CN216312329U

CN216312329U - Multi-chip sintering clamp

Info

Publication number: CN216312329U
Application number: CN202122761861.XU
Authority: CN
Inventors: 张深; 王志源; 石栋
Original assignee: Wuxi Ruike Fiber Laser Technology Co ltd
Current assignee: Wuxi Ruike Fiber Laser Technology Co ltd
Priority date: 2021-11-11
Filing date: 2021-11-11
Publication date: 2022-04-15
Anticipated expiration: 2031-11-11

Abstract

The application discloses multi-chip sintering anchor clamps is applied to semiconductor laser, and semiconductor laser includes base and a plurality of chip, and the chip interval sets up on the base, and multi-chip sintering anchor clamps includes spacing cover and briquetting, and spacing cover is connected with the base, and spacing cover is provided with the through-hole, and a plurality of chips are located the through-hole to the play plain noodles parallel or parallel and level that make a plurality of chips. The pressing block is connected with the limiting cover and is abutted against the first surface of each chip so as to limit each chip. In the embodiment of the application, the chip is fixed by the limiting cover and the pressing block, so that the chip slippage caused by the melting of the solder in the sintering process is avoided, and the position of a plurality of chips in the sintering process can be fixed to ensure the sintering consistency.

Description

Multi-chip sintering clamp

Technical Field

The application belongs to the field of semiconductor photoelectron, and particularly relates to a multi-chip sintering clamp.

Background

At present, due to the development of semiconductor laser materials and the progress of the manufacturing process level, the single chip power reaches nearly 20W, but the requirement of industrial production for high-power laser cannot be met. In order to obtain a high power semiconductor laser output, the number of chips is generally increased to achieve a high output. In the production of high-power semiconductor lasers, the sintering of chips is one of very important and basic processes, and the sintering quality and consistency not only affect the coupling efficiency of optical paths, but also affect the heat dissipation capacity of devices, thereby affecting the service life of products.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a multi-chip sintering clamp, which can improve the consistency of multi-chip sintering.

The embodiment of the application provides a multi-chip sintering anchor clamps is applied to semiconductor laser, semiconductor laser includes base and a plurality of chip, the chip interval set up in on the base, multi-chip sintering anchor clamps include:

the limiting cover is connected with the base and provided with a through hole, and the plurality of chips are positioned in the through hole so that light emergent surfaces of the plurality of chips are parallel or parallel and level;

and the pressing block is connected with the limiting cover and is abutted against the first surface of each chip so as to limit each chip.

Optionally, the position limiting cover further comprises:

the second surface of each chip is abutted with the limiting bulges so as to limit each chip, wherein the first surface is vertical to the second surface.

Optionally, the chip includes a plurality of corners, and each corner abuts against one of the limiting protrusions.

Optionally, the chip further includes a bar, the bar is disposed on the first surface, the light-emitting surface of the bar is flush with the second surface, the light-emitting surface faces the side wall of the through hole, and the limiting cover further includes:

the plurality of abutting protrusions are arranged between the chip and the side wall of the through hole and the second surface, each second surface of the chip is abutted to the plurality of abutting protrusions, and the plurality of abutting protrusions are arranged at intervals to avoid the bars.

Optionally, the first surface of the chip includes a circuit region and a non-circuit region, the non-circuit region is disposed at an edge of the chip, the pressing block abuts against the non-circuit region, the pressing block is provided with a protection groove, and a notch of the protection groove is opposite to the circuit region to avoid the circuit region.

Optionally, the pressing block is provided with an avoiding groove, and the limiting protrusion is inserted into the avoiding groove.

Optionally, the base is provided with a plurality of first steps, the chip is arranged on one of the first steps, the pressing block is provided with a plurality of second steps, and the chip is abutted against one of the second steps.

Optionally, the multi-chip sintering fixture further includes:

the base is provided with a first positioning hole, the limiting cover is provided with a second positioning hole, the first positioning hole is opposite to the second positioning hole, and the positioning pin penetrates through the first positioning hole and the second positioning hole so that the limiting cover is connected with the base.

