CN216181766U

CN216181766U - Wafer dividing device

Info

Publication number: CN216181766U
Application number: CN202122408332.1U
Authority: CN
Inventors: 张龙飞; 张兆新
Original assignee: Xuzhou Xinjing Semiconductor Technology Co Ltd
Current assignee: Zhonghuan Leading Semiconductor Technology Co ltd; Zhonghuan Leading Xuzhou Semiconductor Materials Co ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-04-05
Anticipated expiration: 2031-09-30

Abstract

The utility model provides a wafer dividing device. The wafer dividing apparatus includes: a support structure; the movable pressing plate is arranged on the supporting structure and is used for pressing one part of the wafer on the supporting structure; the movable clamping plate is arranged on the supporting structure, the movable clamping plate and the movable pressing plate are arranged at intervals in the first direction, the movable clamping plate defines a clamping cavity for clamping the other part of the wafer, and the movable clamping plate can rotate relative to the supporting structure; and the scribing knife is used for cutting the wafer, the scribing knife is positioned between the movable pressing plate and the movable clamping plate in a first direction, and the scribing knife is movably arranged on the supporting structure in a second direction, wherein an included angle exists between the second direction and the first direction. According to the technical scheme, the wafer dividing device is adopted for dividing and sampling, so that the accuracy of the scribing position can be improved.

Description

Wafer dividing device

Technical Field

The utility model relates to the technical field of tools, in particular to a wafer dividing device.

Background

In the semiconductor industry, there is a need to perform segmentation sampling on wafers. One commonly used method of cutting and sampling is to manually hold a scribing knife to scribe the wafer and then manually break the wafer. However, the accuracy of the freehand scribing mode is not guaranteed.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a wafer dividing device which can improve the accuracy of scribing positions.

In order to achieve the above object, the present invention provides a wafer dividing apparatus comprising: a support structure; the movable pressing plate is arranged on the supporting structure and is used for pressing one part of the wafer on the supporting structure; the movable clamping plate is arranged on the supporting structure, the movable clamping plate and the movable pressing plate are arranged at intervals in the first direction, the movable clamping plate defines a clamping cavity for clamping the other part of the wafer, and the movable clamping plate can rotate relative to the supporting structure; and the scribing knife is used for cutting the wafer, the scribing knife is positioned between the movable pressing plate and the movable clamping plate in a first direction, and the scribing knife is movably arranged on the supporting structure in a second direction, wherein an included angle exists between the second direction and the first direction.

Further, the movable clamp plate includes an upper plate and a lower plate pivotally connected to define a clamping chamber therebetween, the lower plate being pivotally connected to the support structure.

Further, the wafer dividing device further comprises a first positioning structure, the first positioning structure is arranged on the supporting structure, the movable clamping plate is located between the first positioning structure and the movable pressing plate in the first direction, and the first positioning structure positions the movable clamping plate relative to the supporting structure in a rotating mode.

Further, the movable clamping plate defines a positioning hole, and the first positioning structure comprises: the fixing seat is arranged on the supporting structure, and a mounting hole is defined in the fixing seat; the positioning piece penetrates through the mounting hole, and the positioning piece can move relative to the fixing seat so as to be inserted into the positioning hole.

Furthermore, an internal thread is arranged on the inner wall surface of the mounting hole, and an external thread matched with the internal thread is arranged on the outer wall surface of the positioning piece, so that the rotary motion between the threads is converted into the movement of the positioning piece.

Furthermore, the first positioning structure further comprises a handle, the handle is connected with the positioning piece, and the handle is rotated to drive the positioning piece to move.

Further, the first positioning structure further comprises: the pressing piece is inserted in the mounting hole and can move relative to the fixed seat; and the elastic element is positioned in the mounting hole, one end of the elastic element is connected with the pressing piece, the other end of the elastic element is connected with the positioning piece, and the elastic element is used for providing acting force for the positioning piece to enable the positioning piece to move towards one side far away from the movable pressing plate.

Furthermore, the wafer dividing device also comprises a limiting structure, the limiting structure is arranged on the supporting structure, and the limiting structure is positioned below the movable clamping plate so as to limit the rotating position of the movable clamping plate.

Further, the wafer dividing device also comprises a first guide structure and a second guide structure, wherein the first guide structure is arranged on the support structure to guide the movement of the scribing cutter in the second direction; the second guide structure is arranged on the support structure and used for guiding the movement of the scribing cutter in the first direction.

Furthermore, the first guide structure comprises a first guide rail and a first sliding block, the first guide rail is fixed on the support structure, the scribing cutter is connected with the first sliding block, the first guide rail extends along the second direction, and the first sliding block is in sliding fit with the first guide rail; the second guide structure comprises a second guide rail and a second sliding block, the second guide rail is arranged on the supporting structure, the scribing cutter is connected with the second sliding block, the second guide rail extends along the first direction, and the second sliding block is in sliding fit with the second guide rail.

