CN216246882U - Improved TC module temperature compensation device - Google Patents
Improved TC module temperature compensation device Download PDFInfo
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- CN216246882U CN216246882U CN202122933098.4U CN202122933098U CN216246882U CN 216246882 U CN216246882 U CN 216246882U CN 202122933098 U CN202122933098 U CN 202122933098U CN 216246882 U CN216246882 U CN 216246882U
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Abstract
The utility model discloses an improved TC module temperature compensation device, which comprises an NST element and an MCU micro control unit which are electrically connected; an R1 pull-up resistor is connected in series between the NST element and the MCU micro control unit; the NST element is encapsulated by DFN 2L. The device of the utility model adopts a domestic NST element to replace the original thermistor, the cost of the NST element is lower, and the total cost of the module can be saved; an anti-interference capacitor is added at the NST element, so that the temperature measurement is more accurate and reliable; by adopting a DFN2L packaging mode, an external circuit can be directly compatible with the thermistor, the reference resistor supports pull-up and pull-down, the use is simpler and more convenient, and after a domestic chip is adopted, the related technical improvement is more independent and controllable.
Description
Technical Field
The utility model relates to the technical field of thermal power plant TC module acquisition, in particular to a device for improving temperature compensation of a TC module.
Background
In a thermal generator set, the temperature acquisition and processing are vital, some important equipment, such as a steam turbine, a boiler, a generator, a coal mill, a feed pump and the like, are provided with perfect temperature measuring elements, and the temperature is required to be within a reasonable range during the operation of the equipment so as to ensure the safe and stable operation of the equipment. The temperature of the TC type is a more complex measurement mode among all temperature types, and because the temperature range measured by the TC type element is higher, the requirement for measurement is also higher, the actual temperature of the element needs to be measured, and the temperature of the environment needs to be compensated, so that the displayed temperature value is more accurate.
The traditional temperature compensation element of the TC module adopts a PTC thermistor, the cost of the thermistor is low, the connection is simple, the temperature probe can be conveniently made, and the PTC thermistor can be widely applied to the fields of consumer electronics, household appliances, industry, Internet of things and the like. However, PTC thermistors generally have a large nonlinearity, and can only ensure a certain precision in a narrow temperature range, and the measurement accuracy in a slightly larger temperature range is greatly reduced. In addition, in order to convert the resistance value into a temperature value, the system needs to be matched with a high-precision reference resistor, meanwhile, the MCU needs to provide an ADC with more than 12 bits, and a lookup table is used to calculate the temperature value corresponding to the resistor, thereby increasing the system cost and complexity of operation.
Most of research of students in recent years is a mode of collecting temperature signals by using a thermistor. For example, chinese patent "a temperature detection method using NTC thermistor to fit RTD characteristics", patent application No. 202011506409.2, which proposes to collect temperature signals by using thermistor through curve fitting and software compensation. The chinese patent "temperature control type charging device with environmental temperature difference compensation function and control method", patent application No. 99127194.7, the utility model also realizes temperature control by collecting temperature signals with a thermistor. The thermistor has great nonlinearity, the application range is very limited, and meanwhile, a curve is needed to fit a corresponding temperature value, so that the cost and the difficulty are increased.
The above documents and patents all use the thermistor to realize the temperature acquisition and further control, and have the disadvantages of small applicable temperature range, easy aging of elements, poor stability and poor interchangeability, and meanwhile, the MCU micro-processing unit is required to provide an ADC with more than 12 bits and calculate the temperature value corresponding to the resistor by using the lookup table, thereby increasing the system cost and the complexity of operation.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the design research of the device, the utility model provides a temperature sensor scheme with high precision, low cost and convenient operation for improving the temperature compensation device of the TC module, thereby ensuring that the temperature measurement is more accurate, low cost and autonomous and controllable.
In order to solve the problems, the technical scheme adopted by the utility model is as follows:
an improved TC module temperature compensation device comprises an NST element and an MCU micro control unit which are electrically connected; an R1 pull-up resistor is connected in series between the NST element and the MCU micro control unit;
the NST element is encapsulated by DFN 2L.
As a further improvement of the utility model, one end of the R1 pull-up resistor is electrically connected to a GPIO1 power supply pin of the MCU micro control unit, and the other end of the R1 pull-up resistor is electrically connected to a DQ power supply and data output pin of the NST element and a GPIO2 data processing pin of the MCU micro control unit.