Optionally, the pressing block includes a third positioning hole, the third positioning hole is opposite to the second positioning hole, and the positioning pin is inserted into the third positioning hole and the second positioning hole, so that the pressing block is connected to the limiting cover.

Optionally, the spacing cover includes:

the limiting part is provided with the through hole and is abutted against the base;

the holding part is arranged on one side of the limiting part, which is far away from the base.

In the embodiment of the application, semiconductor laser includes base and a plurality of chip, and the chip interval sets up on the base, and multi-chip sintering anchor clamps include spacing cover and briquetting, and spacing cover is connected with the base, and spacing cover is provided with the through-hole, and a plurality of chips are located the through-hole to the play plain noodles parallel or the parallel and level of making a plurality of chips. The pressing block is connected with the limiting cover and is abutted against the first surface of each chip so as to limit each chip. In the embodiment of the application, the chip is fixed by the limiting cover and the pressing block, so that the chip slippage caused by the melting of the solder in the sintering process is avoided, and the position of a plurality of chips in the sintering process can be fixed to ensure the sintering consistency.

Drawings

The technical solutions and advantages of the present application will become apparent from the following detailed description of specific embodiments of the present application when taken in conjunction with the accompanying drawings.

Fig. 1 is a schematic clamping diagram of a multi-chip sintering fixture according to an embodiment of the present disclosure.

Fig. 2 is a schematic diagram of an exploded structure of the assembly in fig. 1.

Fig. 3 is a sectional view taken along a-a in fig. 1.

Fig. 4 is a schematic structural diagram of a chip in the embodiment of the present application.

Fig. 5 is a schematic view of clamping a chip in a through hole in the embodiment of the present application.

Fig. 6 is a schematic view of a partial structure of a semiconductor laser.

FIG. 7 is a schematic structural diagram of a briquette in an embodiment of the present application.

FIG. 8 is a schematic structural diagram of a position limiting cover in the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The semiconductor laser has the advantages of small volume, light weight, high conversion efficiency, long service life, wide wavelength coverage range and the like, is widely applied to the fields of industry, medical treatment, communication, military and the like, and gradually replaces the traditional gas and solid lasers. In recent years, with the development of fields such as industrial processing, medical treatment, laser printing, and the like, the demand for high-power semiconductor lasers has been increasing year by year. Currently, due to the development of semiconductor laser materials and the progress of the manufacturing process level, the single chip power reaches nearly 20 watts, but the requirement of industrial production for high-power laser cannot be met. In order to obtain high-power laser output, a plurality of chips are generally provided in a semiconductor laser to achieve high output. In the production of high-power semiconductor lasers, a plurality of chips are required to be sintered on a base as required, so that light beams generated by the plurality of chips are parallel. Therefore, the sintering of the chip is one of the very important and fundamental processes, and the sintering quality and consistency not only affect the optical path coupling efficiency but also affect the heat dissipation capability of the device, thereby affecting the service life of the product.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic view illustrating a clamping of a multi-chip sintering fixture according to an embodiment of the present disclosure, fig. 2 is a schematic view illustrating an exploded structure of the clamping body in fig. 1, and fig. 3 is a cross-sectional view taken along a direction a-a in fig. 1. Semiconductor laser 400 includes base 5 and a plurality of chip 7, and the chip 7 interval sets up on base 5, and multi-chip 7 sintering jig 100 is used for fixing chip 7 in order to guarantee the uniformity of light-emitting in sintering process, improves semiconductor laser 400's yield. The multi-chip 7 sintering clamp 100 comprises a limiting cover 1 and a pressing block 2, wherein the limiting cover 1 is connected with a base 5, a through hole 131 is formed in the limiting cover 1, and a plurality of chips 7 are located in the through hole 131 so that light emitting surfaces 72 of the chips 7 are parallel or parallel and level. Illustratively, the number of the chips 7 is ten, and the ten chips 7 are sequentially arranged on the base 5 along the second direction Y. The through holes 131 are disposed opposite to the plurality of chips 7. It is understood that the through-holes 131 need to have a sufficient length in the second direction Y to accommodate ten or more chips 7. The chip 7 is disposed in the through hole 131, and the side wall of the through hole 131 limits the position of the chip 7 in the second direction Y. The light emitting surfaces 72 of the chips 7 are generally disposed opposite to the sidewalls of the through holes 131, and therefore, the through holes 131 are disposed such that the light emitting surfaces 72 of the chips 7 are flush or parallel. It should be noted that, due to the limitation of the process, it is difficult to realize absolute parallelism or leveling of the light emitting surfaces 72 of the chip 7, so a preset angle may be set according to the actual precision and requirement of the semiconductor laser 400, and an included angle between the light emitting surfaces 72 that is smaller than the preset angle may also be regarded as being parallel or leveling, that is, an error within a specified range may be regarded as a product being qualified.

