CN216286213U - Vibrating wire signal acquisition equipment - Google Patents
Vibrating wire signal acquisition equipment Download PDFInfo
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- CN216286213U CN216286213U CN202122383824.XU CN202122383824U CN216286213U CN 216286213 U CN216286213 U CN 216286213U CN 202122383824 U CN202122383824 U CN 202122383824U CN 216286213 U CN216286213 U CN 216286213U
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Abstract
The utility model discloses vibrating wire signal acquisition equipment which comprises a vibrating wire signal acquisition main board, a vibrating wire type sensor, a lightning protection plate and a power supply module, wherein the vibrating wire signal acquisition main board is connected with the vibrating wire type sensor; the vibrating wire signal acquisition main board is provided with a vibrating wire acquisition module and an MCU module; the lightning protection plate is arranged on the vibrating wire signal acquisition main board and is fixedly connected with the vibrating wire signal acquisition main board through a plug connector; the vibrating wire type sensor is electrically connected with the MCU module through the vibrating wire acquisition module and is used for uploading vibrating wire signals to the MCU module through the vibrating wire acquisition module; the power supply module is electrically connected with the MCU module and is used for providing a power supply for the MCU module; the lightning protection plate is used for absorbing energy generated when equipment is struck by lightning. The utility model has no problem of secondary wiring on the equipment site, and has the characteristics of simple installation mode of the lightning protection plate, small equipment volume and the like.
Description
Technical Field
The utility model relates to a signal acquisition device, in particular to vibrating wire signal acquisition equipment.
Background
The vibrating wire sensor is a resonant sensor with a strained rigid wire as a sensitive element. After the length of the rigid string is determined, the magnitude of the tensile force borne by the rigid string can be inferred through the vibration frequency variation of the rigid string, and an electric signal corresponding to the tensile force can be deduced through a corresponding measuring circuit. Because the vibrating wire sensor directly outputs the natural vibration frequency signal of the vibrating wire, the vibrating wire sensor has the advantages of strong anti-interference capability, small zero drift, stable performance, long service life and the like, and is widely applied to the field of engineering measurement.
However, the existing vibrating wire signal acquisition equipment is not provided with a lightning protection circuit, generally, the lightning protection plate is externally connected, and then the lightning protection plate and the acquisition equipment are placed in the metal box together, so that the problems of difficult wiring, overlarge volume of the metal box and the like exist.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide vibrating wire signal acquisition equipment which can solve the problems of large volume, difficult secondary wiring and the like of the conventional vibrating wire signal acquisition equipment.
The purpose of the utility model is realized by adopting the following technical scheme:
a vibrating wire signal acquisition device comprises a vibrating wire signal acquisition main board, a vibrating wire type sensor, a lightning protection plate and a power supply module; the vibrating wire signal acquisition main board is provided with a vibrating wire acquisition module and an MCU module; the lightning protection plate is arranged on the vibrating wire signal acquisition main board and is fixedly connected with the vibrating wire signal acquisition main board through a plug connector; the vibrating wire type sensor is electrically connected with the MCU module through the vibrating wire acquisition module and is used for uploading vibrating wire signals to the MCU module through the vibrating wire acquisition module; the power supply module is electrically connected with the MCU module and is used for providing a power supply for the MCU module; the lightning protection plate is used for absorbing energy generated when equipment is struck by lightning.
Furthermore, a sensor signal wire of the vibrating wire sensor is installed on the lightning protection plate, so that the vibrating wire sensor is connected with the vibrating wire acquisition module through the lightning protection plate and used for transmitting a vibrating wire signal to the vibrating wire acquisition module through the sensor signal wire and uploading the vibrating wire signal to the MCU module through the vibrating wire acquisition module.
Further, the vibrating wire signal acquisition main board and the lightning protection board are arranged in a laminated mode.
Further, the vibrating wire signal acquisition main board is also provided with one or more of the following modules: the device comprises a storage module, a 4G module, a communication interface module and a voltage and current detection module; the storage module, the 4G module, the communication interface module and the voltage and current detection module are respectively electrically connected with the MCU module; one end of the voltage and current detection module is electrically connected with an external input power supply, and the other end of the voltage and current detection module is electrically connected with the MCU module and is used for detecting the voltage and the current of the external input power supply and uploading the detection result to the MCU module;
the communication interface module comprises a 485 interface module and a USB interface module; the MCU module is electrically connected with the 485 equipment through the 485 interface module; the MCU module is electrically connected with the USB equipment through the USB interface module;
the MCU module is in communication connection with the remote terminal through the 4G module and is used for carrying out data interaction with the remote terminal.
