CN216287810U - SMD thermal-link composite piezoresistor assembly - Google Patents

SMD thermal-link composite piezoresistor assembly Download PDF

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Publication number
CN216287810U
CN216287810U CN202122567155.1U CN202122567155U CN216287810U CN 216287810 U CN216287810 U CN 216287810U CN 202122567155 U CN202122567155 U CN 202122567155U CN 216287810 U CN216287810 U CN 216287810U
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resistor
electrode plate
frame
fuse link
connecting block
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CN202122567155.1U
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Chinese (zh)
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孙日光
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Huizhou Chuangde Lightning Protection Electronics Co ltd
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Huizhou Chuangde Lightning Protection Electronics Co ltd
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Abstract

The utility model discloses a surface-mounted thermal fusing composite piezoresistor component, which comprises an outer frame and a resistor, and is characterized in that: the resistor is installed inside the frame, and the frame includes louvre, rubber pad and connecting block, and the resistor includes electrode piece, fuse link, first resistor, second resistor, first electrode, second electrode, porcelain body layer, recess, fixed block, connecting rod and lower electrode piece. This compound piezoresistor subassembly of SMD thermal fusing, the fuse link can make the use of pressure-sensitive more convenient, the design adjustment space of circuit has been increased, direct connected mode has reduced the not thorough risk of fusing simultaneously, the frame has protected first resistor and second resistor not receive outside striking to damage under special environment, also can make first resistor and second resistor connect more stably simultaneously, let first resistor and second resistor can not skew because the vibrating device that the during operation produced has at work.