The pressing block 2 is connected with the limiting cover 1, and the pressing block 2 is abutted against the first surface 73 of each chip 7 so as to limit each chip 7. It should be noted that the chip 7 includes a first surface 73, the first surface 73 faces away from the base 5, and the first surface 73 faces toward the compact 2. The chip 7 is disposed on the base 5, the press block 2 abuts against the first surface 73, and the position of the chip 7 in the third direction Z is restricted by the base 5 and the press block 2.

When producing a semiconductor laser, the chip needs to be fixed to a base. On the one hand, the light emitted by the chip can be compressed into a beam. On the other hand, when the chip is electrified and emits light, heat is generated, and the chip is sintered on the base, so that heat dissipation of the chip is facilitated. In the related art, the chip and the base are usually sintered in an opposite manner. The chips are arranged on the base at intervals along a certain direction, the solder is arranged between the chips and the base, and the solder can be in a rectangular soldering lug shape, for example, the size of the soldering lug is 4.6 mm multiplied by 4.0 mm multiplied by 0.05 mm. The chip and the base are placed under the high power microscope, and the light emergent surfaces of the chip are aligned one by one, so that the light emergent surfaces of the chip are flush. And then the base and the chip are put into a furnace together for heating, and the welding flux is solidified after being melted so as to connect the chip and the base. It can be understood that, in the sintering process, the solder has certain fluidity after melting, which may cause the position of the chip to deviate, and each chip deviates from the pre-placed position, resulting in the light-emitting surface of each chip to be dislocated, and further resulting in poor consistency of the finished product and low product yield.

In the embodiment of the application, the chip 7 is fixed by using the limiting cover 1 and the pressing block 2. Spacing cover 1 can make the play plain noodles 72 parallel and level or the parallel of chip 7, and briquetting 2 compresses tightly chip 7 and base 5, and then avoids the chip 7 that causes because the solder melts in sintering process to slide, can make a plurality of chips 7 rigidity in sintering process to ensure the uniformity of sintering. Meanwhile, the pressing block 2 provides pressure for the chip 7 in the sintering process, so that a solder cavity is prevented from being generated between the chip 7 and the base 5, and the heat dissipation effect of the chip 7 is improved.

Referring to fig. 2, it should be noted that, although the chip 7 is limited in the first direction X and the third direction Z, the chip 7 may be shifted in the second direction Y during the melting process of the solder. The first direction X, the second direction Y and the third direction Z are mutually perpendicular. Therefore, the position limiting cover 1 may further include a plurality of position limiting protrusions 132 for limiting each of the chips 7 in the second direction Y. Note that the first surface 73 is perpendicular to the second surface 74. The second surface 74 of each chip 7 abuts against the plurality of limiting protrusions 132 to enhance the limiting effect of the limiting cover 1 on the plurality of chips 7.

For example, please refer to fig. 4 and 5, fig. 4 is a schematic structural diagram of a chip in an embodiment of the present application, and fig. 5 is a schematic clamping diagram of the chip in a through hole in the embodiment of the present application. When the chip 7 is a rectangular sheet, the first surface 73 may be understood as an upper surface of the chip 7, and the second surface 74 may be understood as four side surfaces of the chip 7. The chip 7 includes 4 corner portions 741, the corner portions 741 are located at the turning points of the second surface 74, and the second surface 74 of the chip 7 can simultaneously abut against the 4 limiting protrusions 132, i.e., each corner portion 741 abuts against one limiting protrusion 132. Of course, the second surface 74 of the chip 7 may abut only two limiting protrusions 132, and the limiting protrusions 132 may abut other portions of the second surface 74, which are not corner portions, for limiting.

