CN216253188U

CN216253188U - Array microphone assembly and electronic equipment

Info

Publication number: CN216253188U
Application number: CN202122870181.1U
Authority: CN
Inventors: 李振乐; 杨猛; 周飞
Original assignee: Shenzhen KTC Commercial Technology Co Ltd
Current assignee: Shenzhen KTC Commercial Technology Co Ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-04-08
Anticipated expiration: 2031-11-22

Abstract

The embodiment of the utility model provides an array microphone assembly and electronic equipment, and relates to the technical field of audio equipment. Wherein the array microphone assembly comprises a microphone control board and a sealing piece; the microphone control board comprises a plurality of sound pickup holes arranged at intervals and a first positioning part; the sealing piece is provided with a first sound pickup through hole corresponding to the plurality of sound pickup holes and a second positioning part corresponding to the plurality of first positioning parts. The sound pickup holes are aligned with the first sound pickup through holes by means of matching of the first positioning part and the second positioning part, so that the sound pickup holes and the first sound pickup through holes are accurately positioned, and the sound pickup effect of the array microphone assembly is ensured; furthermore, with the help of the tight adhesion of the front side of gum sealing member and microphone control board, improve the sealed effect of array microphone subassembly to improve the radio reception effect of array microphone subassembly, avoid appearing the problem of crosstalk, improve speech quality, and then promote user experience.

Description

Array microphone assembly and electronic equipment

Technical Field

The utility model relates to the technical field of audio equipment, in particular to an array microphone assembly and electronic equipment.

Background

Array microphone refers to an arrangement of microphones. That is to say, it is composed of a certain number of acoustic sensors (generally microphone elements) for converting sound field space voice information into electronic signals and transmitting them. Many products with human-computer interaction functions are used in the market, such as intelligent interaction tablets, mobile phones and the like. The better the sealing performance when fixing the microphone, the better the sound pickup performance under the noise environment, and the noise can be prevented from being generated inside the whole microphone.

In the prior art, a microphone assembly is generally fixed on a mounting structure by a screw and a cushion pad, and a screw passes through a microphone control board and the cushion pad of the microphone assembly and then is connected with the mounting structure. The blotter can play certain shock attenuation effect, but the vibrations that other structures of electronic equipment produced can pass through the screw and transmit for the microphone control board, influence array microphone subassembly pickup effect, crosstalk appears, leads to sound not clear enough. Or the microphone control board is embedded in the hollow buffer structure, the buffer structure is wrapped on the microphone control board, and the microphone control board is indirectly contacted with the mounting structure and the cover plate through the buffer structure. However, the buffer structure is greatly affected by thermal expansion and cold contraction, and when the buffer structure contracts, a gap is easily formed between the buffer structure and the cover plate, so that the sealing performance is poor, and crosstalk can occur.

SUMMERY OF THE UTILITY MODEL

The utility model provides an array microphone assembly and electronic equipment, and aims to solve the problem that crosstalk occurs due to poor sealing effect of the array microphone assembly in the conventional electronic equipment.

In a first aspect, an embodiment of the present invention provides an array microphone assembly applied in an electronic device, where the array microphone assembly includes a microphone control board and a sealing member; the microphone control board comprises a plurality of pickup holes arranged at intervals and a first positioning part; the sealing piece is provided with a first sound pickup through hole corresponding to the sound pickup holes and a second positioning part corresponding to the first positioning parts; the sound pickup hole is aligned with the first sound pickup through hole by means of the cooperation of the first positioning member and the second positioning member, and the sealing member is tightly adhered to the front side of the microphone control board.

The technical scheme is that the first positioning part is a through hole, the second positioning part is a protrusion, and when the protrusion is correspondingly accommodated in the through hole, the sound pickup hole is aligned with the first sound pickup through hole.

Its further technical scheme does, the rear side of microphone control board is provided with microphone component array, microphone component array includes the microphone component that a plurality of intervals set up, and is a plurality of microphone component with the pickup hole one-to-one.

The microphone array component comprises a microphone control board, a sealing piece, a microphone assembly and an array microphone assembly, wherein the microphone control board is provided with a plurality of first fixing holes and second fixing holes, and the array microphone assembly is fixed with electronic equipment through the first fixing holes and the second fixing holes.