Description

SMD thermal-link composite piezoresistor assembly
Technical Field
The utility model relates to the technical field of resistors, in particular to a surface-mounted thermal fusing composite piezoresistor component.
Background
The piezoresistor is a resistor with nonlinear voltage-current characteristics, has the characteristics of high current resistance, energy absorption and the like, and when a circuit in which the piezoresistor is arranged bears transient high voltages such as lightning stroke, static electricity and the like, the resistance value of the piezoresistor can be rapidly reduced to several ohms within tens of nanoseconds, so that the high current generated by high voltage is conducted, a circuit system or an element connected with the piezoresistor in parallel is prevented from being subjected to overvoltage breakdown, and the effect of protecting the element or the circuit is achieved. The piezoresistor commonly used in the industry is a lead type structure, which is composed of a cylindrical piezoresistor substrate, electrodes symmetrically attached to the substrate, leads welded to the electrodes through soldering tin, and an insulating layer wrapping silver sheets, the electrodes and part of the leads. The existing resistors are mainly of a lead type, so that the design adjustment space of a circuit is reduced, the risk of fusing is increased, and meanwhile, the device is deviated due to vibration generated during the operation of the resistors, so that the working efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a surface-mounted thermal fusing composite type piezoresistor component, wherein a fuse link can enable the use of pressure sensitivity to be more convenient, the design adjustment space of a circuit is enlarged, meanwhile, the risk of incomplete fusing is reduced by a direct connection mode, a first resistor and a second resistor are protected by an outer frame under a special environment from being damaged by external impact, meanwhile, the first resistor and the second resistor can be connected more stably, the first resistor and the second resistor cannot deviate due to a vibration device generated during working when the first resistor and the second resistor work, and the problems in the prior art can be solved.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a compound piezoresistor subassembly of SMD thermal-link, includes frame and resistor, its characterized in that: the resistor is installed inside the frame, and the frame includes louvre, rubber pad and connecting block, and rubber pad and connecting block are installed inside the frame, and the resistor includes last electrode piece, fuse-link, first resistor, second resistor, first electrode, second electrode, porcelain body layer, recess, fixed block, connecting rod and lower electrode piece, and first resistor and second resistor top are provided with electrode piece and fuse-link, and first resistor and second resistor bottom are provided with lower electrode piece.
Preferably, the louvre has all been seted up at both ends about the frame, and frame inner wall upper end links to each other with rubber pad one side, and the connecting block is all installed to frame inner wall both sides to connecting block center department has seted up the hole, and connecting rod one end can be inlayed in the hole that connecting block center department seted up.
Preferably, the first resistor and the second resistor are of an integral structure, a groove is formed between the first resistor and the second resistor, the bottom ends of the first resistor and the second resistor are mounted at the lower end of the lower electrode plate, the length of the lower electrode plate is longer than the length of the first resistor and the length of the second resistor, and the width of the lower electrode plate is shorter than the width of the first resistor and the width of the second resistor.
Preferably, the upper ends of the first resistor and the second resistor are connected with the bottom end of the fuse link, the upper end of the fuse link is connected with the lower end of the upper electrode plate, the upper end of the upper electrode plate is connected with the bottom end of the rubber pad, the width and the length of the upper electrode plate are smaller than those of the fuse link, the width and the length of the fuse link are smaller than those of the upper ends of the first resistor and the second resistor, one side of the second resistor is connected with one end of the fixed block, and the other end of the fixed block is connected with one side of the connecting rod.
Preferably, a porcelain body layer is arranged on one side of the outer walls of the first resistor and the second resistor, a first electrode is arranged in the first resistor, and a second electrode is arranged in the second resistor.
Compared with the prior art, the utility model has the following beneficial effects:
this compound piezoresistor subassembly of SMD thermal fusing, first resistor and second resistor upper end and fuse-link bottom lug connection, can make the use of pressure-sensitive more convenient, the design adjustment space of circuit has been increased, direct connected mode has reduced the not thorough risk of fusing simultaneously, the frame has protected first resistor and second resistor not receive outside striking damage under special environment, also can make first resistor and second resistor connect more stably simultaneously, let first resistor and second resistor can not have because the vibrations device that the during operation produced has the skew to the certain extent during operation.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an outer frame structure according to the present invention;
FIG. 3 is a schematic diagram of the resistor structure of the present invention;
FIG. 4 is a schematic view of the structure of the porcelain body layer of the present invention.
In the figure: 1. an outer frame; 101. heat dissipation holes; 102. a rubber pad; 103. connecting blocks; 2. a resistor; 201. an electrode plate is arranged; 202. a fuse link; 203. a first resistor; 204. a second resistor; 205. a first electrode; 206. a second electrode; 207. a porcelain body layer; 208. a groove; 209. a fixed block; 210. a connecting rod; 211. and a lower electrode plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a surface mount type thermal fuse composite varistor assembly includes an outer frame 1 and a resistor 2, and is characterized in that: the resistor 2 is arranged inside the outer frame 1, the outer frame 1 comprises heat dissipation holes 101, a rubber pad 102 and a connecting block 103, the rubber pad 102 and the connecting block 103 are arranged inside the outer frame 1, the heat dissipation holes 101 are formed in the upper end and the lower end of the outer frame 1, the upper end of the inner wall of the outer frame 1 is connected with one side of the rubber pad 102, the connecting block 103 is arranged on two sides of the inner wall of the outer frame 1, a hole is formed in the center of the connecting block 103, one end of a connecting rod 210 can be embedded into the hole formed in the center of the connecting block 103, the outer frame 1 protects a first resistor 203 and a second resistor 204 from being damaged by external impact in a special environment, meanwhile, the first resistor 203 and the second resistor 204 can be connected more stably, the first resistor 203 and the second