CN216213400U

CN216213400U - Waterproof dirt-proof semiconductor housing

Info

Publication number: CN216213400U
Application number: CN202122603777.5U
Authority: CN
Inventors: 李琳
Original assignee: Suzhou Gai Machinery Equipment Co ltd
Current assignee: Suzhou Gaiqi Intelligent Technology Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-04-05
Anticipated expiration: 2031-10-28

Abstract

The utility model relates to the technical field of semiconductors, in particular to a waterproof and dustproof semiconductor shell, which comprises a bottom plate, a semiconductor body and a partition frame, wherein the semiconductor body is fixedly connected at the middle position of the upper end of the bottom plate, a protective shell is slidably connected at the upper end of the bottom plate, an inserting frame is slidably connected with the side wall of the protective shell, a water absorption filter element is fixedly connected at the inner side of the inserting frame, a dustproof net is fixedly connected at the outer end of the inserting frame, and a threaded disc is spirally connected at the upper end of the protective shell. The service life of the semiconductor body can be effectively prolonged.

Description

Waterproof dirt-proof semiconductor housing

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a waterproof and dustproof semiconductor shell.

Background

With the development of society, the application of semiconductors is becoming more and more extensive, the semiconductor refers to a material with electric conductivity between the conductor and the insulator at normal temperature, and the semiconductor is applied in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor.

In the prior art, the semiconductor shell can only play a basic protection role when being used, and can not be subjected to waterproof and dustproof treatment, so that dust and moisture are easy to attach to the surface of a semiconductor, the normal use of the semiconductor is influenced, and the service life of the semiconductor is shortened; when the semiconductor shell is used, heat is easy to dissipate, so that the heat is continuously increased, and the semiconductor is easy to damage due to overhigh temperature, thereby affecting the normal use of the semiconductor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a waterproof and dustproof semiconductor housing, so as to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a waterproof dirt-proof semiconductor housing, includes bottom plate, semiconductor body and bulkhead, the upper end intermediate position department fixedly connected with semiconductor body of bottom plate, the upper end sliding connection of bottom plate has the protecting crust, the lateral wall sliding connection of protecting crust has the frame of inserting, the inboard fixedly connected with filter core that absorbs water of frame, the outer end fixedly connected with dust screen of frame inserts, the upper end screwed connection of protecting crust has the thread disc, the upper end fixedly connected with heat dissipation frame of thread disc, the inboard rotation of heat dissipation frame is connected with the flabellum, rotate between flabellum and the thread disc and be connected, the inboard fixedly connected with filter screen of lateral wall of heat dissipation frame.

Preferably, the outer side of the semiconductor main body is fixedly connected with a partition frame, the partition frame is fixedly connected with the bottom plate, the inner side of the partition frame is rotatably connected with a clamping plate, the clamping plate is slidably connected with the protective shell, a torsion spring covers the surface of a rotating shaft between the clamping plate and the partition frame, a front-end torsion arm of the torsion spring is fixedly connected with the partition frame, and a rear-end torsion arm of the torsion spring is fixedly connected with the clamping plate.

Preferably, the inner wall of the protective shell is connected with a push plate in a sliding mode, the outer end of the push plate is fixedly connected with a push rod, the push rod is connected with the protective shell in a sliding mode, and the push plate is connected with the clamping plate in a sliding mode.

Preferably, the upper end of flabellum is equipped with the motor, the flabellum passes through to rotate between output shaft and the motor and is connected, fixed connection between motor and the heat dissipation frame.

Preferably, the inner wall of the heat dissipation frame at the upper end of the fan blade is provided with a vent hole.

Preferably, the side wall of the heat dissipation frame is provided with heat dissipation holes, and the heat dissipation holes are arranged at equal intervals.

Preferably, the inner side of the threaded disc is fixedly connected with water absorption fibers.

