CN216213313U

CN216213313U - Wafer container with novel comb tooth structure

Info

Publication number: CN216213313U
Application number: CN202122797330.6U
Authority: CN
Inventors: 王征
Original assignee: Xindao New Material Zhejiang Co ltd
Current assignee: Xindao New Material Zhejiang Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-04-05
Anticipated expiration: 2031-11-16

Abstract

The utility model provides a wafer container with a novel comb tooth structure, which comprises an outer shell and an inner shell arranged in the outer shell, wherein the inner shell is provided with a plurality of through holes; the inner shell comprises a first supporting plate with a U-shaped structure, a second supporting plate arranged on one side of the first supporting plate and a third supporting plate arranged on the other side of the first supporting plate, wherein a plurality of first comb tooth structures with the height of less than 6.5mm are arranged on the inner wall of the first supporting plate at intervals; the first supporting plate, the second supporting plate and the third supporting plate enclose a containing space for containing the wafer. According to the utility model, the first comb tooth structure on the first supporting plate is limited to be less than 9.5mm, so that the first comb tooth structure can be used for stably fixing the wafer, the first comb tooth structure can not influence the IC module due to the overhigh height, and the cleaning effect in the IC module can be improved.

Description

Wafer container with novel comb tooth structure

Technical Field

The utility model belongs to the technical field of electronic auxiliary transportation equipment, and particularly relates to a wafer container with a novel comb tooth structure.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and since the wafer has a circular shape, it needs to be fixed by using a special container during transportation or storage.

The wafer container is the main container for holding the wafers, and generally includes an outer shell for supporting and an inner shell for holding the wafers.

The inner shell among the current wafer container all can set up the broach structure to increase contact point and area of contact with the wafer, thereby better fixed wafer, nevertheless current broach structure not only can exert an influence to the IC module owing to the design is unreasonable, still can make inside cleaning performance poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer container with a novel comb tooth structure, and aims to solve the problems that an IC module is influenced and the internal cleaning effect is poor due to the fact that the comb tooth structure of an existing wafer container is unreasonable in design.

In order to solve the technical problem, the utility model provides a wafer container with a novel comb tooth structure, which comprises an outer shell and an inner shell arranged in the outer shell;

the inner shell comprises a first supporting plate with a U-shaped structure, a second supporting plate arranged on one side of the first supporting plate and a third supporting plate arranged on the other side of the first supporting plate, wherein a plurality of first comb tooth structures with the height smaller than 9.5mm are arranged on the inner wall of the first supporting plate at intervals;

the first supporting plate, the second supporting plate and the third supporting plate enclose a containing space for containing the wafer.

Furthermore, the height of the first comb tooth structure is 3mm-9 mm.

Furthermore, the first comb tooth structure is matched with the first support plate structure, and the cross section area is a trapezoid structure.

Further, the third support plate is disposed at a partial position on one side of the first support plate.

Furthermore, the third supporting plate comprises two first bearing plates and two second bearing plates, wherein the two first bearing plates are respectively connected to the positions of two corresponding edges on one side of the first supporting plate, and the two second bearing plates are connected with the two first bearing plates.

Furthermore, the wafer support device further comprises a fixing component, wherein the fixing component comprises a plurality of arc-shaped pressing plates used for abutting against the outer wall of the wafer, two elastic arms which are arranged on each pressing plate at intervals and have elasticity, and two connecting plates, the arc-shaped pressing plates are used for abutting against the part of the wafer exposed out of the opening of the first supporting plate, the two elastic arms on each arc-shaped pressing plate are respectively arranged at the positions, close to the two ends, of the arc-shaped pressing plates, and the elastic arms, close to the same end, of each arc-shaped pressing plate are sequentially connected onto the connecting plates; when the shell is closed, one surface of the connecting plate, which is far away from the elastic arm, is abutted against the corresponding position of the shell.

Furthermore, a plurality of second comb tooth structures are arranged on one surface, abutted to the wafer, of each arc-shaped pressing plate at intervals.

Furthermore, two second comb tooth structures are arranged on each arc-shaped pressing plate at intervals, and the length direction of each second comb tooth structure is parallel to the length direction of the arc-shaped pressing plate.

Furthermore, the height of the second comb tooth structure is less than 9.5mm, and the cross section area is a trapezoid structure.

