CN216230539U

CN216230539U - Plastic mould with cooling structure

Info

Publication number: CN216230539U
Application number: CN202220173189.4U
Authority: CN
Inventors: 何建德
Original assignee: Shenzhen Hengjin Plastic Mould Co ltd
Current assignee: Shenzhen Hengjin Plastic Mould Co ltd
Priority date: 2022-01-22
Filing date: 2022-01-22
Publication date: 2022-04-08
Anticipated expiration: 2032-01-22

Abstract

The utility model discloses a plastic mould with a cooling structure, which comprises an upper mould and a lower mould; a die box groove is formed in the lower die of the die, a temperature guide plate is mounted on the inner wall of the die box groove, and a die box ejection assembly is arranged at the bottom of the die box groove; a die box is arranged in the die box groove, and the bottom of the die box is contacted with the die box ejection assembly; air outlet holes are formed in the two sides of the lower die of the die, semiconductor refrigerating sheets are mounted on the two sides of the temperature guide plate, and the air outlet holes correspond to the semiconductor refrigerating sheets of the temperature guide plate; a cooling fan is arranged in the air outlet hole and is in contact with the semiconductor refrigerating sheet; the upper die of the die is covered above the lower die of the die. The semiconductor cooling device is simple in structure, has a quick cooling function through the semiconductor cooling sheet and the cooling fan, and can eject the die box through the die box ejection structure, so that the die box is convenient to replace, and the processing efficiency is higher.

Description

Plastic mould with cooling structure

Technical Field

The utility model relates to a plastic mold, in particular to a plastic mold with a cooling structure.

Background

The plastic mold is a short name for a combined mold used for compression molding, extrusion molding, injection, blow molding and low-foaming molding. The coordination change of the male die, the female die and the auxiliary forming system of the die can process a series of plastic parts with different shapes and sizes. The plastic mould injects hot melting materials along with continuous operation, the temperature of the plastic mould can be kept at a higher level, so that the forming cooling speed is reduced, the forming speed is slowed down, and the formed materials are not easy to take out, thereby influencing the processing time.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a plastic mold with a cooling structure so as to solve the problems that the cooling speed of material molding is reduced, the molding speed is reduced, the molded material is not easy to take out, and the processing time is influenced in the background technology.

The plastic mold with the cooling structure is realized by the following technical scheme: comprises an upper die and a lower die;

a die box groove is formed in the lower die of the die, a temperature guide plate is mounted on the inner wall of the die box groove, and a die box ejection assembly is arranged at the bottom of the die box groove; a mold box is arranged in the mold box groove, and the bottom of the mold box is contacted with the mold box ejection assembly; air outlet holes are formed in the two sides of the lower die of the die, semiconductor refrigerating sheets are mounted on the two sides of the temperature guide plate, and the air outlet holes correspond to the semiconductor refrigerating sheets of the temperature guide plate; a cooling fan is arranged in the air outlet hole and is in contact with the semiconductor refrigerating sheet; the upper die of the die is covered above the lower die of the die.

As a preferred technical scheme, a positioning rod is arranged below an upper die of the die, and a positioning groove corresponding to the positioning rod is arranged on a lower die of the die; the positioning rod is provided with a clamping assembly, and the positioning groove is internally provided with a clamping hole corresponding to the clamping assembly.

As a preferred technical scheme, the mold box ejection assembly comprises a lifting motor arranged at the bottom of a lower mold of the mold and an ejection plate arranged at the bottom of a mold box groove, and an output shaft of the lifting motor is connected with the ejection plate; the ejector plate is in contact with the die box, and a heat insulation plate is arranged above the ejector plate.

As a preferred technical scheme, the clamping assembly comprises a clamping groove arranged on the positioning rod and clamping balls arranged at two ends of the clamping groove, and a spring assembly is arranged between the two clamping balls; the position of the clamping ball corresponds to the position of the clamping hole.

As an optimized technical scheme, a pressing groove is formed above the die box groove, a die upper die is arranged on a pressing block corresponding to the pressing groove, and the die upper die presses the die box in the die box groove through the pressing block.

As preferred technical scheme, the constant head tank upper end is provided with the elasticity rubber ring that is used for the locating lever chucking.

The utility model has the beneficial effects that:

1. the utility model has simple structure, and has quick cooling function through the semiconductor refrigeration piece and the cooling fan.

2. According to the utility model, the die box is ejected out through the die box ejection structure, so that the die box is convenient to replace, and the processing efficiency is higher.

3. The upper die and the lower die of the die are positioned and locked through the positioning rods and the positioning grooves, so that the upper die and the lower die are connected more stably.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic plan view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

FIG. 3 is a schematic cross-sectional view of the thermal plate of the present invention;

fig. 4 is a partial enlarged view of the present invention at a.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

As shown in fig. 1-3, the plastic mold with a cooling structure of the present invention includes an upper mold 1 and a lower mold 2;

a die box groove 3 is formed in the lower die 2 of the die, a temperature guide plate 4 is mounted on the inner wall of the die box groove 3, and a die box ejection assembly is arranged at the bottom of the die box groove 3; a mold box 5 is arranged in the mold box groove 3, and the bottom of the mold box 5 is contacted with the mold box ejection assembly; air outlet holes 6 are formed in the two sides of the lower die 2 of the die, semiconductor refrigerating sheets 7 are mounted on the two sides of the temperature guide plate 4, and the air outlet holes 6 correspond to the semiconductor refrigerating sheets 7 of the temperature guide plate 4; a heat radiation fan 8 is arranged in the air outlet 6, and the heat radiation fan 8 is contacted with the semiconductor refrigerating sheet 7 to play a role in matching materials in the mold box; the upper die 1 is covered above the lower die 2.

