CN216188479U

CN216188479U - U-shaped storage mechanism for reflow soldering of integrated circuit board

Info

Publication number: CN216188479U
Application number: CN202122740320.9U
Authority: CN
Inventors: 李厚锋; 刘巧花
Original assignee: Qingdao Fenghuaxin Electronic Technology Co ltd
Current assignee: Qingdao Fenghuaxin Electronic Technology Co ltd
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2022-04-05
Anticipated expiration: 2031-11-10

Abstract

The utility model discloses an intelligent regulation and control cooling device for reflow soldering of an integrated circuit board, and discloses a U-shaped storage mechanism for reflow soldering of the integrated circuit board, which comprises a reflow soldering device, a rack, a plurality of supporting legs, a U-shaped conveying belt, a plurality of conveying rollers, a storage device and a driving motor for driving the conveying rollers to rotate; the U-shaped conveyor belt is arranged on the rack through a plurality of conveying rollers, a plurality of supporting legs are fixedly arranged at the bottom of the rack, the starting edge of the U-shaped conveyor belt penetrates through the inner cavity of the reflow soldering device, and the containing device is arranged below the end part of the recovery edge of the U-shaped conveyor belt; the U-shaped conveyor belt is adopted, so that the workpiece placing starting end and the processed receiving end are located at the same position, two workers do not need to operate, and the labor cost is saved.

Description

U-shaped storage mechanism for reflow soldering of integrated circuit board

Technical Field

The utility model relates to the technical field of reflow soldering devices, in particular to a U-shaped storage mechanism for reflow soldering of an integrated circuit board.

Background

Among the current reflow soldering device, when carrying out reflow soldering to paster integrated circuit, often need to arrange two staff at the import department and the export of reflow soldering device and cooperate respectively, this process of reflow soldering can't be accomplished by alone independently, has just so increased the cost of labor of paster integrated circuit board production.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a U-shaped receiving mechanism for reflow soldering of an ic board.

The utility model adopts the following scheme: a U-shaped storage mechanism for reflow soldering of an integrated circuit board comprises a reflow soldering device, a rack, a plurality of supporting legs, a U-shaped conveyor belt, a plurality of conveying rollers, a storage device and a driving motor for driving the conveying rollers to rotate; the U-shaped conveyer belt is installed in the frame through a plurality of transfer roller, a plurality of supporting leg sets firmly in the bottom of frame, the inner chamber that the reflow soldering device was run through on the limit of opening of U-shaped conveyer belt, storage device sets up in the tip below on the recovery limit of U-shaped conveyer belt.

Preferably, baffles are arranged on two sides of the U-shaped conveyor belt.

Preferably, the two turning outer edges of the U-shaped conveyor belt are respectively fixedly provided with arc-shaped plates protruding into the conveyor belt, and the arc-shaped plates are provided with smooth outer surfaces and are fixedly arranged on the rack.

Preferably, the two outer edges of the U-shaped conveyor belt that turn round are respectively and fixedly provided with a pushing mechanism for pushing the integrated circuit board inwards to enable the integrated circuit board to be in smooth transition, the pushing mechanism is fixedly arranged on the rack, the pushing mechanism comprises a pushing cylinder, a pushing rod and a pushing plate, and the pushing plate is connected with the output end of the pushing cylinder through the pushing rod.

Preferably, the plurality of supporting legs are telescopic supporting legs with adjustable heights.

Preferably, the driving motor for driving the conveying roller to rotate is a variable frequency motor.

Compared with the prior art, the utility model has the following beneficial effects: the U-shaped conveyor belt is adopted, so that the workpiece placing starting end and the processed receiving end are located at the same position, two workers do not need to operate, and the labor cost is saved; the arrangement of the baffle can avoid the integrated circuit board from falling off in the conveying process; the arrangement of the arc-shaped plate or the pushing mechanism can avoid that the integrated circuit board can not stably pass through the U-shaped conveying belt due to inertia when passing through the corner of the U-shaped conveying belt; the telescopic supporting legs can enable the mechanism to be applied to reflow soldering devices with different heights; the variable frequency motor is more energy-saving and has high adaptability.

Drawings

FIG. 1 is a top view of the present invention.

Fig. 2 is a front view of the present invention.

FIG. 3 is a schematic view of a partial structure of a U-shaped conveyor belt corner of the present invention.

In the figure: 1. a reflow device; 2. a frame; 3. supporting legs; 4. a U-shaped conveyor belt; 5. a conveying roller; 6. a storage device; 7. a baffle plate; 8. a circular arc plate; 9. a push cylinder; 10. a push rod; 11. a push plate.