As a further improvement of the utility model, the device also comprises a C1 anti-interference capacitor connected in parallel on the NST element; one end of the C1 anti-interference capacitor is electrically connected to the DQ power supply and data output pin of the NST element, and the other end is electrically connected to the GND pin of the NST element.
As a further improvement of the utility model, the value range of the pull-up resistance of the R1 is 500-10 k omega.
As a further improvement of the utility model, the NST element and the MCU are grounded through a GND pin respectively.
As a further improvement of the utility model, the GPIO1 power supply pin of the MCU micro control unit is used as a power supply of the R1 pull-up resistor.
As a further improvement of the utility model, the power supply voltage range of the R1 pull-up resistor is 1.65V-5.5V.
Adopt the produced beneficial effect of above-mentioned technical scheme to lie in:
(1) the NST element of the device is packaged by adopting DFN2L, so that the original thermistor can be directly replaced, and the device is simple and convenient;
(2) an anti-interference capacitor is added at the NST element, so that the temperature measurement is more accurate and reliable;
(3) the appearance and the interface of the device are not changed, and the device can be applied to the original slot;
(4) the NST element has 100% factory calibration precision guarantee, and the temperature measurement precision meets the requirement;
(5) NST elements are low in cost, so that the overall cost of the module can be saved;
(6) NST element is the localization, replaces original import component after, can reach the autonomic controllable of product, is convenient for upgrade and improve.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a TC module temperature compensation device according to an alternative embodiment of the present invention.
Description of reference numerals:
a 1-NST element; 2-MCU micro control unit; 3-C1 antijamming capacitance; 4-R1 pull-up resistor; 5-DQ power supply and data output pins; a 6-GND pin; 7-GPIO1 power pin; 8-GPIO2 data processing pin.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The temperature measurement mode of the current plug-in is mainly as follows: the thermocouple, the thermal resistor, the thermistor, the CMOS and the like, the temperature range of the thermocouple is the widest and can reach-200 ℃ to 2000 ℃, and an external reference end is required when the thermocouple is used, so that the thermocouple is complex; the RTD of the platinum resistor has high precision, wider measurement range, higher cost and complex external circuit; the thermistor has the characteristics of low cost, low precision, large temperature coefficient and nonlinear output; the CMOS temperature sensor has very high linearity, low system cost, high function integration level, simple exterior and capability of supporting digital output, but the temperature measurement range is limited to-40-125 ℃.
Example 1
The embodiment provides an improved TC module temperature compensation device, a home-made NST element is adopted to replace an original thermistor, a DFN2L packaging mode is adopted, an external circuit can be directly compatible with the thermistor, a reference resistor supports pull-up and pull-down, the use is simpler and more convenient, and after a home-made chip is adopted, the related technical improvement is more independently controllable.
Preferably, the present invention provides an apparatus wherein: and replacing the original thermistor element with the NST element, and measuring the precision.
Preferably, the present invention provides an apparatus wherein: and a simple 2-pin packaging mode is adopted, so that an external circuit can be directly compatible, and the replacement is simple.
Preferably, the present invention provides an apparatus wherein: a capacitance element is added to the NST element to improve the external anti-interference capability.
Preferably, the present invention provides an apparatus wherein: NST elements have 100% factory calibration temperature accuracy assurance.
Preferably, the present invention provides an apparatus wherein: the NST element is an IC with integrated power supply circuitry, digital circuitry, analog circuitry, and data processing and storage capabilities.
Preferably, the present invention provides an apparatus wherein: NST element is the localization, replaces original import component after, can reach the autonomic controllable of product, is convenient for upgrade and improve.
Preferably, the present invention provides an apparatus wherein: the appearance and the interface of the device are not changed, and the device can be applied to the original slot.
Preferably, the present invention provides an apparatus wherein: NST components are less expensive and the overall cost of the module can be saved.
Example 2
The embodiment is an improved TC module temperature compensation device, which adopts an NST element, directly replaces the original thermistor by using a simple 2-pin mode on the basis of the embodiment 1, enhances the external interference resistance of temperature by adding a capacitor at the NST element, ensures the accuracy of temperature measurement, is a domestic element, has low cost and independently controllable technology, and is convenient for upgrading and transforming the module in the future.