By applying the technical scheme of the utility model, the movable pressure plate is used for pressing one part of the wafer on the supporting structure, the clamping cavity can clamp the other part of the wafer, and the relative position of the wafer can be fixed through the supporting structure, the movable pressure plate and the movable clamping plate. The scribing knife is movable relative to the support structure in a second direction by which the wafer can be scribed to cut the wafer. Since the relative position of the wafer is fixed, the accuracy of the scribing position can be improved by the above arrangement.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

fig. 1 shows a schematic perspective view of an angle of an embodiment of a wafer dividing apparatus according to the present invention;

FIG. 2 is a schematic perspective view of another angle of the wafer dividing apparatus of FIG. 1;

FIG. 3 shows a schematic view of an angled configuration of the wafer singulation apparatus of FIG. 1;

FIG. 4 shows a side view of the wafer singulation apparatus of FIG. 3;

FIG. 5 shows a rear view of the wafer singulation apparatus of FIG. 3;

FIG. 6 shows a top view of the wafer singulation apparatus of FIG. 4; and

fig. 7 shows a bottom view of the wafer singulation apparatus of fig. 6.

Wherein the figures include the following reference numerals:

10. a support structure;

11. a support plate; 12. a mounting cavity; 13. a support frame;

20. a movable pressing plate;

30. a movable splint;

31. a lower plate; 32. an upper plate; 33. positioning holes; 34. a connecting plate;

40. a scribing knife;

41. a scribing cutter holder; 42. a scribing cutter body;

50. a first positioning structure;

51. a fixed seat; 52. a positioning member; 53. a handle;

60. a limiting structure;

61. a connecting member; 62. a limiting member;

70. a first guide structure;

71. a first guide rail; 72. a first slider;

80. a second guide structure;

81. a second guide rail; 82. a second slider;

90. a positioning structure;

101. a first protective liner; 102. a second protective liner; 103. a third protective liner; 104. a fourth protective liner;

111. a first handle; 112. a second handle;

120. a wafer.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the utility model.

In the semiconductor industry, there is a need to perform segmentation sampling on wafers. Two methods are commonly used to perform the segmentation sampling operation. One way is to use automated equipment for segmentation sampling, such as laser cutters; another way is to manually hold the scribing knife to scribe the wafer and then manually break the wafer. The use of automated equipment for wafer singulation requires increased equipment investment and subsequent maintenance and upkeep. For some situations where the sampling amount is not too large, it is still desirable to manually scribe and break the wafer to save the production cost of the enterprise. However, the accuracy of the manual scribing method is not guaranteed, and the wafer is directly and manually broken after scribing, which is likely to cause edge breakage and damage to human body.

In order to solve the above problems, embodiments of the present invention provide a wafer dividing apparatus.

As shown in fig. 1 to 7, in an embodiment of the present invention, a wafer dividing apparatus includes a support structure 10, a movable platen 20, a movable clamp plate 30, and a scribing knife 40 for cutting a wafer 120, the movable platen 20 being disposed on the support structure 10, the movable platen 20 being for pressing a portion of the wafer 120 against the support structure 10; the movable clamp plate 30 is disposed on the support structure 10, the movable clamp plate 30 is disposed spaced apart from the movable platen 20 in the first direction, the movable clamp plate 30 defines a clamping cavity for clamping another portion of the wafer 120, and the movable clamp plate 30 is rotatable with respect to the support structure 10; the scribing knife 40 is disposed between the movable platen 20 and the movable clamp plate 30 in a first direction, and the scribing knife 40 is movably disposed on the support structure 10 in a second direction, wherein the second direction is at an angle with respect to the first direction.

In the above arrangement, the movable platen 20 is used to press a portion of the wafer 120 against the support structure 10, the holding chamber is capable of holding another portion of the wafer 120, and the relative position of the wafer 120 can be fixed by the support structure 10, the movable platen 20, and the movable clamp plate 30. The scribing blade 40 is movable relative to the support structure 10 in a second direction, by which the wafer 120 can be scribed by the scribing blade 40 to cut the wafer 120. Since the relative position of the wafer 120 is fixed, the accuracy of the scribing position can be improved by the above arrangement.

In actual production, the scribing position of the wafer is generally in the wafer notch (notch) direction, and the accuracy of the scribing position can be effectively improved by using the wafer dividing device of the present application.

In addition, because the movable clamp plate 30 is rotatable relative to the support structure 10, the movable clamp plate 30 can drive a part of the wafer 120 clamped in the clamping cavity to rotate relative to another part of the wafer 120 pressed between the support structure 10 and the movable clamp plate 20, so that the wafer 120 is broken at the scribing position, compared with the technology of breaking the wafer by bare hands, in the technical scheme of the application, the contact areas between the movable clamp plate 30 and the wafer 120, between the support structure 10 and the wafer 120, and between the movable clamp plate 20 and the wafer 120 are relatively large, the problem of edge breakage in the process of breaking the wafer by hand can be effectively avoided, the integrity of the wafer is ensured, and the personal safety of operators is ensured.

That is to say, in the technical solution of the present application, the wafer dividing device is used for dividing and sampling, which not only can improve the scribing accuracy, but also can avoid the problem of edge breakage during the wafer breaking process.

In an embodiment of the present invention, an included angle between the second direction and the first direction is 90 ± 15 degrees.

In an embodiment of the utility model, the wafer dividing device is a tool for manually scribing and dividing a wafer, and the wafer can be clamped by the wafer dividing device for breaking off after the wafer is accurately scribed by the wafer dividing device. The wafer scribing precision is guaranteed through the wafer dividing device, the hands of operators are protected from being scratched when the wafers are broken off, and the manual operation is safe and efficient.

In the embodiment of the present invention, the supporting structure 10 has a mounting and supporting function for the movable platen 20, the movable clamping plate 30 and the scribing knife 40.