resistor 204 cannot deviate due to a vibrating device generated in working, the resistor 2 comprises an upper electrode plate 201, a fuse sheet 202, the first resistor 203, the second resistor 204, A second resistor 204, a first electrode 205, a second electrode 206, a ceramic layer 207, a groove 208, a fixed block 209, a connecting rod 210 and a lower electrode sheet 211, wherein the top ends of the first resistor 203 and the second resistor 204 are provided with an upper electrode sheet 201 and a fuse link 202, the bottom ends of the first resistor 203 and the second resistor 204 are provided with the lower electrode sheet 211, the first resistor 203 and the second resistor 204 are of an integral structure, the groove 208 is formed between the first resistor 203 and the second resistor 204, the bottom ends of the first resistor 203 and the second resistor 204 are arranged at the lower end of the lower electrode sheet 211, the length of the lower electrode sheet 211 is longer than that of the first resistor 203 and the second resistor 204, the width of the lower electrode sheet 211 is shorter than that of the first resistor 203 and the second resistor 204, the upper ends of the first resistor 203 and the second resistor 204 are connected with the bottom end of the fuse link 202, the upper ends of the first resistor 203 and the second resistor 204 are directly connected with the bottom end of the fuse link 202, the pressure-sensitive use can be more convenient, the design adjustment space of the circuit is increased, meanwhile, the risk of incomplete fusing is reduced by a direct connection mode, the upper end of the fuse link 202 is connected with the lower end of the upper electrode plate 201, the upper end of the upper electrode plate 201 is connected with the bottom end of the rubber pad 102, the width and the length of the upper electrode plate 201 are smaller than those of the fuse link 202, the width and the length of the fuse link 202 are smaller than those of the upper ends of the first resistor 203 and the second resistor 204, one side of the second resistor 204 is connected with one end of the fixed block 209, the other end of the fixed block 209 is connected with one side of the connecting rod 210, a porcelain body layer 207 is arranged on one side of the outer walls of the first resistor 203 and the second resistor 204, a first electrode 205 is arranged inside the first resistor 203, and a second electrode 206 is arranged inside the second resistor 204.
In summary, in the chip thermal-fusing composite varistor assembly, the upper ends of the first resistor 203 and the second resistor 204 are directly connected to the bottom end of the fuse link 202, so that the varistor can be used more conveniently, the design adjustment space of the circuit is increased, meanwhile, the risk of incomplete fusing is reduced by the direct connection mode, the first resistor 203 and the second resistor 204 are protected by the outer frame 1 under a special environment from being damaged by external impact, and meanwhile, the first resistor 203 and the second resistor 204 can be connected more stably, so that the first resistor 203 and the second resistor 204 cannot deviate due to a vibration device generated during working when working.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a compound piezoresistor subassembly of SMD thermal-link, includes frame (1) and resistor (2), its characterized in that: the resistor (2) is installed inside the outer frame (1), the outer frame (1) comprises heat dissipation holes (101), a rubber pad (102) and a connecting block (103), the rubber pad (102) and the connecting block (103) are installed inside the outer frame (1), the resistor (2) comprises an upper electrode plate (201), a fuse link (202), a first resistor (203), a second resistor (204), a first electrode (205), a second electrode (206), a ceramic body layer (207), a groove (208), a fixing block (209), a connecting rod (210) and a lower electrode plate (211), the upper electrode plate (201) and the fuse link (202) are arranged on the top ends of the first resistor (203) and the second resistor (204), and the lower electrode plate (211) is arranged at the bottom ends of the first resistor (203) and the second resistor (204).
2. The surface mount type thermal-fusing composite varistor assembly according to claim 1, wherein: louvre (101) have all been seted up at both ends about frame (1), and frame (1) inner wall upper end links to each other with rubber pad (102) one side, and connecting block (103) are all installed to frame (1) inner wall both sides to connecting block (103) center department has seted up the hole, and connecting rod (210) one end can be inlayed in the hole that connecting block (103) center department seted up.
3. The surface mount type thermal-fusing composite varistor assembly according to claim 1, wherein: the first resistor (203) and the second resistor (204) are of an integral structure, a groove (208) is formed between the first resistor (203) and the second resistor (204), the bottom ends of the first resistor (203) and the second resistor (204) are installed at the lower end of the lower electrode plate (211), the length of the lower electrode plate (211) is longer than that of the first resistor (203) and the second resistor (204), and the width of the lower electrode plate (211) is shorter than that of the first resistor (203) and the second resistor (204).
4. The surface mount type thermal-fusing composite varistor assembly according to claim 1, wherein: the upper ends of the first resistor (203) and the second resistor (204) are connected with the bottom end of the fuse link (202), the upper end of the fuse link (202) is connected with the lower end of the upper electrode plate (201), the upper end of the upper electrode plate (201) is connected with the bottom end of the rubber pad (102), the width and the length of the upper electrode plate (201) are smaller than those of the fuse link (202), the width and the length of the fuse link (202) are smaller than those of the upper ends of the first resistor (203) and the second resistor (204), one side of the second resistor (204) is connected with one end of the fixed block (209), and the other end of the fixed block (209) is connected with one side of the connecting rod (210).
5. The surface mount type thermal-fusing composite varistor assembly according to claim 1, wherein: a porcelain body layer (207) is arranged on one side of the outer walls of the first resistor (203) and the second resistor (204), a first electrode (205) is arranged inside the first resistor (203), and a second electrode (206) is arranged inside the second resistor (204).
CN202122567155.1U 2021-10-25 2021-10-25 SMD thermal-link composite piezoresistor assembly Active CN216287810U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122567155.1U CN216287810U (en) 2021-10-25 2021-10-25 SMD thermal-link composite piezoresistor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122567155.1U CN216287810U (en) 2021-10-25 2021-10-25 SMD thermal-link composite piezoresistor assembly

Publications (1)

Publication Number Publication Date
CN216287810U true CN216287810U (en) 2022-04-12

Family

ID=81071569

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122567155.1U Active CN216287810U (en) 2021-10-25 2021-10-25 SMD thermal-link composite piezoresistor assembly

Country Status (1)

Country Link
CN (1) CN216287810U (en)

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