Preferably, the number of the dust screens is four, and the dust screens are symmetrically arranged around the central axis of the protective shell.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the semiconductor device, the protective shell, the water absorption filter cotton and the dustproof net are arranged, the semiconductor main body is protected by the protective shell, dust in the external air is filtered by the dustproof net, and moisture in the air is absorbed by the water absorption filter cotton, so that the dust and the moisture are prevented from being attached to the surface of the semiconductor main body to damage the semiconductor, and the service life of the semiconductor main body can be effectively prolonged;

2. according to the utility model, through the arrangement of the fan blades, the filter screen and the water absorption fibers, the heat generated by the semiconductor main body can be rapidly dissipated by utilizing the rotation of the fan blades, the dustproof treatment is carried out on the heat dissipation frame through the arranged filter screen, in the heat dissipation process, the moisture in the protective shell can be absorbed through the arranged water absorption limit, and the moisture entering from the outside can be absorbed, so that the semiconductor main body can be protected by heat dissipation, and the semiconductor can run in a safe environment.

Drawings

FIG. 1 is a schematic view of the overall mounting structure of the present invention;

FIG. 2 is a cross-sectional view of the mounting structure of FIG. 1 in accordance with the present invention;

FIG. 3 is a schematic view of the mounting structure of FIG. 2 at A in accordance with the present invention;

fig. 4 is a sectional view showing an installation structure of a heat dissipation frame and a filter screen according to the present invention.

In the figure: 1. a base plate; 2. a semiconductor body; 3. a protective shell; 4. inserting a frame; 5. a water absorption filter element; 6. a dust screen; 7. a threaded disc; 8. a heat dissipation frame; 9. a fan blade; 10. filtering with a screen; 11. a bulkhead; 12. clamping a plate; 13. a torsion spring; 14. pushing the plate; 15. a push rod; 16. a motor; 17. a vent hole; 18. heat dissipation holes; 19. a water-absorbing fiber.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In embodiment 1, please refer to fig. 1-4, the present invention provides a technical solution: a waterproof and dustproof semiconductor shell comprises a bottom plate 1, a semiconductor body 2 and a partition frame 11, wherein the semiconductor body 2 is fixedly connected at the middle position of the upper end of the bottom plate 1, a protective shell 3 is slidably connected at the upper end of the bottom plate 1 and can protect the semiconductor body 2, an insertion frame 4 is slidably connected with the side wall of the protective shell 3, a water absorption filter element 5 is fixedly connected at the inner side of the insertion frame 4 and is convenient for absorbing moisture in the air, a dustproof net 6 is fixedly connected at the outer end of the insertion frame 4 and can filter dust in the outside air, a threaded disc 7 is spirally connected at the upper end of the protective shell 3, a heat dissipation frame 8 is fixedly connected at the upper end of the threaded disc 7, the heat dissipation frame 8 can be detached through the spiral connection effect of the threaded disc 7 and the protective shell 3, fan blades 9 are rotatably connected at the inner side of the heat dissipation frame 8, and air can circulate through the rotation of the fan blades 9, and then make the heat can spill fast, the inboard fixedly connected with filter screen 10 of lateral wall of heat dissipation frame 8, the upper end of flabellum 9 is equipped with motor 16, ventilation hole 17 has been seted up to the heat dissipation frame 8 inner wall of flabellum 9 upper end, louvre 18 has been seted up to the lateral wall of heat dissipation frame 8, can make flabellum 9 carry out the heat dissipation treatment to the heat that the motor gived off through louvre 18, the inboard fixedly connected with fibre 19 that absorbs water of frid 7 is convenient for absorb the use to the moisture in heat dissipation frame 8 and protecting crust 3.

Example 2: referring to fig. 2-3, the difference between the present embodiment and embodiment 1 is: the outside fixedly connected with bulkhead 11 of semiconductor subject 2, the inboard rotation of bulkhead 11 is connected with cardboard 12, pivot surface between cardboard 12 and the bulkhead 11 is covered with torsion spring 13 outward, the pivoted action through cardboard 12 makes protecting crust 3 can obtain stable installation, the inner wall sliding connection of protecting crust 3 has push pedal 14, the outer end fixedly connected with push rod 15 of push pedal 14, sliding connection between push pedal 14 and the cardboard 12, and then make push pedal 14 can drive cardboard 12 and move to the inboard through pressing down to push rod 15, and then make cardboard 12 can with protecting crust 3 disconnection, the dismouting of the protecting crust 3 of being convenient for is used.