Further, the voltage and current detection module comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a chip U1 and a chip U2; one end of the resistor R2 is grounded, and the other end is electrically connected with an external input power supply through the resistor R1; a first input end of the MCU module is connected between the resistor R1 and the resistor R2 and used for acquiring a first data signal; the port 2 of the chip U1 is grounded, the port 5 is connected with a 3.3V power supply, the port 3 is connected with an external input power supply, the port 4 is electrically connected with the port 3 of the chip U1 through a resistor R3, the port 1 is grounded through a resistor R4, and the port 1 is electrically connected with the port 2 of the chip U2;
the port 1 of the chip U1 is electrically connected with the second input end of the MCU module through a resistor R5 and is used for inputting a second data signal to the MCU module;
a port 2 of the chip U2 is grounded, the port 2 is electrically connected with a port 1 of the chip U1 through a resistor R4, a port 4 is electrically connected with a port 1 of the chip U2, and a port 5 is connected with a 3.3V power supply; the port 1 is electrically connected with a second input end of the MCU module through a resistor R5;
one end of the capacitor C1 is grounded, and the other end is electrically connected to the port 1 of the chip U2 through the resistor R5.
Furthermore, a power supply module is also arranged on the vibrating wire signal acquisition main board; the power supply module comprises a 5V power supply module and a 3.3V power supply module; the input end of the 5V power supply module is electrically connected with an external input power supply through a resistor R3, and the output end of the 5V power supply module is used for outputting a 5V power supply; the input end of the 3.3V power supply module is used for inputting a 5V power supply, and the output end of the 3.3V power supply module is used for outputting a 3.3V power supply.
Further, the 5V power module includes a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C44, a resistor R11, a resistor R12, an inductor L1, a chip U4, a pull-up resistor R6, a pull-up resistor R8, a resistor R7, a triode Q1, a capacitor C2, and a MOS transistor Q2; a port 7 and a port 5 of a chip U4 are both connected to an external input power supply through a resistor R3, the port 5 and the port 7 are both grounded through a capacitor C5 and a capacitor C6, a port 3 is grounded through a capacitor C44, a port 6 and a port 8 are grounded, a port 9 is grounded, a port 1 is electrically connected with a port 2 of a chip U4 through a capacitor C3, the port 1 is also electrically connected with a source electrode of a MOS transistor Q2 through an inductor L1, and a port 4 is grounded through a resistor R12;
one end of the capacitor C17 is electrically connected to the port 4 of the chip U4, and the other end is electrically connected to the port 1 of the chip U4 through the inductor L1;
the negative electrode of the capacitor C4 is grounded, and the positive electrode of the capacitor C4 is electrically connected with the port 1 of the chip U4 through the inductor L1; one end of the resistor R11 is electrically connected with the port 1 of the chip U4 through the inductor L1, and the other end of the resistor R12 is grounded; the port 4 of the chip U4 is also connected between the resistor R11 and the resistor R12;
one end of a pull-up resistor R6 is electrically connected with the port 1 of the chip U4 through an inductor L1, and the other end of the pull-up resistor R6 is electrically connected with the base electrode of the triode Q1 through a resistor R7; one end of a pull-up resistor R8 is electrically connected with the port 1 of the chip U4 through an inductor L1, and the other end of the pull-up resistor R8 is electrically connected with the collector of the triode Q1; the pull-up resistor R8 is also electrically connected with the gate of the MOS transistor Q2; the drain electrode of the MOS transistor Q2 outputs a 5V power supply, the drain electrode is grounded through a capacitor C2, and the grid electrode is connected between a pull-up resistor R8 and the collector electrode of a triode Q1;
the emitter of the triode Q1 is grounded;
the 3.3V power supply module comprises a capacitor C32, a capacitor C10, a capacitor C8 and a chip U28; the port 1 of the chip U28 is grounded, the port 2 outputs 3.3V power supply, the port 3 is connected with 5V power supply, and the port 3 is grounded through a capacitor C32;
one end of the capacitor C10 is grounded, and the other end is connected with a 3.3V power supply; the negative electrode of the capacitor C8 is grounded, and the positive electrode is connected with a 3.3V power supply.