To facilitate placement and removal of the wafer 120, in an embodiment of the present invention, as shown in FIG. 1, the movable platen 20 is movably disposed on the support structure 10.

It should be noted that, in the embodiment of the present invention, the "movable" in the above-mentioned "the movable platen 20 is movably disposed on the support structure 10" means that the movable platen 20 is placed on the support structure 10 and is not connected to the support structure 10, and only the gravity of the movable platen 20 presses a portion of the wafer 120 between the support structure 10 and the movable platen 20.

Of course, in alternative embodiments of the present application, the movable platen 20 may also be connected to the support structure 10 and movably arranged with respect to the support structure 10, according to the actual needs.

The movable platen 20 has a certain weight to press a portion of the wafer 120 against the support structure 10, and when the wafer 120 is broken by rotating the movable clamp plate 30, the wafer 120 between the support structure 10 and the movable platen 20 is prevented from being lifted due to the gravity of the movable platen 20, thereby ensuring that the wafer 120 can be broken.

As shown in fig. 1, 2, 4, 6 and 7, in the embodiment of the present invention, the movable clamp plate 30 includes an upper plate 32 and a lower plate 31, the upper plate 32 and the lower plate 31 are pivotally connected, a clamping cavity is defined between the upper plate 32 and the lower plate 31, and the lower plate 31 is pivotally connected to the support structure 10.

In the above arrangement, a clamping cavity is defined between the upper plate 32 and the lower plate 31, and the upper plate 32 and the lower plate 31 cooperate to clamp the wafer 120 in the clamping cavity, so that reliable clamping can be realized. The upper plate 32 is pivotally connected to the lower plate 31 such that the upper plate 32 can be rotated relative to the lower plate 31 to facilitate the placement and removal of the wafer 120 into and from the clamping chamber. The lower plate 31 is pivotally coupled to the support plate 11 such that the lower plate 31 is rotatable with respect to the support plate 11, and rotating the lower plate 31 brings the upper plate 32 and the wafer 120 held between the upper plate 32 and the lower plate 31 together to rotate with respect to the support plate 11, thereby breaking apart the wafer 120.

As shown in fig. 2, in the present embodiment, the upper plate 32 is located above the lower plate 31, and since the upper plate 32 has a certain weight, a portion of the wafer 120 can be pressed in the holding cavity, on one hand, the wafer 120 can be positioned, so that the relative position of the wafer 120 is fixed, and on the other hand, the wafer 120 can be pressed, so that the wafer 120 can rotate together with the upper plate 32 and the lower plate 31, thereby achieving the purpose of breaking the wafer 120.

As shown in fig. 1, 2 and 4 to 7, in the embodiment of the present invention, the wafer dividing apparatus further includes a first positioning structure 50, the first positioning structure 50 is disposed on the support structure 10, the movable clamp plate 30 is located between the first positioning structure 50 and the movable clamp plate 20 in the first direction, and the first positioning structure 50 positions the movable clamp plate 30 to rotate relative to the support structure 10.

In the above solution, the supporting structure 10 is used for installing and supporting the first positioning structure 50, the first positioning structure 50 is used for positioning the movable clamp plate 30 relative to the rotation of the supporting structure 10, so that the relative position between the movable clamp plate 30 and the supporting structure 10 is fixed, that is, the movable clamp plate 30 cannot rotate relative to the supporting structure 10, and thus, the wafer 120 can be conveniently placed, the wafer 120 is stably pressed in the clamping cavity and on the supporting structure 10, and the scribing knife 40 is conveniently used for scribing and cutting the wafer 120.

Preferably, the inner wall surface of the bottom of the clamping cavity is flush with the upper surface of the support structure 10, so that the wafer 120 can be horizontally pressed in the clamping cavity and on the support structure 10, the height difference between different parts of the wafer 120 is prevented, the scribing accuracy is improved, and the problem of edge breakage in the process of breaking the wafer is avoided.

As shown in fig. 1, 2, 4 and 6, in the embodiment of the present invention, the movable clamping plate 30 is located between the first positioning structure 50 and the movable clamping plate 20, that is, the first positioning structure 50 and the movable clamping plate 20 are respectively located at two opposite sides of the movable clamping plate 30 along the first direction. The arrangement is convenient for arrangement, and the problem of mutual interference between the parts can be avoided.

As shown in fig. 1, in the embodiment of the present invention, the movable clamping plate 30 defines the positioning hole 33, the first positioning structure 50 includes a fixed seat 51 and a positioning member 52, the fixed seat 51 is disposed on the supporting structure 10, and the fixed seat 51 defines a mounting hole therein; the positioning member 52 is inserted into the mounting hole, and the positioning member 52 is movable relative to the fixing base 51, so that the positioning member 52 can be inserted into the positioning hole 33.

In the above arrangement, the movable clamp plate 30 defines the positioning hole 33, the fixed seat 51 is fixedly mounted on the supporting structure 10, and the positioning member 52 is inserted into the mounting hole and is movable relative to the fixed seat 51, so that when a force is applied to the positioning member 52, the positioning member 52 moves relative to the fixed seat 51, and one end of the positioning member 52 can be inserted into the positioning hole 33, so that the movable clamp plate 30 cannot rotate relative to the supporting structure 10, thereby achieving the purpose that the first positioning structure 50 positions the rotation of the movable clamp plate 30 relative to the supporting structure 10, and further ensuring that the scribing knife 40 performs scribing and cutting operations on the wafer 120. When the positioning members 52 are disengaged from the positioning holes 33, the movable clamp plate 30 can rotate relative to the support structure 10, and further can rotate together with the wafer 120 in the clamping cavity, thereby achieving the purpose of breaking the wafer 120.

