CN216175829U

CN216175829U - Die carrier for hardware die with shock-absorbing function

Info

Publication number: CN216175829U
Application number: CN202122903770.5U
Authority: CN
Inventors: 王志鹏; 张涛; 游顺华
Original assignee: Foshan Gute Hardware Technology Co ltd
Current assignee: Foshan Gute Hardware Technology Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-04-05
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses a die carrier for a hardware die with a damping function, which comprises a bottom plate, wherein buffer columns are arranged inside buffer grooves, the middle parts of the bottoms inside the buffer grooves are fixedly connected to the bottoms of buffer airbags, the middle parts of the bottoms of buffer blocks are fixedly connected to the top ends of first springs, the tops of first cushion pads are fixedly connected to the bottoms of top plates, and the tops of the top plates are fixedly connected to the bottoms of second cushion pads. According to the die frame, the buffer air bag can be used for damping the buffer column, the first spring is used for damping the buffer block when the buffer column moves downwards, the first buffer cushion and the second buffer cushion can effectively protect the buffer column, the top plate and the die and prevent the surface from being damaged, and the mode that the buffer air bag is matched with the first spring is used for greatly increasing the overall damping performance of the die frame, so that the service life of the die is prolonged.

Description

Die carrier for hardware die with shock-absorbing function

Technical Field

The utility model relates to the technical field of die carriers, in particular to a die carrier for a hardware die with a damping function.

Background

The mold is an indispensable tool for producing products in modern factories, and is also crucial to the design of a mold frame for installing and fixing the mold in the structural technology during the production of the products in the factories, so that the mold plays a good supporting role.

Chinese patent document CN208230681U discloses a die carrier for hardware mould with shock-absorbing function, including upper bracket and base, the middle part of base upper surface is provided with the lower carriage, the both sides of base upper surface are provided with the platform, the upper surface of lower carriage is provided with the second magnetic path, the one end of lower carriage is connected with the buffering post, the one end of upper bracket is connected with the fixed column, be connected through the fixed column between upper bracket and the lower carriage, be fixed knot between upper bracket and the fixed column and construct, the inside scarf joint of buffering post has reset spring. The utility model discloses a reasonable in design through being provided with first magnetic path and second magnetic path between the upper ledge and the lower carriage of this die carrier, utilizes the principle that like poles repel each other to carry out the shock attenuation work between upper ledge and the lower carriage between first magnetic path and the second magnetic path, and the inside mosaic of buffering post between upper ledge and the lower carriage has reset spring to carry out the further shock attenuation work between upper ledge and the lower carriage, and visible this kind of utility model, the function is practical, is fit for extensively promoting. But its shock attenuation effect is not good, and is not convenient for install the dismantlement to the mould.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides a die frame with a damping function for a hardware die.

In order to achieve the purpose, the utility model adopts the following technical scheme: a die carrier with a damping function for a hardware die comprises a base plate, wherein buffer grooves are arranged inside two sides of the middle part of the top of the base plate, buffer columns are arranged inside the buffer grooves, sliders are arranged at the bottoms of two sides of each buffer column, the middle parts of the bottoms of the sliders are fixedly connected to the tops of buffer blocks, the middle parts of the bottoms of the buffer blocks are fixedly connected to the top ends of telescopic columns, telescopic grooves are arranged inside two sides of the inner wall of the bottom of each buffer groove, the top ends of the buffer columns are fixedly connected to two sides of the middle part of the bottom of a first buffer pad respectively, the top of the first buffer pad is fixedly connected to the bottom of a top plate, the top of the top plate is fixedly connected to the bottom of a second buffer pad, clamping grooves are arranged inside the front rear parts of two sides of the top plate, dies are arranged at the top of the second buffer pad, and regularly distributed mounting lugs are arranged at the front part and the rear parts of two sides of the bottom of the dies respectively, the inner parts of the middle parts of the mounting lugs are all connected to the outer diameter of the clamping block in a sliding mode.

As a further description of the above technical solution:

the middle part of the bottom inside the buffer groove is fixedly connected to the bottom of the buffer air bag.

As a further description of the above technical solution:

the inside of lower part inner wall all is provided with the spout in the dashpot both sides, the equal sliding connection of slider is in the inside of spout.

As a further description of the above technical solution:

the equal fixed connection in bottom middle part of buffer block is on the top of first spring, the bottom of first spring fixed connection is in the both sides of the inside bottom of dashpot respectively.

