CN216161761U - LED packaging structure and LED packaging equipment - Google Patents
LED packaging structure and LED packaging equipment Download PDFInfo
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- CN216161761U CN216161761U CN202122160426.1U CN202122160426U CN216161761U CN 216161761 U CN216161761 U CN 216161761U CN 202122160426 U CN202122160426 U CN 202122160426U CN 216161761 U CN216161761 U CN 216161761U
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Abstract
The utility model provides an LED packaging structure and LED packaging equipment, wherein the LED packaging structure comprises: a support; the chip is arranged on the bracket; the flange piece is provided with a fixing hole, and the edge of the flange piece is connected with the bracket; the lens is embedded in the fixing hole and covers the chip; an inorganic material structure hermetically connecting the flange member and the lens; the LED packaging equipment is used for producing the LED packaging structure; by adopting the technical scheme, the inorganic material structure is used for sealing and connecting the lens and the flange piece, and the gap between the lens and the flange piece is blocked, so that the sealing property of a cavity formed among the lens, the flange piece and the bracket is higher, and the possibility of corroding a chip by air and water is avoided; in addition, the lens and the flange part are connected in a sealing mode through the inorganic material structure, so that the phenomenon that the inorganic material structure is aged due to the fact that the chip emits light can be avoided, the sealing effectiveness of the inorganic material structure is guaranteed, and meanwhile the service life of the LED packaging structure is prolonged.
Description
Technical Field
The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure and LED packaging equipment.
Background
With the continuous improvement of the LED chip technology, the working range of the existing LED chip is larger and larger, the LED chip in an ultraviolet band has the functions of sterilization, disinfection and solidification, the LED chip is exposed in the air and is easy to be oxidized and damaged, so that the LED chip can not work normally, the requirement of the LED chip on packaging is quite strict, the chip is isolated from air, water and the like during packaging, the existing packaging technology is that the isolation effect cannot be achieved by bonding with glue, the glue can age after being bonded for a long time, the glue belongs to organic matters, the process of yellowing and accelerated aging can be realized after long-time ultraviolet irradiation, the sealing property is also deteriorated, and the problem that the poor stability of the LED chip sealing and packaging is urgently needed to be solved is solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an LED packaging structure and LED packaging equipment, and aims to solve the technical problem of poor sealing stability of an LED chip in the prior art.
In order to achieve the above object, the present invention adopts a technical solution that is an LED package structure, including:
a support;
the chip is arranged on the bracket;
the flange piece is provided with a fixing hole, and the edge of the flange piece is connected with the bracket;
the lens is embedded in the fixing hole and covers the chip;
and the inorganic material structure is used for hermetically connecting the flange piece and the lens.
By adopting the technical scheme, the inorganic material structure is used for sealing and connecting the lens and the flange piece, and the gap between the lens and the flange piece is blocked, so that the sealing property of a cavity formed among the lens, the flange piece and the bracket is higher, and the possibility of corroding a chip by air and water is avoided; in addition, the lens and the flange part are connected in a sealing mode through the inorganic material structure, so that the phenomenon that the inorganic material structure is aged due to the fact that the chip emits light can be avoided, the sealing effectiveness of the inorganic material structure is guaranteed, and meanwhile the service life of the LED packaging structure is prolonged.
In one embodiment, the flange member includes a connecting portion and a fixing portion connected to the connecting portion, the connecting portion is connected to the bracket, the fixing portion is connected to the lens, and an inner surface of the fixing portion is attached to an outer surface of the lens.
Through adopting above-mentioned technical scheme, flange spare includes connecting portion and fixed part, and connecting portion are used for and leg joint, and the fixed part is used for being connected with lens, does benefit to the fixed connection of lens and support, and the internal surface of fixed part and the surface laminating of lens have improved the firm degree when fixed lens of fixed part simultaneously.
In one embodiment, an extending direction of the connecting portion and an extending direction of the fixing portion form an inclined angle.
Through adopting above-mentioned technical scheme, do benefit to being connected of connecting portion and support, also do benefit to being connected of fixed part and lens simultaneously.
In one embodiment, the fixation portion extends in a direction away from the bracket.
Through adopting above-mentioned technical scheme, reduce the fixed part and to the encroaching on of sealed chamber, guaranteed that sealed chamber has great space that can the holding chip and connecting wire.
In one embodiment, the inorganic material structure is provided at an intersection of the connecting portion, the fixing portion, and the bracket.
By adopting the technical scheme, the inorganic material structure is simultaneously connected with the connecting part, the fixing part and the support in a sealing manner, the gap between the support and the connecting part is also blocked, and the sealing performance of the sealing cavity is further improved.
