CN216159833U - Semiconductor diameter measuring device - Google Patents

Semiconductor diameter measuring device Download PDF

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Publication number
CN216159833U
CN216159833U CN202122100125.XU CN202122100125U CN216159833U CN 216159833 U CN216159833 U CN 216159833U CN 202122100125 U CN202122100125 U CN 202122100125U CN 216159833 U CN216159833 U CN 216159833U
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fixedly connected
sliding
wall
semiconductor
rod
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CN202122100125.XU
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Chinese (zh)
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王垚森
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Suzhou Simeo Electronics Co ltd
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Suzhou Simeo Electronics Co ltd
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Abstract

The utility model relates to the technical field of semiconductor measurement, in particular to a semiconductor diameter measuring device, which comprises a base, wherein the top of the base is fixedly connected with a supporting frame, the top end of the supporting frame is fixedly connected with a box body, the inner wall of one side of the box body is provided with a sliding hole, a movable rod is slidably connected in the sliding hole, one end of the movable rod is fixedly connected with a laser ranging head, the inner wall of the bottom of the base is fixedly connected with a servo motor, and the output end of the servo motor is connected with a driving shaft through a coupler; according to the utility model, the servo motor can be started to drive the driving shaft to rotate, the driving shaft rotates to drive the rotating rod to rotate through the driving wheel and the driving belt, the rotating rod rotates to drive the notch gear to rotate, and the notch gear rotates to drive the rack and the sliding plate to move, so that the sliding plate moves on the rail, the purpose of driving the cylindrical semiconductor to intermittently move is realized, the diameters of different positions of the cylindrical semiconductor can be measured, and the measurement accuracy is improved.