In the embodiment of the present invention, an internal thread is provided on the inner wall surface of the mounting hole, and an external thread matched with the internal thread is provided on the outer wall surface of the positioning member 52, so that the rotational movement between the threads is converted into the movement of the positioning member 52. The internal thread is matched with the external thread, and the positioning element 52 is screwed, so that the positioning element 52 can move relative to the fixed seat 51.

As shown in fig. 1, in the embodiment of the present invention, the first positioning structure 50 further includes a handle 53, the handle 53 is connected to the positioning member 52, and the handle 53 is rotated to move the positioning member 52.

The positioning member 52 can be moved by rotating the handle 53, so that the positioning member 52 can be inserted into the positioning hole 33 or pulled out of the positioning hole 33.

Of course, in an alternative embodiment of the present invention, it is also possible that the first positioning structure 50 further includes a pressing piece and an elastic element according to actual needs, the pressing piece is inserted into the mounting hole, and the pressing piece is movable relative to the fixing seat 51; the elastic element is located in the mounting hole, one end of the elastic element is connected with the pressing piece, the other end of the elastic element is connected with the positioning piece, and the elastic element is used for providing acting force for the positioning piece 52 to enable the positioning piece 52 to move towards the side far away from the movable pressing plate 20.

Preferably, the first positioning structure 50 is an indexing pin that cooperates with the positioning hole 33 to position the movable clamp plate 30 for rotation relative to the support structure 10. The indexing pins are provided on the support structure 10. When the index pin is inserted into the positioning hole 33, the movable clamp plate 30 can be positioned to facilitate scribing the wafer 120. When the index pins are pulled out of the positioning holes 33, the movable clamp plate 30 can be rotated relative to the support structure 10 to break the wafer 120.

It should be noted that, in the embodiments of the present invention, the index pin is conventional in the art, and is not described herein again.

As shown in fig. 1, 2 and 4 to 6, in the embodiment of the present invention, the movable clamping plate 30 further includes a connecting plate 34, the connecting plate 34 is used for connecting the lower plate 31 and the upper plate 32, the connecting plate 34 is fixedly connected with the lower plate 31, the connecting plate 34 is pivotally connected with the upper plate 32, and the upper plate 32 is rotatably connected with the lower plate 31 through the connecting plate 34.

Specifically, the connecting plate 34 is "U" type, and the connecting plate 34 includes diapire, roof and lateral wall, and the roof sets up with the diapire relatively, and the lateral wall is used for connecting diapire and roof, and diapire, lateral wall and roof are connected and are formed "U" type structure. The bottom wall is fixedly connected with the lower plate 31, and the top wall is pivotally connected with the upper plate 32; the side walls define positioning holes 33.

Preferably, the top wall is hingedly connected to the upper plate 32. Preferably, the top wall is hingedly connected to the upper plate 32 by a spring.

Of course, in alternative embodiments of the present application, the connecting plate 34 may be fixedly connected to the upper plate 32, and the connecting plate 34 may be pivotally connected to the lower plate 31, according to actual requirements.

As shown in fig. 1 to 5, in the embodiment of the present invention, the wafer dividing apparatus further includes a limiting structure 60, the limiting structure 60 is disposed on the support structure 10, and the limiting structure 60 is located below the movable clamp plate 30 to limit a position where the movable clamp plate 30 rotates.

In the above arrangement, the support structure 10 is used for supporting the position limiting structure 60, the position limiting structure 60 is located below the movable clamp plate 30, and the position limiting structure 60 is used for limiting the limit position of the movable clamp plate 30 rotating downwards relative to the support structure 10.

Specifically, as shown in fig. 3 and 5, in the embodiment of the present invention, the limiting structure 60 includes a limiting member 62 disposed on the supporting structure 10, and the limiting member 62 is located below the movable clamp plate 30 to limit a limit position of the movable clamp plate 30 rotating downward relative to the supporting structure 10.

In the embodiment of the present invention, the movable clamp plate 30 rotates to drive the wafer 120 clamped in the clamping cavity to rotate, so as to open the wafer 120, the limiting member 62 is used to limit the limit position of the movable clamp plate 30 rotating downward relative to the support structure 10, and on the basis of ensuring that the wafer 120 can be opened, the motion range of the movable clamp plate 30 can be reduced, the space occupied by the movable clamp plate 30 can be reduced, and the structure distribution of the wafer dividing apparatus is more reasonable, the structure is compact, and the occupied space is small.

The support structure 10 is used to install and form the stop 62. The limiting member 62 is located below the movable clamp plate 30, so that the limiting member 62 can limit the movable clamp plate 30.

As shown in fig. 1 to 5 and 7, in the embodiment of the present invention, the limiting structure 60 further includes a connecting member 61 connected to the supporting structure 10, and the limiting member 62 is connected to the connecting member 61 and is movably disposed in the vertical direction relative to the connecting member 61; the stopper 62 can abut against the lower surface of the movable clamp plate 30.

