is rotatably arranged on the lifting plate, and the worm is meshed with the worm wheel.
4. The electroplating mold glue pouring equipment according to claim 3, wherein a motor is fixedly installed on the lifting plate and fixedly connected with the worm.
5. The electroplating mold glue pouring equipment according to claim 1, wherein a sealing ring is fixedly arranged in the shell, a support is fixedly arranged in the shell, a sliding rod is slidably arranged on the support, a sealing plate is fixedly arranged on the sliding rod, and the sealing plate is movably connected with the sealing ring in a sealing manner.
6. The electroplating mold glue pouring device according to claim 5, wherein a spring is sleeved on the sliding rod in a sliding manner, and two ends of the spring are fixedly connected with the bracket and the sealing plate respectively.
7. The electroplating mold glue pouring equipment according to claim 6, wherein a connecting rod is fixedly installed at the bottom end of the sliding rod, a sliding block is installed on the baffle in a sliding mode, and the sliding block is rotatably connected with the connecting rod.
8. An electroplating mold glue pouring device according to claim 1, characterized in that a glue inlet pipe is arranged on the electric heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122754343.5U CN216323038U (en) | 2021-11-11 | 2021-11-11 | Electroplating mold glue pouring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122754343.5U CN216323038U (en) | 2021-11-11 | 2021-11-11 | Electroplating mold glue pouring equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216323038U true CN216323038U (en) | 2022-04-19 |
Family
ID=81136519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122754343.5U Active CN216323038U (en) | 2021-11-11 | 2021-11-11 | Electroplating mold glue pouring equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216323038U (en) |
-
2021
- 2021-11-11 CN CN202122754343.5U patent/CN216323038U/en active Active
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