The further technical scheme is that a guide installation part is arranged at the end part of the sealing piece to guide the array microphone assembly to be installed on the electronic equipment.

The further technical scheme is that the sealing element is bonded with the front side of the microphone control board through back adhesive.

In a second aspect, an embodiment of the present invention further provides an electronic device, including the array microphone assembly and a receiving groove disposed in a front shell of the electronic device and corresponding to the sealing element, where when the array microphone assembly is fixed to the front shell, the sealing element is received in the receiving groove; still be provided with a plurality of second pickup through-holes on the preceding shell, it is a plurality of the second pickup through-hole with first pickup through-hole one-to-one on the array microphone subassembly, the second pickup through-hole will microphone component and external intercommunication.

The technical scheme is that a plurality of fixing columns are arranged on the inner side of the front shell at intervals, and the array microphone assembly is fixed with the front shell of the electronic equipment by means of the fixing columns.

The array microphone assembly comprises a front shell, a front shell and a rear shell, wherein the front shell is fixedly connected with the front shell through a fixing piece, and the array microphone assembly is fixedly pressed on the front shell through the lower end of the fixing piece.

The sealing element is adhered to the containing groove through back glue.

According to the array microphone assembly and the electronic equipment provided by the embodiment of the utility model, the sound pickup hole is aligned with the first sound pickup through hole by means of the matching of the first positioning part and the second positioning part, so that the accurate positioning of the sound pickup hole and the first sound pickup through hole is realized, and the sound pickup effect of the array microphone assembly is ensured; and need not to fix through the screw, avoided the vibrations that other structures of electronic equipment produced to transmit for the microphone control board through the screw, influence array microphone subassembly pickup effect. Furthermore, the sealing element is closely adhered to the front side of the microphone control board through the back adhesive, so that the sealing effect of the array microphone assembly is improved, the radio reception effect of the array microphone assembly is improved, the problem of crosstalk is avoided, the conversation quality is improved, and the user experience is further improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is an exploded view of an array microphone assembly according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of an array microphone assembly according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a partial explosion structure of an electronic device according to an embodiment of the present invention;

fig. 4 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the utility model.

Reference numerals

The microphone comprises a microphone control board 1, a sound pickup hole 11, a first positioning part 12, a microphone element 13, a first fixing hole 14, a sealing part 2, a first sound pickup through hole 21, a second positioning part 22, a back adhesive 23, a second fixing hole 24, a guide installation part 25, a front shell 3, a fixing column 31, a second sound pickup through hole 32, an accommodating groove 33, a fixing support 4, an upper end part 41 and a lower end part 42.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the embodiments of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the utility model. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Referring to fig. 1 to 2, an array microphone assembly 1 according to an embodiment of the present invention is applied to an electronic device. The array microphone assembly comprises a microphone control board 1 and a sealing piece 2; the microphone control board 1 comprises a plurality of sound pickup holes 11 arranged at intervals and a first positioning part 12; the sealing member 2 is provided with a first sound pickup through hole 21 corresponding to the plurality of sound pickup holes 11 and a second positioning member 22 corresponding to the plurality of first positioning members 12; the sound pickup hole 11 is aligned with the first sound pickup through hole 21 by the cooperation of the first positioning member 12 and the second positioning member 22, and the sealing member 2 is tightly adhered to the front side of the microphone control board 1. Specifically, in one embodiment, by aligning the sound pickup hole 11 with the first sound pickup through hole 21 through the cooperation of the first positioning part 12 and the second positioning part 22, the sound pickup hole 11 and the first sound pickup through hole 21 are accurately positioned, and the sound pickup effect of the array microphone assembly is ensured; furthermore, the sealing element 2 is tightly adhered to the front side of the microphone control board 1, so that the sealing effect of the array microphone assembly can be improved, the sound receiving effect of the array microphone assembly is improved, the problem of crosstalk is avoided, the conversation quality is improved, and the user experience is further improved.

