CN216134747U

CN216134747U - Power supply unit and electronic device

Info

Publication number: CN216134747U
Application number: CN202121092672.1U
Authority: CN
Inventors: 蒙浩; 陈君; 李泉明
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2022-03-25
Anticipated expiration: 2031-05-20

Abstract

The present application provides a power supply unit. The power supply unit comprises a shell, an upper functional module, a lower functional module and a cooling plate, wherein the upper functional module, the lower functional module and the cooling plate are fixed in the shell. The cooling plate is positioned between the upper functional module and the lower functional module. The upper functional module comprises an upper substrate, an upper component and an upper heat conducting assembly, wherein the upper component and the cooling plate are mutually spaced and transfer heat to the cooling plate through the upper heat conducting assembly; the lower functional module comprises a lower substrate, a lower component and a lower heat conduction assembly, wherein the lower component and the cooling plate are mutually spaced and transfer heat towards the cooling plate through the lower heat conduction assembly. The cooling plate is communicated with an external refrigeration source to realize cooling heat exchange of the cooling plate. The power supply unit utilizes the two opposite sides of the cooling plate to respectively dissipate heat of the upper functional module and the lower functional module, and the utilization rate of the cooling plate is improved. The power supply unit obtains better cooling effect and more balanced overall temperature. The application also provides an electronic device.

Description

Power supply unit and electronic device

Technical Field

The present application relates to the field of power supplies, and in particular, to a power supply unit and an electronic device including the same.

Background

With the development of industries such as computers and communications, the number of power utilization modules in electronic equipment is increasing dramatically. The market size of power supply units represented by Uninterruptible Power Supplies (UPS) and solid-state transformers (SST) is gradually increasing. In order to improve the Power Utilization Efficiency (PUE) of the electronic device, the heat dissipation manner of the power supply unit is gradually evolving from air cooling heat dissipation to liquid cooling heat dissipation.

The existing power supply unit mostly adopts a liquid cooling plate mode for heat dissipation, the temperature in the power supply unit box is conducted to the outside of the box, and the liquid cooling plate is used for heat dissipation, or the liquid cooling plate is directly placed in the power supply unit box. However, the components in the power supply unit box are different in types, sizes and shapes, and the liquid cooling plate is not easy to uniformly dissipate heat of the components in the box. Inside some high density power supply unit's box, still be provided with multilayer substrate in order to carry on the components and parts that quantity is more, further cause the phenomenon of the interior uneven temperature of box, influence power supply unit's energy utilization efficiency.

SUMMERY OF THE UTILITY MODEL

The application provides a power supply unit and an electronic device including the power supply unit for realize better radiating effect, promote energy efficiency. The application specifically comprises the following technical scheme:

in a first aspect, the present application provides a power supply unit, comprising a housing, and an upper functional module, a lower functional module, and a cooling plate fixed in the housing, the cooling plate being located between the upper functional module and the lower functional module; the upper functional module comprises an upper substrate, an upper component and an upper heat conduction assembly, the upper component and the upper heat conduction assembly are fixed on one side, facing the cooling plate, of the upper substrate, the upper component and the cooling plate are mutually spaced, the upper component is also in contact with the upper heat conduction assembly, and heat is transferred towards the cooling plate through the upper heat conduction assembly; the lower functional module comprises a lower substrate, a lower component and a lower heat conduction assembly, the lower component and the lower heat conduction assembly are fixed on one side, facing the cooling plate, of the lower substrate, the lower component and the cooling plate are mutually spaced, the lower component is also in contact with the lower heat conduction assembly, and heat is transferred towards the cooling plate through the lower heat conduction assembly; the cooling plate is fixedly connected with an input pipe and an output pipe, the input pipe and the output pipe penetrate out of the shell respectively and are communicated with an external refrigeration source, and therefore cooling heat exchange of the cooling plate is achieved.

The power supply unit of the application is accommodated and protected by the shell, and comprises the upper functional module, the lower functional module and the cooling plate. Wherein, through arranging the cooling plate in between function module and the lower function module for the relative two sides of cooling plate can dispel the heat to last function module and lower function module respectively, has promoted the utilization ratio of cooling plate. And respectively through last heat-conducting component with the heat transfer of upper portion components and parts to the cooling plate to and through heat-conducting component with the heat transfer of lower part components and parts to the cooling plate down, can make the device of branch shell both sides all obtain better cooling effect, temperature is also more balanced from this in this application power supply unit's the casing, and whole radiating effect is better.

In one possible implementation, the upper functional module is used to implement a rectification function of the power supply unit, and the lower functional module is used to implement an inversion function of the power supply unit. Or the upper functional module is used for realizing the inversion function of the power supply unit, and the lower functional module is used for realizing the rectification function of the power supply unit.

In this implementation, the function difference setting of last function module and function module down for go up function module and function module down and carry out different functions separately, can avoid forming too much electric connection between last function module and the function module down, and then simplify power supply unit's internal line and arrange.

In one possible implementation manner, the upper component comprises an upper power semiconductor, the corresponding upper heat conduction assembly comprises an upper heat conduction block, the upper power semiconductor is attached to the upper heat conduction block, and the upper heat conduction block is attached to the cooling plate so as to realize heat transfer of the upper power semiconductor towards the cooling plate; the lower component comprises a lower power semiconductor, the corresponding lower heat conduction assembly comprises a lower heat conduction block, the lower power semiconductor is attached to the lower heat conduction block, and the lower heat conduction block is attached to the cooling plate so as to realize heat transfer of the lower power semiconductor towards the cooling plate.

In the present implementation, the upper power semiconductor is included corresponding to the upper component, and the volume of the upper power semiconductor is relatively small, and the distance between the upper power semiconductor and the cooling plate is relatively large. Therefore, the heat of the upper power semiconductor is transferred to the cooling plate through the upper heat conducting block, and the upper power semiconductor can be better radiated; and the lower power semiconductor transfers heat to the cooling plate through the lower heat conducting block, so that a better heat dissipation function is realized.

In one possible implementation manner, the upper heat conducting block comprises an upper temperature equalizing part and an upper heat conducting part, the upper power semiconductor is attached to the upper temperature equalizing part, the upper heat conducting part is attached to the cooling plate, and the upper power semiconductor transmits heat towards the cooling plate through the upper temperature equalizing part and the upper heat conducting part in sequence; the lower heat conducting block comprises a lower temperature equalizing part and a lower heat conducting part, the lower power semiconductor is attached to the lower temperature equalizing part, the lower heat conducting part is attached to the cooling plate, and the lower power semiconductor transmits heat towards the cooling plate through the lower temperature equalizing part and the lower heat conducting part successively.

In this implementation, go up the laminating of samming portion and last power semiconductor, can be so that the heat of last power semiconductor more balanced transmit to the upper heat conduction portion on, and then form better heat conduction effect. The lower temperature equalizing part is attached to the lower power semiconductor, so that heat of the lower power semiconductor is transferred to the lower heat conducting part more uniformly, and a better heat conducting effect is formed.

In one possible implementation mode, the number of the upper temperature equalizing parts of the upper heat conducting block is two, the two upper temperature equalizing parts are arranged on two sides of the upper heat conducting part, the two upper temperature equalizing parts are respectively attached to one upper power semiconductor, and the upper heat conducting part simultaneously transfers the heat of the two upper power semiconductors to the cooling plate; the lower temperature equalizing parts of the lower heat conducting block are two, the two lower temperature equalizing parts are arranged on two sides of the lower heat conducting part, the two lower temperature equalizing parts are respectively attached to one lower power semiconductor, and the lower heat conducting parts transmit heat of the two lower power semiconductors to the cooling plate.