Furthermore, the vibrating wire signal acquisition main board is also provided with a watchdog module; the first end of the watchdog module is electrically connected with the MCU module and used for regularly transmitting data signals to the MCU module and receiving feedback signals of the MCU module; the second end of the watchdog module is electrically connected with the power supply module and used for disconnecting the power supply module from the MCU module when the MCU module is abnormal or the system reaches a preset time, so that the MCU module enters a restart state;
the watchdog module comprises a chip U3; the port 1 of the chip U3 is electrically connected with the 5V power supply module, and the port 4 and the port 5 are electrically connected with the MCU module; a port 16 of the chip U3 is connected with a 3.3V power supply, a port 15 is connected with a 5V power supply, and a port 14 is grounded; the chip U3 sends signals through a port 4 and a port 5 at regular time and receives feedback signals of the MCU module; once the chip U3 cannot detect a feedback signal of the MCU module or the system time reaches the preset time, outputting a low level through the port 1 to control the 5V power supply module not to work, disconnecting the power supply of the MCU module, enabling the 3.3V power supply module not to work, enabling the chip U3 to be in a power-off state, and enabling the port 1 of the chip U3 to be in a high configuration state; at this time, the 5V power module restarts working under the action of the pull-up resistor R6 and the pull-up resistor R8 and outputs a 5V power, and the MCU module is restarted after being connected to the power supply.
Further, the device also comprises a temperature and humidity sensor; the temperature and humidity sensor is electrically connected with the MCU module and used for detecting the temperature and humidity of the vibrating wire signal acquisition equipment installation site and uploading the temperature and humidity to the MCU module, and the temperature and humidity sensor comprises a pull-up resistor R9, a pull-up resistor R10 and a chip U9; one end of the pull-up resistor R9 is connected to a 3.3V power supply, and the other end of the pull-up resistor R9 is electrically connected with the port 2 of the chip U9; one end of the pull-up resistor R10 is connected with a 3.3V power supply, and the other end of the pull-up resistor R10 is electrically connected with a port 3 of a chip U9; the port 1 of the chip U9 is grounded, the port 6 is suspended, the port 5 is grounded, the port 4 is connected with a 3.3V power supply, and the port 2 and the port 3 are respectively electrically connected with the IIC interface of the MCU module.
Further, the device also comprises a touch screen; the touch screen is electrically connected with the MCU module and used for displaying the acquired sensor data and the working state of the equipment.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the lightning protection plate is arranged on the vibrating wire signal acquisition mainboard of the vibrating wire acquisition equipment, and the lightning protection plate is connected with the vibrating wire signal acquisition mainboard in a plug connector manner, so that the lightning protection plate is simple to install, secondary wiring can be avoided in an equipment installation site, the lightning protection of the vibrating wire acquisition equipment is realized, and the problem of large size of a metal box body of the equipment caused by the need of externally connecting the lightning protection plate in the prior art is solved.
Drawings
FIG. 1 is a block diagram of a vibrating wire signal collecting device according to the present invention;
FIG. 2 is a circuit diagram of a 5V power module;
FIG. 3 is a circuit diagram of a 3.3V power module;
FIG. 4 is a circuit diagram of a voltage current detection module;
FIG. 5 is a circuit diagram of a watchdog module;
fig. 6 is a circuit diagram of the temperature and humidity sensor.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
According to the utility model, the plug connector is arranged on the mainboard of the vibrating wire signal acquisition equipment and is used for connecting and fixing the lightning protection plate, so that the lightning protection plate is fixed on the mainboard of the vibrating wire signal acquisition equipment, and secondary wiring during installation of the vibrating wire signal acquisition equipment is avoided.
The utility model provides a preferred embodiment, and relates to a vibrating wire signal acquisition device, which comprises a vibrating wire signal acquisition main board, a lightning protection board and a vibrating wire type sensor, as shown in fig. 1.
The lightning protection plate is arranged on the vibrating wire signal acquisition mainboard, is fixed on the vibrating wire signal acquisition mainboard through the plug connector and is used for absorbing energy when the equipment is struck by lightning, so that all parts on the equipment are prevented from being damaged. Simultaneously, this embodiment is fixed with the mode of plug connector through gathering mainboard with lightning protection board and vibrating wire signal, and its installation is simple, avoids the on-the-spot secondary wiring of equipment fixing.
Furthermore, the lightning protection plate and the vibrating wire signal acquisition main board are stacked, so that the size of the whole equipment is further reduced.
The plug-in components in this embodiment can play the fixed action to vibrating wire signal acquisition mainboard and lightning protection board on the one hand, and on the other hand still is used for transmitting the vibrating wire signal of vibrating wire sensor to vibrating wire signal acquisition mainboard, realizes the collection of vibrating wire signal.