Furthermore, the height of the second comb tooth structure is 3mm-9 mm.

Compared with the prior art, the wafer container with the novel comb tooth structure has the advantages that the first comb tooth structure on the first supporting plate is limited to be smaller than 9.5mm, so that the first comb tooth structure can be used for stably fixing a wafer, the first comb tooth structure cannot influence an IC module due to overhigh height, and the cleaning effect of the interior of the first comb tooth structure can be improved.

Drawings

In order to make the content of the utility model clearer, the drawings needed to be used in the description of the embodiments will be briefly described below, it being clear that the drawings in the following description are only some embodiments of the utility model, and that other drawings can be derived by a person skilled in the art without inventive effort, wherein:

fig. 1 is a schematic perspective view illustrating a wafer container having a novel comb structure according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an inner shell loading wafer in a wafer container with a novel comb structure according to an embodiment of the present invention;

FIG. 3 is a side view of an inner case of a wafer container having a novel comb structure according to an embodiment of the present invention;

FIG. 4 is a top view of an inner shell of a wafer container with a novel comb structure according to an embodiment of the present invention;

FIG. 5 is an enlarged view of the structure of portion A in FIG. 4;

fig. 6 is a perspective view of a fixing member in a wafer container having a novel comb structure according to an embodiment of the present invention.

Wherein, 1, a shell; 11. a first housing; 12. a second housing; 2. an inner shell; 21. a first support plate; 22. a second support plate; 23. a third support plate; 231. a first bearing plate; 232. a second bearing plate; 24. a first comb tooth structure; 3. a fixing member; 31. an arc-shaped pressing plate; 32. a resilient arm; 33. a connecting plate; 34. a second comb structure; 4. and (5) a wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment of the utility model provides a wafer container with a novel comb tooth structure, which is shown in the attached drawings 1 to 6 and comprises an outer shell 1 and an inner shell 2 arranged in the outer shell 1.

Specifically, the housing 1 includes a first case 11 and a second case 12 covering the first case 11.

The first housing 11 and the second housing 12 are both in a semi-closed state, and when the second housing 12 is covered on the first housing 11, a closed state is formed. Certainly, according to actual requirements, a sealing structure such as a sealing ring and a sealant can be added between the first casing 11 and the second casing 12 to improve the sealing effect between the two.

The structures of the first housing 11 and the second housing 12 are set according to actual requirements, and the two housings can be rectangular structures, cylindrical structures and the like after being covered.

Specifically, the inner case 2 includes a first support plate 21 of a U-shaped structure, a second support plate 22 provided at one side of the first support plate 21, and a third support plate 23 provided at the other side of the first support plate 21.

The first support plate 21, the second support plate 22 and the third support plate 23 enclose a receiving space for receiving the wafer 4.

Wherein the second support plate 22 is arranged at the position of the unclosed state of one side of the U-shaped structure of the first support plate 21 and completely or partially closes the position of the unclosed state; the third support plate 23 is then arranged at the position of the other side of the U-shaped structure of the first support plate 21 in the non-closed state, which can be completely closed or partially closed.

In this embodiment, the second support plate 22 completely closes the position of the unclosed state of one side of the U-shaped structure of the first support plate 21. The third supporting plate 23 partially seals the position of the other side of the U-shaped structure of the first supporting plate 21 in the non-sealed state, that is, the third supporting plate 23 is disposed at a partial position of one side of the first supporting plate 21, so that the plane of the wafer 4 is exposed to facilitate the taking out of the wafer 4.

In the present embodiment, the third support plate 23 includes two first receiving plates 231 respectively connected to positions of two corresponding edges on one side of the first support plate 21 and two second receiving plates 232 connecting the two first receiving plates 231.

Specifically, the two first receiving plates 231 are symmetrically disposed and connected to each other at an interval by the two second receiving plates 232.

Specifically, the inner wall of the first support plate 21 is provided with a plurality of first comb tooth structures 24 having a height of less than 9.5mm (millimeters) at intervals. Therefore, the first comb structure 24 can be ensured to be capable of stably fixing the wafer 4, the first comb structure 24 can not influence the IC module due to too high height of the first comb structure, and the cleaning effect of the first comb structure can be improved.