In the implementation mode, one upper heat conducting part is used for simultaneously transferring the heat of two upper power semiconductors to the cooling plate, so that the mounting density of the upper power semiconductors is improved, and the integration level of the upper functional module is also improved; the lower heat conducting part is utilized to simultaneously transfer the heat of the two lower power semiconductors to the cooling plate, so that the mounting density of the lower power semiconductors is improved, and the integration level of the lower functional module is improved.

In a possible implementation manner, the upper heat conducting block further comprises upper heat radiating teeth, the upper heat radiating teeth extend out towards one side of the upper power semiconductor along the outer surface of the upper heat conducting part and are positioned between the upper temperature equalizing part and the cooling plate; the lower heat conducting block also comprises lower heat radiating teeth, and the lower heat radiating teeth extend out towards one side of the lower power semiconductor along the outer surface of the lower heat conducting part and are positioned between the lower temperature equalizing part and the cooling plate.

In this implementation, the arrangement of the upper heat dissipation teeth and the lower heat dissipation teeth can further utilize the upper heat dissipation teeth and the lower heat dissipation teeth to dissipate heat in the process of transferring heat between the upper heat conduction block and the lower heat conduction block, so that the heat dissipation effects of the upper heat conduction block and the lower heat conduction block are respectively improved.

In one possible implementation mode, the upper component comprises an upper power inductor, the corresponding upper heat conduction assembly comprises an upper potting box and upper potting glue, the upper power inductor is contained in the upper potting box and fixed with the upper potting box through the upper potting glue, the upper potting box is respectively in contact with the upper substrate and the cooling plate in an attaching mode, and the upper power inductor transmits heat to the cooling plate through the upper potting glue and the upper potting box; the lower component comprises a lower power inductor, the corresponding lower heat conduction assembly comprises a lower potting box and lower potting adhesive, the lower power inductor is contained in the lower potting box and fixed with the lower potting box through the lower potting adhesive, the lower potting box is respectively in contact with the lower substrate and the cooling plate in an attaching mode, and the lower power inductor transmits heat towards the cooling plate through the lower potting adhesive and the lower potting box.

In this implementation, the upper component includes an upper power inductor, which is bulky. The upper power inductor can be protected in a sealing mode by arranging the potting box in the upper heat conducting assembly, and heat of the upper power inductor is transferred to the upper potting box by the upper potting adhesive, so that the purpose that the upper power inductor transfers the heat to the cooling plate is achieved; similarly, the heat of the lower power inductor can be transferred to the cooling plate through the lower potting adhesive and the lower potting box in sequence.

In a possible implementation manner, the upper potting box comprises an upper side wall, the upper side wall is connected between the upper base plate and the cooling plate, and an upper heat dissipation fin is further convexly arranged on the upper side wall; the lower potting box comprises a lower side wall, the lower side wall is connected between the lower substrate and the cooling plate, and a lower heat dissipation fin is further arranged under the lower side wall in a protruding mode.

In the implementation mode, the upper pouring sealant can transfer the heat of the upper power inductor to the periphery of the upper pouring box, and the upper radiating fins are arranged on the upper side wall of the upper pouring box, so that the radiating function of the upper pouring box can be realized through the upper radiating fins in the process of transferring the heat of the upper power inductor, and the radiating effect of the upper pouring box is improved. Correspondingly, the lower potting box can also improve the heat dissipation effect of the lower power inductor through the lower heat dissipation fins.

In a possible implementation manner, a turbulent fan is further arranged in the shell, and the turbulent fan supplies air corresponding to a gap between the upper component and the cooling plate, and/or supplies air corresponding to a gap between the lower component and the cooling plate, so as to balance the temperature in the shell.

In this implementation, the turbulent fan utilizes the gap between the upper component and the cooling plate, and/or utilizes the gap between the lower component and the cooling plate, so that the air in the casing forms a turbulent air flow, and further the heat in the casing is promoted to be exchanged, thereby achieving the effect of balancing the temperature inside the casing.

In a possible implementation mode, an upper radiator and a lower radiator are further arranged in the shell, the upper radiator is located between the upper substrate and the cooling plate and is fixedly connected with the cooling plate, and at least one upper component is further arranged between the upper radiator and the turbulent fan; the lower radiator is positioned between the lower substrate and the cooling plate and is fixedly connected with the cooling plate, and at least one lower component is arranged between the lower radiator and the turbulent fan.

In this implementation, set up radiator and lower radiator on the cooling plate to make and go up radiator and vortex fan and branch at least one upper portion components and parts both sides, and lower radiator also with vortex fan branch at least one lower part components and parts both sides, can make upper radiator and lower radiator form the radiating effect in the place of keeping away from the vortex fan relatively, make the inside temperature of casing more balanced.

In one possible implementation manner, the upper heat sink includes a plurality of upper heat dissipation fins, the plurality of upper heat dissipation fins are all arranged in parallel to the air supply direction of the turbulent fan, the plurality of upper heat dissipation fins are spaced from each other, and the plurality of upper heat dissipation fins extend from the cooling plate towards the upper substrate; the lower radiator comprises a plurality of lower radiating fins, the plurality of lower radiating fins are all parallel to the air supply direction of the turbulent fan, the plurality of lower radiating fins are spaced from each other, and the plurality of lower radiating fins extend from the cooling plate to the lower substrate.

In this implementation, go up the setting of heat dissipation fin and the air supply direction that heat dissipation fin all is on a parallel with the vortex fan down, the more even radiator and the lower radiator of flowing through of wind energy that the vortex fan sent out, and then reach better radiating effect.

In one possible implementation mode, the number of the upper heat conduction blocks is multiple, and the multiple upper heat conduction blocks are arranged at intervals along the direction perpendicular to the air supply direction of the turbulent flow fan; the quantity of heat conduction piece also is a plurality of down, and a plurality of heat conduction pieces are arranged at interval along the air supply direction of perpendicular to vortex fan down.

In this implementation, go up the heat conduction piece and all arrange along the air supply direction of perpendicular to vortex fan with heat conduction piece down, the wind energy that the vortex fan sent out more even flows through go up the heat conduction piece and heat conduction piece down, and then reaches better radiating effect.

In one possible implementation mode, the number of the upper encapsulation boxes is multiple, and the multiple upper encapsulation boxes are arranged at intervals along the direction perpendicular to the air supply direction of the turbulent flow fan; the number of the lower potting boxes is also multiple, and the multiple lower potting boxes are also arranged at intervals along the air supply direction perpendicular to the turbulent flow fan.

In this implementation, go up embedment box and lower embedment box and all arrange along the air supply direction of perpendicular to vortex fan, the more even embedment box and lower embedment box of flowing through of wind energy that the vortex fan sent out, and then reach better radiating effect.

In one possible implementation manner, the upper power semiconductors and the upper power inductors are respectively and intensively arranged, the projections of the upper power semiconductors on the cooling plate are all located in the first area, and the projections of the upper power inductors on the cooling plate are all located in the second area; the lower power semiconductors and the lower power inductors are respectively and intensively arranged, projections of the lower power semiconductors under the cooling plate are located in the first area, and projections of the lower power inductors under the cooling plate are located in the second area.