Example 3
The embodiment provides a specific manufacturing process of an improved TC module temperature compensation device.
The utility model will be described in further detail with reference to the accompanying drawing 1:
the first step is as follows: disassembling the TC module, and disassembling the original thermistor from the circuit board;
the second step is that: replacing the thermistor with the NST element packaged by the DFN 2L;
the third step: connecting a GPIO2 pin of the micro-processing unit to a DQ pin of the NST element;
the fourth step: the resistance of R1 is calculated, and the pull-up resistor R1 may be selected to be between 500 Ω and 10k Ω. The specific values require a compromise between minimum operating voltage, power consumption and transmission distance. Since the NST has a maximum current of 45uA when performing temperature conversion, the smaller the voltage drop of R1 on the chip, the higher the supply voltage to the chip. The maximum value of R1 can be estimated using the following equation: r1<(VDD (supply voltage) -1.45)/45 x 10-6Since power consumption at the time of temperature data transmission becomes larger as the resistance decreases, it is necessary to use a larger resistance as much as possible in order to minimize power consumption;
the fifth step: the capacitance of C1 is calculated, the switch resistance of a DQ pin is only about 50 omega, so the output pull-down speed is generally high, and the capacitance of the C1 capacitance is determined according to the R1 resistance value calculated in the previous step;
and a sixth step: the pull-up resistor is connected between the micro-processing unit and the NST element in series, one end of the pull-up resistor is connected to a GPIO1 pin of the micro-processing unit and used as a power supply, and the other end of the pull-up resistor is connected with a DQ pin of the NST element and a GPIO2 pin of the micro-processing unit;
the seventh step: connecting an anti-interference capacitor with the NST element in parallel, wherein one end of the anti-interference capacitor is connected to a DQ pin of the NST element, and the other end of the anti-interference capacitor is connected to a GND pin of the NST element;
eighth step: and (3) packaging and debugging the module, and confirming whether the precision meets the actual requirement or not by applying a signal externally.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; it is obvious as a person skilled in the art to combine several aspects of the utility model. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. An improved TC module temperature compensation device is characterized in that: the device comprises an NST element (1) and an MCU micro control unit (2) which are electrically connected;
an R1 pull-up resistor (4) is connected in series between the NST element (1) and the MCU micro control unit (2);
the NST element (1) is encapsulated by DFN 2L.
2. The improved TC module temperature compensation apparatus according to claim 1, wherein: one end of the R1 pull-up resistor (4) is electrically connected to a GPIO1 power supply pin (7) of the MCU micro control unit (2), and the other end of the R1 pull-up resistor is electrically connected to a DQ power supply and data output pin (5) of the NST element (1) and a GPIO2 data processing pin (8) of the MCU micro control unit (2).
3. The improved TC module temperature compensation apparatus according to claim 1, wherein: the circuit also comprises a C1 anti-interference capacitor (3) connected in parallel on the NST element (1); one end of the C1 anti-interference capacitor (3) is electrically connected to the DQ power supply and data output pin (5) of the NST element (1), and the other end is electrically connected to the GND pin (6) of the NST element (1).
4. The improved TC module temperature compensation apparatus according to claim 1, wherein: the value range of the R1 pull-up resistor (4) is 500-10 k omega.
5. The improved TC module temperature compensation apparatus according to claim 1, wherein: the NST element (1) and the MCU (2) are grounded through a GND pin (6) respectively.
6. The improved TC module temperature compensation apparatus according to claim 2, wherein: and a GPIO1 power supply pin (7) of the MCU micro-control unit (2) is used as a power supply of the R1 pull-up resistor (4).
7. The improved TC module temperature compensation apparatus according to claim 6, wherein: the power supply voltage range of the R1 pull-up resistor (4) is 1.65V-5.5V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122933098.4U CN216246882U (en) | 2021-11-26 | 2021-11-26 | Improved TC module temperature compensation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122933098.4U CN216246882U (en) | 2021-11-26 | 2021-11-26 | Improved TC module temperature compensation device |
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| Publication Number | Publication Date |
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| CN216246882U true CN216246882U (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122933098.4U Active CN216246882U (en) | 2021-11-26 | 2021-11-26 | Improved TC module temperature compensation device |
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| CN (1) | CN216246882U (en) |
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2021
- 2021-11-26 CN CN202122933098.4U patent/CN216246882U/en active Active
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