Further, the sealing element 2 and the microphone control board 1 are fixed through the structure, screws are not needed by the fixing structure, vibration generated by other structures of the electronic equipment is prevented from being transmitted to the microphone control board 1 through the screws, and the sound pickup effect of the array microphone assembly is prevented from being influenced.

Further, the first positioning component 12 is a through hole, the second positioning component 22 is a protrusion, and when the protrusion is correspondingly received in the through hole, the sound pickup hole 11 is aligned with the first sound pickup through hole 21. Specifically, in an embodiment, the cylindrical protrusions provided on the sealing member 2 are inserted into the circular through holes of the microphone control board 1, and the number of the first positioning members 12 and the second positioning members 22 is at least two, so as to perform the positioning function. Specifically, the shapes of the first positioning member 12 and the second positioning member 22 may be set by a user according to actual conditions, and are not specifically limited herein.

Further, a microphone element array is arranged on the rear side of the microphone control board 1, the microphone element array comprises a plurality of microphone elements 13 arranged at intervals, and the plurality of microphone elements 13 are in one-to-one correspondence with the sound pickup holes 11. Specifically, in one embodiment, a plurality of sound pickup holes 11 are provided on the front side of the microphone element 13 corresponding to the position of the microphone control board 1, and the microphone element 13 receives external sound through the sound pickup holes 11.

Furthermore, a plurality of first fixing holes 14 and second fixing holes 24 are correspondingly arranged on the sealing member 2 and the microphone control board 1 at intervals, and the plurality of first fixing holes 14 and second fixing holes 24 are used for fixing the array microphone assembly and the electronic device. Specifically, in one embodiment, the first fixing hole 14 and the second fixing hole 24 are coaxial through holes, and a fastener may pass through the plurality of first fixing holes 14 and the second fixing holes 24 to fix the array microphone assembly and the electronic device.

Further, a guide mounting portion 25 is provided at an end portion of the sealing member 2 to guide the array microphone assembly to be mounted on an electronic device. Specifically, the guide mounting portion 25 guides the user to correctly mount the array microphone assembly to the electronic apparatus to prevent the mounting from adversely affecting the quality of the electronic apparatus. In one embodiment, the guide mounting portion 25 is a protrusion disposed on a side of the end of the sealing member 2, and the electronic device front case is provided with a receiving groove 33 corresponding to the sealing member, so that the array microphone assembly can be mounted on the electronic device only when the protrusion of the side of the sealing member is aligned with the receiving groove 33, thereby preventing the array microphone assembly from being mounted upside down. The guide mounting portion 25 may be provided at another position than the sealing member 2, so that the array microphone assembly can be mounted on the electronic device while being distinguished from the left and right.

Further, the sealing member is bonded to the front side of the microphone control board by a back adhesive. Specifically, in an embodiment, the sealing element is made of a silicone material, and the sealing element is bonded to the front side of the microphone control board by disposing a back adhesive on the sealing element, so as to improve the sealing performance of the array microphone assembly, and the sealing element and the array microphone assembly can also be tightly bonded together by a sealing adhesive or other bonding agents.

Referring to fig. 3 to 4, an electronic device according to an embodiment of the present invention includes the above array microphone assembly and a receiving groove 33 disposed on a front case 3 of the electronic device and corresponding to the sealing member 2, wherein when the array microphone assembly is fixed to the front case 3, the sealing member 2 is received in the receiving groove 33. Specifically, in an embodiment, the accommodating groove 33 is disposed on the front case 3 of the electronic device, so as to facilitate the mounting of the array microphone assembly on the electronic device; on the other hand, the leakproofness of array microphone subassembly is improved, prevents that array microphone subassembly from because of vibrations influence the pickup effect. Therefore, the radio effect of the electronic equipment is improved, the problem of crosstalk is avoided, the call quality is improved, and the user experience is further improved.

Further, still be provided with a plurality of second pickup through-holes 32 on the preceding shell 3, it is a plurality of second pickup through-holes 32 with first pickup through-hole 21 on the array microphone subassembly one-to-one, second pickup through-hole 32 will microphone component 13 communicates with the external world. Specifically, in one embodiment, the plurality of second sound pickup through holes 32, the first sound pickup through holes 21, and the sound pickup holes 11 communicate one to one for receiving external sound.