The chip 7 is provided with a bar 71, the bar 71 is generally disposed on the second surface 74, the light-emitting surface 72 is disposed on the surface of the bar 71, and the light-emitting surface 72 of the chip 7 faces the sidewall of the through hole 131. In the process of mounting and holding the chip 7, it is necessary to avoid damage to the chip 7 by the multi-chip 7 sintering jig 100 as much as possible. Therefore, the position limiting cover 1 may further include a plurality of abutting protrusions 133, the abutting protrusions 133 are disposed between the side wall and the second surface 74, the second surface 74 of each chip 7 abuts against the plurality of abutting protrusions 133, and the plurality of abutting protrusions 133 are disposed at intervals to avoid the bars 71. The arrangement of the abutment projection 133 restricts the position of the chip 7 in the first direction X, while avoiding damage to the chip 7 by clamping.

It should be noted that, in the first direction X, the length of the limiting projection 132 needs to be greater than the length of the abutting projection 133, the limiting projection 132 is used for limiting the position of the chip 7 in the second direction Y, and the abutting projection 133 is used for limiting the position of the chip 7 in the first direction X. The abutment protrusion 133 and the stopper protrusion 132 may be both provided on the sidewall of the through-hole 131, and the abutment protrusion 133 and the stopper protrusion 132 may be provided at an interval. Of course, the limiting protrusion 132 may be disposed on the abutting protrusion 133, which is not limited herein.

The first surface 73 of the chip 7 includes a circuit region 731 and a non-circuit region 732, and the non-circuit region 732 is disposed at an edge of the chip 7. The pressing block 2 is disposed in the through hole 131, and the pressing block 2 applies pressure to the chip 7 by its own weight to prevent the chip 7 from moving relative to the base 5. In the process of clamping, it is also necessary to avoid damage to the circuit region 731 of the chip 7 by the press block 2. Therefore, the pressure block 2 is in contact with only the non-circuit region 732, and the pressure block 2 may be provided with a protective groove 223, a notch of the protective groove 223 facing the circuit region 731, and the protective groove 223 for protecting the circuit region 731 from being damaged during the clamping.

It will be appreciated that the press block 2 is disposed within the through-hole 131 and needs to cooperate with structures on the side walls of the through-hole 131. Therefore, the pressing block 2 may be provided with an avoiding groove 225, and the limiting protrusion 132 is inserted into the limiting groove to form an avoiding to the limiting protrusion 132.

Referring to fig. 6 and 7, fig. 6 is a schematic diagram of a partial structure of a semiconductor laser, and fig. 7 is a schematic diagram of a compact according to an embodiment of the present disclosure. In order to combine the light emitted by each chip 7 into one beam, a plurality of first steps 51 are arranged on the base 5, one chip 7 is arranged on one first step 51, the light emitted by each chip 7 is compressed into one beam of parallel light through a lens, and then the multiple beams of parallel light are coupled into an optical fiber. Correspondingly, the pressing block 2 is provided with a plurality of second steps 221, and one chip 7 abuts against one second step 221. That is, the plurality of second steps 221 of the pressure block 2 and the plurality of first steps 51 of the base 5 are disposed to face each other and abut against each other, and the chip 7 is disposed between the facing first steps 51 and second steps 221.

It can be understood that the pressing block 2 may include a main body portion 21 and a pressing portion 22, and the main body portion 21 is connected with the position-limiting cover 1. The pressing portion 22 is connected to the body portion 21, and the pressing portion 22 is provided with a plurality of second steps 221. The protective groove 223 may be disposed on the second step 221, and the escape groove 225 may be disposed between the two second steps 221.

The multi-chip 7 sintering fixture 100 further comprises a positioning pin 3, a first positioning hole 52 is formed in the base 5, a second positioning hole 134 is formed in the limiting cover 1, the first positioning hole 52 and the second positioning hole 134 are oppositely arranged, and the positioning pin 3 penetrates through the first positioning hole 52 and the second positioning hole 134, so that the limiting cover 1 is connected with the base 5.