In this implementation, the upper power semiconductor and the lower power semiconductor are symmetrically arranged with respect to the cooling plate, and the corresponding upper heat conduction block and the lower heat conduction block may also be symmetrically arranged with respect to the cooling plate; the upper power inductor and the lower power inductor are also symmetrically arranged relative to the cooling plate, and the corresponding upper potting box and the corresponding lower potting box are also symmetrically arranged relative to the cooling plate. The arrangement mode is relatively neat, and the arrangement of the devices of the power supply unit is facilitated.

In one possible implementation manner, the upper power semiconductors and the upper power inductors are respectively and intensively arranged, the projections of the upper power semiconductors on the cooling plate are all located in the first area, and the projections of the upper power inductors on the cooling plate are all located in the second area; the lower power semiconductors and the lower power inductors are respectively and intensively arranged, projections of the lower power semiconductors under the cooling plate are located in the second area, projections of the lower power inductors under the cooling plate are located in the first area, and a step shape with a height difference is formed between the first area and the second area of the cooling plate.

In this implementation, the upper power semiconductor is disposed corresponding to the position of the lower power inductor, and the lower power semiconductor is disposed corresponding to the position of the upper power inductor. Since the upper power semiconductor and the lower power semiconductor have small sizes, when they are arranged corresponding to the lower power inductor and the upper power inductor, respectively, the overall height of the case can be reduced. The cooling plate is formed into a ladder shape and respectively constructed between the upper power semiconductor and the lower power inductor and between the upper power semiconductor and the lower power semiconductor, and the heat dissipation effect can also be respectively realized.

In a possible implementation manner, the upper functional module further includes an upper auxiliary component, and the upper auxiliary component is located between the upper substrate and the cooling plate and spaced from the cooling plate; the lower functional module further comprises a lower auxiliary component, and the lower auxiliary component is positioned between the lower substrate and the cooling plate and is mutually spaced from the cooling plate.

In this implementation, the upper auxiliary component and the lower auxiliary component can respectively contribute to the functional implementation of the upper functional module and the lower functional module. And are spaced from the cooling plate, respectively, to form a heat dissipation path between the upper auxiliary component and the lower auxiliary component.

In a possible implementation mode, a turbulent fan is further arranged in the shell, the upper auxiliary component is located on one side, away from the turbulent fan, of the upper component in the air supply direction of the turbulent fan, and the lower auxiliary component is located on one side, away from the turbulent fan, of the lower component.

In this implementation, the heat generation amount of the upper auxiliary device and the lower auxiliary device is relatively small, and the upper auxiliary device and the lower auxiliary device are arranged on the side far away from the turbulent fan, so that the turbulent fan can preferentially dissipate heat of the upper component and the lower component.

In a possible implementation mode, heat-conducting glue is filled between the upper substrate and the lower substrate and used for wrapping the upper auxiliary component and the lower auxiliary component, and the heat-conducting glue is in contact with the cooling plate so as to transfer heat of the upper auxiliary component and the lower auxiliary component to the cooling plate.

In this implementation, the heat transfer that upper portion auxiliary components and parts and lower part auxiliary components and parts faced the cooling plate respectively has been realized to the heat conduction glue to upper portion auxiliary components and parts and lower part auxiliary components and parts have formed sealed protection respectively.

In a possible implementation manner, the input pipe inputs the refrigerant towards the inside of the cooling plate along a first direction, a plurality of guide grooves are formed in the cooling plate, the guide grooves are parallel and arranged at intervals along a second direction, and the second direction is perpendicular to the first direction.

In this implementation, the setting of a plurality of guiding gutters can be with the more even dispersion of the refrigerant in the input tube to two surface positions of cooling plate, realizes the heat dissipation to last function module and lower function module respectively.

In one possible implementation, the guide grooves include a first guide groove and a second guide groove, the first guide groove is located between the input pipe and the second guide groove, and the length of the first guide groove is shorter than that of the second guide groove.

In this implementation manner, the length of the first diversion trench is shorter, so that more refrigerants can flow through the side edge of the first diversion trench and reach the second diversion trench. When the guide grooves are arranged according to the above, the refrigerant can flow into each guide groove more uniformly.

In one possible implementation manner, the guide grooves include an upper guide groove which is opened upwards and a lower guide groove which is opened downwards, and the upper guide groove and the lower guide groove are alternately arranged.

In this implementation, the upper diversion trench is opened upward, and the refrigerant directly contacts with the upper surface of the cooling plate, so that the heat dissipation effect is better. The lower diversion trench is opened downwards, and the refrigerant is in direct contact with the lower surface of the cooling plate, so that the heat dissipation effect is better. The upper guide grooves and the lower guide grooves are alternately arranged, so that the cooling effect of the upper surface and the lower surface of the cooling plate is more uniform.

In a second aspect, the present application provides an electronic device, including the power supply unit provided in the first aspect of the present application, where the power supply unit is configured to provide electric energy required for operation for the electronic device. It can be understood that, in the electronic device provided in the second aspect of the present application, since the power supply unit provided in the first aspect of the present application is used, the effect is substantially the same, and details are not described here.

In one possible implementation, the operating environment of the electronic device is hermetically sealed from the outside.

Drawings

Fig. 1 is a schematic structural diagram of an external shape of a power supply unit provided in the present application;

fig. 2 is a schematic diagram of an internal structure of a power supply unit provided in the present application;

fig. 3 is a schematic structural diagram of an upper functional module in a power supply unit according to the present application;

fig. 4 is a schematic structural diagram of a lower functional module in a power supply unit provided in the present application;

FIG. 5 is a schematic diagram of a heat conduction pattern of an upper power semiconductor in a power supply unit provided herein;

fig. 6 is an exploded view of a heat conducting form of an upper power semiconductor in a power supply unit according to the present application;

FIG. 7 is a schematic diagram of a thermal conductivity pattern of a lower power semiconductor in a power supply unit provided herein;

FIG. 8 is an exploded view of a lower power semiconductor of a power supply unit according to the present application;

FIG. 9 is a schematic diagram of a heat conduction pattern of an upper power inductor in a power supply unit provided herein;

FIG. 10 is an exploded view of the upper power inductor of a power supply unit according to the present application;

FIG. 11 is a schematic diagram of a heat conduction pattern of a lower power inductor in a power supply unit provided herein;

FIG. 12 is an exploded view of the lower power inductor of a power supply unit according to the present application;

fig. 13 is a schematic arrangement diagram of internal components of a power supply unit provided in the present application;

fig. 14 is a schematic diagram of the arrangement of the internal components of another power supply unit provided in the present application;

FIG. 15 is a schematic diagram of the internal structure of another power supply unit provided in the present application;

fig. 16 is a schematic plan view of an upper functional module in another power supply unit provided in the present application;

FIG. 17 is a schematic plan view of a lower functional module of another power supply unit provided in the present application;

FIG. 18 is a schematic diagram of the internal structure of another power supply unit provided in the present application;

fig. 19 is a schematic diagram of the internal structure of another power supply unit provided in the present application;

FIG. 20 is a schematic view of the internal plan structure of a cooling plate in a power supply unit provided herein;

FIG. 21 is a schematic view of a partial cross-sectional structure of a cooling plate in a power supply unit provided herein;

fig. 22 is a partial sectional view schematically illustrating a cooling plate in another power supply unit provided in the present application.