In one embodiment, the bracket comprises a bracket main body and a bracket step protruding from the bracket main body, and the connecting part is connected with the bracket step.
By adopting the technical scheme, the connecting part is supported by the support step, the fixing part is supported by the connecting part, the lens is supported by the fixing part, and the lens is maintained above the cover arranged on the chip.
In one embodiment, the bracket step and the connecting portion are metal pieces.
Through adopting above-mentioned technical scheme, do benefit to the connection between support step and the connecting portion, reduce because of both lead to the fact the connection difficulty or give off the heat and lead to both deformation degree difference and separate for different materials in chip course of operation.
The embodiment also provides LED packaging equipment for producing the LED packaging structure, the LED packaging equipment comprises a prefabricated loading mould for fixing a plurality of lenses and a tight sleeving mould for fixing a plurality of flange pieces, the prefabricated loading mould comprises a loading mould body and a top plate, the loading mould body is provided with a plurality of lens holes for loading the lenses, the top plate is correspondingly arranged in each lens hole and used for ejecting and fixing the lenses in the lens holes, the tight sleeving mould is provided with a plurality of flange piece holes for loading a plurality of flange pieces, when the tight sleeving mould is in butt joint with the prefabricated loading mould, the flange piece holes are right opposite to the lens holes, and the top plate is used for ejecting the lenses into the flange pieces.
By adopting the technical scheme, the efficiency of the process of embedding the plurality of lenses into the plurality of flange pieces in advance is improved.
In one embodiment, the preform loading mold further comprises a resilient member that abuts against the loading mold body and the top plate.
By adopting the technical scheme, the LED packaging equipment is simple and easy to use.
In one embodiment, the LED packaging apparatus further comprises coating means for coating the inorganic material structure between the lens and the flange member.
Through adopting above-mentioned technical scheme, after going into flange spare with the lens top, utilize coating unit with the coating of inorganic material structure between lens and flange spare, improve the efficiency that sets up the inorganic material structure.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an LED package structure provided in an embodiment of the present invention;
FIG. 2 is a top view of a flange member provided by an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an LED packaging apparatus provided by an embodiment of the present invention before a lens is loaded;
fig. 4 is a schematic structural diagram of an LED packaging apparatus provided by an embodiment of the present invention after a lens is loaded;
FIG. 5 is a schematic structural diagram of an LED packaging apparatus according to an embodiment of the present invention before a lens is inserted into a flange;
FIG. 6 is a schematic structural diagram of an LED packaging apparatus provided by an embodiment of the present invention after a lens is inserted into a flange;
FIG. 7 is a schematic structural diagram of an LED package structure provided by an embodiment of the present invention before being coated with an inorganic material structure;
fig. 8 is a schematic structural view of an LED package structure coated with an inorganic material structure according to an embodiment of the present invention.
The figures are numbered:
100-LED package structure; 200-an LED packaging device;
1-a scaffold; 2-chip; 3-a flange member; 4-a lens; 5-inorganic material structure; 6-prefabricating a loading mould; 7-tightly sleeving the mold;
11-a stent body; 12-a support step; 30-a fixing hole; 31-a connecting portion; 32-a fixed part; 61-loading the mold body; 62-a top plate; 63-an elastic member; 71-flange piece holes;
611-lens aperture.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the utility model, and do not indicate that the device or component must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
as shown in fig. 1 and fig. 2, an LED package structure 100 according to an embodiment of the present invention includes: the structure comprises a support 1, a chip 2, a flange piece 3, a lens 4 and an inorganic material structure 5; the bracket 1 is used for fixing the chip 2; the chip 2 is arranged on the bracket 1; the flange piece 3 is provided with a fixing hole 30, and the edge of the flange piece 3 is connected with the bracket 1; the lens 4 is embedded in the fixing hole 30 and covers the chip 2; the inorganic material structure 5 hermetically connects the flange member 3 and the lens 4.
The working principle of the LED package structure 100 provided in this embodiment is as follows:
the chip 2 provided in this embodiment is a light emitting chip 2, including but not limited to a UVLED chip 2, that is, an LED chip 2 emitting ultraviolet band light, the LED chip 2 is fixed on a support 1, a lens 4 is embedded in a fixing hole 30 in a flange 3 in advance, an inorganic material structure 5 is disposed in a gap between the lens 4 and the flange 3, the lens 4 and the flange 3 are hermetically connected by the inorganic material structure 5, the flange 3 is fixed on the support 1, the lens 4, the flange 3, the inorganic material structure 5 and the support 1 enclose the chip 2, the lens 4, the flange 3, the inorganic material structure 5 and the support 1 enclose a sealed cavity, and the chip 2 is accommodated in the sealed cavity.