The limiting member 62 is connected to the supporting structure 10 through the connecting member 61. During the rotation of the movable clamp plate 30 relative to the support structure 10, the limiting member 62 can abut against the lower surface of the lower plate 31, so that the limiting member 62 limits the limit position of the downward rotation of the movable clamp plate 30.

Preferably, the limiting member 62 is movable in the vertical direction relative to the connecting member 61, so that the height of the limiting member 62 in the vertical direction can be adjusted, the heights of the limiting members 62 in the vertical direction are different, the limiting ranges of the limiting members 62 on the rotation angles of the movable clamp plate 30 are different, and the limiting position of the movable clamp plate 30 rotating downwards can be adjusted and limited by adjusting the height of the limiting member 62 in the vertical direction, so that the adaptability is improved.

Specifically, as shown in fig. 3 and 5, in the embodiment of the present invention, the limiting member 62 includes a second screw, the connecting member 61 is provided with an internal threaded hole, the second screw is inserted into the internal threaded hole and is in threaded fit with the internal threaded hole, and by screwing the second screw, the height of the second screw in the vertical direction can be adjusted, and the second screw can abut against the lower surface of the lower plate 31.

The connecting member 61 includes a longitudinal member provided below the support frame 13 in the vertical direction and a cross member connected to the longitudinal member, and the female screw hole is provided in the cross member and located below the side plate.

As shown in fig. 3, 5 and 7, in an embodiment of the utility model, the wafer dividing apparatus includes a plurality of limiting members 62 disposed at intervals along the second direction and a plurality of connecting members 61 disposed corresponding to the plurality of limiting members 62.

The limiting members 62 jointly limit the limit position of the downward rotation of the movable clamp plate 30, and the limiting effect can be improved.

As shown in fig. 3 and fig. 5, in the embodiment of the utility model, the wafer dividing apparatus includes two limiting members 62, and the two limiting members 62 are respectively located at two opposite sides of the movable clamp plate 30 along the second direction.

In an embodiment of the present invention, as shown in fig. 1 and 2, the scribing knife 40 is movably disposed in the second direction with respect to the supporting structure 10.

The support structure 10 provides support for the scoring blade 40. The scribing blade 40 is movable in a second direction relative to the support structure 10 so that the scribing blade 40 can scribe the wafer 120.

The scribing cutter 40 includes a scribing cutter body 41 and a scribing cutter body 42 connected to the scribing cutter body 41, the scribing cutter body 42 is used for scribing, and the scribing cutter body 42 is used for supporting the scribing cutter body 41. The scribing cutter body 42 is provided movably in the vertical direction with respect to the scribing cutter holder 41, so that the height of the scribing cutter body 42 in the vertical direction can be adjusted to facilitate the scribing operation.

It should be noted that, in the embodiment of the present invention, the scribing knife 40 is implemented by a conventional technique in the art, and is not described herein again.

As shown in fig. 1, 2, 4 and 6, in an embodiment of the present invention, the scribing knife 40 is movably disposed in a first direction with respect to the supporting structure 10.

After the wafer 120 is secured, the relative position between the scribing blade 40 and the wafer 120 needs to be determined before the wafer 120 is scribed by the scribing blade 40 to facilitate scribing by the subsequent scribing blade 40. With the above arrangement, the relative position of the scribing blade 40 in the first direction can be adjusted, thereby adjusting the relative position between the scribing blade 40 and the wafer 120. Once adjusted, the scribing blade 40 is used to scribe the line by moving the scribing blade 40 in the second direction.

As shown in fig. 1 to 6, in the embodiment of the present invention, the wafer dividing apparatus further includes a first guide structure 70 and a second guide structure 80, the first guide structure 70 being provided on the support structure 10 to guide the movement of the scribing blade 40 in the second direction; the second guide structure 80 is provided on the support structure 10 and serves to guide the movement of the scribing blade 40 in the first direction.

The supporting structure 10 is used for supporting the first guiding structure 70, and the first guiding structure 70 is used for guiding the movement of the scribing cutter 40 relative to the supporting structure 10 along the second direction, so that the problem of inaccurate scribing caused by the deviation of the scribing cutter 40 in the movement process is avoided, and the scribing accuracy can be improved.

The supporting structure 10 is used for supporting the second guiding structure 80, and the second guiding structure 80 is used for guiding the movement of the scribing cutter 40 relative to the supporting plate 11 along the first direction, so that the problem that the relative position of the scribing cutter 40 is inaccurate in adjustment and the subsequent scribing precision is influenced due to the fact that the scribing cutter 40 deviates in the process of moving along the first direction is avoided.

As shown in fig. 1, in the embodiment of the present invention, the first guide structure 70 includes a first guide rail 71 and a first slider 72, the first guide rail 71 is fixed on the support structure 10, the scribing cutter 40 is connected to the first slider 72, the first guide rail 71 extends in the second direction, and the first slider 72 is slidably engaged with the first guide rail 71.

The first guide rail 71 extends along the second direction, the first sliding block 72 is in sliding fit with the first guide rail 71, and the scribing cutter 40 is connected with the first sliding block 72, so that when the scribing cutter 40 moves under the driving of an external force, the scribing cutter 40 can drive the first sliding block 72 to move along the first guide rail 71 together, and the guiding effect of the first guiding structure 70 on the movement of the scribing cutter 40 along the second direction is realized.

As shown in fig. 1, in the embodiment of the present invention, the scribing blade holder 41 of the scribing blade 40 is connected to the first slider 72.

