CN216179721U - Grinding wheel and penetrating type double-end-face grinding device using same - Google Patents

Abstract

The utility model discloses a grinding wheel and a penetrating type double-end-face grinding device using the same, wherein the grinding wheel comprises a base body and an abrasive layer, the base body is provided with a grinding face, the abrasive layer penetrates through the center of the grinding face of the base body, the abrasive layer is adhered to the grinding face, the abrasive layer is of a honeycomb layered structure, the honeycomb layered structure is provided with a plurality of chip removal holes, the chip removal holes are regular hexagonal holes, and the chip removal holes are arranged in a honeycomb shape. The number of the chip removal holes can be maximized by using the regular hexagonal chip removal holes in the grinding material layer with the same area, so that chips can fall from the chip removal holes as much as possible during grinding, and the grinding quality is guaranteed.

Description

Grinding wheel and penetrating type double-end-face grinding device using same

Technical Field

The utility model relates to the technical field of material grinding tools, in particular to a grinding wheel and a penetrating type double-end-face grinding device applying the same.

Background

The grinding wheel is also called a consolidation grinding tool, and is a consolidation grinding tool which is formed by consolidating common grinding materials into a certain shape by a bonding agent and has certain strength. In a through type double-end-face grinding device, ground chips on a workpiece fall onto the surface of a grinding wheel, so that the chips prevent the workpiece from contacting the grinding wheel when the next workpiece is ground, and the grinding quality of the subsequent workpiece is influenced.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks, an object of the present invention is to provide a grinding wheel and a through double-ended grinding apparatus using the same.

In order to achieve the purpose, the utility model adopts the following technical scheme: a grinding wheel comprises a base body and an abrasive layer;

the base body is provided with a grinding surface, and an installation part penetrates through the center of the grinding surface;

the abrasive material layer glues to be located the face of polishing, the abrasive material layer is honeycomb laminated structure, honeycomb laminated structure is equipped with a plurality of chip removal hole, the chip removal hole is regular hexagon hole, and a plurality of the chip removal hole is honeycomb arrangement.

Preferably, the polishing surface is further provided with a transition annular layer, and the transition annular layer is arranged on the periphery of the abrasive layer.

Preferably, the length of the diagonal line of the chip removal hole is 4mm-8mm, and the ratio of the thickness of the hole wall of the chip removal hole to the length of the diagonal line of the chip removal hole is 8: 25.

Preferably, the thickness H of the transition annular layer is 10mm-20 mm.

Preferably, the thickness M of the abrasive layer is 20 to 40 mm.

Preferably, the material of the substrate is aluminum, cast iron or 45 steel.

A penetrating type double-end-face grinding device comprises two groups of rotating assemblies and two grinding wheels, wherein the two groups of rotating assemblies are arranged in opposite directions, one grinding wheel is inserted into each group of rotating assemblies, the two grinding material layers are arranged in opposite directions, a grinding space is reserved between the two grinding material layers, and the grinding space is used for accommodating a workpiece;

the rotating assembly is used for driving the grinding wheel to rotate.

Preferably, at least one grinding wheel is obliquely arranged on the rotating assembly, and the minimum distance between the two honeycomb laminated structures is the height of a ground workpiece.

One of the above technical solutions has the following advantages or beneficial effects: the number of the chip removal holes can be maximized by using the regular hexagonal chip removal holes in the grinding material layer with the same area, so that chips can fall from the chip removal holes as much as possible during grinding, and the grinding quality is guaranteed.

Drawings

FIG. 1 is a schematic diagram of the construction of one embodiment of the grinding wheel of the present invention;

FIG. 2 is a side cross-sectional view of one embodiment of the grinding wheel of the present invention;

FIG. 3 is an enlarged view at A in FIG. 2;

FIG. 4 is a schematic diagram of an embodiment of a through double-ended grinding apparatus of the present invention;

fig. 5 is a schematic structural view of another embodiment of the through double-ended grinding apparatus of the present invention.