Detailed Description

Technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 illustrates an external configuration of a power supply unit 100 provided in the present application. The power supply unit 100 can be applied to an electronic device (not shown) provided in the present application, and is used for supplying power required for the electronic device to operate. The power supply unit 100 may be an Uninterruptible Power System (UPS) or a solid-state transformer (SST). The electronic equipment can be electronic equipment in the fields of mines, aerospace, industry, communication, national defense, hospitals, computer service terminals, network servers, network equipment, data storage equipment, emergency lighting systems, railways, shipping, traffic, power plants, transformer substations, nuclear power stations, fire safety alarm systems, wireless communication systems, program-controlled switches, mobile communication, solar energy storage energy conversion equipment, control equipment and emergency protection systems thereof, personal computers and the like. When the power supply unit 100 is an uninterruptible power supply, stable and uninterrupted power can be provided for the electronic device; when the power supply unit 100 is a solid-state transformer, a controllable transition function of the power characteristics may be achieved.

In the schematic of fig. 1, the power supply unit 100 of the present application includes a housing 110, an input pipe 31, and an output pipe 32, wherein the housing 110 has a substantially rectangular shape and a sealed inner cavity is provided inside the housing. The inlet pipe 31 and the outlet pipe 32 each extend into a sealed interior of the housing 110. Please refer to fig. 2 for an internal structure of the power supply unit 100. The upper functional module 10, the lower functional module 20, and the cooling plate 30 are housed in the inner cavity of the housing 110. Wherein the cooling plate 30 is located between the upper functional module 10 and the lower functional module 20. The upper functional module 10, the lower functional module 20 and the cooling plate 30 are all fixed and contained in the sealed inner cavity of the housing 110, and are protected by the sealing of the housing 110. In some embodiments, the working environment of the whole electronic device is also isolated and sealed from the outside so as to ensure that the electronic device is not interfered by the outside.

Referring to fig. 3, the upper functional module 10 includes an upper substrate 11, an upper component 12, and an upper heat conducting assembly 13. The number of the upper components 12 is plural, and the plural upper components 12 are fixed to the upper substrate 11 and cooperate to form the function of the upper function module 10. In some embodiments, the upper functional module 10 may serve as a rectifying part or an inverting part of the power supply unit 100, and is used to implement a rectifying or inverting function of the power supply unit 100. When the upper component 12 is fixed to the upper substrate 11, it is located on a surface of the upper substrate 11 on a side facing the cooling plate 30. The upper component 12 is also spaced from the cooling plate 30. The upper heat conducting assembly 13 is in contact with at least part of the upper component 12 and simultaneously with the cooling plate 30, the upper heat conducting assembly 13 being adapted to achieve a heat transfer effect of the upper component 12 towards the cooling plate 30. Heat generated by the upper component 12 during operation may be transferred to the cooling plate 30 through the upper heat conducting assembly 13.

Referring to fig. 4, the lower functional module 20 includes a lower substrate 21, a lower component 22 and a lower heat conducting element 23. The number of the lower components 22 is plural, and the plural lower components 22 are fixed on the lower substrate 21 and cooperate to form the functions of the lower functional module 20. Among them, the lower substrate 21 may be implemented as a function board of the power supply unit 100. In some embodiments, the lower functional module 20 may serve as an inverter or a rectifier of the power supply unit 100 and is used to implement an inverter or a rectifier of the power supply unit 100. The lower component 22 is located on a surface of the lower substrate 21 facing the cooling plate 30 when it is fixed to the lower substrate 21. The lower component 22 is also spaced from the cooling plate 30. The lower heat conducting assembly 23 is in contact with at least a portion of the lower component 22 and simultaneously with the cooling plate 30, the lower heat conducting assembly 23 being adapted to achieve a heat transfer effect of the lower component 22 towards the cooling plate 30. Heat generated by the lower component 22 during operation may be transferred to the cooling plate 30 through the lower heat conducting assembly 23.

It is understood that the upper functional module 10 and the lower functional module 20 can be used to respectively implement the inverting and rectifying functions of the power supply unit 100, and the two modules cooperate to complete the power transmission of the power supply unit 100. In other embodiments, the upper functional module 10 and the lower functional module 20 may also be used to implement an inverting or rectifying function of the power supply unit 100 at the same time, or implement an inverting or rectifying function of the power supply unit 100 through cross-matching, without affecting the overall functional implementation of the power supply unit 100. On the other hand, in the embodiment of the present application, the upper functional module 10 and the lower functional module 20 are only illustrated as a distinction of two components, and in an actual product, the upper functional module 10 may be located at an upper portion of the lower functional module 20, or may be located at a lower portion of the lower functional module 20, and does not affect the specific function implementation of the power supply unit 100 of the present application.

The cooling plate 30 is hollow, and has an outer wall at one side thereof for connecting an input pipe 31 and an output pipe 32. The input pipe 31 and the output pipe 32 are respectively communicated with the inner cavity of the cooling plate 30, and the input pipe 31 and the output pipe 32 simultaneously penetrate through the casing 110 to be communicated with an external cooling source (not shown). The input pipe 31 can send the refrigerant with lower temperature in the external refrigeration source into the inner cavity of the cooling plate 30, and the refrigerant flows in the inner cavity of the cooling plate 30 to exchange heat, and reduce the overall temperature of the cooling plate 30. Then, the refrigerant with increased temperature can flow back to the external refrigeration source through the output pipe 32, and flows back to the cooling plate 30 from the input pipe 31 after being cooled again, so that the effect of circulating cooling is realized. In some embodiments, the cooling medium may be implemented by a cooling liquid. On the other hand, the inlet pipe 31 and the outlet pipe 32 may be disposed at different positions on the outer wall of the cooling plate 30, such as the outer wall where the inlet pipe 31 and the outlet pipe 32 are arranged opposite or adjacent to the cooling plate.

Thus, the power supply unit 100 according to the present invention can dissipate heat from the upper functional module 10 and the lower functional module 20, respectively, by utilizing the cooling effect of the cooling plate 30. Because the heat source of the upper functional module 10 is mainly the upper component 12, and the upper component 12 transfers the temperature to the cooling plate 30 through the upper heat conducting assembly 13; the heat source of the lower functional module 20 is mainly the lower component 22, and the lower component 22 transfers the temperature to the cooling plate 30 through the lower heat conducting assembly 23. The cooling plate 30 can simultaneously dissipate heat from the upper functional module 10 and the lower functional module 20. The devices in the shell 110 all obtain better cooling effect, the temperature is more balanced, and the whole heat dissipation effect is better. The power supply unit 100 has a relatively simple structure, a high space utilization rate, and high reliability.

Referring back to fig. 3, in the upper functional module 10, the upper component 12 includes an upper power semiconductor 121. The upper power semiconductors 121 are collectively arranged in one side region of the upper substrate 11, and in the illustrated illustration, a partial capacitance device 125 is further arranged in the region of the upper power semiconductors 121. The upper heat conductive assembly 13 is provided with an upper heat conductive block 131 corresponding to the upper power semiconductor 121. The upper heat conduction block 131 is fixed to the upper substrate 11 and is in contact with the upper power semiconductor 121. The end of the upper heat conduction block 131 away from the upper substrate 11 is also in contact with the cooling plate 30. The upper heat-conducting block 131 may be made of a material having a relatively high heat-conducting capacity, such as metal. Therefore, the heat generated by the upper power semiconductor 121 during operation can be transferred to the cooling plate 30 through the upper heat conduction block 131, so as to achieve the heat dissipation function.