Preferably, the vibrating wire signal acquisition main board is further provided with an MCU module and a vibrating wire acquisition module. One end of the vibrating wire acquisition module is electrically connected with the vibrating wire type sensor, and the other end of the vibrating wire acquisition module is electrically connected with the MCU module and used for sending an excitation signal to the vibrating wire type sensor according to a control signal sent by the MCU module, so that a vibrating wire signal sent by the vibrating wire type sensor is obtained and transmitted to the MCU module. More specifically, the vibrating wire acquisition module in this embodiment selects different relay channels by using a 74HC164 shift register to complete acquisition of 8-channel vibrating wire sensor signals, reads the frequency of the vibrating wire sensor through the stability control VM501 module, and sends the data to the MCU module through a serial port.
Specifically, the MCU module is realized by adopting a chip with the model STM32L496VGT6, the chip has an excellent low-power consumption technology, and the device energy consumption can be reduced by entering a sleep mode when not measuring.
Further, the vibrating wire signal acquisition main board is also provided with one or more combinations of the following modules: the device comprises a storage module, a communication interface module, a 4G module, a voltage and current detection module and a watchdog module. The storage module, the 4G module, the communication interface module, the voltage and current detection module and the watchdog module are respectively electrically connected with the MCU module.
The communication interface module comprises a 485 interface module and a USB interface module. The MCU module is connected with 485 equipment through a 485 interface module and is used for data communication with the 485 equipment. The MCU module is connected with the USB interface equipment through the USB interface module and is used for carrying out data communication with the USB equipment.
The 4G module is electrically connected with the MCU module and is used for realizing communication between the MCU module and a remote terminal so as to upload the acquired vibrating wire signal to the remote terminal, for example, to a cloud. Likewise, the MCU module may also receive a remote instruction, such as an OTA upgrade instruction, a remote restart instruction, a remote test instruction, etc., sent by the remote terminal through the 4G module. Meanwhile, the utility model can also upload the running state data of the equipment to the remote terminal through the 4G module, judge whether the equipment works abnormally in real time, can realize the timely maintenance to the equipment, can solve the problem that the running state of the equipment can not be uploaded in time by the existing vibrating wire signal acquisition equipment, which causes the equipment can not be maintained in time.
The voltage and current detection module is electrically connected with the MCU module and used for detecting the voltage and the current of the power supply and uploading the voltage and the current to the MCU module. Specifically, the AD conversion interface of the MCU module is electrically connected to the voltage/current detection module for realizing power consumption, power supply voltage, and the like of the power supply module to detect whether the power supply is abnormal. Through increasing voltage electric current detection module, can detect power consumption and the supply voltage of power module to judge whether the power supply is unusual or equipment is ageing etc. realize the timely maintenance to equipment.
The storage module is electrically connected with the MCU module and used for storing various monitoring data and data acquired by the vibrating wire type sensor. The data are stored by providing an external large-capacity storage module, so that the collected data can be conveniently inquired. The chip of the storage module adopts Huabang W25Q128JVSIQ, has 128Mb memory and can store 10000 pieces of memory.
The watchdog module is electrically connected with the MCU module and is used for carrying out data communication with the MCU module at regular time so as to judge whether the MCU module operates normally; and controlling the MCU module to disconnect the power supply once the MCU module is detected to be abnormally operated so as to restart the MCU module. Through setting up the watchdog module, can in time judge whether MCU module is in unusually, avoid equipment to be in the dead halt state. In addition, in this embodiment, a timed restart program may be set by the watchdog module, and once the system running time reaches the preset time, the MCU module is controlled to turn off the power supply, so that the device is restarted, the device data is periodically cleared, and the memory overflow of the MCU module is avoided.
Preferably, the vibrating wire signal acquisition main board is further provided with a power supply module. The power module is used for providing power for the whole equipment. Because the vibrating wire signal acquisition main board is provided with various different types of modules, and the required power supply voltages of different modules are different, the power supply module is arranged in the embodiment and used for converting an externally input 9V-36V power supply into a power supply with corresponding voltage so as to enable each module to normally operate. Specifically, the power supply module includes a 5V power supply module and a 3.3V power supply module. Wherein, power module, the accessible adopts LM23630 switching power supply chip to carry out the DCDC transform, converts external power supply into 5V power, supplies uses such as 4G module, vibrating wire signal acquisition mainboard. And the 3.3V power supply module adopts an LDO voltage reduction chip to convert a 5V power supply into a 3.3V power supply for the use of the MCU module, the storage module, the watchdog module, the communication module and the like. The LDO voltage reduction chip is adopted to realize voltage reduction of the power supply, circuit ripples can be reduced, and equipment reliability is improved. Specifically, as shown in fig. 2, the 5V power module includes a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C44, a resistor R11, a resistor R12, an inductor L1, a chip U4, a pull-up resistor R6, a pull-up resistor R8, a resistor R7, a transistor Q1, a capacitor C2, and a MOS transistor Q2.