Wherein: the grinding wheel comprises a grinding wheel 1, a base body 11, a grinding material layer 12, a mounting part 2, a chip removal hole 3, a transition annular layer 4, a rotating assembly 5, a feeding device 6 and a workpiece 7.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in figures 1-5, a grinding wheel comprises a base (11) and an abrasive layer (12);

the base body (11) is provided with a grinding surface, and the base body (11) is provided with an installation part (2) in a penetrating way at the center of the grinding surface;

abrasive material layer (12) glue to be located the face of polishing, abrasive material layer (12) are honeycomb laminated structure, honeycomb laminated structure is equipped with a plurality of chip removal hole (3), chip removal hole (3) are regular hexagon hole, and a plurality of chip removal hole (3) are honeycomb and arrange.

The abrasive layer (12) is arranged on the surface of the base body (11) in an adhering mode, and because the grinding layer is used for grinding, the grinding layer is high in consumption and short in service life, a new abrasive layer (12) can be quickly arranged by the method.

When the grinding wheel (1) is used, the grinding wheel (1) is arranged on a rotatable device, the rotating device drives the grinding wheel (1) to rotate, the surface of the workpiece (7) to be ground, which needs to be ground, is abutted against the honeycomb layered structure on the grinding material layer (12), and the workpiece (7) is ground by the rotating honeycomb layered structure. During polishing, the polished chips on the workpiece (7) fall onto the honeycomb laminated structure to influence the polishing quality of the subsequent workpiece (7), so that the honeycomb laminated structure is provided with the chip removal holes (3), the chips falling off from the workpiece (7) during polishing can be discharged through the chip removal holes (3), and the chips are prevented from staying on the honeycomb laminated structure. In addition, in one technical scheme of the application, the shape of the chip removal hole (3) is a regular hexagon. The number of the chip removal holes (3) can be maximized by using the regular hexagonal chip removal holes (3) in the honeycomb laminated structure with the same area, so that chips can fall from the chip removal holes (3) as much as possible during polishing, and the polishing quality is ensured.

Preferably, the polishing surface is further provided with a transition annular layer (4), and the transition annular layer (4) is arranged on the periphery of the abrasive layer (12).

The transition annular layer (4) is arranged at the edge of the grinding wheel (1) to avoid the defects of scraping and the like of the workpiece (7) during grinding, the transition annular layer (4) is composed of phenolic resin liquid, corundum and silicon carbide, and the scraping of the edge of the grinding wheel (1) to the workpiece (7) can be reduced.

Preferably, the length of the diagonal line of the chip removal hole (3) is 4mm-8mm, and the ratio of the thickness of the hole wall of the chip removal hole (3) to the length of the diagonal line of the chip removal hole (3) is 8: 25.

The hole wall of the chip removal hole (3) is mainly used for polishing with the workpiece (7) during polishing, if the aperture of the chip removal hole (3) is large, the number of the hole walls of the chip removal hole (3) can be reduced, and the workpiece (7) can be partially and difficultly polished, so that the chip removal hole (3) can be effectively removed when the length of a diagonal line is 4-8 mm, and the polishing quality can not be influenced.

Preferably, the thickness H of the transition annular layer (4) is 10mm-20 mm.

Preferably, the thickness M of the abrasive layer (12) is 20-40 mm.

Preferably, the material of the substrate (11) is aluminum, cast iron or 45 steel.

A penetrating type double-end-face grinding device comprises two groups of rotating assemblies (5) and two grinding wheels (1), wherein the two groups of rotating assemblies (5) are arranged in opposite directions, one grinding wheel (1) is inserted into each group of rotating assemblies (5), the two grinding material layers (12) are arranged in opposite directions, a grinding space is reserved between the two grinding material layers (12), and the grinding space is used for accommodating a workpiece;

the rotating assembly (5) is used for driving the grinding wheel (1) to rotate.

