CN216182533U - Heat radiation structure for injection molding of MP4 shell - Google Patents
Heat radiation structure for injection molding of MP4 shell Download PDFInfo
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- CN216182533U CN216182533U CN202122452310.5U CN202122452310U CN216182533U CN 216182533 U CN216182533 U CN 216182533U CN 202122452310 U CN202122452310 U CN 202122452310U CN 216182533 U CN216182533 U CN 216182533U
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Abstract
The utility model discloses a heat dissipation structure for injection molding of an MP4 shell, which comprises a function box, wherein the top of the function box is symmetrically and fixedly connected with a support plate, the top of the support plate is fixedly connected with a baffle plate, the bottom of the baffle plate is fixedly connected with an air cylinder, the output end of the air cylinder is fixedly connected with a push plate, the bottom of the push plate is fixedly connected with an upper die, the top of the function box is fixedly connected with a cooling frame, the inside of the cooling frame is provided with an air suction plate and an air outlet plate, the inside of the cooling frame is fixedly connected with a lower die, the inside of the cooling frame is fixedly connected with a cooling pipe, and the inside of the function box is fixedly connected with a fan and a water pump, and the heat dissipation structure has the following beneficial effects that: can accomplish the cooling including injection moulding in the inside of cooling frame, improve the efficiency of the back cooling of moulding plastics, can dispel the heat to the injection moulding device by a large scale, improve the radiating rate of device greatly, guarantee the production efficiency of device.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation structure for injection molding of an MP4 shell.
Background
Injection molding is a process in which a plastic material that is completely melted is stirred by a screw at a certain temperature, injected into a mold cavity at high pressure, and cooled to solidify to obtain a molded article. The method is suitable for mass production of parts with complex shapes, and is one of important processing methods. The heat dissipation device mainly comprises 6 stages of die assembly, glue injection, pressure maintaining, cooling, die opening and product taking out, the existing heat dissipation device for the injection molding of the MP4 shell has the advantages that the general heat dissipation mode is automatic heat dissipation, cooling and cooling, the cooling speed is low, the working efficiency is low, and the production efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a heat dissipation structure for injection molding of MP4 casing, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a MP shell is heat radiation structure for injection moulding, includes the function case, the top symmetry fixedly connected with backup pad of function case, the top fixedly connected with baffle of backup pad, the bottom fixedly connected with cylinder of baffle, the output fixedly connected with push pedal of cylinder, the bottom fixedly connected with of push pedal goes up the mould, the top fixedly connected with cooling frame of function case, the inside of cooling frame is equipped with the board of airing exhaust and goes out the aerofoil, the inside fixedly connected with lower mould of cooling frame, the inside fixedly connected with cooling tube of cooling frame, the inside fixedly connected with fan and the water pump of function case, the inside fixedly connected with semiconductor refrigeration piece of function case.
Preferably, the bottom of baffle just is located the outside symmetry fixedly connected with telescopic link of cylinder, the bottom and the push pedal fixed connection of telescopic link.
Preferably, the inside of function case just is located the top equidistance fixedly connected with metal pole of semiconductor refrigeration piece, the bottom fixedly connected with heating panel of semiconductor refrigeration piece.
Preferably, the inside of function case and the one side fixedly connected with second baffle that is located the water pump, the inside of function case and the one side fixedly connected with first baffle that is located the fan, the inside of function case and be located and be equipped with the ventilation pipe between first baffle and the second baffle.
Preferably, the inlet scoop of the fan is communicated with the air suction plate through a pipeline, the air outlet of the fan is communicated with the vent pipe, the air outlet of the vent pipe is communicated with the air outlet plate, and the water outlet of the water pump is communicated with the cooling pipe through a pipeline.
Preferably, the outside of function case is equipped with control panel, cylinder, water pump, fan and semiconductor refrigeration piece all with control panel electric connection.
The utility model has the following beneficial effects: through the setting of cooling frame, can include injection moulding with the cooling and accomplish in the inside of cooling frame, improve the efficiency of the back cooling of moulding plastics, through the setting of cooling tube and ventilation pipe, can dispel the heat to the injection moulding device by a large scale, improve the radiating rate of device greatly, guarantee the production efficiency of device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention.
In the figure: 1. a function box; 2. a support plate; 3. a baffle plate; 4. pushing the plate; 5. an upper die; 6. a lower die; 7. a cooling frame; 8. a cylinder; 9. a telescopic rod; 10. a suction plate; 11. an air outlet plate; 12. a cooling tube; 13. a water pump; 14. a fan; 15. a first separator; 16. a heat dissipation plate; 17. a semiconductor refrigeration sheet; 18. a metal rod; 19. a vent pipe; 20. a second separator.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the utility model provides a MP4 shell heat radiation structure for injection moulding, including function case 1, the top symmetry fixedly connected with backup pad 2 of function case 1, the top fixedly connected with baffle 3 of backup pad 2, the bottom fixedly connected with cylinder 8 of baffle 3, the output fixedly connected with push pedal 4 of cylinder 8, push pedal 4 is conveniently removed, mould 5 on the bottom fixedly connected with of push pedal 4, the top fixedly connected with cooling frame 7 of function case 1, the inside of cooling frame 7 is equipped with air suction plate 10 and air-out board 11, the inside fixedly connected with lower mould 6 of cooling frame 7, the inside fixedly connected with cooling tube 12 of cooling frame 7, conveniently cool down the injection moulding device, the inside fixedly connected with fan 14 and the water pump 13 of function case 1, the inside fixedly connected with semiconductor refrigeration piece 17 of function case 1, the convenience is to the inside liquid cooling of function case 1.
