CN216310183U - Flat plate type semiconductor device steady-state thermal resistance testing device - Google Patents
Flat plate type semiconductor device steady-state thermal resistance testing device Download PDFInfo
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- CN216310183U CN216310183U CN202121895340.7U CN202121895340U CN216310183U CN 216310183 U CN216310183 U CN 216310183U CN 202121895340 U CN202121895340 U CN 202121895340U CN 216310183 U CN216310183 U CN 216310183U
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Abstract
The utility model discloses a flat plate type semiconductor device steady-state thermal resistance testing device, which relates to the technical field of semiconductor device thermal resistance testing and comprises a detection box, wherein sliding grooves are formed in two sides of the detection box, sliding blocks are connected inside the sliding grooves in a sliding mode, one end of each sliding block is fixedly connected with a cooling top plate, the top end of each cooling top plate is fixedly connected with a spring, and the springs are fixedly connected with the inner wall of the top end of the detection box. According to the utility model, through the matched arrangement of the detection box, the spring, the tested device, the second standard thermal resistance, the heating bottom plate, the sliding groove and the sliding block, the clamping and installation of the flat plate type semiconductor device are convenient to carry out, so that the thermal resistance test is carried out, the tight fit in the test process of the semiconductor device is ensured, the stability is increased, and the problems that the existing thermal resistance test device of the semiconductor device is difficult and complicated in clamping and installation, the tight fit effect cannot be ensured in the test process of the semiconductor device, and the stability in the test process of the thermal resistance is poor are solved.
Description
Technical Field
The utility model relates to the technical field of thermal resistance testing of semiconductor devices, in particular to a device for testing the steady-state thermal resistance of a flat-plate type semiconductor device.
Background
The thermal resistance of the power semiconductor device is an important index of device performance parameters, and the definition of the thermal resistance is thatThe ratio of the temperature difference between two specified points to the dissipated power that creates the temperature difference between the two points under thermal equilibrium conditions. The thermal resistance reflects the heat dissipation capability of the device. The flat-plate device is characterized by that when the high-power supply is used to supply heating current to the tested device, and when the heat is balanced, the junction temperature T can be measuredjShell temperature TcAnd heating power P, calculating the crusting thermal resistance Rjc. The existing flat plate type semiconductor device steady-state thermal resistance testing device is difficult and complicated to clamp and install, so that a tight fit effect cannot be guaranteed during testing of the semiconductor device, the stability in the thermal resistance testing process is poor, the temperature difference between two ends of the flat plate type semiconductor device is not obvious during testing, the thermal resistance error of the semiconductor device is large, the accuracy of measuring the temperature of two ends of the semiconductor device is low, the measured data is single, and large errors are easy to generate.
Therefore, it is necessary to provide a device for testing the steady-state thermal resistance of a flat-type semiconductor device to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims to: the utility model provides a steady-state thermal resistance testing device for a flat plate type semiconductor device, which aims to solve the problems that the existing thermal resistance testing device for the semiconductor device is difficult and complicated to clamp and install, so that the close attachment effect cannot be ensured during the test of the semiconductor device, the stability in the thermal resistance testing process is poor, the temperature difference between two ends of the flat plate type semiconductor device is not obvious during the test, so that the thermal resistance error of the semiconductor device is larger, the accuracy of measuring the temperatures of the two ends of the semiconductor device is lower, the measured data is single, and larger errors are easy to generate.
(II) technical scheme
The utility model specifically adopts the following technical scheme for realizing the purpose:
a flat plate type semiconductor device steady-state thermal resistance testing device comprises a detection box, wherein sliding grooves are formed in two sides of the detection box, a sliding block is connected inside each sliding groove in a sliding mode, a cooling top plate is fixedly connected to one end of each sliding block, a spring is fixedly connected to the top end of the cooling top plate, the spring is fixedly connected with the inner wall of the top end of the detection box, a first standard thermal resistance is fixedly connected to the bottom end of the cooling top plate, a device to be tested is arranged at the bottom end of the first standard thermal resistance, connectors are fixedly connected to two ends of the device to be tested, a second standard thermal resistance is arranged at the bottom end of the device to be tested, adapters are fixedly connected to one ends of the second standard thermal resistance and the first standard thermal resistance, the two adapters are arranged in a crossed and symmetrical mode, the adapters are electrically connected with the connectors, and a heating bottom plate is fixedly connected to the bottom end of the second standard thermal resistance, the heating bottom plate is fixedly connected with the inner wall of the bottom end of the detection box.