The working process is as follows: the device is powered by a power supply of the semiconductor main body 2 when in use, when a semiconductor is installed, the semiconductor main body 2 is installed on the inner side of a partition frame 11 and is connected with the partition frame 11 through a protective shell 3, the protective shell 3 is pressed downwards to enable the protective shell 3 to extrude a clamping plate 12, when the protective shell 3 is connected with a bottom plate 1, a torsion spring 13 drives the clamping plate 12 to rotate towards the outer side, and further the protective shell 3 is limited for use through the clamping plate 12, so that the protective shell 3 can be stably installed, a push plate 14 can move towards the inner side through pressing a push rod 15, and further the clamping plate 12 can be disconnected with the protective shell 3, so that the protective shell 3 can be quickly disassembled, the semiconductor main body 2 can be conveniently disassembled and protected for use, and in the running process of the semiconductor, the fan blades 9 can rotate through the rotating action of a motor 16, and then make the heat that semiconductor body 2 gived off in the protecting crust 3 can discharge fast, and make the air current circulate, dust in to the entering air is filtered through the dust screen 6 that sets up, absorb the moisture in the air through the filter core 5 that absorbs water that sets up simultaneously, prevent that dust and moisture from attaching to the surface of semiconductor body 2 and causing the damage to semiconductor body 2, simultaneously through louvre 18 and the ventilation hole 17 that sets up, the heat that makes motor 16 and semiconductor body 2 gived off can be effused fast, and prevent dust through the filter screen 10 that sets up to heat radiation frame 8 and use, absorb the moisture in heat radiation frame 8 and the protecting crust 3 through the fibre 19 that absorbs water that sets up simultaneously, make semiconductor body 2 can be in the safe environment and operate.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a waterproof dirt-proof semiconductor housing, includes bottom plate (1), semiconductor body (2) and bulkhead (11), its characterized in that: the upper end intermediate position department fixedly connected with semiconductor body (2) of bottom plate (1), the upper end sliding connection of bottom plate (1) has protecting crust (3), the lateral wall sliding connection of protecting crust (3) inserts frame (4), the inboard fixedly connected with that inserts frame (4) filter core (5) that absorbs water, the outer end fixedly connected with dust screen (6) of inserting frame (4), the upper end screwed connection of protecting crust (3) has thread disc (7), the upper end fixedly connected with heat dissipation frame (8) of thread disc (7), the inboard rotation of heat dissipation frame (8) is connected with flabellum (9), rotate between flabellum (9) and thread disc (7) and be connected, the inboard fixedly connected with filter screen (10) of the lateral wall of heat dissipation frame (8).

2. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the outside fixedly connected with of semiconductor body (2) separates frame (11), fixed connection between separate frame (11) and bottom plate (1), the inboard rotation of separate frame (11) is connected with cardboard (12), sliding connection between cardboard (12) and protecting crust (3), pivot surface between cardboard (12) and separate frame (11) coats and has torsion spring (13), fixed connection between the front end torque arm of torsion spring (13) and separate frame (11), fixed connection between the rear end torque arm of torsion spring (13) and cardboard (12).

3. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the inner wall sliding connection of protecting crust (3) has push pedal (14), the outer end fixedly connected with push rod (15) of push pedal (14), sliding connection between push rod (15) and protecting crust (3), sliding connection between push pedal (14) and cardboard (12).

4. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the upper end of flabellum (9) is equipped with motor (16), flabellum (9) are connected through rotating between output shaft and motor (16), fixed connection between motor (16) and heat dissipation frame (8).

5. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the inner wall of the heat dissipation frame (8) at the upper end of the fan blade (9) is provided with a ventilation hole (17).

6. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: radiating holes (18) are formed in the side wall of the radiating frame (8), and the radiating holes (18) are arranged at equal intervals.

7. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the inner side of the threaded disc (7) is fixedly connected with water-absorbing fibers (19).

8. The waterproof and dustproof semiconductor case according to claim 1, characterized in that: the number of the dust screens (6) is four, and the dust screens (6) are symmetrically arranged relative to the central axis of the protective shell (3).