CN216173693U

CN216173693U - Gluing device for semiconductor production

Info

Publication number: CN216173693U
Application number: CN202122124392.0U
Authority: CN
Inventors: 华铁军; 黄春城
Original assignee: Jiangsu Haichuang Microelectronics Co ltd
Current assignee: Jiangsu Haichuang Microelectronics Co ltd
Priority date: 2021-09-04
Filing date: 2021-09-04
Publication date: 2022-04-05
Anticipated expiration: 2031-09-04

Abstract

The utility model discloses a gluing device for semiconductor production, which comprises a gluing pen, wherein the bottom end of the gluing pen is fixedly connected with a connecting port, a glue dispensing port matched with the connecting port is inserted into the bottom end of the connecting port, the top end surface of the glue dispensing port is sleeved with an anti-glue-dripping mechanism, the anti-glue-dripping mechanism comprises a movable frame, the surface of the movable frame is sleeved with a movable ring matched with the movable frame, and sliding grooves are symmetrically formed in the surfaces of two sides of the movable frame. According to the utility model, the movable frame and the movable ring are arranged, when the dispensing opening is taken out from the interior of the movable frame, the movable frame can be contracted into the interior of the movable ring through the self elasticity of the first spring, so that the leakage of the colloid in the connecting opening when the dispensing opening is detached can be effectively prevented, and the limiting block can be far away from the interior of the movable ring by screwing the screw into the interior of the limiting block, so that the integral drip-proof mechanism can be conveniently and regularly cleaned and maintained.

Description

Gluing device for semiconductor production

Technical Field

The utility model relates to the technical field of gluing machines, in particular to a gluing device for semiconductor production.

Background

The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, the importance of the semiconductor is very great, and most of electronic products, such as computers, mobile phones or core units in digital recorders, are closely related to the semiconductor;

the most important step in the production process of the semiconductor is glue dispensing, wherein the glue dispensing is to drip electronic glue on a product, so that the product has the effects of sticking, encapsulating, insulating, fixing, smooth surface and the like;

during dispensing, a dispensing pen is needed, and the dispensing head needs to be replaced regularly during the use process of the dispensing pen, however, when the dispensing head is replaced and the dispensing head is separated from the dispensing pen, the glue inside the dispensing pen is easy to leak, so that the glue is wasted;

therefore, we propose a gluing device for semiconductor production to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides a gluing device for semiconductor production.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a gluing device is used in semiconductor production, includes the rubberizing pen, the bottom fixedly connected with connector of rubberizing pen, and the bottom of connector inside insert be equipped with the glue mouth of connector looks adaptation, the top surface cover of glue mouth is equipped with anti-drip mechanism, and anti-drip mechanism is including removing the frame, the surface cover that removes the frame is equipped with the shift ring rather than the looks adaptation, the spout has been seted up to the bilateral surface symmetry of removing the frame, and the inside of spout is inserted and is equipped with the first slider that can slide in its inside, the bottom fixed surface of first slider is connected with first spring, the inside fixed inserting of removing the frame is equipped with the solid fixed ring inconsistent with glue mouth top.

Preferably, the both sides surface symmetry of connector is seted up and is run through the spacing groove of establishing of inserting, and the inside of spacing groove is inserted and is equipped with stop gear, stop gear includes the screw rod, and the screw rod passes through the bearing and installs the inside at the spacing groove, the inside of spacing groove is inserted and is equipped with the stopper, and the upper and lower both ends surface symmetry fixedly connected with two sets of the same second sliders of stopper, the slide rail corresponding with the second slider is seted up to the upper and lower both ends inner wall of spacing groove, the second slider is inserted and is established the inside of slide rail, the inside of slide rail is inserted and is equipped with the second spring.

Preferably, rectangular notches capable of blanking are symmetrically formed in the surface of the moving frame, and the rectangular notches are abutted to the inner wall of the moving ring.

Preferably, the both sides surface symmetry of shift ring is seted up and is had the spacing hole corresponding with the stopper, and the inner wall symmetry of spacing groove inserts and be equipped with the stopper to shift ring limiting displacement, the stopper is provided with two sets ofly, two sets of the bottom of stopper is the tilt state from inboard outside downwards.

Preferably, the bottom end of the first spring is fixedly connected with the inner wall of the bottom end of the sliding groove, and the top end of the first spring is fixedly connected with the bottom end of the first sliding block.

Preferably, the inner wall of the limiting block is provided with an inner cavity corresponding to the screw, the inner wall of the inner cavity is provided with an inner thread corresponding to the outer thread of the screw, and the screw is in threaded connection with the limiting block.

Preferably, one end of the second spring is fixedly connected with the inner wall of the sliding rail, and the end, far away from the inner wall of the sliding chute, of the second spring is fixedly connected with the surface of the second sliding block.