The port 7 and the port 5 of the chip U4 are both electrically connected to an external power supply for accessing an external power supply signal.
The ports 5 and 7 of the chip U4 are grounded through the capacitors C5 and C6. The filtering of the input power signal is performed by capacitor C5 and capacitor C6.
The port 3 of the chip U4 is grounded through a capacitor C44, the ports 6 and 8 are grounded, the port 9 is grounded, the port 1 is electrically connected with the port 2 of the chip U4 through a capacitor C3, the port 1 further outputs a first internal power signal 5V _ IN through an inductor L1, and the port 4 is grounded through a resistor R12.
One end of the capacitor C17 is electrically connected to the port 4 of the chip U4, and the other end is electrically connected to the port 1 of the chip U4 through the inductor L1.
The negative electrode of the capacitor C4 is grounded, and the positive electrode is electrically connected to the port 1 of the chip U4 through the inductor L1. One end of the resistor R11 is electrically connected to the port 1 of the chip U4 through the inductor L1, and the other end is grounded through the resistor R12. Port 4 of chip U4 is also connected between resistor R11 and resistor R12.
One end of the pull-up resistor R6 is connected to the first internal power signal 5V _ IN, and the other end is electrically connected to the base of the triode Q1 through the resistor R7. One end of the pull-up resistor R8 is connected to the first internal power signal 5V _ IN, and the other end is electrically connected to the collector of the transistor Q1. The pull-up resistor R8 is also electrically connected to the gate of the MOS transistor Q2.
The source of the MOS transistor Q2 is connected to the first internal power signal 5V _ IN, and the drain outputs 5V power.
The emitter of transistor Q1 is connected to ground. The drain of the MOS transistor Q2 is also grounded via a capacitor C2, and the gate is connected between the pull-up resistor R8 and the collector of the transistor Q1.
And the power supply module is used for converting an external input power supply into a 5V power supply for a corresponding module in the system to use.
More preferably, as shown in fig. 3, the 3.3V power module includes a capacitor C32, a capacitor C10, a capacitor C8, and a chip U28. The port 1 of the chip U28 is grounded, the port 2 outputs 3.3V power, the port 3 is connected to 5V power, and the port 3 is grounded through a capacitor C32. The chip U28 is LM1117F-3.3
One end of the capacitor C10 is grounded, and the other end is connected with a 3.3V power supply. The negative electrode of the capacitor C8 is grounded, and the positive electrode is connected with a 3.3V power supply. The 3.3V power supply output by the chip U28 is filtered through the filter circuit connected by the capacitor C10 and the capacitor C8, so that the output power supply is more stable.
Specifically, as shown in fig. 4, the voltage and current detection module includes a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a chip U1, and a chip U2.
One end of the resistor R2 is grounded, and the other end is electrically connected to an external input power source through the resistor R1, and is used for receiving an input power signal VIN.
The first input end of the MCU module is connected between the resistor R1 and the resistor R2, and is used for connecting a first data signal Voltage Sense.
One end of the resistor R3 is connected to the input power signal VIN, and the other end is electrically connected to the input end of the 5V power module. That is, the port 5 and the port 7 of the chip U4 of the 5V power supply module are also connected to the external input power supply signal VIN through the resistor R3.
The port 2 of the chip U1 is grounded, the port 5 is connected with a 3.3V power supply, the port 3 is connected with an external power supply signal CIN, the port 4 is electrically connected with the port 3 of the chip U1 through a resistor R3, the port 1 is grounded through a resistor R4, and the port 1 is electrically connected with the port 2 of the chip U2.
The port 1 of the chip U2 is electrically connected to the second input terminal of the MCU module through the resistor R5, and is configured to input a second data signal Current Sense to the MCU module.
The port 2 of the chip U2 is grounded, the port 2 is electrically connected with the port 1 of the chip U1 through the resistor R4, the port 4 is electrically connected with the port 1 of the chip U2, and the port 5 is connected with a 3.3V power supply.
One end of the capacitor C1 is grounded, and the other end is electrically connected to the port 1 of the chip U2 through the resistor R5.
The chip U2 is an emitter follower, and is a negative feedback amplifier, which has high input impedance and low output impedance, can draw a small current from a signal source, and has strong load carrying capacity.
The MCU module is electrically connected with the Voltage and Current detection module, calculates a corresponding Voltage value by the collected first data signal Voltage Sense and the second data signal Current Sense, and calculates the Current according to a preset formula. The resistor R1 and the resistor R2 form a voltage dividing circuit, and the voltage of the external input power supply is transmitted to the MCU module through the voltage dividing circuit. The resistance values of the resistor R1 and the resistor R1 have a certain proportional relationship, so that voltages meeting requirements can be read by the MCU module and the MCU module is not damaged.