Description

Semiconductor diameter measuring device
Technical Field
The utility model relates to the technical field of semiconductor measurement, in particular to a semiconductor diameter measuring device.
Background
Semiconductor materials are used for manufacturing electronic materials of semiconductor devices and integrated circuits, different semiconductor devices are prepared, and have different morphological requirements on semiconductor materials, including slicing, lapping, polishing, thin films and the like of single crystals.
In the prior art, the following problems exist:
(1) most of the existing semiconductor diameter measuring devices measure the diameter of a semiconductor by using a vernier caliper or a dividing ruler by workers, and the measured value is inaccurate and has errors;
(2) most workers rarely measure the same semiconductor for many times, and the accuracy of semiconductor measurement is reduced.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor diameter measuring device to solve the above problems.
The technical scheme of the utility model is as follows: the utility model provides a semiconductor diameter measuring device, the on-line screen storage device comprises a base, the top fixedly connected with support frame of base, the top fixedly connected with box of support frame, the slip hole has been seted up to one side inner wall of box, sliding connection has the movable rod in the slip hole, the one end fixedly connected with laser ranging head of movable rod, the bottom inner wall fixedly connected with servo motor of base, servo motor's output has the drive shaft through the coupling joint, the movable hole has all been seted up to one side that base and box are close to each other, the top of drive shaft runs through two movable holes and fixedly connected with centrifugal carousel in proper order, install the extrusion mechanism that slides on the centrifugal carousel, install link gear in the drive shaft.
Preferably, the extrusion mechanism slides including rotating the U-shaped connecting rod of connecting in centrifugal carousel top, and the one end of U-shaped connecting rod is rotated and is connected with the slider, has cup jointed fixed slide on the slider, and fixed slide's bottom fixed connection has L shape dead lever in the bottom inner wall of box, and the one end laminating of U-shaped connecting rod has L shape dead lever, and the top fixed connection of L shape dead lever installs the unit that resets on the movable rod on the cylinder lateral wall of movable rod.
Preferably, the reset unit is including seting up the sliding tray in movable rod one end, and sliding connection has the guide post in the sliding tray, and the one end fixed connection of guide post has cup jointed reset spring in the opposite side inner wall of box on the guide post, reset spring's both ends respectively with movable rod and box fixed connection.
Preferably, the linkage mechanism comprises a round hole arranged on the inner wall of the top of the base, a rotating rod is connected to the round hole in a rotating mode, transmission wheels are fixedly sleeved on the rotating rod and the driving shaft, transmission belts are sleeved on the two transmission wheels in a tensioning mode, a notch gear is fixedly connected to the top end of the rotating rod, and a moving unit is installed on the notch gear.
Preferably, the moving unit comprises a rack meshed with the notch gear, a sliding plate is fixedly connected to one side of the rack, a rail is slidably connected to the sliding plate, the bottom of the rail is fixedly connected to the top of the base, and a fixing element is mounted on the sliding plate.
Preferably, the fixed element includes fixed connection in the fixed block at sliding plate top, and the activity groove has been seted up to one side of fixed block, and swing joint has the slip post in the activity groove, and the one end cylinder lateral wall fixedly connected with extrusion piece of slip post, the bar hole has been seted up to the top inner wall in activity groove, and the bar hole runs through on the top of extrusion piece, the one end fixedly connected with extrusion spring of slip post, and the one end fixed connection of extrusion spring is in the inner wall of fixed block.
Preferably, the other end of the sliding column is fixedly connected with a rubber block, the top of the sliding plate is fixedly connected with a rubber baffle, and the rubber baffle corresponds to the rubber block in position.
The utility model provides a semiconductor diameter measuring device through improvement, compared with the prior art, the utility model has the following improvement and advantages:
one is as follows: according to the utility model, the servo motor is started to drive the driving shaft to rotate, the driving shaft rotates to drive the rotating rod to rotate through the driving wheel and the driving belt, the rotating rod rotates to drive the notch gear to rotate, and the notch gear rotates to drive the rack and the sliding plate to move, so that the sliding plate moves on the track, the purpose of driving the cylindrical semiconductor to intermittently move is realized, the diameters of different positions of the cylindrical semiconductor can be measured, and the measurement accuracy is improved;
the second step is as follows: the device drives the centrifugal turntable to rotate through the rotation of the driving shaft, the centrifugal turntable drives the sliding block to move through the U-shaped connecting rod, the sliding block extrudes the L-shaped fixed rod to drive the movable rod to move, the movable rod moves to extrude the reset spring to compress and generate elastic deformation, and when the centrifugal rail drives the U-shaped connecting rod to rotate in the direction of the rail, the reset spring drives the movable rod to reset, so that the diameter of the cylindrical semiconductor is automatically measured, and the measurement error is reduced compared with the measurement by a manual tool.
Drawings
The utility model is further explained below with reference to the figures and examples:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional perspective view of the present invention;
FIG. 3 is a schematic view of another perspective, cutaway perspective structure of the present invention;
FIG. 4 is a schematic perspective view of the sliding extrusion mechanism of the present invention;
fig. 5 is a perspective view of the fixing member of the present invention.
Description of reference numerals:
1. a base; 101. a support frame; 102. a box body; 103. a movable rod; 104. a laser ranging head; 105. an L-shaped fixing rod; 106. a guide post; 107. a return spring; 2. a servo motor; 201. a drive shaft; 202. a centrifugal turntable; 203. a U-shaped connecting rod; 204. a slider; 205. fixing the slideway; 3. rotating the rod; 301. a driving wheel; 302. a transmission belt; 303. a notched gear; 304. a rack; 305. a sliding plate; 306. a track; 4. a fixed block; 401. a sliding post; 402. extruding the block; 403. a compression spring; 404. a rubber block.
Detailed Description
The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a semiconductor diameter measuring device through improvement, and the technical scheme of the utility model is as follows:
as shown in fig. 1 to 5, a semiconductor diameter measuring device comprises a base 1, a supporting frame 101 is fixedly connected to the top of the base 1, a box 102 is fixedly connected to the top end of the supporting frame 101, a sliding hole is formed in the inner wall of one side of the box 102, a movable rod 103 is slidably connected in the sliding hole, a laser ranging head 104 is fixedly connected to one end of the movable rod 103, a servo motor 2 is fixedly connected to the inner wall of the bottom of the base 1, the output end of the servo motor 2 is connected with a driving shaft 201 through a coupler, movable holes are formed in the sides, close to each other, of the base 1 and the box 102, the top end of the driving shaft 201 sequentially penetrates through the two movable holes and is fixedly connected with a centrifugal turntable 202, a sliding extrusion mechanism is installed on the centrifugal turntable 202, and a linkage mechanism is installed on the driving shaft 201; by means of the structure, the cylindrical semiconductor is detected by an instrument through the arrangement of the laser ranging head 104, and detection errors are reduced.
Further, the sliding extrusion mechanism comprises a U-shaped connecting rod 203 which is rotatably connected to the top of the centrifugal turntable 202, one end of the U-shaped connecting rod 203 is rotatably connected with a sliding block 204, a fixed slide way 205 is sleeved on the sliding block 204, the bottom of the fixed slide way 205 is fixedly connected to the inner wall of the bottom of the box body 102, one end of the U-shaped connecting rod 203 is attached with an L-shaped fixed rod 105, the top end of the L-shaped fixed rod 105 is fixedly connected to the cylindrical outer side wall of the movable rod 103, and a reset unit is installed on the movable rod 103; by means of the structure, the slide block 204 is located in the middle of the fixed slide way 205 through the arrangement of the slide block 204, and when the centrifugal rail 306 drives the U-shaped connecting rod 203 to rotate towards the rail 306, the movable rod 103 cannot be driven to move.
Further, the reset unit comprises a sliding groove formed in one end of the movable rod 103, a guide post 106 is connected in the sliding groove in a sliding manner, one end of the guide post 106 is fixedly connected to the inner wall of the other side of the box body 102, a reset spring 107 is sleeved on the guide post 106, and two ends of the reset spring 107 are respectively fixedly connected with the movable rod 103 and the box body 102; by means of the structure, the movable rod 103 is limited and guided through the arrangement of the guide column 106.
Further, the linkage mechanism comprises a round hole formed in the inner wall of the top of the base 1, a rotating rod 3 is rotatably connected in the round hole, the rotating rod 3 and the driving shaft 201 are fixedly sleeved with driving wheels 301, the two driving wheels 301 are tightly sleeved with a driving belt 302, the top end of the rotating rod 3 is fixedly connected with a notch gear 303, and a moving unit is installed on the notch gear 303; by means of the structure, the mobile unit is driven to move intermittently by the arrangement of the notch gear 303.
Further, the moving unit comprises a rack 304 engaged with the notch gear 303, a sliding plate 305 is fixedly connected to one side of the rack 304, a rail 306 is slidably connected to the sliding plate 305, the bottom of the rail 306 is fixedly connected to the top of the base 1, and a fixing element is mounted on the sliding plate 305; with the above-described structure, the cylindrical semiconductor can be placed on the sliding plate 305 by the arrangement of the sliding plate 305.
Further, the fixing element comprises a fixing block 4 fixedly connected to the top of the sliding plate 305, a movable groove is formed in one side of the fixing block 4, a sliding column 401 is movably connected in the movable groove, an extrusion block 402 is fixedly connected to the outer cylindrical side wall of one end of the sliding column 401, a strip-shaped hole is formed in the inner wall of the top of the movable groove, the top end of the extrusion block 402 penetrates through the strip-shaped hole, an extrusion spring 403 is fixedly connected to one end of the sliding column 401, and one end of the extrusion spring 403 is fixedly connected to the inner wall of the fixing block 4; by means of the structure, the sliding column 401 is conveniently pulled to move through the arrangement of the extrusion block 402.
Further, the other end of the sliding column 401 is fixedly connected with a rubber block 404, the top of the sliding plate 305 is fixedly connected with a rubber baffle, and the rubber baffle corresponds to the rubber block 404; by means of the structure, through the arrangement of the rubber baffle and the rubber block 404, the damage to the cylindrical semiconductor can be reduced by using the rubber materials of the rubber baffle and the rubber block 404.
The working principle is as follows: the extrusion block 402 is pulled outwards to drive the sliding column 401 and the rubber block 404 to move, the sliding column 401 moves to drive the extrusion spring 403 to move and generate elastic deformation, a cylindrical semiconductor needing to be measured is placed between the rubber block 404 and the rubber baffle, the extrusion block 402 is released, so that the extrusion spring 403 drives the sliding column 401 and the rubber block 404 to reset and clamp the cylindrical semiconductor, the servo motor 2 is started to drive the driving shaft 201 to rotate, the driving shaft 201 rotates to drive the rotating rod 3 to rotate through the transmission wheel 301 and the transmission belt 302, the rotating rod 3 rotates to drive the notch gear 303 to rotate, the notch gear 303 rotates to drive the rack 304 and the sliding plate 305 to move, so that the sliding plate 305 moves on the rail 306, it is realized that the cylindrical semiconductor can be driven to move intermittently, and then can measure the diameter of cylinder semiconductor different positions, improve the precision of detecting.