Further, the bottom of baffle 3 and the outside symmetry fixedly connected with telescopic link 9 that is located cylinder 8, the bottom and the push pedal 4 fixed connection of telescopic link 9 make push pedal 4 more firm.
Further, inside of function box 1 and the top equidistance fixedly connected with metal pole 18 that is located semiconductor refrigeration piece 17, the bottom fixedly connected with heating panel 16 of semiconductor refrigeration piece 17, the convenience is to the liquid cooling of function box 1 inside.
Further, inside of function box 1 and the one side fixedly connected with second baffle 20 that is located water pump 13, inside of function box 1 and the first baffle 15 of one side fixedly connected with that is located fan 14, inside of function box 1 and be located and be equipped with ventilation pipe 19 between first baffle 15 and the second baffle 20, the convenience is cooled down to injection moulding device.
Furthermore, the inlet scoop of the fan 14 is communicated with the air suction plate 10 through a pipeline, the air outlet of the fan 14 is communicated with the vent pipe 19, the air outlet of the vent pipe 19 is communicated with the air outlet plate 11, and the water outlet of the water pump 13 is communicated with the cooling pipe 12 through a pipeline, so that the cooling is convenient.
Furthermore, a control panel is arranged on the outer side of the function box 1, and the air cylinder 8, the water pump 13, the fan 14 and the semiconductor refrigerating sheet 17 are electrically connected with the control panel, so that the air-conditioning system is convenient to control.
Specifically, when the utility model is used, the cylinder 8 is started to push the push plate 4 to move downwards, the push plate 4 drives the upper die 5 to move, when the upper die 5 and the lower die 6 are correspondingly clamped and provided with the injection molding, the fan 14 is started to pump out hot air in the cooling frame 7 through the air suction plate 10 and blow the hot air into the ventilation pipe 19, the ventilation pipe 19 cools in liquid in the functional box 1, the cooled air is blown out in the cooling frame 7 through the air outlet plate 11, cooling the injection molding device, cooling the liquid in the functional box 1 by the semiconductor refrigerating sheet 17, starting the water pump 13 to convey the liquid to the inside of the cooling pipe 12, cool off the injection moulding device, cool off the inside that injection moulding device cooling back liquid reentrant function case 1, after the cooling, cylinder 8 drives push pedal 4 and removes, goes up mould 5 rebound, and it can to take out the product.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a MP4 shell heat radiation structure for injection moulding, includes function case (1), its characterized in that: the top of the functional box (1) is symmetrically and fixedly connected with a supporting plate (2), the top of the supporting plate (2) is fixedly connected with a baffle plate (3), the bottom of the baffle (3) is fixedly connected with an air cylinder (8), the output end of the air cylinder (8) is fixedly connected with a push plate (4), the bottom of the push plate (4) is fixedly connected with an upper die (5), the top of the functional box (1) is fixedly connected with a cooling frame (7), an air suction plate (10) and an air outlet plate (11) are arranged inside the cooling frame (7), the interior of the cooling frame (7) is fixedly connected with a lower die (6), the interior of the cooling frame (7) is fixedly connected with a cooling pipe (12), a fan (14) and a water pump (13) are fixedly connected inside the functional box (1), the inside fixedly connected with semiconductor refrigeration piece (17) of function case (1).
2. The heat dissipation structure for injection molding of MP4 casing according to claim 1, wherein: the bottom of baffle (3) just is located the outside symmetry fixedly connected with telescopic link (9) of cylinder (8), the bottom and push pedal (4) fixed connection of telescopic link (9).
3. The heat dissipation structure for injection molding of MP4 casing according to claim 1, wherein: inside and the top equidistance fixedly connected with metal pole (18) that are located semiconductor refrigeration piece (17) of function case (1), the bottom fixedly connected with heating panel (16) of semiconductor refrigeration piece (17).
4. The heat dissipation structure for injection molding of MP4 casing according to claim 1, wherein: the utility model discloses a fan, including function case (1), one side fixedly connected with second baffle (20) that just is located water pump (13) in the inside of function case (1), the inside of function case (1) just is located one side fixedly connected with first baffle (15) of fan (14), the inside of function case (1) just is located and is equipped with ventilation pipe (19) between first baffle (15) and second baffle (20).
5. The heat dissipation structure for injection molding of MP4 casing according to claim 1, wherein: the exhaust inlet of fan (14) passes through pipeline and air suction plate (10) intercommunication, the air outlet and ventilation pipe (19) intercommunication of fan (14), the air outlet and the play aerofoil (11) intercommunication of ventilation pipe (19), the delivery port of water pump (13) passes through pipeline and cooling tube (12) intercommunication.
6. The heat dissipation structure for injection molding of MP4 casing according to claim 1, wherein: the outside of function case (1) is equipped with control panel, cylinder (8), water pump (13), fan (14) and semiconductor refrigeration piece (17) all with control panel electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122452310.5U CN216182533U (en) | 2021-10-12 | 2021-10-12 | Heat radiation structure for injection molding of MP4 shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122452310.5U CN216182533U (en) | 2021-10-12 | 2021-10-12 | Heat radiation structure for injection molding of MP4 shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216182533U true CN216182533U (en) | 2022-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122452310.5U Active CN216182533U (en) | 2021-10-12 | 2021-10-12 | Heat radiation structure for injection molding of MP4 shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216182533U (en) |
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2021
- 2021-10-12 CN CN202122452310.5U patent/CN216182533U/en active Active
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