Furthermore, the inner wall of the cooling top plate is fixedly connected with a built-in cooling box, and a condensation pipe is arranged inside the built-in cooling box.
Furthermore, one side of the condensing pipe is fixedly connected with a connecting guide vane, and one end of the condensing pipe is fixedly connected with a cooling control end.
Furthermore, the inner wall of the heating bottom plate is fixedly connected with a heat insulation plate, and the inner wall of the heat insulation plate is fixedly connected with a built-in heating box.
Furthermore, a heating wire is arranged inside the built-in heating box, and one end of the heating wire is fixedly connected with a heating control end.
Further, the inner wall fixedly connected with temperature measuring box of both sides of detection case, temperature measuring box has two, two temperature measuring box is corresponding setting, the inner wall fixedly connected with electric telescopic handle of temperature measuring box.
Further, the inner wall fixedly connected with slide rail of temperature measurement case, the inner wall sliding connection of slide rail has temperature sensor, temperature sensor and electric telescopic handle fixed connection.
Further, one side outer wall fixedly connected with guard plate of temperature-measuring box, temperature sensor and the inner wall sliding connection of guard plate.
(III) advantageous effects
The utility model has the following beneficial effects:
according to the utility model, through the matching arrangement of the detection box, the spring, the cooling top plate, the first standard thermal resistance, the tested device, the second standard thermal resistance, the heating bottom plate, the sliding chute and the sliding block, the clamping installation of the flat plate type semiconductor device is convenient to carry out, so that the thermal resistance test is convenient to carry out, the tight fit in the test process of the semiconductor device is ensured, the stability is increased, and the problems that the existing thermal resistance test device of the semiconductor device is difficult and complicated in clamping installation, the tight fit effect cannot be ensured in the test process of the semiconductor device, and the stability in the test process of the thermal resistance is poor are solved.
2 the utility model, through the cooperation arrangement of the heating bottom plate, the heating control end, the built-in heating box, the heating wire, the heat insulation plate, the cooling top plate, the built-in cooling box, the connecting guide vane, the condensing tube and the cooling control end, strengthens the temperature difference of two ends of the flat plate type semiconductor device in the test, is convenient to calculate the thermal resistance of the semiconductor device, and solves the problem that the thermal resistance error of the semiconductor device is larger because the temperature difference of two ends of the flat plate type semiconductor device in the test is not obvious in the existing thermal resistance test device of the semiconductor device.
According to the utility model, through the matched arrangement of the temperature measurement box, the slide rail, the temperature sensor, the protection plate and the electric telescopic rod, the accuracy of measuring the temperatures at two ends of the semiconductor device can be effectively improved, the accuracy of measuring the thermal resistance is improved, the effect of reducing the measurement error of the measurement repeatability is enhanced, and the problems that the accuracy of measuring the temperatures at two ends of the semiconductor device is low, the measurement data is single and a large error is easily generated in the conventional thermal resistance testing device for the semiconductor device are solved.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a perspective view of the heating base plate structure of the present invention;
FIG. 3 is a schematic bottom view of the cooling ceiling structure of the present invention;
FIG. 4 is a schematic view of the interior of the incubator of the present invention.
Reference numerals: 1. a detection box; 2. a spring; 3. cooling the top plate; 4. a first standard thermal resistance; 5. a temperature measuring box; 6. a heat-generating base plate; 7. a second standard thermal resistance; 8. a device under test; 9. an adapter; 10. a connector; 11. a slider; 12. a chute; 13. a heating control end; 14. a heating box is arranged inside; 15. heating wires; 16. a heat insulation plate; 17. a cooling box is arranged inside; 18. connecting the guide sheet; 19. a condenser tube; 20. cooling the control end; 21. an electric telescopic rod; 22. a slide rail; 23. a temperature sensor; 24. and (4) a protective plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-4, a device for testing the stable thermal resistance of a flat plate type semiconductor device comprises a detection box 1, sliding grooves 12 are formed in both sides of the detection box 1, sliding blocks 11 are slidably connected inside the sliding grooves 12, a cooling top plate 3 is fixedly connected to one end of each sliding block 11, a spring 2 is fixedly connected to the top end of each cooling top plate 3, the spring 2 is fixedly connected to the inner wall of the top end of the detection box 1, a first standard thermal resistance 4 is fixedly connected to the bottom end of each cooling top plate 3, a device 8 to be tested is arranged at the bottom end of each first standard thermal resistance 4, connectors 10 are fixedly connected to both ends of each device 8 to be tested, a second standard thermal resistance 7 is arranged at the bottom end of each device 8 to be tested, adapters 9 are fixedly connected to one end of each second standard thermal resistance 7 and one end of each first standard thermal resistance 4, two adapters 9 are provided, the two adapters 9 are arranged in a cross symmetry manner, and the adapters 9 are electrically connected to the connectors 10, the bottom end of the second standard thermal resistance 7 is fixedly connected with a heating bottom plate 6, and the heating bottom plate 6 is fixedly connected with the inner wall of the bottom end of the detection box 1.
In the embodiment, the thermal resistance test device is convenient to clamp and install a flat plate type semiconductor device through the matching arrangement among the detection box 1, the spring 2, the cooling top plate 3, the first standard thermal resistance 4, the tested device 8, the second standard thermal resistance 7, the heating bottom plate 6, the sliding chute 12 and the sliding block 11 so as to carry out thermal resistance test, ensure the tight fit in the test process of the semiconductor device and increase the stability, and solves the problems that the existing thermal resistance test device of the semiconductor device is difficult and complicated to clamp and install, so that the tight fit effect cannot be ensured in the test process of the semiconductor device, and the stability is poor in the test process of the thermal resistance, the cooling top plate 3 is pushed to compress the spring 2, so that the sliding block 11 slides in the sliding chute 12, the first standard thermal resistance 4 starts to rise, the tested device 8 is placed at the top end of the second standard thermal resistance 7, and the connector 10 is electrically connected with the adapter 9, and meanwhile, the cooling top plate 3 is tightly attached to the top end of the tested device 8, so that the flat-plate type semiconductor device is clamped and fixed, and the connector 10 at the other end is connected with the adapter 9 at one end of the first standard thermal resistor 4 for installation, so that the first standard thermal resistor 4, the tested device 8 and the second standard thermal resistor 7 are ensured to be connected in series.
Example 2
Referring to fig. 2 and 3, the present embodiment is further optimized based on embodiment 1, specifically, an internal cooling box 17 is fixedly connected to an inner wall of the cooling top plate 3, and a condensation pipe 19 is disposed inside the internal cooling box 17.
Specifically, one side of the condensation pipe 19 is fixedly connected with the connecting guide vane 18, and one end of the condensation pipe 19 is fixedly connected with the cooling control end 20.
Specifically, a heat insulation plate 16 is fixedly connected to the inner wall of the heating bottom plate 6, and a built-in heating box 14 is fixedly connected to the inner wall of the heat insulation plate 16.
Specifically, a heating wire 15 is arranged inside the built-in heating box 14, and one end of the heating wire 15 is fixedly connected with a heating control end 13.