As a further description of the above technical solution:

the equal sliding connection of bottom external diameter of flexible post is in the inside in flexible groove.

As a further description of the above technical solution:

the mounting lugs are connected to the top plate and the inner portions of the front and rear portions of two sides of the top of the second cushion pad in a sliding mode.

As a further description of the above technical solution:

the middle parts of the right ends of the clamping blocks are fixedly connected to the left end of the stretching column.

As a further description of the above technical solution:

the right-hand member of fixture block all fixed connection is in the left end of second spring, the equal fixed connection in the outside of draw-in groove inner wall of right-hand member of second spring.

The utility model has the following beneficial effects:

1. according to the die frame, firstly, the buffer column can be damped by the buffer air bag when moving downwards, the buffer block can be damped by the telescopic column and the first spring when the buffer column moves downwards, the buffer column, the top plate and the die can be effectively protected by the first buffer cushion and the second buffer cushion, the surface is prevented from being damaged, and the overall damping performance of the die frame is greatly improved by the mode that the buffer air bag is matched with the first spring, so that the service life of the die can be prolonged.

2. According to the utility model, the die can be inserted on the upper part of the top plate by pulling the telescopic column through the mounting lug, the telescopic column is released through the second spring, so that the fixture block and the telescopic column can be reset in the clamping groove, and the fixture block can be clamped with the mounting lug through resetting of the fixture block so as to mount the die.

Drawings

FIG. 1 is a perspective view of a metal mold frame with a shock-absorbing function according to the present invention;

fig. 2 is a front sectional view of a die carrier for a hardware die with a shock-absorbing function according to the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2.

Illustration of the drawings:

1. a base plate; 2. a buffer tank; 3. a buffer column; 4. a slider; 5. a buffer air bag; 6. a chute; 7. a buffer block; 8. a telescopic column; 9. a first spring; 10. a telescopic groove; 11. a first cushion pad; 12. a top plate; 13. a second cushion pad; 14. a mold; 15. mounting lugs; 16. a clamping block; 17. a card slot; 18. stretching the column; 19. a second spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, one embodiment of the present invention is provided: a die carrier with a shock absorption function for a hardware die comprises a base plate 1, buffer grooves 2 are respectively arranged inside two sides of the middle part of the top of the base plate 1, buffer columns 3 are respectively arranged inside the buffer grooves 2, sliders 4 are respectively arranged at the bottoms of two sides of each buffer column 3, the sliders 4 and sliding grooves 6 can move downwards inside the buffer grooves 2 during working, the middle parts of the bottoms of the sliders 4 are respectively and fixedly connected to the tops of buffer blocks 7, the middle parts of the bottoms of the buffer blocks 7 are respectively and fixedly connected to the top ends of telescopic columns 8, the buffer blocks 7 are subjected to a shock absorption effect when the buffer columns 3 move downwards through the telescopic columns 8 and first springs 9, the mode that the buffer air bags 5 are matched with the first springs 9 greatly increases the overall shock absorption performance of the die carrier, so that the service life of a die 14 can be prolonged, the telescopic grooves 10 are respectively arranged inside two sides of the inner wall of the bottom of each buffer groove 2, can realize flexible post 8 lapse through flexible groove 10, the top of bumping post 3 is the both sides at first blotter 11 bottom middle part of fixed connection respectively, the top fixed connection of first blotter 11 is in the bottom of roof 12, the top fixed connection of roof 12 is in the bottom of second blotter 13, the inside at rear portion all is provided with draw-in groove 17 before roof 12 top both sides, the top of second blotter 13 is provided with mould 14, can be effectual to bumping post 3 through first blotter 11 and second blotter 13, roof 12 plays the guard action with mould 14, prevent that the surface from causing the damage, the front and back portion of mould 14 bottom both sides sets up regularly distributed's installation ear 15 respectively, the inside equal sliding connection in middle part of installation ear 15 is at the external diameter of fixture block 16, installation ear 15 can realize the block with fixture block 16.