It should be further explained that the inorganic material structure 5 may be an inorganic paste, and the inorganic paste may be coated in the gap between the lens 4 and the flange member 3, and the gap is sealed by the adhesive property of the inorganic paste, so that the lens 4, the flange member 3 and the bracket 1 may enclose to form a sealed cavity.
By adopting the technical scheme, the inorganic material structure 5 is used for hermetically connecting the lens 4 and the flange piece 3, and a gap between the lens 4 and the flange piece 3 is blocked, so that the sealing performance of a cavity formed among the lens 4, the flange piece 3 and the support 1 is higher, and the possibility that air and water erode the chip 2 is avoided; in addition, the inorganic material structure 5 is used for sealing and connecting the lens 4 and the flange piece 3, so that the inorganic material structure 5 can be prevented from being aged due to the light emission of the chip 2, the sealing effectiveness of the inorganic material structure 5 is ensured, and the service life of the LED packaging structure 100 is prolonged.
In one embodiment, the flange member 3 includes a connecting portion 31 and a fixing portion 32 connected to the connecting portion 31, the connecting portion 31 is connected to the frame 1, the fixing portion 32 is connected to the lens 4, and an inner surface of the fixing portion 32 is attached to an outer surface of the lens 4.
Alternatively, the shape of the lens 4 includes, but is not limited to, a hemisphere, the outer surface of the lens 4 is a spherical surface, the inner surface of the fixing portion 32 is used to conform to the spherical surface, i.e. the fixing portion 32 is adapted to the shape of the lens 4, and the fixing portion 32 also has an arc surface conforming to the spherical surface.
Through adopting above-mentioned technical scheme, flange spare 3 includes connecting portion 31 and fixed part 32, and connecting portion 31 is used for being connected with support 1, and fixed part 32 is used for being connected with lens 4, does benefit to the fixed connection of lens 4 with support 1, and the internal surface of fixed part 32 and the surface laminating of lens 4 have improved the firm degree when fixed lens 4 of fixed part 32 simultaneously.
In one embodiment, the extending direction of the connecting portion 31 and the extending direction of the fixing portion 32 form an oblique angle.
Alternatively, the extending direction of the connecting portion 31 and the extending direction of the fixing portion 32 are 90 °.
By adopting the technical scheme, the connection between the connecting part 31 and the bracket 1 is facilitated, and the connection between the fixing part 32 and the lens 4 is also facilitated.
In one embodiment, the fixation portion 32 extends in a direction away from the bracket 1.
Specifically, the fixing portion 32 extends from the inside of the sealed chamber formed between the lens 4, the flange member 3, and the like toward the outside of the sealed chamber.
Through adopting above-mentioned technical scheme, reduce fixed part 32 and to the encroaching on of sealed chamber, guaranteed that the sealed chamber has great space that can holding chip 2 and connecting wire.
In one embodiment, the inorganic material structure 5 is provided at the intersection of the connecting portion 31, the fixing portion 32 and the bracket 1.
Specifically, the intersection of the joining portion 31, the fixing portion 32, and the holder 1 is located inside the sealed chamber.
By adopting the technical scheme, the inorganic material structure 5 is simultaneously connected with the connecting part 31, the fixing part 32 and the bracket 1 in a sealing manner, the gap between the bracket 1 and the connecting part 31 is also blocked, and the sealing performance of the sealing cavity is further improved.
In one embodiment, the bracket 1 includes a bracket body 11 and a bracket step 12 protruded on the bracket body 11, and the connection portion 31 is connected to the bracket step 12.
Specifically, the support step 12 protrudes from the surface of the support main body 11, the chip 2 and the support step 12 are located on the same surface of the support main body 11, the height of the support step 12 is greater than that of the chip 2, and the support step 12 supports the lens 4 above the chip 2.
By adopting the above technical solution, the support step 12 supports the connection portion 31, the connection portion 31 supports the fixing portion 32, the fixing portion 32 supports the lens 4, and the lens 4 is maintained to be covered on the chip 2.
In one embodiment, the bracket step 12 and the connection 31 are metal pieces.
Specifically, metallic members include, but are not limited to, kovar, stainless steel, nickel, iron, or copper.
Through adopting above-mentioned technical scheme, do benefit to the connection between support step 12 and the connecting portion 31, reduce because of both are different materials and cause the connection difficulty or give off the heat and lead to both deformation degree difference and separation in chip 2 course of operation.