The pressing block 2 comprises a third positioning hole 212, the third positioning hole 212 is opposite to the second positioning hole 134, and the positioning pin 3 is inserted into the third positioning hole 212 and the second positioning hole 134, so that the pressing block 2 is connected with the limit cover 1. Illustratively, the main body portion 21 of the pressing block 2 is provided with a third positioning hole 212.

In order to improve the positioning effect, a plurality of positioning pins 3 may be provided, and correspondingly, a plurality of first positioning holes 52 are provided on the base 5, a plurality of second positioning holes 134 are provided on the position-limiting cover 1, and a plurality of third positioning holes 212 are provided on the press block 2. The positioning pin 3 may include a first section 31 and a second section 32, the diameter of the first section 31, the diameter of the first positioning hole 52, and the diameter of the second positioning hole 134 being equal, and the diameter of the second section 32, the diameter of the second positioning hole 134, and the diameter of the third positioning hole 212 being equal.

Please refer to fig. 8, fig. 8 is a schematic structural diagram of a position limiting cover according to an embodiment of the present application. To facilitate removal of the multi-chip 7 sintering jig 100 from the base 5, the position limiting cap 1 may have a grip portion 15. The limiting cover 1 comprises a limiting part 13 and a holding part 15, the limiting part 13 is provided with the through hole 131, and the limiting part 13 is abutted to the base 5. The holding portion 15 is disposed on a side of the limiting portion 13 away from the base 5.

Illustratively, when the edge of the base 5 is provided with a sidewall, the sidewall serves as a part of the package of the semiconductor laser 400. The size of spacing cover 1 can match with the inside size of base 5, and grip 15 can include connecting portion 151 and hem 152, and hem 152 and lateral wall set up relatively, and spacing 13 of spacing cover 1 is connected to the one end of connecting portion 151, and hem 152 is connected to the other end of connecting portion 151. The user can hold the folding edge 152, put the limiting cover 1 into the space enclosed by the base 5 and the side wall, and after sintering, can hold the folding edge 152 to take out the limiting cover 1.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The multi-chip sintering fixture provided by the embodiment of the present application is described in detail above, and the principle and the implementation of the present application are explained herein by applying specific examples, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a multi-chip sintering anchor clamps, is applied to semiconductor laser, its characterized in that, semiconductor laser includes base and a plurality of chip, the chip interval set up in on the base, multi-chip sintering anchor clamps include:

2. The multi-chip sintering fixture of claim 1 wherein the retaining cap further comprises:

3. The multi-chip sintering fixture of claim 2 wherein the chip includes a plurality of corners, each corner abutting a retention bump.

4. The multi-chip sintering fixture of claim 2, wherein the chip further comprises a bar, the bar is disposed on the first surface, the light emitting surface of the bar is flush with the second surface, the light emitting surface faces the sidewall of the through hole, and the position-limiting cover further comprises:

5. The multi-chip sintering fixture of any one of claims 2 to 4, wherein the first surface of the chip comprises a circuit area and a non-circuit area, the non-circuit area is disposed at an edge of the chip, the compact abuts the non-circuit area, the compact is provided with a protective groove, and a notch of the protective groove is opposite to the circuit area to avoid the circuit area.

6. The multi-chip sintering jig according to any one of claims 2 to 4, wherein the pressing block is provided with an avoiding groove, and the limiting protrusion is inserted into the avoiding groove.

7. The multi-chip sintering jig of any one of claims 1 to 4, wherein a plurality of first steps are provided on the base, a chip is provided on one of the first steps, and a plurality of second steps are provided on the compact, a chip abutting one of the second steps.

8. The multi-chip sintering fixture of any one of claims 1-4, further comprising:

9. The multi-chip sintering fixture of claim 8, wherein the compact includes a third locating hole disposed opposite the second locating hole, the locating pin passing through the third locating hole and the second locating hole to connect the compact to the retaining cap.

10. The multi-chip sintering fixture of any one of claims 1 to 4, wherein the position limiting cap comprises: