CN216291606U - Circuit board, power module and LED display module - Google Patents
Circuit board, power module and LED display module Download PDFInfo
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- CN216291606U CN216291606U CN202122978980.0U CN202122978980U CN216291606U CN 216291606 U CN216291606 U CN 216291606U CN 202122978980 U CN202122978980 U CN 202122978980U CN 216291606 U CN216291606 U CN 216291606U
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Abstract
The application relates to a circuit board, power module and LED display module assembly, it include the mainboard with set up in mainboard week side and be on a parallel with the subplate of mainboard, the mainboard with the subplate forms the difference in height, the subplate thickness is less than the mainboard thickness, the subplate orientation electronic components can be installed to a side of mainboard, the mainboard pass through the contact pin with the subplate electricity is connected. The application has the effect of thinner structure.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a circuit board, a power supply module and an LED display module.
Background
The circuit board makes the circuit miniaturized, direct-viewing at present, play an important role to fixed circuit's batch production and optimize electrical apparatus overall arrangement.
Electronic components of a power supply module in an existing LED display screen are generally arranged on a whole circuit board, and due to the fact that heights of the electronic components on the circuit board are different, the thickness of a shell for installing the circuit board is often matched with the highest electronic component on the circuit board, so that the shell is thick, and the application range is small.
The related art has the defect that the overall structure of the circuit board is thick.
SUMMERY OF THE UTILITY MODEL
In order to improve the problem that the overall structure of circuit board is thick, this application provides a circuit board, power module and LED display module assembly.
In a first aspect, the present application provides a circuit board, which adopts the following technical scheme:
the utility model provides a circuit board, include the mainboard with set up in mainboard week side and be on a parallel with the subplate of mainboard, the mainboard with the subplate forms the difference in height, the subplate is thinner than the mainboard, the subplate orientation electronic components can be installed to a side of mainboard, the mainboard pass through the contact pin with the subplate electricity is connected.
Through adopting above-mentioned technical scheme, it compares to establish electronic components with the equipment of correlation technique on complete circuit board, this application divide into mainboard and subplate with the monoblock circuit board, and the subplate is close to the week side setting of mainboard, mainboard and subplate form the difference in height, the thickness of subplate is less than the thickness of mainboard, through installing thicker electronic components in the concentration on the subplate side towards the mainboard, install thinner electronic components in the concentration on the mainboard, make thicker electronic components sink the distance that is equivalent to mainboard and subplate thickness difference, make the height of electronic components more balanced on the circuit board, the height of electronic components on the circuit board that the structure is thicker has been reduced, make the overall structure of circuit board thin.
Optionally, the auxiliary board extends to form a connecting board near the periphery of the main board, and the connecting board is electrically connected with the main board through the contact pin.
Through adopting above-mentioned technical scheme, the setting of connecting plate provides the installation carrier for the contact pin, realizes that mainboard and subplate are connected.
Optionally, the connecting plate is provided with a fixing hole, the main board is provided with a through hole coaxially arranged with the fixing hole, one end of the contact pin is fixed in the fixing hole, and the other end of the contact pin is fixed in the through hole.
Through adopting above-mentioned technical scheme, the contact pin is fixed in fixed orifices and through-hole, and the contact pin of being convenient for is connected with connecting plate and mainboard, makes the contact pin fixed more firm.
Optionally, two pins are provided.
Through adopting above-mentioned technical scheme, for a contact pin, subplate and mainboard are fixed to two contact pins, make the subplate be difficult for rocking, make subplate and mainboard connection more stable.
Optionally, a limiting ring is arranged around the middle of the contact pin, one end of the limiting ring abuts against the main board, and the other end of the limiting ring abuts against the auxiliary board.
By adopting the technical scheme, the arrangement of the limiting ring plays a supporting role, the auxiliary plate is heightened, so that the height difference between the main plate and the auxiliary plate is increased, and the heights of electronic components on the circuit board can be more balanced by adjusting the length of the limiting ring; meanwhile, the limiting ring improves the pressure resistance of the circuit board, so that the mainboard and the first auxiliary plate are arranged more stably at intervals.
Optionally, a protection plate parallel to the main plate is arranged on one side of the main plate facing the auxiliary plate.
Through adopting above-mentioned technical scheme, the setting of guard plate makes the electronic components that mainboard orientation one side of first subplate was installed be difficult for receiving the extrusion and damage.
In a second aspect, the present application provides a power module, which adopts the following technical solution:
a power supply module comprising a circuit board as described above.
By adopting the technical scheme, the power supply module is thinner.
In a third aspect, the present application provides an LED display module, which adopts the following technical solution:
an LED display module comprises the circuit board.
By adopting the technical scheme, the LED display module is thinner.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the whole circuit board is divided into the main board and the auxiliary board, the auxiliary board is arranged close to the periphery of the main board, the main board and the auxiliary board form a height difference, the thickness of the auxiliary board is smaller than that of the main board, thicker electronic components are intensively arranged on one side surface of the auxiliary board facing the main board, and thinner electronic components are intensively arranged on the main board, so that the thicker electronic components sink by a distance equivalent to the thickness difference between the main board and the auxiliary board, the heights of the electronic components on the circuit board are more balanced, the heights of the electronic components with thicker structures on the circuit board are reduced, and the whole structure of the circuit board is thinned;
2. the auxiliary plate is raised through the limiting ring, so that the height difference between the main plate and the auxiliary plate is increased, the heights of electronic components on the circuit board can be more balanced by adjusting the length of the limiting ring, and meanwhile, the pressure resistance of the circuit board is improved through the limiting ring, so that the main plate and the first auxiliary plate are arranged more stably in a spaced mode;
3. through the guard plate, make the electronic components that mainboard orientation one side of first subplate was installed be difficult for receiving the extrusion and damage.
Drawings
Fig. 1 is a schematic overall structure diagram of a first embodiment of the present application.
Fig. 2 is an exploded view of the overall structure of the first embodiment of the present application.
Fig. 3 is an exploded view of the overall structure of the second embodiment of the present application.
Description of reference numerals: 1. a main board; 11. a through hole; 2. a first sub-panel; 21. a first connecting plate; 211. a fixing hole; 3. a second sub-panel; 31. a second connecting plate; 4. inserting a pin; 5. a limiting ring; 6. a fixing member; 7. and (4) a protective plate.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses a circuit board.
The first embodiment;
referring to fig. 1, a circuit board includes mainboard 1 and subplate, and mainboard 1 is parallel to each other with the subplate, and the subplate is close to the week side setting of mainboard 1, and mainboard 1 forms the difference in height with the subplate, and the thickness of subplate is less than the thickness of mainboard, and electronic components can be installed towards the side of mainboard 1 to the subplate, and mainboard 1 is connected with the subplate electricity through contact pin 4. For correlation technique, this application embodiment divides into mainboard 1 and subplate with complete circuit board, through install thicker electronic components in the subplate towards concentrating on the side of mainboard 1, install thinner electronic components in the concentration on mainboard 1, make thicker electronic components sink the distance that is equivalent to mainboard 1 and subplate thickness difference, make electronic components's height more balanced on the circuit board, reduced the height of the electronic components that the structure is thicker on the circuit board, make the overall structure of circuit board thin.
Specifically, in the embodiment of the present application, the secondary board includes a first secondary board 2 and a second secondary board 3, the thickness of the main board 1 is greater than the thicknesses of the first secondary board 2 and the second secondary board, the main board 1 is horizontally placed on a horizontal plane, the first secondary board 2 is disposed near a narrow side of the main board 1, and the first secondary board 2 is located below the main board 1. Therefore, the main board 1 and the first auxiliary board 2 form a height difference, and when electronic components are installed, the electronic components can be classified, so that the circuit board is modularized; thicker electronic components are arranged on one side of the first auxiliary board 2 facing the main board 1, thinner electronic components are arranged on the upper side surface and the lower side surface of the main board 1, or the electronic components which need to penetrate through the main board 1 are arranged on the main board 1. By the arrangement, on one hand, the heights of the electronic components on the circuit board are more balanced, and the limited space is fully utilized; on the other hand, the height of the electronic component with a thicker structure on the circuit board is reduced, so that the whole structure of the circuit board is thinned. Accordingly, the sub-board is not limited to the first sub-board 2 and the second sub-board 3, and more sub-boards having a difference in height from the main board 1 may be provided.
Referring to fig. 2, the sub-board extends to form a connection board near the periphery of the main board 1, and the connection board is electrically connected to the main board through pins 4. The first sub-board 2 extends to form a first connection board 21 near the peripheral side of the main board 1, and the first connection board 21 is connected to the main board 1 through the pins 4. The arrangement of the first connecting plate 21 provides an installation carrier for the pins 4, which facilitates the connection between the main board 1 and the first sub-board 2. Specifically, in the embodiment of the present application, the first sub-plate 2 extends to form the first connecting plate 21 near the peripheral side portion of the main plate 1, so that the area of the first connecting plate 21 is reduced, and the cost is saved. The first connecting plate 21 is located right below the main board 1, and the pin 4 is disposed between the main board 1 and the first connecting plate 21.
Fixing hole 211 has been seted up to first connecting plate 21, and mainboard 1 has seted up the through-hole 11 with the coaxial setting of fixing hole 211, and during fixed hole 211 and through-hole 11 were worn to establish by contact pin 4, the one end of contact pin 4 was fixed in fixing hole 211, and the other end of contact pin 4 is fixed in through-hole 11. In the embodiment, the first auxiliary board 2 is connected with the main board 1 through a pin, so that the first auxiliary board 2 is fixed on the main board 1; on the other hand, the circuit conduction between the main board 1 and the first sub-board 2 is realized. After the pin is inserted into the fixing hole 211 and the through hole 11, both ends of the pin are soldered to fix the pin.
In order to make the connection between the first sub-board 2 and the main board 1 more stable, two pins 4 are disposed on the first connecting board 21. Correspondingly, the arrangement of the two pins 4 makes the first sub-board 2 not easy to shake relative to the main board 1.
The middle part of contact pin 4 is equipped with spacing ring 5 all around, and one end butt in mainboard 1 of spacing ring 5, the other end butt in first subplate 2 of spacing ring 5. Specifically, the limiting ring 5 is circumferentially arranged on the contact pin and plays a supporting role, the auxiliary plate is raised, so that the height difference between the main plate 1 and the auxiliary plate is increased, and the heights of electronic components on the circuit board can be more balanced by adjusting the length of the limiting ring 5; simultaneously, the limiting ring 5 improves the pressure resistance of the circuit board, so that the main board 1 and the first auxiliary board 2 are arranged more stably at intervals.
Because the main board 1 and the first auxiliary board 2 have a height difference, when the circuit board is installed, the higher main board 1 is easily stressed, so that the electronic components installed on the main board 1 are extruded, and the electronic components are damaged. Therefore, in order to protect the electronic components mounted on the main board 1, a protection plate 7 parallel to the main board 1 is provided on the side of the main board 1 facing the first sub-board 2. In the present embodiment, the protection plate 7 is fixed directly below the main plate 1 by pins, and the protection plate 7 is as high as the first sub-plate 2, so that the main plate 1 can be placed on a horizontal plane in a balanced manner.
Referring to fig. 1 and 2, the second sub-board 3 is connected to the main board 1 by a fixing member 6; the second auxiliary board 3 is close to the periphery of the main board 1, the second auxiliary board 3 is located on one side of the main board 1 departing from the first auxiliary board 2, and the second auxiliary board 3 is provided with an electronic component towards one side of the main board 1. Specifically, the second auxiliary board 3 is arranged close to the main board 1 and far away from the opposite side edge of the first auxiliary board 2, and the first auxiliary board 2 and the second auxiliary board 3 are both provided with thicker electronic components towards one side of the main board 1, so that the circuit board is modularized, the height of the electronic components on the circuit board is effectively reduced, and the whole structure of the circuit board becomes thinner.
The second sub-plate 3 extends to form a second connecting plate 31 near the peripheral side of the main plate 1, the second connecting plate 31 is connected with the main plate 1 through a fixing part 6, and the second connecting plate 31 is attached to the main plate 1. One side part of the second auxiliary plate 3 close to the main plate 1 extends to form a first connecting plate 21, so that the area of the second connecting plate 31 is reduced, and the cost is saved; the first connecting plate 21 is located right above the main plate 1, which facilitates the connection between the main plate 1 and the second sub-plate 3.
The principle of the first embodiment of the application is as follows: a first auxiliary plate 2 and a second auxiliary plate 3 are respectively arranged on two opposite side edges close to the main plate 1, the first auxiliary plate 2 is positioned on the lower side surface of the horizontally arranged main plate 1, and the second auxiliary plate 3 is positioned on the upper side surface of the horizontally arranged main plate 1; a thinner electronic component is arranged on the main board 1; one side of the first auxiliary board 2 facing the main board 1 is provided with a thicker electronic component, and the first auxiliary board 2 is connected with the main board 1 through a contact pin 4, so that the first auxiliary board 2 is conducted with a circuit on the upper side surface of the main board 1; the second sub-board 3 is also provided with a thicker electronic component towards one side of the main board 1, and the second sub-board 3 is connected with the main board 1 through a fixing part 6, so that the second sub-board 3 is conducted with a circuit on the lower side surface of the main board 1.
Through with mainboard 1, the first subplate 2 forms complete circuit board with the 3 concatenations of second subplate, classify the back with thicker electronic components according to the connection requirement with the circuit board, install on first subplate 2 and the second subplate 3, first subplate 2 and the second subplate 3 are located mainboard 1 relative both sides, make electronic components's on the whole circuit board highly more balanced, reduced the height of the electronic components that the structure is thicker on the circuit board, thereby make the overall structure attenuation of circuit board.
Example two;
referring to fig. 3, the present application differs from the first embodiment in that: the first auxiliary board 2 and the second auxiliary board 3 are located on the same side of the main board 1, one side faces, facing the main board 1, of the first auxiliary board 2 and the second auxiliary board 3 are used for installing thicker electronic components, the height of the electronic components with thicker structures on the circuit board is reduced, and therefore the whole structure of the circuit board becomes thinner.
The principle of the second embodiment of the present application is: through with mainboard 1, the first subplate 2 forms complete circuit board with the 3 concatenations of second subplate, classify the back with thicker electronic components according to the connection requirement with the circuit board, install on first subplate 2 and the second subplate 3, first subplate 2 and the 3 same one sides that are located mainboard 1 of second subplate, make electronic components's height more balanced on the whole circuit board, reduced the height of the electronic components that the structure is thicker on the circuit board, thereby make the overall structure attenuation of circuit board.
The embodiment of the application also discloses a power supply module.
A power module comprises a shell and the circuit board of the embodiment, and the thinned circuit board is installed in the matched shell to thin the power module, so that the application range of the power module is expanded.
The implementation principle of the power module in the embodiment of the application is as follows: the thinned circuit board of the embodiment is installed in the matched shell, so that the power supply module is thinned, and the application range of the power supply module is wider.
The embodiment of the application also discloses an LED display module.
The utility model provides a LED display module assembly includes the circuit board of above-mentioned embodiment, adopts the circuit board that forms and the attenuation by the concatenation of a plurality of plates, has reduced LED display module assembly's thickness.
The implementation principle of the LED display module is as follows: by adopting the circuit board with the thinner structure, the LED display module is thinner.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. A circuit board, characterized by: include mainboard (1) and set up in mainboard week side and be on a parallel with the subplate of mainboard, mainboard (1) with the subplate forms the difference in height, the subplate thickness is less than the thickness of mainboard (1), the subplate orientation electronic components can be installed to a side of mainboard (1), mainboard (1) through contact pin (4) with the subplate electricity is connected.
2. A circuit board according to claim 1, wherein: the auxiliary board is close to the periphery of the main board (1) and extends to form a connecting board, and the connecting board is electrically connected with the main board (1) through the contact pin (4).
3. A circuit board according to claim 2, wherein: fixing hole (211) have been seted up to the connecting plate, mainboard (1) seted up with through-hole (11) of the coaxial setting of fixing hole (211), the one end of contact pin (4) is fixed in fixing hole (211), the other end of contact pin (4) is fixed in through-hole (11).
4. A circuit board according to claim 3, wherein: the number of the contact pins (4) is two.
5. A circuit board according to claim 3, wherein: the middle part of contact pin (4) week is equipped with spacing ring (5), the one end butt of spacing ring (5) in mainboard (1), the other end butt of spacing ring (5) in the subplate.
6. A circuit board according to claim 1, wherein: one side of the main plate (1) facing the auxiliary plate is provided with a protection plate (7) parallel to the main plate (1).
7. A power module, characterized by: a circuit board comprising any one of claims 1-6.
8. The utility model provides a LED display module assembly which characterized in that: a circuit board comprising any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122978980.0U CN216291606U (en) | 2021-11-29 | 2021-11-29 | Circuit board, power module and LED display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122978980.0U CN216291606U (en) | 2021-11-29 | 2021-11-29 | Circuit board, power module and LED display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216291606U true CN216291606U (en) | 2022-04-12 |
Family
ID=81041774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122978980.0U Active CN216291606U (en) | 2021-11-29 | 2021-11-29 | Circuit board, power module and LED display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216291606U (en) |
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2021
- 2021-11-29 CN CN202122978980.0U patent/CN216291606U/en active Active
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