In this embodiment, the temperature difference between the two ends of the flat semiconductor device under test is enhanced by the cooperation of the heating bottom plate 6, the heating control end 13, the built-in heating box 14, the heating wire 15, the thermal insulation plate 16, the cooling top plate 3, the built-in cooling box 17, the connecting guide piece 18, the condenser tube 19 and the cooling control end 20, so as to conveniently calculate the thermal resistance of the semiconductor device, and solve the problem that the temperature difference between the two ends of the flat semiconductor device under test is not obvious, which results in a large error in calculating the thermal resistance of the semiconductor device, the cooling control end 20 in the cooling top plate 3 is started to make the cooling control end 20 start to operate the condenser tube 19, transmit the low temperature to the first standard thermal resistance 4 through the connecting guide piece 18, transmit the low temperature to one end of the device under test 8 through the first standard thermal resistance 4, and start the heating control end 13 in the built-in heating box 14 to transmit the high temperature generated by the heating wire 15 to the device under test through the second standard thermal resistance 7 And the other end of the device 8 is tested, so that the temperature difference between two ends of the device 8 to be tested in the test is enhanced, and the calculation is convenient.
Example 3
Referring to fig. 4, the present embodiment is optimized based on the embodiment 1 or 2, specifically, two temperature measurement boxes 5 are fixedly connected to inner walls of two sides of the detection box 1, the two temperature measurement boxes 5 are correspondingly arranged, and an electric telescopic rod 21 is fixedly connected to an inner wall of the temperature measurement box 5.
Specifically, the inner wall of the temperature measuring box 5 is fixedly connected with a slide rail 22, the inner wall of the slide rail 22 is slidably connected with a temperature sensor 23, and the temperature sensor 23 is fixedly connected with the electric telescopic rod 21.
Specifically, the outer wall of one side of the temperature measuring box 5 is fixedly connected with a protection plate 24, and the temperature sensor 23 is connected with the inner wall of the protection plate 24 in a sliding manner.
In the embodiment, the temperature measuring box 5, the slide rail 22, the temperature sensor 23, the protection plate 24 and the electric telescopic rod 21 are arranged in a matching manner, so that the accuracy of measuring the temperatures at two ends of the semiconductor device can be effectively improved, the accuracy of measuring the thermal resistance is improved, meanwhile, the effect of reducing measurement errors through measurement repeatability is enhanced, the problem that the existing semiconductor device thermal resistance testing device is solved, the accuracy of measuring the temperatures at two ends of a semiconductor device is low, the measurement data is single, and large errors are easily generated is solved, the temperature measuring boxes 5 on two sides of the inner wall of the detection box 1 start to push the temperature sensor 23 to be close to one end of the tested device 8 to carry out temperature measurement by the electric telescopic rod 21, so that the temperature sensor 23 slides in the sliding rail 22 and the protection plate 24 to one of the temperature measuring boxes 5 to measure the low-temperature end, the other temperature measuring box 5 measures the high-temperature end, the measurement accuracy is improved, and the measurement errors are reduced through multiple measurements.
In summary, the following steps: the utility model is convenient for clamping and mounting the flat-plate type semiconductor device, so as to carry out thermal resistance test, ensure tight fit in the test process of the semiconductor device, increase stability, solve the problems that the prior thermal resistance test device of the semiconductor device is difficult and complicated to clamp and mount, cannot ensure tight fit effect in the test of the semiconductor device and has poor stability in the test process of the thermal resistance, strengthen the temperature difference of two ends of the flat-plate type semiconductor device in the test, facilitate the calculation of the thermal resistance of the semiconductor device, solve the problems that the temperature difference of two ends of the flat-plate type semiconductor device is not obvious in the test and cause larger error in the calculation of the thermal resistance of the semiconductor device in the prior thermal resistance test device of the semiconductor device, effectively improve the accuracy of measuring the temperature of two ends of the semiconductor device, improve the accuracy of measuring the thermal resistance and simultaneously strengthen the effect of reducing the measurement error of the measurement, the problem of current semiconductor device thermal resistance testing arrangement, the precision of measuring the temperature of semiconductor device both ends is lower, and measured data is single, produces great error easily is solved.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, and the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be covered by the scope of the present invention.