The resistor R4 is a voltage amplification factor adjusting resistor, and the amplification factors of different resistance values are different. For example, if the amplification factor b Is set, and the current ls flowing through the resistor R3, the final output voltage Uo Is R3.
The resistor R5 and the capacitor C1 form a low-pass filter circuit, so that data flowing to the MCU module are smoother.
More specifically, as shown in FIG. 5, the watchdog module includes a chip U3. The port 1 of the chip U3 is electrically connected to the resistor R7 of the 5V Power module, and is configured to send a Power signal to the 5V Power module to control on and off of the transistor Q1 and the MOS transistor Q2, so as to control the operating state of the 5V Power module.
Specifically, when the Power signal output by the port 1 of the chip U3 is at a low level, the triode Q1 of the 5V Power module is cut off, the MOS transistor Q2 is cut off, the 5V Power module cannot output a 5V Power, the MCU module is powered off, the 3.3V Power module cannot work, the chip U3 is also powered off, and the port Power of the chip U3 is at a high-impedance state. And due to the fact that the pull-up resistor R6 and the pull-up resistor R8 of the 5V power supply module are connected with the first internal power supply signal 5V _ IN, the grid of the MOS transistor Q2 is at a high level, the base of the triode Q1 is at a high level, the triode Q1 is conducted, the MOS transistor Q2 is conducted, the 5V power supply module starts to work again, and the MCU module is powered on again and started.
And the port 4 and the port 5 of the chip U3 are electrically connected with the MCU module and are used for timing communication with the MCU module. Once the chip U3 cannot detect a feedback signal of the MCU module, the port 1 of the chip U3 outputs a low level to control the 5V power supply module not to output a 5V power supply, and the MCU module is in a power-off state at the moment; the 3.3V power supply is not operating, chip U3 is also in a power-off state, and port 1 of chip U3 is in a high configuration state. At this time, the triode Q1 and the MOS transistor Q2 of the 5V power supply module can be conducted through the pull-up resistor R6 and the pull-up resistor R8, the 5V power supply module outputs power again, and the MCU module is connected with the power supply again to enter a restart state. According to the utility model, the abnormal restart of the MCU module can be realized through the watchdog module, so that the normal work of the MCU module is ensured; and the system can be restarted at regular time, and data can be cleaned regularly, so that memory overflow and the like can be avoided.
Further, this embodiment still includes temperature and humidity sensor. The temperature and humidity sensor is electrically connected with the MCU module and used for detecting the environmental data of the site where the equipment is located and sending the environmental data to the MCU module. Specifically, the temperature and humidity sensor can be electrically connected with the MCU module through the IIC interface. Through increasing temperature and humidity sensor, can realize gathering the environmental data of equipment job site, further learn the operational environment of equipment to know the running condition of equipment.
Preferably, as shown in fig. 6, the temperature and humidity sensor includes a pull-up resistor R9, a pull-up resistor R10, and a chip U9. One end of the pull-up resistor R9 is connected to a 3.3V power supply, and the other end is electrically connected to the port 2 of the chip U9. One end of the pull-up resistor R10 is connected to a 3.3V power supply, and the other end is electrically connected with the port 3 of the chip U9. The port 1 of the chip U9 is grounded, the port 6 is suspended, the port 5 is grounded, the port 4 is connected with a 3.3V power supply, and the port 2 and the port 3 are respectively electrically connected with the IIC interface of the MCU module.
The temperature and humidity sensor is connected with the MCU module through an IIC interface and used for uploading detected temperature data and humidity data to the MCU module.
The capacitor C3 is a decoupling capacitor, and plays a role in filtering power supply interference and reducing ripple.
Further, the present embodiment further includes a touch screen. The touch screen is electrically connected with the MCU module and used for receiving display data sent by the MCU module, such as frequency of the vibrating wire sensor, environment temperature and humidity, voltage and current of the acquisition instrument and other related data, or receiving an inquiry instruction input from outside and displaying an inquiry result through the touch screen.