As shown in fig. 4, a positioning rod 9 is arranged below the upper die 1 of the die, and a positioning groove 10 corresponding to the positioning rod 9 is arranged on the lower die 2 of the die; a clamping assembly is arranged on the positioning rod 9, and a clamping hole 11 corresponding to the clamping assembly is arranged in the positioning groove 10; the clamping assembly comprises a clamping groove 14 arranged on the positioning rod 9 and clamping balls 15 arranged at two ends of the clamping groove 14, and a spring assembly 16 is arranged between the two clamping balls 15; the position of the clamping ball 15 corresponds to the position of the clamping hole 11, and the upper die and the lower die of the die are locked and fixed through the clamping assembly, so that the connection is stable.

In the embodiment, the mold box ejection assembly comprises a lifting motor 12 arranged at the bottom of the lower mold 2 of the mold and an ejection plate 13 arranged at the bottom of the mold box groove 3, an output shaft of the lifting motor 12 is connected with the ejection plate 13, and the mold box is ejected by driving the lifting motor, so that the mold box is convenient to replace and use; liftout plate 13 contacts with diaphragm capsule 5, and liftout plate 13 top is installed the thermal-insulated board, plays the effect of isolated temperature, and protection elevator motor can not damage because of the high temperature.

In this embodiment, the top in die box groove 3 is provided with compresses tightly groove 18, set up on the mould 1 in with compress tightly the compact heap 19 that groove 18 is corresponding, mould 1 compresses tightly die box 5 in die box groove 3 through compact heap 19 on the mould for the leakproofness of die box is good.

In this embodiment, constant head tank 10 upper end is provided with the elastic rubber ring 17 that is used for the chucking of locating lever 9, when locating lever 9 inserts constant head tank 10, carries out preliminary location through the elastic rubber ring.

The beneficial effects are as follows:

firstly, an upper die and a lower die of the die are positioned and locked through a positioning rod and a positioning groove, so that the upper die and the lower die are connected more stably, and materials in a die box are quickly condensed and cooled through a semiconductor refrigeration sheet and a cooling fan, so that the cooling time is reduced; the mold box is ejected through the mold box ejection structure after cooling is completed, so that the mold box is convenient to replace, and the processing efficiency is higher.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a plastic mould with cooling structure which characterized in that: comprises an upper die (1) and a lower die (2);

a die box groove (3) is formed in the lower die (2), a temperature guide plate (4) is mounted on the inner wall of the die box groove (3), and a die box ejection assembly is arranged at the bottom of the die box groove (3); a die box (5) is arranged in the die box groove (3), and the bottom of the die box (5) is contacted with the die box ejection assembly; air outlet holes (6) are formed in the two sides of the lower die (2), semiconductor refrigerating sheets (7) are mounted on the two sides of the heat conducting plate (4), and the air outlet holes (6) correspond to the semiconductor refrigerating sheets (7) of the heat conducting plate (4); a heat radiation fan (8) is arranged in the air outlet hole (6), and the heat radiation fan (8) is in contact with the semiconductor refrigeration sheet (7); the upper die (1) of the die is covered above the lower die (2) of the die.

2. The plastic mold with a cooling structure as claimed in claim 1, wherein: a positioning rod (9) is arranged below the upper die (1) of the die, and a positioning groove (10) corresponding to the positioning rod (9) is arranged on the lower die (2) of the die; the positioning rod (9) is provided with a clamping assembly, and the positioning groove (10) is internally provided with a clamping hole (11) corresponding to the clamping assembly.

3. The plastic mold with a cooling structure as claimed in claim 1, wherein: the die box ejection assembly comprises a lifting motor (12) arranged at the bottom of the lower die (2) of the die and an ejection plate (13) arranged at the bottom of the die box groove (3), and an output shaft of the lifting motor (12) is connected with the ejection plate (13); the ejector plate (13) is in contact with the die box (5), and a heat insulation plate is arranged above the ejector plate (13).

4. The plastic mold with a cooling structure as claimed in claim 2, wherein: the clamping assembly comprises a clamping groove (14) arranged on the positioning rod (9) and clamping balls (15) arranged at two ends of the clamping groove (14), and a spring assembly (16) is arranged between the two clamping balls (15); the position of the clamping ball (15) corresponds to the position of the clamping hole (11).

5. The plastic mold with a cooling structure as claimed in claim 2, wherein: a pressing groove (18) is formed above the die box groove (3), a pressing block (19) corresponding to the pressing groove (18) is arranged on the die upper die (1), and the die box (5) is pressed in the die box groove (3) through the pressing block (19) by the die upper die (1).

6. The plastic mold with a cooling structure as claimed in claim 2, wherein: and an elastic rubber ring (17) for clamping the positioning rod (9) is arranged at the upper end of the positioning groove (10).