As shown in fig. 3 to 6, the present embodiment further provides an LED packaging apparatus 200 for producing the LED packaging structure 100, the LED packaging apparatus 200 includes a pre-loading mold 6 for fixing a plurality of lenses 4 and a clamping mold 7 for fixing a plurality of flange members 3, the pre-loading mold 6 includes a loading mold body 61 and a top plate 62, the loading mold body 61 is provided with a plurality of lens holes 611 for loading the lenses 4, the top plate 62 is correspondingly provided in each lens hole 611 for ejecting the lenses 4 fixed in the lens holes 611, the clamping mold 7 is provided with a plurality of flange member holes 71 for loading the plurality of flange members 3, when the clamping mold 7 is abutted with the pre-loading mold 6, the flange member holes 71 are aligned with the lens holes 611, and the top plate 62 is used for ejecting the lenses 4 into the flange members 3.
By adopting the above technical scheme, the efficiency of the process of embedding the plurality of lenses 4 into the plurality of flange pieces 3 in advance is improved.
In one embodiment, the preform loading mold 6 further comprises a resilient member 63, the resilient member 63 abutting against the loading mold body 61 and the top plate 62.
Specifically, the elastic member 63 is used to restore the top plate 62 to the original state, and drive the top plate 62 to overcome the elastic force of the elastic member 63, so that the top plate 62 is pushed into the lens hole 611, and further the lens 4 is pushed into the flange member 3; when the force applied to the top plate 62 is removed, the top plate 62 returns to the original state, and the next batch of lenses 4 is placed in the lens holes 611, and the next ejection of the top plate 62 into the lenses 4 is performed.
By adopting the technical scheme, the LED packaging equipment 200 is simple and easy to use.
As shown in fig. 7 and 8, in one embodiment, the LED packaging apparatus 200 further comprises a coating device for coating the inorganic material structure 5 between the lens 4 and the flange member 3.
By adopting the technical scheme, after the lens 4 is pushed into the flange piece 3, the inorganic material structure 5 is coated between the lens 4 and the flange piece 3 by utilizing the coating device, and the efficiency of arranging the inorganic material structure 5 is improved.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (10)
1. An LED package structure, comprising:
a support;
the chip is arranged on the bracket;
the flange piece is provided with a fixing hole, and the edge of the flange piece is connected with the bracket;
the lens is embedded in the fixing hole and covers the chip;
and the inorganic material structure is used for hermetically connecting the flange piece and the lens.
2. The LED package structure of claim 1, wherein the flange comprises a connecting portion and a fixing portion connected to the connecting portion, the connecting portion is connected to the support, the fixing portion is connected to the lens, and an inner surface of the fixing portion is attached to an outer surface of the lens.
3. The LED package structure of claim 2, wherein an extending direction of the connecting portion and an extending direction of the fixing portion form an oblique angle.
4. The LED package structure of claim 2, wherein said anchor portion extends in a direction away from said support.
5. The LED package structure of claim 4, wherein the inorganic material structure is disposed at an intersection of the connection portion, the fixing portion, and the support.
6. The LED package structure of claim 2, wherein the support comprises a support body and a support step protruding from the support body, and the connecting portion is connected to the support step.
7. The LED package structure of claim 6, wherein the standoff step and the connection are metal pieces.
8. An LED packaging apparatus for producing the LED packaging structure of any one of claims 1 to 7, wherein the LED packaging apparatus comprises a pre-loading mold for fixing a plurality of lenses and a tightening mold for fixing a plurality of flange members, the pre-loading mold comprises a loading mold body and a top plate, the loading mold body is provided with a plurality of lens holes for loading the lenses, the top plate is correspondingly arranged in each lens hole and used for ejecting the lenses fixed in the lens holes, the tightening mold is provided with a plurality of flange member holes for loading a plurality of flange members, when the tightening mold is butted with the pre-loading mold, the flange member holes are opposite to the lens holes, and the top plate is used for ejecting the lenses into the flange members.
9. The LED packaging apparatus of claim 8, wherein the pre-form load mold further comprises a resilient member that abuts the load mold body and the top plate.
10. The LED packaging apparatus of claim 8, further comprising a coating device for coating the inorganic material structure between the lens and the flange piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122160426.1U CN216161761U (en) | 2021-09-07 | 2021-09-07 | LED packaging structure and LED packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122160426.1U CN216161761U (en) | 2021-09-07 | 2021-09-07 | LED packaging structure and LED packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216161761U true CN216161761U (en) | 2022-04-01 |
Family
ID=80843654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122160426.1U Active CN216161761U (en) | 2021-09-07 | 2021-09-07 | LED packaging structure and LED packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216161761U (en) |
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2021
- 2021-09-07 CN CN202122160426.1U patent/CN216161761U/en active Active
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