Further, a plurality of fixing posts 31 are spaced from the inner side of the front housing 3, and the array microphone assembly is fixed to the front housing 3 of the electronic device by means of the fixing posts 31. Specifically, in an embodiment, the array microphone assembly is fixed to the front shell 3 of the electronic device through the fixing posts 31 without screws, so that the vibration generated by other structures of the electronic device is prevented from being transmitted to the array microphone assembly through the screws, and the sound pickup effect of the array microphone assembly is prevented from being affected.

Further, the microphone array further comprises a fixing support 4, an upper end portion 41 of the fixing support 4 is fixedly connected with the front shell 3 through a fixing piece, and a lower end portion 42 of the fixing support 4 fixes the array microphone assembly and the front shell 3 in a pressing mode. Specifically, in one embodiment, the array microphone assembly and the electronic device are further fixed by the fixing bracket 4 to ensure that the array microphone assembly is not affected by vibration of the sound source or vibration generated by the electronic device, wherein the fixing member may be a screw.

Further, the sealing member 2 is adhered to the accommodating groove 33 by a back adhesive 23. Specifically, in an embodiment, the sealing performance of the array microphone assembly mounted on the electronic device is further improved by the back adhesive 23, and the sealing member may also be adhered to the receiving groove 33 by a sealant or other adhesive.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, while the utility model has been described with respect to the above-described embodiments, it will be understood that the utility model is not limited thereto but may be embodied with various modifications and changes.

While the utility model has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An array microphone assembly applied to electronic equipment is characterized by comprising a microphone control board and a sealing piece; the microphone control board comprises a plurality of pickup holes arranged at intervals and a first positioning part; the sealing piece is provided with a first sound pickup through hole corresponding to the sound pickup holes and a second positioning part corresponding to the first positioning parts; the sound pickup hole is aligned with the first sound pickup through hole by means of the cooperation of the first positioning member and the second positioning member, and the sealing member is tightly adhered to the front side of the microphone control board.

2. The microphone array assembly of claim 1, wherein the first positioning member is a through hole and the second positioning member is a protrusion, and wherein the sound pickup hole is aligned with the first sound pickup through hole when the protrusion is correspondingly received in the through hole.

3. The microphone array assembly of claim 2, wherein the rear side of the microphone control board is provided with a microphone element array, the microphone element array comprises a plurality of microphone elements which are arranged at intervals, and the plurality of microphone elements correspond to the sound pickup holes in a one-to-one manner.

4. The array microphone assembly of claim 3, wherein the sealing member and the microphone control board are respectively provided with a plurality of first fixing holes and a plurality of second fixing holes at intervals, and the plurality of first fixing holes and the plurality of second fixing holes are used for fixing the array microphone assembly with an electronic device.

5. The array microphone assembly of claim 4 wherein the end of the seal member is provided with a guide mount to guide the array microphone assembly to an electronic device.

6. The array microphone assembly of claim 1 wherein the seal is bonded to the front side of the microphone control board by a backing adhesive.

7. An electronic device, comprising the array microphone assembly as claimed in any one of claims 1 to 6, and a receiving groove disposed on a front housing of the electronic device and corresponding to the sealing member, wherein the sealing member is received in the receiving groove when the array microphone assembly is fixed to the front housing; still be provided with a plurality of second pickup through-holes on the preceding shell, it is a plurality of the second pickup through-hole with first pickup through-hole one-to-one on the array microphone subassembly, the second pickup through-hole will microphone subassembly and external intercommunication.

8. The electronic device of claim 7, wherein a plurality of fixing posts are spaced on the inner side of the front housing, and the array microphone assembly is fixed with the front housing of the electronic device by the fixing posts.

9. The electronic device of claim 8, further comprising a fixing bracket, wherein an upper end of the fixing bracket is fixedly connected to the front housing through a fixing member, and a lower end of the fixing bracket presses and fixes the array microphone assembly and the front housing.

10. The electronic device of claim 9, wherein the sealing member is bonded to the receiving slot by a back adhesive.