Of course, in an alternative embodiment of the present application, the first guiding structure 70 may also include a first sliding block disposed on the supporting plate 11 and a first guiding rail slidably engaged with the first sliding block, the first sliding block extends along the second direction, and the scribing knife 40 is connected with the first guiding rail according to actual requirements.

As shown in fig. 1, in the embodiment of the present invention, the second guide structure 80 includes a second guide rail 81 and a second sliding block 82, the second guide rail 81 is disposed on the support structure 10, the scribing knife 40 is connected to the second sliding block 82, the second guide rail 81 extends in the first direction, and the second sliding block 82 is slidably engaged with the second guide rail 81.

The second guide rail 81 extends in the first direction, the second slider 82 is slidably fitted to the second guide rail 81, and the scribing cutter 40 is connected to the second slider 82. In this way, when the scribing cutter 40 moves under the driving of an external force, the scribing cutter 40 drives the second slider 82 to move along the second guide rail 81, so that the second guide structure 80 can guide the movement of the scribing cutter 40 in the first direction.

As shown in fig. 1 to 6, in the embodiment of the present invention, the scribing knife 40, the first slider 72, the first guide rail 71, and the second slider 82 are connected in this order. The scoring blade 40, the first guide structure 70 and the second slider 82 all move along the second guide rail 81.

Of course, in an alternative embodiment of the present application, the second guiding structure 80 may also include a second sliding block disposed on the supporting plate 11 and a second guiding rail slidably engaged with the second sliding block, the second sliding block extends along the first direction, and the scribing knife 40 is connected with the second guiding rail according to actual requirements.

As shown in fig. 1 to 4 and fig. 6, in the embodiment of the present invention, the wafer dividing apparatus further includes a positioning structure 90 for positioning a position where the second slider 82 slides with respect to the second guide rail 81.

After the position of the scribing cutter 40 along the first direction is determined, the relative position of the second sliding block 82 and the second guide rail 81 needs to be fixed, so that the scribing cutter 40 is prevented from continuously moving along the first direction to influence the scribing precision. The positioning structure 90 is used for positioning the sliding position of the second sliding block 82 relative to the second guide rail 81, so that the relative position of the second sliding block 82 and the second guide rail 81 is fixed, thereby ensuring that the scribing cutter 40 cannot move continuously along the first direction and ensuring the scribing accuracy.

As shown in fig. 1 to 4 and fig. 6, in the embodiment of the present invention, the positioning structure 90 includes a first screw, the second slider 82 is provided with a threaded through hole, the first screw is inserted into the threaded through hole and is in threaded fit with the threaded through hole, and one end of the first screw can abut against the second guide rail 81.

When the relative position between the second slider 82 and the second rail 81 needs to be fixed, the first screw is screwed to abut against the second rail 81, so that the second slider 82 is fixed to the second rail 81, and the position of the second slider 82 is fixed. When the second slider 82 needs to be moved relative to the second guide rail 81, the first screw is screwed to release the first screw from contact with the second guide rail 81, so that the second slider 82 and the second guide rail 81 are slidably engaged with each other, and the position of the scribing cutter 40 in the first direction can be adjusted and guided.

As shown in fig. 1 to 3 and fig. 6, in the embodiment of the present invention, the wafer dividing apparatus includes two second guiding structures 80 and two positioning structures 90 disposed corresponding to the two second guiding structures 80, the two second guiding structures 80 are respectively disposed at two ends of the first guiding rail 71 along the second direction, and the two second sliders 82 of the two second guiding structures 80 are both connected to the first guiding rail 71. The two second guide structures 80 support and guide the first guide structure 70.

In an embodiment of the present invention, the support structure 10 includes a first mounting region and a second mounting region arranged in sequence, the first mounting region defining a mounting cavity 12 therein, the movable clamp plate 30 being located in the mounting cavity 12, and the movable pressure plate 20 being arranged in the second mounting region, the second mounting region being configured to be pivotally connected to the lower plate 31.

Specifically, as shown in fig. 1, in the embodiment of the present invention, the support structure further includes a support plate 11 and a support frame 13, the support frame 13 defines a first mounting area and a second mounting area, the support plate 11 is disposed in the second mounting area, the support plate 11 is pivotally connected to the lower plate 31, the movable platen 20 presses a portion of the wafer 120 against the support plate 11, and the support plate 11 is connected to the support frame 13.

The support frame 13 has a mounting and supporting function for both the support plate 11 and the movable clamp plate 30. At least part of the movable clamping plate 30 is positioned in the mounting cavity 12, and when the movable clamping plate 30 rotates relative to the supporting plate 11, the mounting cavity 12 can avoid the movable clamping plate 30, so that the movable clamping plate 30 is prevented from interfering, and the movable clamping plate 30 can smoothly rotate.

Preferably, as shown in fig. 1, in the embodiment of the present invention, the first mounting region and the second mounting region communicate. This arrangement makes it possible to make the wafer dividing apparatus compact and also to make the support frame 13 have a certain protective effect on the support plate 11.

As shown in fig. 1 to 5, in the embodiment of the present invention, the supporting frame 13 includes a quadrangular frame defining a first mounting area and a second mounting area, and four legs disposed below the quadrangular frame, the supporting plate 11 is connected to the quadrangular frame, and the four legs support the quadrangular frame, the supporting plate 11, the movable clamping plate 30, and the like.