Referring to fig. 5, in an embodiment, the upper power semiconductor 121 is plate-shaped, and its surface with a larger area completely adheres to the upper heat conducting block 131, so as to obtain a better heat dissipation effect. Further, referring to fig. 6, the upper heat conduction block 131 is further provided with an upper temperature equalization portion 1311 and an upper heat conduction portion 1312. The upper temperature uniforming portion 1311 is interposed between the upper power semiconductor 121 and the upper heat conducting portion 1312, and when the upper temperature uniforming portion 1311 is attached to the upper power semiconductor 121, heat generated by the upper power semiconductor 121 can be uniformly conducted to the upper heat conducting portion 1312, thereby improving heat conduction efficiency. In the illustration of fig. 5, the upper temperature equalizing portion 1311 and the upper heat conducting portion 1312 are integrally formed, while in the illustration of fig. 6, the upper temperature equalizing portion 1311 and the upper heat conducting portion 1312 are respectively formed as separate structures and are formed by subsequent assembly. Both implementations can achieve similar beneficial effects.

In an embodiment, two upper power semiconductors 121 are further attached to two opposite sides of the upper heat conduction block 131, that is, two power semiconductors 121 are attached to two opposite sides of the same upper heat conduction block 131, so as to improve the integration of the upper functional module 10. It is understood that two upper temperature equalizing portions 1311 may be disposed, and the two upper temperature equalizing portions 1311 are respectively disposed at two opposite sides of the upper heat conducting portion 1312 and are respectively used for assisting heat dissipation of one upper power semiconductor 121. Meanwhile, in the length direction of the upper heat conduction block 131, a plurality of upper power semiconductors 121 may be arranged at intervals, that is, the plurality of upper power semiconductors 121 are attached to the upper heat conduction block 131 at intervals, and the plurality of upper power semiconductors 121 all realize a heat transfer function through the same upper heat conduction block 131.

With continued reference to fig. 6, in an embodiment, the upper heat conduction block 131 is further provided with upper heat dissipation teeth 1313. The upper heat dissipation teeth 1313 extend along the outer surface of the upper heat conduction part 1312 toward the upper power semiconductor 121 side, and the upper heat dissipation teeth 1313 are also located between the upper temperature uniforming part 1311 and the cooling plate 30. When the heat of the upper power semiconductor 121 is transferred to the cooling plate 30 through the upper temperature equalizing portion 1311 and the upper heat conducting portion 1312, the upper heat dissipation teeth 1313 may increase the heat dissipation area of the upper heat conducting portion 1312, so as to achieve auxiliary heat dissipation of the upper heat conducting portion 1312.

Please refer to FIG. 4, in conjunction with the schematic illustrations of FIGS. 7 and 8. In the lower functional module 20, the lower component 22 also includes a lower power semiconductor 221. The lower power semiconductor 221 is intensively disposed in one side region of the lower substrate 21, and a part of the capacitor device 125 is also disposed in the region of the lower power semiconductor 221. The lower heat conductive assembly 23 is provided with a lower heat conductive block 231 corresponding to the lower power semiconductor 221. The lower heat conduction block 231 is fixed to the lower substrate 21 and is in contact with the lower power semiconductor 221. One end of the lower heat conduction block 231 facing away from the lower substrate 21 is also in close contact with the cooling plate 30. The lower heat conducting block 231 may also be made of a material having a relatively strong heat conducting ability, such as metal. Therefore, the heat generated by the lower power semiconductor 221 during operation can be transferred to the cooling plate 30 through the lower heat conduction block 231, so as to achieve the heat dissipation function.

In one embodiment, the lower power semiconductor 221 has a plate shape, and its surface with a larger area completely fits the lower heat conduction block 231 to obtain a better heat dissipation effect. Further, the lower heat conduction block 231 is also provided with a lower temperature uniforming portion 2311 and a lower heat conduction portion 2312. The lower temperature equalizing portion 2311 is sandwiched between the lower power semiconductor 221 and the lower heat conducting portion 2312, and when the lower temperature equalizing portion 2311 is attached to the lower power semiconductor 221, heat generated by the lower power semiconductor 221 can be uniformly conducted to the lower heat conducting portion 2312, so that heat conduction efficiency is improved. In the illustration of fig. 7, the lower temperature equalizing portion 2311 and the lower heat conducting portion 2312 are integrally formed, while in the illustration of fig. 8, the lower temperature equalizing portion 2311 and the lower heat conducting portion 2312 are respectively formed as separate structures through subsequent assembly. Both implementations can achieve similar beneficial effects.

In one embodiment, two lower power semiconductors 221 are further attached to two opposite sides of the lower heat conducting block 231, that is, two power semiconductors 121 are attached to two opposite sides of the same lower heat conducting block 231, so as to improve the integration of the lower functional module 20. It is understood that two lower temperature equalizing portions 2311 may be correspondingly disposed, and the two lower temperature equalizing portions 2311 are respectively disposed at two opposite sides of the lower heat conducting portion 2312 and are respectively used for assisting the heat dissipation of one lower power semiconductor 221. Meanwhile, in the length direction of the lower heat conduction block 231, a plurality of lower power semiconductors 221 may be arranged at intervals, that is, the plurality of lower power semiconductors 221 are attached to the lower heat conduction block 231 at intervals, and the plurality of lower power semiconductors 221 all realize a heat transfer function through the same lower heat conduction block 231.

With continued reference to fig. 8, in an embodiment, the lower heat conducting block 231 is further provided with lower heat dissipating teeth 2313. The lower heat dissipation teeth 2313 protrude toward the lower power semiconductor 221 side along the outer surface of the lower heat conduction portion 2312, and the lower heat dissipation teeth 2313 are also located between the lower temperature uniforming portion 2311 and the cooling plate 30. When the heat of the lower power semiconductor 221 is transferred to the cooling plate 30 through the lower temperature equalizing portion 2311 and the lower heat conducting portion 2312, the lower heat dissipation teeth 2313 can increase the heat dissipation area of the lower heat conducting portion 2312, and therefore auxiliary heat dissipation of the lower heat conducting portion 2312 is achieved.

Referring back to fig. 3, in one embodiment, the upper component 12 further includes an upper power inductor 122. As shown in fig. 9, the upper power inductors 122 are also intensively disposed in a side region of the upper substrate 11, and the upper power inductors 122 are fixed on the upper substrate 11. The upper heat conducting assembly 13 is provided with an upper potting box 132 and an upper potting adhesive 133 corresponding to the upper power inductor 122 (see fig. 10). The upper potting box 132 surrounds the periphery of the upper power inductor 122 and forms a hermetic protection for the upper power inductor 122. That is, the upper potting case 132 and the upper substrate 11 are enclosed to form a housing cavity, and the upper power inductor 122 is housed in the housing cavity.

Referring to fig. 10, the upper potting compound 133 is filled in the upper potting box 132 to fill the gap between the upper potting compound 133 and the upper potting box 132 and the gap between the upper power inductor 122 and the upper substrate 11. The upper potting compound 133 may fix the upper power inductor 122 in the upper potting box 132, and on the other hand, may also realize heat transfer from the upper power inductor 122 to the upper potting box 132. The potting box 132 is in contact with the cooling plate 30, and the heat generated by the operation of the upper power inductor 122 is transmitted to the cooling plate 30 through the upper potting adhesive 133 and the upper potting box 132 in sequence.

In the illustrated embodiment, the upper potting box 132 further includes an upper sidewall 1321, the upper sidewall 1321 being connected between the upper substrate 11 and the cooling plate 30. The upper side wall 1321 is also provided with upper heat dissipating fins 1322. The upper heat dissipation fins 1322 extend out from the upper side wall 1321 in a direction away from the upper power inductor 122, and have a function similar to that of the upper heat dissipation teeth 1313, and in the process that the heat of the upper power inductor 122 is transmitted to the cooling plate 30 through the upper potting adhesive 133 and the upper potting box 132, the upper heat dissipation fins 1322 can increase the heat dissipation area of the upper potting box 132, so that an auxiliary heat dissipation effect is formed on the upper potting box 132.