The temperature and humidity detection of the field environment of the vibrating wire signal acquisition equipment is added, the power supply voltage of a power supply module of the equipment and the power consumption of the equipment are detected, the environmental abnormality and the self abnormality can be found in time, and the equipment is maintained in advance.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A vibrating wire signal acquisition device is characterized by comprising a vibrating wire signal acquisition main board, a vibrating wire type sensor, a lightning protection plate and a power supply module; the vibrating wire signal acquisition main board is provided with a vibrating wire acquisition module and an MCU module; the lightning protection plate is arranged on the vibrating wire signal acquisition main board and is fixedly connected with the vibrating wire signal acquisition main board through a plug connector; the vibrating wire type sensor is electrically connected with the MCU module through the vibrating wire acquisition module and is used for uploading vibrating wire signals to the MCU module through the vibrating wire acquisition module; the power supply module is electrically connected with the MCU module and is used for providing a power supply for the MCU module; the lightning protection plate is used for absorbing energy generated when equipment is struck by lightning.
2. The vibrating wire signal collecting device according to claim 1, wherein the sensor signal line of the vibrating wire sensor is installed on a lightning protection plate, so that the vibrating wire sensor is connected with the vibrating wire collecting module through the lightning protection plate, and is used for transmitting the vibrating wire signal to the vibrating wire collecting module through the sensor signal line and uploading the vibrating wire signal to the MCU module through the vibrating wire collecting module.
3. The vibrating wire signal acquisition device according to claim 1, wherein the vibrating wire signal acquisition main board is laminated with a lightning protection board.
4. The vibrating wire signal collecting device according to claim 1, wherein the vibrating wire signal collecting main board is further provided with one or more of the following modules: the device comprises a storage module, a 4G module, a communication interface module and a voltage and current detection module; the storage module, the 4G module, the communication interface module and the voltage and current detection module are respectively electrically connected with the MCU module; one end of the voltage and current detection module is electrically connected with an external input power supply, and the other end of the voltage and current detection module is electrically connected with the MCU module and is used for detecting the voltage and the current of the external input power supply and uploading the detection result to the MCU module;
the communication interface module comprises a 485 interface module and a USB interface module; the MCU module is electrically connected with the 485 equipment through the 485 interface module; the MCU module is electrically connected with the USB equipment through the USB interface module;
the MCU module is in communication connection with the remote terminal through the 4G module and is used for carrying out data interaction with the remote terminal.
5. The vibrating wire signal acquisition device according to claim 4, wherein the voltage and current detection module comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a chip U1 and a chip U2; one end of the resistor R2 is grounded, and the other end is electrically connected with an external input power supply through the resistor R1; a first input end of the MCU module is connected between the resistor R1 and the resistor R2 and used for acquiring a first data signal; the port 2 of the chip U1 is grounded, the port 5 is connected with a 3.3V power supply, the port 3 is connected with an external input power supply, the port 4 is electrically connected with the port 3 of the chip U1 through a resistor R3, the port 1 is grounded through a resistor R4, and the port 1 is electrically connected with the port 2 of the chip U2;
the port 1 of the chip U1 is electrically connected with the second input end of the MCU module through a resistor R5 and is used for inputting a second data signal to the MCU module;
a port 2 of the chip U2 is grounded, the port 2 is electrically connected with a port 1 of the chip U1 through a resistor R4, a port 4 is electrically connected with a port 1 of the chip U2, and a port 5 is connected with a 3.3V power supply; the port 1 is electrically connected with a second input end of the MCU module through a resistor R5;
one end of the capacitor C1 is grounded, and the other end is electrically connected to the port 1 of the chip U2 through the resistor R5.
6. The vibrating wire signal collecting device according to claim 5, wherein a power supply module is further arranged on the vibrating wire signal collecting main board; the power supply module comprises a 5V power supply module and a 3.3V power supply module; the input end of the 5V power supply module is electrically connected with an external input power supply through a resistor R3, and the output end of the 5V power supply module is used for outputting a 5V power supply; the input end of the 3.3V power supply module is used for inputting a 5V power supply, and the output end of the 3.3V power supply module is used for outputting a 3.3V power supply.