Compared with the prior art, the utility model has the beneficial effects that:

1. the device is through being provided with removal frame and shift ring, through when some jiao kou takes out from the inside of removing the frame, through the elasticity of first spring self, can make the inside that removes the frame shrink and advance the shift ring to can effectually prevent that the glue mouth of dead point from connecting the inside colloid of mouth when dismantling to take place to leak.

2. The device is through being provided with screw rod and stopper, through the inside with screw rod screw in stopper to the pulling screw rod can make the stopper keep away from the inside of shifting ring, can dismantle the whole inside of following of drip proof gluey mechanism at this moment, thereby can conveniently regularly clear up the maintenance to drip proof gluey mechanism wholly.

Drawings

Fig. 1 is a schematic perspective view of a gluing device for semiconductor manufacturing according to the present invention;

FIG. 2 is a schematic perspective cross-sectional view of the structure of FIG. 1;

FIG. 3 is a three-dimensional burst diagram of the structure of the anti-drip mechanism shown in FIG. 1;

fig. 4 is a perspective enlarged view of the structure at a in fig. 1.

In the figure: 100. gluing a pen; 200. a connecting port; 300. dispensing a glue port; 400. an anti-drip mechanism; 401. moving the frame; 402. a moving ring; 403. a first slider; 404. a first spring; 405. a fixing ring; 500. a limiting mechanism; 501. a screw; 502. a limiting block; 503. a second slider; 504. a second spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-4, a gluing device for semiconductor production, including gluing pen 100, the bottom fixedly connected with connector 200 of gluing pen 100, and connector 200's bottom is inside to be inserted and is equipped with some glue mouth 300, the top surface cover of some glue mouth 300 is equipped with anti-drip mechanism 400, and anti-drip mechanism 400 is including removing frame 401, the surface cover that removes frame 401 is equipped with shift ring 402, the spout has been seted up to the bilateral surface symmetry of removing frame 401, and the inside of spout is inserted and is equipped with first slider 403, the bottom surface fixedly connected with first spring 404 of first slider 403, the inside fixed of removing frame 401 is inserted and is equipped with solid fixed ring 405, can effectually avoid when changing some glue mouths 300 through anti-drip mechanism 400, the inside colloid of gluing pen 100 leaks, avoid the colloid extravagant.

Further, as can be known by referring to fig. 2 and 4, a limiting groove is symmetrically formed in the two side surfaces of the connecting port 200, a limiting mechanism 500 is inserted into the limiting groove, the limiting mechanism 500 comprises a screw 501, the screw 501 is installed in the limiting groove through a bearing, a limiting block 502 is inserted into the limiting groove, a second slider 503 is symmetrically and fixedly connected to the upper end surface and the lower end surface of the limiting block 502, a sliding rail corresponding to the second slider 503 is formed in the inner walls of the upper end and the lower end of the limiting groove, the second slider 503 is inserted into the sliding rail, a second spring 504 is inserted into the sliding rail, the screw 501 and the second spring 504 are matched with each other for use, and the drip-proof mechanism 400 can be fixed and detached.

Further, refer to fig. 3 and learn that rectangular notch has been seted up to the surface symmetry of removal frame 401, and rectangular notch offsets with the inner wall of shift ring 402, avoids the inside colloid of rubberizing pen 100 to leak through contradicting, and the while upwards slides, and the colloid of the rubberizing pen 100 inner wall of being convenient for flows out to open and shut and sealed effect to in reply different demands.

Further, refer to fig. 3 and fig. 4 and learn that the both sides surface symmetry of shift ring 402 is seted up and is equipped with the spacing hole corresponding with stopper 502, and the inner wall symmetry of spacing groove is inserted and is equipped with stopper 502, and stopper 502 is provided with two sets ofly, and the bottom of two sets of stoppers 502 is the tilt state downwards from inboard outside, through the tilt state, is convenient for contradict with shift ring 402 surface and slides, avoids taking place the phenomenon of jam between shift ring 402 and the stopper 502.

Further, as can be known from fig. 3, the bottom end of the first spring 404 is fixedly connected to the inner wall of the bottom end of the sliding groove, the top end of the first spring 404 is fixedly connected to the bottom end of the first sliding block 403, and the movable frame 401 is driven to reset by the elastic force of the first spring 404, so that the movable frame 401 can be repeatedly used.

Further, refer to fig. 4 and learn that the inner wall of stopper 502 has seted up the inner chamber corresponding with screw rod 501, and the inner wall of inner chamber has seted up the internal thread corresponding with screw rod 501 external screw thread, and screw rod 501 is threaded connection with stopper 502, and through the use of meshing between the internal and external screw thread, be convenient for drive stopper 502 and slide, simultaneously, can fix spacing effect with stopper 502, avoid stopper 502 to slide at the inner wall of shift ring 402.

Further, as can be known from fig. 4, one end of the second spring 504 is fixedly connected to the inner wall of the slide rail, the other end of the second spring 504 is fixedly connected to the surface of the second slider 503, and the second slider 503 is convenient to reset by itself under the elastic force of the second spring 504.