Please refer to FIG. 4, together with the schematic illustrations of FIGS. 11 and 12. In one embodiment, lower component 22 also includes a lower power inductor 222. As shown in fig. 11, the lower power inductors 222 are also intensively disposed in a side region of the lower substrate 21, and the lower power inductors 222 are fixed on the lower substrate 21. The lower heat conducting assembly 23 is provided with a lower potting box 232 and a lower potting adhesive 233 (see fig. 12) corresponding to the lower power inductor 222. The lower potting box 232 surrounds the periphery of the lower power inductor 222 to form a hermetic protection for the lower power inductor 222. That is, the lower potting case 232 and the lower substrate 21 are enclosed to form a receiving cavity, and the lower power inductor 222 is received in the receiving cavity.

Referring to fig. 12, the lower potting adhesive 233 is filled in the lower potting box 232 to fill the gap between the lower potting adhesive 233 and the lower potting box 232 and the gap between the lower power inductor 222 and the lower substrate 21. The lower potting adhesive 233 may fix the lower power inductor 222 in the lower potting box 232, and may also realize heat transfer from the lower power inductor 222 to the lower potting box 232. The potting box 132 is in contact with the cooling plate 30, and the heat generated by the lower power inductor 222 during operation is transmitted to the cooling plate 30 through the lower potting adhesive 233 and the lower potting box 232 in sequence.

In the illustrated embodiment, the lower potting box 232 further includes a lower sidewall 2321, the lower sidewall 2321 being connected between the lower substrate 21 and the cooling plate 30. The lower side wall 2321 is further provided with a lower heat dissipation fin 2322 in a protruding manner. The lower heat dissipation fins 2322 extend out from the lower side wall 2321 in a direction away from the lower power inductor 222, and have a function similar to that of the lower heat dissipation teeth 2313, and in the process that the heat of the lower power inductor 222 is transmitted to the cooling plate 30 through the lower potting adhesive 233 and the lower potting box 232, the lower heat dissipation fins 2322 can increase the heat dissipation area of the lower potting box 232, so that an auxiliary heat dissipation effect is formed on the lower potting box 232.

Referring to fig. 13, in one embodiment, the upper power semiconductors 121 are arranged in a concentrated manner, and the positions of the upper power semiconductors 121 on the upper substrate 11 correspond to the positions of the lower power semiconductors 221 on the lower substrate 21. That is, the cooling plate 30 is defined to include the first region 301, and the projection of the upper power semiconductor 121 on the cooling plate 30 in the stacking direction of the upper functional module 10, the cooling plate 30, and the lower functional module 20 is located within the first region 301. At the same time, the projection of the lower power semiconductor 221 on the cooling plate 30 is also located within the first region 301. The position of the upper power inductor 122 (shown as the upper potting box 132 in fig. 13) on the upper substrate 11 also corresponds to the position of the lower power inductor 222 (shown as the lower potting box 232 in fig. 13) on the lower substrate 21. That is, the projection of the upper power inductor 122 on the cooling plate 30 is located within the second region 302, and the projection of the lower power inductor 222 on the cooling plate 30 is also located within the second region 302.

In the embodiment of fig. 13, the upper power semiconductor 121 and the lower power semiconductor 221 are symmetrically arranged with respect to the cooling plate 30, and correspondingly, the upper heat conduction block 131 and the lower heat conduction block 231 may also be symmetrically arranged with respect to the cooling plate 30. Meanwhile, the upper power inductor 122 and the lower power inductor 222 are also symmetrically arranged with respect to the cooling plate 30, and the corresponding upper potting box 132 and the lower potting box 232 are also symmetrically arranged with respect to the cooling plate 30. The embodiment of fig. 13 is arranged relatively neatly, which is beneficial to routing and routing devices in the power supply unit 100.

See fig. 14 for another embodiment. The upper power semiconductors 121 are also arranged in a concentrated manner, and the projection of the upper power semiconductors 121 on the cooling plate 30 is located within the first region 301. The lower power inductors 222 (represented in fig. 14 as lower potting box 232) are also arranged centrally and the projection of the lower power inductors 222 on the cooling plate 30 is located within the first region 301. Correspondingly, after the upper power inductor 122 (represented as the upper potting box 132 in fig. 14) is arranged in a concentrated manner, its projection on the cooling plate 30 is located within the second region 302. After the lower power semiconductor 221 is arranged in a concentrated manner, its projection on the cooling plate 30 is located within the second region 301. That is, in the embodiment of fig. 14, the upper power semiconductor 121 is disposed corresponding to the lower power inductor 222, and the two are symmetrically arranged with respect to the cooling plate 30. The upper power inductor 122 and the lower power semiconductor 221 are symmetrically arranged with respect to the cooling plate 30, corresponding to the position alignment of the two.

Further, the cooling plate 30 is configured in a stepped shape, and the first region 301 and the second region 302 thereof form a height difference. The first region 301 of the cooling plate 30 is located on the side closer to the upper substrate 11, and the second region 302 is located on the side closer to the lower substrate 21. The refrigerants in the first region 301 and the second region 302 can flow each other. In other embodiments, the cooling plate 30 may be divided into two, wherein one cooling plate 30 is formed as the first region 301 and the other cooling plate is formed as the second region 302. The number of the corresponding inlet pipes 31 and outlet pipes 32 is also two, and each set of the inlet pipes 31 and outlet pipes 32 is used for providing a circulation path of the cooling medium for one cooling plate 30.

In the embodiment of fig. 14, because the upper power inductor 122 has a larger external size, it is higher than the upper power semiconductor 121 and is closer to the cooling plate 30 when it is fixed on the upper substrate 11. Lower power inductor 222 is also closer to cooling plate 30 than lower power semiconductor 221. Therefore, the upper power semiconductor 121 with a relatively low height in the upper functional module 10 is disposed at a position corresponding to the lower power inductor 222 with a relatively high height in the lower functional module 20. Correspondingly, the upper power inductor 122 with a relatively high height in the upper functional module 10 may also be disposed at a position corresponding to the lower power semiconductor 221 with a relatively low height in the lower functional module 20. Thereby, the entire height of the case 110 can be reduced, and the integration of the power supply unit 100 can be improved.

One embodiment is shown in FIG. 15. The power supply unit 100 of the present application may further include a disturbing flow fan 40. The spoiler fan 40 is also fixedly disposed in the housing 110 and is located at one side of the cooling plate 30. Turbulator fan 40 blows air toward the gap between cooling plate 30 and upper component 12, and/or turbulator fan 40 blows air toward the gap between cooling plate 30 and lower component 22. Because the upper component 12 and the lower component 22 are spaced apart from the cooling plate 30, the turbulent fan 40 blows air to drive the air inside the housing 110 to flow in the gap, so as to form turbulent airflow in the housing 110, and promote mutual heat exchange in the housing. Under the scene that the heating degrees of part of the upper component 12 and/or the lower component 22 are different, the temperature in the housing 110 can be relatively balanced after heat exchange, and the cooling effect of the cooling plate 30 on the upper functional module 10 and the lower functional module 20 is relatively uniform.