In the present embodiment, the height of the first comb tooth structure 24 is 6 mm. Of course, the height of the first comb structure 24 may also be 2mm, 4mm, 4.3mm, 5mm, 5.7mm, 7.8mm, 9.2mm, etc., or may be adjusted to be greater than 9.5mm, such as 10mm, 11.3mm, etc., according to actual requirements.

Wherein, the number of the first comb structures 24 is set according to actual requirements, and the first comb structures 24 on both sides are respectively close to the edges of both sides of the first supporting plate 21.

In the present embodiment, the first comb structure 24 matches with the structure of the first support plate 21, i.e. the first comb structure 24 is also a U-shaped structure. Of course, the first comb structure 24 may not match the structure of the first support plate 21 according to actual requirements.

In addition, the cross-sectional area of the first comb tooth structure 24 is a trapezoid structure, specifically an isosceles trapezoid structure. Of course, the structure can be a right-angled trapezoid structure, a square structure or other adaptive structures according to actual requirements.

Specifically, according to actual requirements, the comb structure may be disposed on the outer wall of the first supporting plate 21, so that the first supporting plate 21 can be disposed in the housing 1 more stably. Furthermore, the height of the comb tooth structure on the outer wall is correspondingly matched with the height of the first comb tooth structure 24.

Specifically, the wafer container with the novel comb structure further comprises a fixing member 3, the fixing member 3 comprises a plurality of arc-shaped pressing plates 31 for abutting against the outer wall of the wafer 4, two elastic arms 32 which are arranged on each pressing plate at intervals and have elasticity, and two connecting plates 33, the arc-shaped pressing plates 31 are used for abutting against the exposed part of the wafer 4 from the opening of the first supporting plate 21, the two elastic arms 32 on each arc-shaped pressing plate 31 are respectively arranged at the positions, close to the two ends, of the arc-shaped pressing plate 31, and the elastic arms 32, close to the same end, of each arc-shaped pressing plate 31 are sequentially connected to the connecting plates 33; when the housing 1 is closed, the surface of the connecting plate 33 remote from the elastic arm 32 abuts against the corresponding position of the housing 1.

Wherein, the abutting means abutting contact; the number of the arc-shaped pressing plates 31 is set according to actual requirements; the arc of the arc-shaped pressing plate 31 matches with the arc of the wafer 4, so that the wafer 4 can be better abutted.

When each arc-shaped pressing plate 31 is connected to the connecting plate 33 in sequence by the elastic arm 32 close to the same end, a certain interval is formed between two adjacent arc-shaped pressing plates 31, and the interval distance is set according to actual requirements. Of course, according to actual requirements, two adjacent arc-shaped pressing plates 31 can be abutted.

The opening of the first support plate 21 is in a position where the top of its U-shaped structure is not closed.

The enclosure 1 is closed, that is, the second enclosure 12 is covered on the first enclosure 11, at this time, one surface of the connecting plate 33, which is far away from the elastic arm 32, abuts against a corresponding position on the second enclosure 12 of the enclosure 1 under the elastic action of the elastic arm 32, so that the wafer 4 is indirectly abutted and pressed, the contact area with the wafer 4 is increased, the phenomenon that the wafer 4 moves in the transportation process is avoided, the elastic arm 32 plays a role in shock resistance, and the wafer 4 is prevented from being damaged due to serious shock.

Specifically, the elastic arm 32 is formed by extending the arc-shaped pressing plate 31 to the outside near the end thereof, and the included angle with the arc-shaped pressing plate 31 is less than 90 degrees. This arrangement can raise the resilience of the resilient arm 32 to achieve a better shock absorbing effect.

The included angle between the elastic arm 32 and the arc-shaped pressing plate 31 can be 35 degrees, 45 degrees, 60 degrees, 73 degrees and the like.

Specifically, one surface of each arc-shaped pressing plate 31 abutting against the wafer 4 is provided with a plurality of second comb tooth structures 34 at intervals. This raises the contact point with the wafer 4 to better fix the wafer 4.

In the present embodiment, two second comb-tooth structures 34 are disposed on each arc-shaped pressure plate 31 at intervals, and the length direction of the first comb-tooth structure 24 is parallel to the length direction of the arc-shaped pressure plate 31.