7. The vibrating wire signal acquisition equipment as claimed in claim 6, wherein the 5V power supply module comprises a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C44, a resistor R11, a resistor R12, an inductor L1, a chip U4, a pull-up resistor R6, a pull-up resistor R8, a resistor R7, a triode Q1, a capacitor C2 and a MOS tube Q2; a port 7 and a port 5 of a chip U4 are both connected to an external input power supply through a resistor R3, the port 5 and the port 7 are both grounded through a capacitor C5 and a capacitor C6, a port 3 is grounded through a capacitor C44, a port 6 and a port 8 are grounded, a port 9 is grounded, a port 1 is electrically connected with a port 2 of a chip U4 through a capacitor C3, the port 1 is also electrically connected with a source electrode of a MOS transistor Q2 through an inductor L1, and a port 4 is grounded through a resistor R12;
one end of the capacitor C17 is electrically connected to the port 4 of the chip U4, and the other end is electrically connected to the port 1 of the chip U4 through the inductor L1;
the negative electrode of the capacitor C4 is grounded, and the positive electrode of the capacitor C4 is electrically connected with the port 1 of the chip U4 through the inductor L1; one end of the resistor R11 is electrically connected with the port 1 of the chip U4 through the inductor L1, and the other end of the resistor R12 is grounded; the port 4 of the chip U4 is also connected between the resistor R11 and the resistor R12;
one end of a pull-up resistor R6 is electrically connected with the port 1 of the chip U4 through an inductor L1, and the other end of the pull-up resistor R6 is electrically connected with the base electrode of the triode Q1 through a resistor R7; one end of a pull-up resistor R8 is electrically connected with the port 1 of the chip U4 through an inductor L1, and the other end of the pull-up resistor R8 is electrically connected with the collector of the triode Q1; the pull-up resistor R8 is also electrically connected with the gate of the MOS transistor Q2; the drain electrode of the MOS transistor Q2 outputs a 5V power supply, the drain electrode is grounded through a capacitor C2, and the grid electrode is connected between a pull-up resistor R8 and the collector electrode of a triode Q1;
the emitter of the triode Q1 is grounded;
the 3.3V power supply module comprises a capacitor C32, a capacitor C10, a capacitor C8 and a chip U28; the port 1 of the chip U28 is grounded, the port 2 outputs 3.3V power supply, the port 3 is connected with 5V power supply, and the port 3 is grounded through a capacitor C32;
one end of the capacitor C10 is grounded, and the other end is connected with a 3.3V power supply; the negative electrode of the capacitor C8 is grounded, and the positive electrode is connected with a 3.3V power supply.
8. The vibrating wire signal collecting device according to claim 7, wherein the vibrating wire signal collecting main board is further provided with a watchdog module; the first end of the watchdog module is electrically connected with the MCU module and used for regularly transmitting data signals to the MCU module and receiving feedback signals of the MCU module; the second end of the watchdog module is electrically connected with the power supply module and used for disconnecting the power supply module from the MCU module when the MCU module is abnormal or the system reaches a preset time, so that the MCU module enters a restart state;
the watchdog module comprises a chip U3; the port 1 of the chip U3 is electrically connected with the 5V power supply module, and the port 4 and the port 5 are electrically connected with the MCU module; a port 16 of the chip U3 is connected with a 3.3V power supply, a port 15 is connected with a 5V power supply, and a port 14 is grounded; the chip U3 sends signals through a port 4 and a port 5 at regular time and receives feedback signals of the MCU module; once the chip U3 cannot detect a feedback signal of the MCU module or the system time reaches the preset time, outputting a low level through the port 1 to control the 5V power supply module not to work, disconnecting the power supply of the MCU module, enabling the 3.3V power supply module not to work, enabling the chip U3 to be in a power-off state, and enabling the port 1 of the chip U3 to be in a high configuration state; at this time, the 5V power module restarts working under the action of the pull-up resistor R6 and the pull-up resistor R8 and outputs a 5V power, and the MCU module is restarted after being connected to the power supply.
9. The vibrating wire signal acquisition device according to claim 1, further comprising a temperature and humidity sensor; the temperature and humidity sensor is electrically connected with the MCU module and used for detecting the temperature and humidity of the vibrating wire signal acquisition equipment installation site and uploading the temperature and humidity to the MCU module, and the temperature and humidity sensor comprises a pull-up resistor R9, a pull-up resistor R10 and a chip U9; one end of the pull-up resistor R9 is connected to a 3.3V power supply, and the other end of the pull-up resistor R9 is electrically connected with the port 2 of the chip U9; one end of the pull-up resistor R10 is connected with a 3.3V power supply, and the other end of the pull-up resistor R10 is electrically connected with a port 3 of a chip U9; the port 1 of the chip U9 is grounded, the port 6 is suspended, the port 5 is grounded, the port 4 is connected with a 3.3V power supply, and the port 2 and the port 3 are respectively electrically connected with the IIC interface of the MCU module.
10. The vibrating wire signal acquisition device according to claim 1, further comprising a touch screen; the touch screen is electrically connected with the MCU module and used for displaying the acquired sensor data and the working state of the equipment.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122383824.XU CN216286213U (en) | 2021-09-28 | 2021-09-28 | Vibrating wire signal acquisition equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122383824.XU CN216286213U (en) | 2021-09-28 | 2021-09-28 | Vibrating wire signal acquisition equipment |
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| CN216286213U true CN216286213U (en) | 2022-04-12 |
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