The middle part of the bottom inside the buffer groove 2 is fixedly connected to the bottom of the buffer airbag 5, the buffer column 3 can have a damping effect on the buffer column 3 through the buffer airbag 5 when moving downwards, the inner walls of the middle and lower parts of the two sides of the buffer groove 2 are both provided with a chute 6, a slide block 4 is all slidably connected inside the chute 6, the middle part of the bottom of the buffer block 7 is all fixedly connected to the top end of a first spring 9, the bottom end of the first spring 9 is respectively and fixedly connected to the two sides of the bottom inside the buffer groove 2, the outer diameter of the bottom end of a telescopic column 8 is all and slidably connected inside the telescopic groove 10, mounting lugs 15 are all and slidably connected to the front and rear parts of the two sides of the top plate 12 and the second buffer pad 13, the die 14 can be inserted on the upper part of the top plate 12 by pulling the telescopic column 18 through the mounting lugs 15, the middle part of the right end of a fixture block 16 is all and fixedly connected to the left end of a second spring 19, the equal fixed connection in the outside of draw-in groove 17 inner wall of right-hand member of second spring 19 loosens flexible post 18 and can make fixture block 16 and flexible post 18 realize reseing in draw-in groove 17 through second spring 19, thereby resets through fixture block 16 and carries out the block with installation ear 5 and install mould 14, thereby this kind of mode makes the mould be convenient for the installation and dismantle can change the use to the mould.

The working principle is as follows: firstly, the buffer column 3, the sliding block 4 and the sliding groove 6 can move downwards in the buffer groove 2 when working, the buffer column 3 can have a damping effect on the buffer column 3 through the buffer air bag 5 when moving downwards, the buffer block 7 can be damped when the buffer column 3 moves downwards through the telescopic column 8 and the first spring 9, the buffer column 3, the top plate 12 and the die 14 can be effectively protected through the first buffer cushion 11 and the second buffer cushion 13, the surface damage can be prevented, the mode that the buffer air bag 5 is matched with the first spring 9 is greatly increased in the integral damping performance of the die set, so that the service life of the die 14 can be prolonged, the die 14 can be inserted on the upper part of the top plate 12 by pulling the telescopic column 18 through the mounting lug 15, the telescopic column 18 is loosened, the clamping block 16 and the telescopic column 18 can be reset in the clamping groove 17 through the second spring 19, the fixture blocks 16 are reset to be clamped with the mounting lugs 5 so as to mount the die 14, so that the die is convenient to mount and dismount, and the die can be replaced.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a die carrier for hardware mould with shock-absorbing function, includes bottom plate (1), its characterized in that: the buffer slots (2) are arranged inside two sides of the middle part of the top of the bottom plate (1), the buffer posts (3) are arranged inside the buffer slots (2), the sliders (4) are arranged at the bottoms of two sides of the buffer posts (3), the middle parts of the bottoms of the sliders (4) are fixedly connected to the tops of the buffer blocks (7), the middle parts of the bottoms of the buffer blocks (7) are fixedly connected to the top ends of the telescopic posts (8), the telescopic slots (10) are arranged inside two sides of the inner wall of the bottom of the buffer slot (2), the top ends of the buffer posts (3) are fixedly connected to two sides of the middle part of the bottom of the first buffer cushion (11), the top of the first buffer cushion (11) is fixedly connected to the bottom of the top plate (12), the top of the top plate (12) is fixedly connected to the bottom of the second buffer cushion (13), the clamping slots (17) are arranged inside the front rear parts of two sides of the top plate (12), the top of the second cushion pad (13) is provided with a die (14), the front part and the rear part of the two sides of the bottom of the die (14) are respectively provided with regularly distributed mounting lugs (15), and the inner parts of the middle parts of the mounting lugs (15) are all connected to the outer diameter of the clamping block (16) in a sliding manner.

2. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the middle part of the bottom inside the buffer groove (2) is fixedly connected to the bottom of the buffer air bag (5).

3. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the inside of lower part inner wall all is provided with spout (6) in buffer slot (2) both sides, the equal sliding connection of slider (4) is in the inside of spout (6).

4. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the equal fixed connection in bottom middle part of buffer block (7) is on the top of first spring (9), the bottom of first spring (9) is fixed connection respectively in the both sides of the inside bottom of buffer slot (2).

5. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the bottom outer diameter of the telescopic column (8) is connected inside the telescopic groove (10) in a sliding mode.

6. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the mounting lugs (15) are connected to the inner portions of the front and rear portions of the two sides of the tops of the top plate (12) and the second cushion pad (13) in a sliding mode.

7. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the middle parts of the right ends of the clamping blocks (16) are fixedly connected with the left end of the stretching column (18).

8. The die carrier with the shock absorption function for the hardware die as claimed in claim 1, wherein: the right ends of the clamping blocks (16) are fixedly connected to the left end of the second spring (19), and the right ends of the second spring (19) are fixedly connected to the outer side of the inner wall of the clamping groove (17).