Claims (8)
1. The steady-state thermal resistance testing device for the flat plate type semiconductor device comprises a detection box (1) and is characterized in that: the detection box comprises a detection box body (1), sliding grooves (12) are formed in two sides of the detection box body (1), a sliding block (11) is connected to the inside of each sliding groove (12) in a sliding mode, a cooling top plate (3) is fixedly connected to one end of each sliding block (11), a spring (2) is fixedly connected to the top end of each cooling top plate (3), each spring (2) is fixedly connected to the inner wall of the top end of the detection box body (1), a first standard thermal resistor (4) is fixedly connected to the bottom end of each cooling top plate (3), a tested device (8) is arranged at the bottom end of each first standard thermal resistor (4), connectors (10) are fixedly connected to two ends of each tested device (8), a second standard thermal resistor (7) is arranged at the bottom end of each tested device (8), an adapter (9) is fixedly connected to one end of each second standard thermal resistor (7) and one end of each first standard thermal resistor (4), and the adapters (9) are two, two adapter (9) are the cross symmetry setting, adapter (9) are connected with connector (10) electricity, the bottom fixedly connected with of second standard thermal resistance (7) bottom plate (6) generate heat, the bottom inner wall fixed connection of bottom plate (6) and detection case (1) generates heat.
2. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 1, wherein: the inner wall of the cooling top plate (3) is fixedly connected with a built-in cooling box (17), and a condensation pipe (19) is arranged inside the built-in cooling box (17).
3. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 2, wherein: one side fixedly connected with of condenser pipe (19) connects guide vane (18), one end fixedly connected with cooling control end (20) of condenser pipe (19).
4. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 1, wherein: the heating device is characterized in that a heat insulation plate (16) is fixedly connected to the inner wall of the heating bottom plate (6), and a built-in heating box (14) is fixedly connected to the inner wall of the heat insulation plate (16).
5. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 4, wherein: the heating device is characterized in that a heating wire (15) is arranged inside the built-in heating box (14), and one end of the heating wire (15) is fixedly connected with a heating control end (13).
6. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 1, wherein: the utility model discloses a temperature measurement box, including detection case (1), temperature measurement box (5) have two, two temperature measurement box (5) are corresponding setting, the inner wall fixedly connected with electric telescopic handle (21) of temperature measurement box (5).
7. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 6, wherein: the inner wall fixedly connected with slide rail (22) of temperature measurement case (5), the inner wall sliding connection of slide rail (22) has temperature sensor (23), temperature sensor (23) and electric telescopic handle (21) fixed connection.
8. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 7, wherein: one side outer wall fixedly connected with guard plate (24) of temperature measurement case (5), temperature sensor (23) and the inner wall sliding connection of guard plate (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121895340.7U CN216310183U (en) | 2021-08-13 | 2021-08-13 | Flat plate type semiconductor device steady-state thermal resistance testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121895340.7U CN216310183U (en) | 2021-08-13 | 2021-08-13 | Flat plate type semiconductor device steady-state thermal resistance testing device |
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| Publication Number | Publication Date |
|---|---|
| CN216310183U true CN216310183U (en) | 2022-04-15 |
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|---|---|---|---|
| CN202121895340.7U Active CN216310183U (en) | 2021-08-13 | 2021-08-13 | Flat plate type semiconductor device steady-state thermal resistance testing device |
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| CN (1) | CN216310183U (en) |
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- 2021-08-13 CN CN202121895340.7U patent/CN216310183U/en active Active
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Effective date of registration: 20220928 Address after: 5th Floor, Building 8, No. 611 Dongguan Road, Puyan Street, Binjiang District, Hangzhou City, Zhejiang Province 310000 Patentee after: ZHEJIANG ANLIAN TEST TECHNOLOGY SERVICE CO.,LTD. Address before: 310000 room 1402, unit 2, building 14, Jiangnan Wenyuan, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Wang Yong |