As shown in fig. 1, 2 and 4 to 7, in the embodiment of the present invention, the first positioning structure 50 is disposed on the support frame 13. The support frame 13 is used to mount and support the first positioning structure 50. The first guide structure 70 and the second guide structure 80 are both mounted on the support frame 13, and the support frame 13 has a supporting function for both the first guide structure 70 and the second guide structure 80.

As shown in fig. 1, 2 and 6, in the embodiment of the present invention, the wafer dividing apparatus further includes a first protective liner 101, the first protective liner 101 is disposed on the supporting plate 11, and the first protective liner 101 is located on a side of the supporting plate 11 facing the movable platen 20.

The first protective liner 101 is used to protect the wafer 120 from metal contamination.

As shown in fig. 1 and 2, in the embodiment of the present invention, the wafer dividing apparatus further includes a second protective liner 102, the second protective liner 102 is disposed on the movable platen 20, and the second protective liner 102 is located on a side of the movable platen 20 facing the supporting plate 11.

The second protective liner 102 is used to protect the wafer 120 from metal contamination.

Preferably, the first protective liner 101 is made of PU (Polyurethane) material. Preferably, the second protective liner 102 is made of PU material.

As shown in fig. 1 to 6, in the embodiment of the present invention, the wafer dividing apparatus further includes a first handle 111, and the first handle 111 is disposed on a side of the movable platen 20 away from the support plate 11.

The operator holds the first handle 111 and can easily move the movable platen 20, thereby facilitating the placement and removal of the wafer 120.

As shown in fig. 1 and 2, in the embodiment of the present invention, the wafer dividing apparatus further includes a third protective liner 103, the third protective liner 103 is disposed on the lower plate 31, and the third protective liner 103 is located on a side of the lower plate 31 facing the upper plate 32.

The third protective liner 103 is used to protect the wafer 120 from metal contamination.

As shown in fig. 1, 2 and 4, in the embodiment of the present invention, the wafer dividing apparatus further includes a fourth protective liner 104, the fourth protective liner 104 is disposed on the upper plate 32, and the fourth protective liner 104 is located on a side of the upper plate 32 facing the lower plate 31.

The fourth protective liner 104 is used to protect the wafer 120 from metal contamination.

Preferably, the third protective liner 103 and the fourth protective liner 104 are made of PU material, which can protect the wafer 120.

As shown in fig. 1 to 6, in the embodiment of the present invention, the wafer dividing apparatus further includes a second handle 112, and the second handle 112 is disposed on a side of the upper plate 32 facing away from the lower plate 31.

The operator can easily rotate the upper plate 32 with respect to the lower plate 31 by holding the second handle 112, thereby facilitating the placement and removal of the wafer 120.

Of course, in alternative embodiments not shown in the drawings of the present application, the upper plate 32 and the lower plate 31 may be connected in other detachable connection manners, such as by fasteners such as screws, according to actual needs.

As shown in fig. 1 to 7, in an embodiment of the present invention, the wafer dividing apparatus includes a supporting structure 10, a movable platen 20, a movable clamping plate 30, a scribing cutter 40, a first positioning structure 50, a limiting member 62, a first guiding structure 70, and a second guiding structure 80.

The support structure 10 provides support for the entire tool, the support structure 10 includes a support frame 13 and a support plate 11, the support plate 11 is mounted on the support frame 13, the support plate 11 is lined with a first protective liner 101, and a portion of the wafer 120 can be placed on the first protective liner 101 and protected from metal contamination.

The movable platen 20 is provided with a second protective liner 102, the support plate 11 is provided with a first protective liner 101, and the movable platen 20 can be used to press the wafer 120 on the support plate 11 conveniently.

The movable clamp plate 30 includes a lower plate 31 and an upper plate 32 which are hinged by a spring, the lower plate 31 is pivotally connected to the support plate 11, the movable clamp plate 30 can be fixed to the support frame 13 by the first positioning structure 50, and another portion of the wafer 120 can be clamped between the lower plate 31 and the upper plate 32.

The wafer dividing apparatus is provided with guide rails extending in two directions, and the scribing blade holder 41 is mounted on a first guide rail 71 extending in the second direction, and the first guide rail 71 is mounted on a second guide rail 81 extending in the first direction, so that the scribing blade 40 can move in the entire plane to reach a position where scribing is required.

The scribing cutter body 42 used in the wafer dividing apparatus is attached to the scribing cutter holder 41, and when the scribing cutter body 42 is held by a hand, the tip of the scribing cutter body 42 comes into contact with the wafer 120 and moves in the second direction along the first guide rail 71, thereby performing scribing.

After the scribing operation is completed, the first positioning structure 50 is pulled out of the positioning hole 33, and the entire movable clamp plate 30 can be rotated around the support plate 11, thereby performing the operation of breaking the wafer 120.

When the movable clamp plate 30 rotates to a certain position around the support plate 11, the movable clamp plate 30 abuts against the limiting member 62, and the limiting member 62 can limit the limit position of the movable clamp plate 30 rotating downward relative to the support plate 11, so that the movable clamp plate 30 is prevented from rotating too much.

In the embodiment of the utility model, the wafer dividing device can conveniently clamp the wafer, the scribing operation of the wafer is carried out through the movement of the scribing cutter, and then the breaking action of the wafer is carried out through the rotation of the movable clamping plate by utilizing the tool.