The workpiece (7) can be arranged on the feeding device (6), and after the workpiece (7) is arranged on the feeding device (6), the feeding device (6) drives the workpiece (7) to penetrate through a polishing space between the grinding wheel (1) above and the grinding wheel (1) below. And (3) removing the allowance of the upper end surface and the lower end surface of the workpiece (7) by polishing the honeycomb laminated structure on the grinding wheel (1), obtaining the required thickness size and the corresponding parallelism of the workpiece (7), and enabling the surface roughness of the workpiece (7) to meet the requirement. Wherein, rotating assembly (5) can be rotating electrical machines, fixes through axle sleeve or interference fit's mode installation department (2), and installation department (2) in this application run through whole emery wheel (1), make it can rotating assembly (5) are upper and lower adjusting position to satisfy the polishing of not unidimensional work piece (7).

Preferably, at least one grinding wheel (1) is obliquely arranged on the rotating assembly (5), and the minimum distance between the two honeycomb laminated structures is the height of a workpiece (7) to be ground.

If the two grinding wheels (1) are arranged in parallel, and a convex margin is left on the surface of the workpiece (7) before grinding, the workpiece (7) is difficult to be pushed to a position between the two grinding wheels (1) by the feeding device (6). Therefore, in one technical scheme of the application, at least one grinding wheel (1) is inclined, so that a height difference is formed between the two grinding wheels (1), the highest distance between the end faces of the two grinding wheels (1) is an inlet of a workpiece (7), the lowest distance between the end faces of the two grinding wheels (1) is an outlet of the workpiece (7), the workpiece (7) can smoothly enter the space between the two grinding wheels (1) for polishing, and the allowance for removing the workpiece (7) is the largest.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (8)

1. A grinding wheel characterized by: comprises a substrate (11) and an abrasive layer (12);

the base body (11) is provided with a grinding surface, and the base body (11) is provided with an installation part (2) in a penetrating way at the center of the grinding surface;

abrasive material layer (12) glue to be located the face of polishing, abrasive material layer (12) are honeycomb laminated structure, honeycomb laminated structure is equipped with a plurality of chip removal hole (3), chip removal hole (3) are regular hexagon hole, and a plurality of chip removal hole (3) are honeycomb and arrange.

2. A grinding wheel according to claim 1, characterized in that: the sanding surface is also provided with a transition annular layer (4), and the transition annular layer (4) is arranged on the periphery of the abrasive layer (12).

3. A grinding wheel according to claim 1, characterized in that: the length of the diagonal line of the chip removal hole (3) is 4-8 mm, and the ratio of the thickness of the hole wall of the chip removal hole (3) to the length of the diagonal line of the chip removal hole (3) is 8: 25.

4. A grinding wheel according to claim 2, characterized in that: the thickness H of the transition annular layer (4) is 10mm-20 mm.

5. A grinding wheel according to claim 1, characterized in that: the thickness M of the abrasive layer (12) is 20-40 mm.

6. A grinding wheel according to claim 1, characterized in that the material of the basic body (11) is aluminium, cast iron or 45 steel.

7. A through type double end-face grinding device, using a grinding wheel according to any one of claims 1 to 6, characterized by comprising two sets of rotating assemblies (5) and two grinding wheels (1), wherein the two sets of rotating assemblies (5) are arranged oppositely, one grinding wheel (1) is inserted into each set of rotating assemblies (5), the two abrasive material layers (12) are arranged oppositely, and a grinding space is reserved between the two abrasive material layers (12) and is used for accommodating a workpiece;

the rotating assembly (5) is used for driving the grinding wheel (1) to rotate.

8. A through-penetrating double-ended grinding device according to claim 7, wherein at least one of said grinding wheels (1) is arranged obliquely to said rotating assembly (5), the smallest distance between two honeycomb layers being the height of the workpiece (7) being ground.

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