When the dispensing opening 300 needs to be detached, the dispensing opening 300 is pulled downwards manually, the dispensing opening 300 slides out of the interior of the connecting port 200, when the dispensing opening 300 is separated from the interior of the movable frame 401, the external force of the first spring 404 is relieved, the movable frame 401 is driven to slide downwards by contraction, the rectangular notch on the surface of the movable frame 401 is attached to the inner wall of the movable ring 402, and the colloid in the gluing pen 100 is effectively prevented from flowing out;

when the anti-drip mechanism 400 needs to be cleaned, the screw 501 is rotated, the screw 501 rotates to slide towards the inside of the limiting block 502 without mutual engagement of internal threads of the inner wall of the limiting block 502, then the screw 501 is pulled outwards, the limiting block 502 slides outwards and is separated from the inner wall of the moving ring 402, and the whole anti-drip mechanism 400 slides downwards, so that the anti-drip mechanism 400 is convenient to clean, rectangular notches on two sides of the moving frame 401 are prevented from being blocked, and the device is convenient to use normally;

the above is the overall working principle of the present invention.

In the present invention, the installation manner, the connection manner, or the setting manner of all the components described above are all common mechanical manners, and the specific structures, models, and coefficient indexes of all the components are their own technologies, which can be implemented as long as the beneficial effects thereof can be achieved, and thus, the details are not repeated.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

In the present invention, unless otherwise specified, the terms "upper, lower, left, right, front, back, inner, outer, vertical and horizontal" and the like included in the terms only represent the orientation of the terms in the conventional use state or are colloquially understood by those skilled in the art, and should not be construed as limiting the terms, and meanwhile, the terms "first", "second" and "third" and the like do not represent specific numbers and sequences, but are merely used for name differentiation, and the terms "include", "include" and any other variations are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or also includes elements inherent to such process, method, article, or apparatus.

Claims

1. A gluing device for semiconductor production comprises a gluing pen (100) and is characterized in that the bottom end of the gluing pen (100) is fixedly connected with a connector (200), a glue dispensing opening (300) matched with the connecting opening (200) is inserted into the bottom end of the connecting opening (200), the top end surface of the glue dispensing opening (300) is sleeved with a glue dripping prevention mechanism (400), the drip-proof mechanism (400) comprises a movable frame (401), a movable ring (402) matched with the movable frame (401) is sleeved on the surface of the movable frame (401), sliding grooves are symmetrically formed in the surfaces of the two sides of the movable frame (401), a first sliding block (403) capable of sliding in the sliding groove is inserted in the sliding groove, a first spring (404) is fixedly connected to the bottom end surface of the first sliding block (403), the inside of the movable frame (401) is fixedly inserted with a fixing ring (405) which is abutted against the top end of the glue dispensing opening (300).

2. The gluing device for semiconductor production according to claim 1, wherein limiting grooves capable of being inserted are symmetrically formed in the two side surfaces of the connecting port (200), the limiting mechanism (500) is inserted in the limiting grooves, the limiting mechanism (500) comprises a screw (501), the screw (501) is mounted in the limiting grooves through a bearing, the limiting blocks (502) are inserted in the limiting grooves, two groups of identical second sliding blocks (503) are symmetrically and fixedly connected to the surfaces of the upper end and the lower end of each limiting block (502), sliding rails corresponding to the second sliding blocks (503) are formed in the inner walls of the upper end and the lower end of each limiting groove, the second sliding blocks (503) are inserted in the sliding rails, and second springs (504) are inserted in the sliding rails.

3. The gluing device for semiconductor production as recited in claim 1, wherein the surface of the movable frame (401) is symmetrically provided with rectangular notches for blanking, and the rectangular notches are abutted against the inner wall of the movable ring (402).

4. The gluing device for semiconductor production according to claim 1, wherein two limiting holes corresponding to the limiting blocks (502) are symmetrically formed in the two side surfaces of the moving ring (402), the limiting blocks (502) for limiting the moving ring (402) are symmetrically inserted into the inner wall of the limiting groove, two groups of the limiting blocks (502) are arranged, and the bottom ends of the two groups of the limiting blocks (502) are inclined downward from the inner side to the outer side.

5. The gluing device for semiconductor production according to claim 1, wherein the bottom end of the first spring (404) is fixedly connected with the inner wall of the bottom end of the chute, and the top end of the first spring (404) is fixedly connected with the bottom end of the first slider (403).

6. The gluing device for semiconductor production according to claim 2, wherein an inner cavity corresponding to the screw rod (501) is formed in the inner wall of the limiting block (502), an inner thread corresponding to the outer thread of the screw rod (501) is formed in the inner wall of the inner cavity, and the screw rod (501) is in threaded connection with the limiting block (502).

7. The gluing device for semiconductor production according to claim 2, wherein one end of the second spring (504) is fixedly connected with the inner wall of the slide rail, and one end of the second spring (504) far away from the inner wall of the slide groove is fixedly connected with the surface of the second sliding block (503).