Detailed Description

The first embodiment is as follows:

as shown in fig. 1 and fig. 2, the present embodiment includes a reflow soldering apparatus 1, and further includes a frame 2, a plurality of support legs 3, a U-shaped conveyor belt 4, a plurality of conveying rollers 5, a storage device 6, and a driving motor for driving the conveying rollers to rotate; the U-shaped conveyor belt 4 is arranged on the rack 2 through a plurality of conveyor rollers 5, two sides of the U-shaped conveyor belt 4 can be provided with baffle plates 7, a plurality of supporting legs 3 are fixedly arranged at the bottom of the rack 2, and the supporting legs 3 are telescopic supporting legs with adjustable heights and can be used for reflow soldering devices with different heights; the starting edge of the U-shaped conveyor belt 4 penetrates through the inner cavity of the reflow soldering device 1, and the containing device 6 is arranged below the end part of the recovery edge of the U-shaped conveyor belt 4; in order to enable the integrated circuit board to stably pass through two corners of the U-shaped conveyor belt 4, arc-shaped plates 8 protruding into the conveyor belt are fixedly arranged at the outer edges of the two corners of the U-shaped conveyor belt 4 respectively, and the arc-shaped plates 8 have smooth outer surfaces and are fixedly arranged on the rack 2; the driving motor for driving the conveying roller to rotate may preferably be a variable frequency motor.

Example two:

as an improved embodiment of the first embodiment, as shown in fig. 1 to fig. 3, the other structures are the same as the first embodiment, except that pushing mechanisms for pushing the ic board inward for smooth transition are respectively fixed at two outer edges of two corners of the U-shaped conveyor belt 4, instead of the circular arc-shaped board 8, the pushing mechanisms are fixed on the frame 2, each pushing mechanism includes a pushing cylinder 9, a pushing rod 10 and a pushing plate 11, and the pushing plate 11 is connected with an output end of the pushing cylinder 9 through the pushing rod 10.

The working principle is as follows: during the use, the height that highly makes its adaptation reflow soldering device of regulation supporting leg, the staff puts paster integrated circuit board at the edge of opening of U-shaped conveyer belt, also be exactly on one side of reflow soldering device import, then the U-shaped conveyer belt conveys paster integrated circuit board to the inner chamber of reflow soldering device, carry out reflow soldering, after reflow soldering, come out behind two turnings of U-shaped conveyer belt from the exit of reflow soldering device, steadily pass through with the help of convex board or thrustor, another limit through U-shaped conveying also is exactly the recovery limit, convey the integrated circuit board that reflow soldering accomplished back to staff's next door, accomodate through storage device.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

While the above-described embodiments have been described in further detail to solve the problems, technical solutions and advantages of the present invention, it should be noted that those skilled in the art should understand that the present invention is not limited by the above-described embodiments, and that various changes and modifications can be made in the present invention without departing from the spirit and scope of the present invention, which falls within the scope of the claimed invention.

Claims

1. The utility model provides a U type receiving mechanism for integrated circuit board reflow soldering, includes reflow soldering device (1), its characterized in that: the conveying device comprises a machine frame (2), a plurality of supporting legs (3), a U-shaped conveying belt (4), a plurality of conveying rollers (5), a containing device (6) and a driving motor for driving the conveying rollers to rotate; u-shaped conveyer belt (4) are installed on frame (2) through a plurality of transfer roller (5), a plurality of supporting leg (3) set firmly in the bottom of frame (2), the inner chamber of reflow soldering device (1) is run through on the limit of opening of U-shaped conveyer belt (4), storage device (6) set up in the tip below on the recovery limit of U-shaped conveyer belt (4).

2. The U-shaped receiving mechanism for reflow soldering of an ic board as set forth in claim 1, wherein: and baffles (7) are arranged on two sides of the U-shaped conveyor belt (4).

3. The U-shaped receiving mechanism for reflow soldering of an ic board as set forth in claim 1 or 2, wherein: two outer edges that turn round of U-shaped conveyer belt (4) set firmly respectively in to conveyer belt bellied circular arc board (8), circular arc board (8) have smooth surface and set firmly on frame (2).

4. The U-shaped receiving mechanism for reflow soldering of an ic board as set forth in claim 1 or 2, wherein: the outer edge of turning round of two of U-shaped conveyer belt (4) has set firmly respectively and is used for inwards promoting the thrustor mechanism that integrated circuit board made its steady transition, thrustor mechanism sets firmly on frame (2), thrustor mechanism is including promoting cylinder (9), catch bar (10) and push pedal (11), push pedal (11) link to each other with the output that promotes cylinder (9) through catch bar (10).

5. The U-shaped receiving mechanism for reflow soldering of an ic board as set forth in claim 1, wherein: the supporting legs (3) are telescopic supporting legs with adjustable heights.

6. The U-shaped receiving mechanism for reflow soldering of an ic board as set forth in claim 1, wherein: and the driving motor for driving the conveying roller to rotate is a variable frequency motor.