Specifically, the height of the second comb-tooth structure 34 is correspondingly matched with the height of the first comb-tooth structure 24, and both the heights are smaller than 9.5 mm. Accordingly, in the present embodiment, the height of the second comb tooth structure 34 is 6 mm. Of course, according to actual requirements, the height of the second comb structure 34 may not be correspondingly matched with the height of the first comb structure 24, and may be set to be 2mm, 4mm, 4.3mm, 5mm, 5.7mm, 7.8mm, 9.2mm, etc., or may be adjusted to be greater than 9.5mm, such as 10mm, 11.3mm, etc.

In the present embodiment, the cross-sectional area of the second comb tooth structure 34 is a trapezoid structure, specifically, an equal right-angle trapezoid structure. Of course, according to actual requirements, an isosceles trapezoid structure, a square structure or other adaptive structures can be set.

In the present embodiment, the surfaces of the two connecting plates 33 away from the elastic arm 32 are located on the same horizontal plane. This allows the two webs 33 to abut uniformly against the housing 1.

In this embodiment, the two connecting plates 33 are flat surfaces on the sides far away from the elastic arm 32. This can increase the contact area between the two connecting plates 33 and the housing 1, so that the force applied to the wafer 4 can be distributed to the housing 1 at a better distance.

Compared with the prior art, the wafer container with the novel comb tooth structure has the advantages that the first comb tooth structure 24 on the first supporting plate 21 is limited to be smaller than 9.5mm, so that the first comb tooth structure 24 can be used for stably fixing the wafer 4, the first comb tooth structure 24 cannot influence an IC module due to overhigh height, and the cleaning effect of the interior of the IC module can be improved.

The above examples are merely illustrative for clearly illustrating the present invention and are not intended to limit the embodiments; the scope of the present invention includes, but is not limited to, the above embodiments, and all equivalent changes in the shape and structure according to the present invention are included in the scope of the present invention.

Claims

1. A wafer container with a novel comb tooth structure is characterized by comprising an outer shell and an inner shell arranged in the outer shell;

2. The wafer container with novel comb tooth structures as claimed in claim 1, wherein the height of the first comb tooth structure is 3mm to 9 mm.

3. The wafer container with novel comb tooth structures as claimed in claim 1, wherein the first comb tooth structure matches with the structure of the first support plate, and the cross-sectional area is a trapezoidal structure.

4. The wafer container with the novel comb tooth structure as claimed in claim 1, wherein the third support plate is disposed at a partial position on one side of the first support plate.

5. The wafer container with novel comb tooth structures as claimed in claim 4, wherein the third supporting plate comprises two first receiving plates respectively connected to the positions of two corresponding edges on one side of the first supporting plate and two second receiving plates connecting the two first receiving plates.

6. The wafer container with the novel comb tooth structure as claimed in claim 1, further comprising a fixing member, wherein the fixing member comprises a plurality of arc-shaped pressing plates for abutting against the outer wall of the wafer, two elastic arms with elastic force and arranged on each pressing plate at intervals, and two connecting plates, the arc-shaped pressing plates are used for abutting against the portion of the wafer exposed from the opening of the first supporting plate, the two elastic arms on each arc-shaped pressing plate are respectively arranged at the positions of the arc-shaped pressing plates near the two ends, and the elastic arms of each arc-shaped pressing plate near the same end are sequentially connected to the connecting plates; when the shell is closed, one surface of the connecting plate, which is far away from the elastic arm, is abutted against the corresponding position of the shell.

7. The wafer container with the novel comb tooth structure as claimed in claim 6, wherein a plurality of second comb tooth structures are arranged at intervals on one surface of each arc-shaped pressure plate, which abuts against the wafer.

8. The wafer container with the novel comb tooth structure as claimed in claim 7, wherein two second comb tooth structures are spaced apart from each other on each of the arc-shaped pressing plates, and the length direction of the second comb tooth structures is parallel to the length direction of the arc-shaped pressing plates.

9. The wafer container with the novel comb tooth structure as claimed in claim 7 or 8, wherein the second comb tooth structure has a height of less than 9.5mm and a cross-sectional area of a trapezoidal structure.

10. The wafer container with novel comb tooth structures as claimed in claim 9, wherein the height of the second comb tooth structure is 3mm-9 mm.