The driving shaft 201 rotates to drive the centrifugal turntable 202 to rotate, the centrifugal turntable 202 drives the sliding block 204 to move through the U-shaped connecting rod 203, when the centrifugal rail 306 drives the U-shaped connecting rod 203 to rotate towards the opposite direction of the rail 306, the sliding block 204 extrudes the L-shaped fixed rod 105 to drive the movable rod 103 to move, the movable rod 103 moves to extrude the reset spring 107 to compress and elastically deform, when the centrifugal rail 306 drives the U-shaped connecting rod 203 to rotate towards the direction of the rail 306, the reset spring 107 drives the movable rod 103 to reset, the cylindrical semiconductor moves once at each interval, the movable rod 103 drives the laser ranging head 104 to reciprocate to measure the cross section of the cylindrical semiconductor, the maximum measurement value is the diameter of the cylindrical semiconductor, the diameter of the cylindrical semiconductor is automatically measured, the measurement is measured by a tool for manual work, and the measurement error is reduced.
The previous description is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A semiconductor diameter measuring device comprises a base (1), and is characterized in that: the top fixedly connected with support frame (101) of base (1), top fixedly connected with box (102) of support frame (101), the slide opening has been seted up to one side inner wall of box (102), sliding connection has movable rod (103) in the slide opening, the one end fixedly connected with laser range finding head (104) of movable rod (103), bottom inner wall fixedly connected with servo motor (2) of base (1), there is drive shaft (201) output of servo motor (2) through the coupling joint, the movable hole has all been seted up to one side that base (1) and box (102) are close to each other, the top of drive shaft (201) runs through two movable holes and fixedly connected with centrifugation carousel (202) in proper order, install the extrusion mechanism that slides on centrifugation carousel (202), install link gear on drive shaft (201).
2. A semiconductor diameter measuring device according to claim 1, characterized in that: the sliding extrusion mechanism comprises a U-shaped connecting rod (203) which is rotatably connected to the top of a centrifugal turntable (202), a sliding block (204) is rotatably connected to one end of the U-shaped connecting rod (203), a fixed slide way (205) is sleeved on the sliding block (204), the bottom of the fixed slide way (205) is fixedly connected to the inner wall of the bottom of a box body (102), an L-shaped fixing rod (105) is attached to one end of the U-shaped connecting rod (203), the top end of the L-shaped fixing rod (105) is fixedly connected to the outer cylindrical side wall of a movable rod (103), and a reset unit is installed on the movable rod (103).
3. A semiconductor diameter measuring device according to claim 2, characterized in that: the reset unit comprises a sliding groove arranged at one end of the movable rod (103), a guide post (106) is connected in the sliding groove in a sliding mode, one end of the guide post (106) is fixedly connected to the inner wall of the other side of the box body (102), a reset spring (107) is sleeved on the guide post (106), and two ends of the reset spring (107) are fixedly connected with the movable rod (103) and the box body (102) respectively.
4. A semiconductor diameter measuring device according to claim 1, characterized in that: the linkage mechanism comprises a round hole arranged on the inner wall of the top of the base (1), a rotating rod (3) is connected to the round hole in a rotating mode, transmission wheels (301) are fixedly sleeved on the rotating rod (3) and the driving shaft (201), a transmission belt (302) is sleeved on the two transmission wheels (301) in a tensioning mode, a notch gear (303) is fixedly connected to the top end of the rotating rod (3), and a moving unit is installed on the notch gear (303).
5. A semiconductor diameter measuring device according to claim 4, characterized in that: the moving unit comprises a rack (304) meshed with the notch gear (303), a sliding plate (305) is fixedly connected to one side of the rack (304), a rail (306) is slidably connected to the sliding plate (305), the bottom of the rail (306) is fixedly connected to the top of the base (1), and a fixing element is mounted on the sliding plate (305).
6. A semiconductor diameter measuring device according to claim 5, wherein: the fixed element comprises a fixed block (4) fixedly connected to the top of the sliding plate (305), a movable groove is formed in one side of the fixed block (4), a sliding column (401) is movably connected in the movable groove, an extrusion block (402) is fixedly connected to the outer side wall of one end cylinder of the sliding column (401), a strip-shaped hole is formed in the inner wall of the top of the movable groove, the strip-shaped hole is penetrated through the top end of the extrusion block (402), an extrusion spring (403) is fixedly connected to one end of the sliding column (401), and one end of the extrusion spring (403) is fixedly connected to the inner wall of the fixed block (4).
7. A semiconductor diameter measuring device according to claim 6, wherein: the other end of the sliding column (401) is fixedly connected with a rubber block (404), the top of the sliding plate (305) is fixedly connected with a rubber baffle, and the rubber baffle corresponds to the rubber block (404).
CN202122100125.XU 2021-09-02 2021-09-02 Semiconductor diameter measuring device Active CN216159833U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122100125.XU CN216159833U (en) 2021-09-02 2021-09-02 Semiconductor diameter measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122100125.XU CN216159833U (en) 2021-09-02 2021-09-02 Semiconductor diameter measuring device

Publications (1)

Publication Number Publication Date
CN216159833U true CN216159833U (en) 2022-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122100125.XU Active CN216159833U (en) 2021-09-02 2021-09-02 Semiconductor diameter measuring device

Country Status (1)

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CN (1) CN216159833U (en)

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