From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: the movable pressure plate is used for pressing one part of the wafer on the supporting structure, the clamping cavity can clamp the other part of the wafer, and the relative position of the wafer can be fixed through the supporting structure, the movable pressure plate and the movable clamping plate. The scribing knife is movable relative to the support structure in a second direction by which the wafer can be scribed to cut the wafer. Since the relative position of the wafer is fixed, the accuracy of scribing can be improved by the above arrangement. In addition, because movable clamp plate is rotatable in vertical plane for bearing structure, consequently, movable clamp plate can drive the partly another part rotation for compressing tightly the wafer between bearing structure and movable clamp plate of centre gripping intracavity wafer, thereby break off the wafer off with the fingers and thumb in the marking off department, among the technical scheme of this application, between movable clamp plate and the wafer, area of contact between bearing structure and the wafer and between movable clamp plate and the wafer is great relatively, can effectively avoid breaking off with the fingers and thumb the problem of breaking off the limit in-process taking place, wafer integrality has been guaranteed and operating personnel's personal safety has been ensured. That is to say, in the technical scheme of the application, the wafer dividing device is adopted to carry out dividing and sampling, so that the scribing accuracy can be improved, and the problem of edge breakage in the wafer breaking process can be avoided.

It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer dividing apparatus, comprising:

a support structure (10);

a movable platen (20) disposed on the support structure (10), the movable platen (20) for pressing a portion of a wafer (120) against the support structure (10);

a movable clamp plate (30) disposed on the support structure (10), the movable clamp plate (30) being spaced from the movable platen (20) in a first direction, the movable clamp plate (30) defining a clamping cavity for clamping another portion of the wafer (120), and the movable clamp plate (30) being rotatable relative to the support structure (10); and

a scribing knife (40) for cutting the wafer (120), the scribing knife (40) being located between the movable platen (20) and the movable clamp plate (30) in the first direction, the scribing knife (40) being movably arranged on the support structure (10) in a second direction, wherein the second direction is at an angle to the first direction.

2. Wafer dividing apparatus according to claim 1, wherein the movable clamping plate (30) comprises an upper plate (32) and a lower plate (31), the upper plate (32) and the lower plate (31) being pivotally connected, the upper plate (32) and the lower plate (31) defining the clamping cavity therebetween, the lower plate (31) being pivotally connected to the support structure (10).

3. The wafer dividing apparatus according to claim 1, further comprising a first positioning structure (50), wherein the first positioning structure (50) is disposed on the support structure (10), and wherein the movable clamp plate (30) is located between the first positioning structure (50) and the movable clamp plate (20) in the first direction, and wherein the first positioning structure (50) positions the movable clamp plate (30) for rotation relative to the support structure (10).

4. The wafer dividing apparatus of claim 3, wherein the movable clamp plate (30) defines a positioning aperture (33), and the first positioning structure (50) comprises:

a fixed seat (51) arranged on the support structure (10), wherein a mounting hole is defined in the fixed seat (51);

the positioning piece (52) penetrates through the mounting hole, and the positioning piece (52) can move relative to the fixed seat (51) so that the positioning piece (52) can be inserted into the positioning hole (33).

5. The wafer dividing apparatus as claimed in claim 4, wherein an inner wall surface of the mounting hole is provided with an inner thread, and an outer wall surface of the positioning member (52) is provided with an outer thread engaged with the inner thread, so as to convert a rotational movement between the threads into a movement of the positioning member (52).

6. The wafer dividing apparatus as claimed in claim 5, wherein the first positioning structure (50) further comprises a handle (53), the handle (53) is connected to the positioning member (52), and the handle (53) is rotated to move the positioning member (52).

7. Wafer dividing apparatus according to claim 4, wherein the first positioning structure (50) further comprises:

the pressing piece is inserted into the mounting hole and can move relative to the fixed seat (51);

the elastic element is positioned in the mounting hole, one end of the elastic element is connected with the pressing piece, the other end of the elastic element is connected with the positioning piece (52), and the elastic element is used for providing acting force for the positioning piece (52) to enable the positioning piece (52) to move towards one side far away from the movable pressing plate (20).

8. The wafer dividing apparatus according to any one of claims 1 to 7, further comprising a limiting structure (60), wherein the limiting structure (60) is disposed on the support structure (10), and the limiting structure (60) is located below the movable clamp plate (30) to define a position where the movable clamp plate (30) rotates.

9. The wafer dividing apparatus according to any one of claims 1 to 7, further comprising a first guide structure (70) and a second guide structure (80), the first guide structure (70) being provided on the support structure (10) to guide movement of the scribing blade (40) in the second direction; the second guide structure (80) is provided on the support structure (10) and serves to guide movement of the scribing blade (40) in the first direction.

10. The wafer dividing apparatus according to claim 9,

the first guide structure (70) comprises a first guide rail (71) and a first sliding block (72), the first guide rail (71) is fixed on the supporting structure (10), the scribing knife (40) is connected with the first sliding block (72), the first guide rail (71) extends along the second direction, and the first sliding block (72) is in sliding fit with the first guide rail (71);

the second guide structure (80) comprises a second guide rail (81) and a second sliding block (82), the second guide rail (81) is arranged on the supporting structure (10), the scribing knife (40) is connected with the second sliding block (82), the second guide rail (81) extends along the first direction, and the second sliding block (82) is in sliding fit with the second guide rail (81).