Referring to fig. 16, in an embodiment, the number of the upper power semiconductors 121 is plural, and the number of the corresponding upper heat conduction blocks 131 is plural. The plurality of upper heat-conducting blocks 131 are arranged at intervals along the air supply direction perpendicular to the turbulent fan 40, so that turbulent air flow sent by the turbulent fan 40 can smoothly and relatively uniformly pass through gaps among the upper heat-conducting blocks 131, and a better heat dissipation effect is formed on the plurality of upper power semiconductors 121. The number of the upper power capacitors 122 is also plural, and corresponds to the number of the upper potting cases 132. The upper potting boxes 132 are also arranged at intervals in the direction perpendicular to the air blowing direction of the spoiler fan 40, so that the spoiler fan 40 can smoothly and relatively uniformly pass through the gaps between the upper potting boxes 132. Further, in the illustration of fig. 16, the gaps between the upper heat-conducting blocks 131 may also be aligned with the gaps between the upper potting boxes 132, so that the disturbed airflow flows through the gaps between the upper heat-conducting blocks 131 and then flows through the gaps between the upper potting boxes 132 more smoothly.

In the embodiment illustrated in fig. 17, the number of the lower power semiconductors 221 is plural, and the number of the corresponding lower heat conduction blocks 231 is plural. The lower heat-conducting blocks 231 are arranged at intervals along the air supply direction perpendicular to the turbulent fan 40, so that turbulent air flow sent by the turbulent fan 40 can smoothly and relatively uniformly pass through gaps among the lower heat-conducting blocks 231, and a better heat dissipation effect is formed on the upper and lower power semiconductors 221. The number of the lower power capacitors 222 is also plural, and corresponds to the number of the lower potting boxes 232. The lower potting boxes 232 are also arranged at intervals along the air supply direction perpendicular to the turbulent fan 40, so that the turbulent air flow sent by the turbulent fan 40 can smoothly and relatively uniformly pass through the gaps among the lower potting boxes 232. Further, in the illustration of fig. 17, the gaps between the lower heat-conducting blocks 231 may also be aligned with the gaps between the lower potting boxes 232, so that the disturbed airflow flows through the gaps between the lower heat-conducting blocks 231 and then flows through the gaps between the lower potting boxes 232 smoothly.

For the embodiment that the upper heat conducting assembly 13 is further provided with the upper heat dissipating teeth 1313 and the upper heat dissipating fins 1322, and the embodiment that the lower heat conducting assembly 23 is further provided with the lower heat dissipating teeth 2313 and the lower heat dissipating teeth 2322, the upper heat dissipating teeth 1313, the upper heat dissipating fins 1322, the lower heat dissipating teeth 2313, and the lower heat dissipating fins 2322 may be further arranged in the direction parallel to the air supply direction of the turbulent fan 40, so that the turbulent airflow sent by the turbulent fan 40 can smoothly pass through the gaps between the upper heat dissipating teeth 1313, the gaps between the upper heat dissipating teeth 1322, the gaps between the lower heat dissipating teeth 2313, and the gaps between the lower heat dissipating fins 2322, thereby achieving a better heat dissipating effect.

In the embodiment of fig. 15, an upper heat sink 51 and a lower heat sink 52 are also provided within the housing 110. Specifically, referring to fig. 18, the upper heat sink 51 and the lower heat sink 52 are fixedly connected to the cooling plate 30, respectively, and extend toward the upper substrate 11 and the lower substrate 21, respectively. That is, the upper and

lower heat sinks

51 and 52 are symmetrically disposed with respect to the cooling plate 30 and serve to assist heat dissipation of the upper and lower

functional modules

10 and 20, respectively.

In the illustration of fig. 15, the upper heat sink 51 is located between the upper power semiconductor 121 and the upper power inductor 122, and the lower heat sink 52 is located between the lower power semiconductor 221 and the lower power inductor 222. That is, at least one upper component 12 is disposed between the disturbing fluid fan 40 and the upper heat sink 51, and at least one lower component 22 is also disposed between the disturbing fluid fan 40 and the lower heat sink 52. The disturbed airflow sent by the disturbed flow fan 40 can firstly dissipate heat of one upper component 12, then carry out heat conversion and temperature reduction at the upper radiator 51, and then flow to the next upper component 12, so as to obtain better heat dissipation effect; correspondingly, after the disturbed airflow sent by the disturbed flow fan 40 can be dissipated with respect to one lower component 22, the disturbed airflow is subjected to heat conversion and temperature reduction at the lower heat sink 52 and flows to the next lower component 22, so that a better heat dissipation effect is obtained.

With continued reference to fig. 18, in the present embodiment, the upper heat sink 51 may include a plurality of upper heat dissipating fins 511. The plurality of upper heat dissipating fins 511 are arranged at intervals, and the arrangement direction of the upper heat dissipating fins 511 is perpendicular to the blowing direction of the turbulent fan 40. Further, the upper heat dissipating fin 511 is disposed in parallel to the blowing direction of the disturbing fan 40, and extends from one side of the cooling plate 30 toward the upper substrate 11. Since the upper heat sink 51 is fixedly connected to the cooling plate 30, the temperature of the cooling plate 30 can be transmitted to the upper heat sink 51. The arrangement of the plurality of upper heat dissipation fins 511 can cool the air flowing through the upper heat sink 51, so that the temperature of the air flowing out of the upper heat sink 51 is reduced, and a better heat dissipation effect is achieved in the subsequent flowing process.

Correspondingly, the lower heat sink 52 may also include a plurality of lower heat dissipating fins 521. The plurality of lower heat dissipating fins 521 are arranged at intervals, and the arrangement direction of the lower heat dissipating fins 521 is perpendicular to the air blowing direction of the turbulent fan 40. Further, the lower heat dissipation fin 521 is disposed in parallel with the blowing direction of the disturbing fan 40, and extends from one side of the cooling plate 30 toward the lower substrate 21. Because the lower heat sink 52 is fixedly connected to the cooling plate 30, the temperature of the cooling plate 30 can be transferred to the lower heat sink 52. The arrangement of the plurality of lower heat dissipation fins 521 can also cool the air flowing through the lower heat sink 52, so that the temperature of the air flowing out of the lower heat sink 52 is reduced, and a better heat dissipation effect is achieved in the subsequent flowing process.

Referring back to fig. 2, 3 and 16, in one embodiment, the upper functional module 10 further includes an upper auxiliary component 14. The upper auxiliary component 14 is also fixed to the upper substrate 11, and is positioned on the side of the upper substrate 11 facing the cooling plate 30, similarly to the upper component 12. The upper auxiliary component 14 may include a capacitor, a terminal, a fuse, and other devices for implementing various auxiliary functions of the upper functional module 10. A gap is also left between the upper auxiliary component 14 and the cooling plate 30, and in the embodiment where the disturbing flow fan 40 is provided, the upper auxiliary component 14 is located on the side of the upper component 12 facing away from the disturbing flow fan 40. That is, the turbulent air flow sent by the turbulent fan 40 flows through the upper component 12 and the upper heat conducting assembly 13, and then flows to the upper auxiliary component 14, so as to dissipate heat of the upper auxiliary component 14.

Similarly, in the embodiment illustrated in fig. 2, 4 and 17, the lower functional module 20 further includes a lower auxiliary component 24. Similarly to the lower component 22, the lower auxiliary component 24 is also fixed to the lower substrate 21 and is located on the side of the lower substrate 21 facing the cooling plate 30. The lower auxiliary component 24 may also include a capacitor, a terminal, a fuse, and other devices for implementing various auxiliary functions of the lower functional module 20. A gap is also left between the lower auxiliary component 24 and the cooling plate 30, and in the embodiment where the spoiler fan 40 is provided, the lower auxiliary component 24 is located on a side of the lower component 22 facing away from the spoiler fan 40. That is, the disturbed airflow sent by the disturbing fan 40 flows through the lower component 22 and the lower heat conducting assembly 23, and then flows to the lower auxiliary component 24 to dissipate heat of the lower auxiliary component 24.

In some embodiments, no cooling plate 30 is provided between the upper auxiliary component 14 and the lower auxiliary component 24. Since the upper auxiliary component 14 and the lower auxiliary component 24 are short in height and relatively densely distributed, it is not easy to provide the upper heat conductive member 13 or the lower heat conductive member 23 at the upper auxiliary component 14 and the lower auxiliary component 24, respectively. In the structural embodiment without the cooling plate 30, a large heat dissipation space can be obtained between the upper auxiliary component 14 and the lower auxiliary component 24, which facilitates natural heat dissipation of the upper auxiliary component 14 and the lower auxiliary component 24. Or, in the embodiment with the turbulent fan 40, the heat dissipation space between the upper auxiliary component 14 and the lower auxiliary component 24 is large, and the turbulent airflow sent by the turbulent fan 40 can fully contact with the upper auxiliary component 14 and the lower auxiliary component 24 in the heat dissipation space, so that a good heat dissipation effect can be achieved.

Referring to the embodiment of fig. 19, in the present embodiment, the power supply unit 100 is further provided with a heat conductive adhesive 60. The thermally conductive paste 60 is disposed at a position corresponding to the upper auxiliary component 14 and the lower auxiliary component 24, and is used to encapsulate the upper auxiliary component 14 and the lower auxiliary component 24. That is, the thermal paste 60 is disposed at a position corresponding to the upper auxiliary component 14 and the lower auxiliary component 24, and is filled between the upper substrate 11 and the lower substrate 21. The thermally conductive paste 60 also contacts the cooling plate 30 to transfer heat from the upper auxiliary component 14 and the lower auxiliary component 24 to the cooling plate. It can be understood that the thermal conductive paste 60 can dissipate heat from the upper auxiliary component 14 and the lower auxiliary component 24, and also can protect the upper auxiliary component 14 and the lower auxiliary component 24 from being sealed.

One embodiment is shown in FIG. 20. The cooling plate 30 is provided with a guide groove 33 therein. The number of the guide grooves 33 is plural, and the plurality of guide grooves 33 are arranged at intervals along the first direction 001. The first direction 001 may be defined as an extending direction of the input pipe 31, that is, a direction in which the input pipe 31 feeds the refrigerant into the cooling plate 30. The plurality of guiding grooves 33 extend along a second direction 002, and the second direction 002 is perpendicular to the first direction 001. Accordingly, when the refrigerant fed from the inlet pipe 31 flows toward the inside of the cooling plate 30 in the first direction, the refrigerant is relatively uniformly distributed into the guide grooves 33 and flows out from the other ends of the guide grooves 33. It is understood that the output pipe 32 is disposed at the other side of the input pipe 31 along the second direction 002, and the refrigerant flowing out of each guiding groove 33 can flow out of the inner cavity of the cooling plate 30 from the output pipe 32 after cooling the two opposite surfaces of the cooling plate 30.

In the illustration of fig. 20, channels 33 further include first channel 331 and second channel 332. In the first direction 001, first guide groove 331 is located between input pipe 31 and second guide groove 332. And the length of first guide groove 331 is shorter than the length of second guide groove 332. That is, the opening size between first guide groove 331 and the sidewall of cooling plate 30 is larger than the opening size between second guide groove 332 and the sidewall of cooling plate 30. Therefore, when the refrigerant enters the inner cavity of the cooling plate 30 along the first direction 001, the refrigerant needs to flow through the first guiding groove 331 first. At this time, because the opening of the first guiding groove 331 is large in size, the refrigerant is divided, a portion of the refrigerant flows in the first guiding groove 331 along the second direction 002, and another portion of the refrigerant continues to flow in the first direction 001 along the opening and flows into the second guiding groove 332 after reaching the second guiding groove 332. When the refrigerant is closer to the input pipe 31, more refrigerant is required to flow toward the guide grooves 33 at the rear end along the first direction 001, and the refrigerant is divided into the guide grooves 33 to cool the cooling plate 30. Therefore, the opening size of the first guiding groove 331 is relatively larger, so that more refrigerant flows toward the rear end along the first direction 001. At a position far from the input pipe 31, less refrigerant needs to flow to the rear end, and at this time, the size of the opening at the second guide groove 332 is reduced, so that more refrigerant can flow into the second guide groove 332. So, when guiding gutter 33 quantity in cooling plate 30 is more, the length dimension that all sets up guiding gutter 33 near input tube 31 is shorter for each guiding gutter forms trapezoidal structure as shown in fig. 20 and arranges, can make the refrigerant more even flow in each guiding gutter 33, and then makes cooling plate 30's cooling effect also balanced relatively, avoids appearing the refrigerant too much to concentrate on near input tube 31 one end, reduces the bad phenomenon appearance of cooling plate 30 cooling effect.

Referring to fig. 21, in an embodiment, the guiding grooves 33 further include upper guiding grooves 333 and lower guiding grooves 334, and the upper guiding grooves 333 and the lower guiding grooves 334 are alternately arranged along the first direction 001. The opening of the upper guide groove 333 is upward, and the refrigerant can directly contact one side surface of the cooling plate 30 when flowing through the upper guide groove 333, so that the upper surface of the cooling plate 30 can be cooled better; the opening of the lower guide groove 334 faces downward, and the refrigerant can directly contact the other side surface of the cooling plate 30 when flowing through the lower guide groove 334, so as to better cool the lower surface of the cooling plate 30. In the present power supply unit 100, it can be understood that the upper channels 333 are used to better cool the surface of the cooling plate 30 facing the upper functional module 10, and the lower channels 334 are used to better cool the surface of the cooling plate 30 facing the lower functional module 20. The alternate arrangement of the upper channels 333 and the lower channels 334 can make the cooling effect of the cooling plate 30 on the upper functional module 10 and the lower functional module 20 tend to be consistent, and make the temperature in the power supply unit 100 relatively uniform.

Referring to fig. 22, an upper baffle 34 and a lower baffle 35 may be disposed inside the cooling plate 30. The upper baffle plates 34 are multiple, and the multiple upper baffle plates 34 are arranged at intervals along the first direction 001 to form a part of the diversion trench 33; the lower baffle 35 is also plural, and the plural lower baffles 35 are also arranged at intervals in the first direction 001 to form another part of the guide groove 33. The positions of the upper baffle 34 and the lower baffle 35 are aligned with each other to ensure the flowing smoothness of the refrigerant in the diversion trench 33 formed by the upper baffle 34 and the lower baffle 35. In the present embodiment, the refrigerant can directly contact with two opposite outer surfaces of the cooling plate 30 respectively during flowing through the guiding groove 33, and a good cooling effect can be obtained.

In an embodiment, a gap is left between the upper baffle 34 and the lower baffle 35, and the gap can prevent the upper baffle 34 and/or the lower baffle 35 from abutting against each other due to machining or assembly errors to cause concave-convex deformation of the outer surface of the cooling plate 30, ensure flatness of the cooling plate 30, and ensure reliable adhesion between the cooling plate 30 and the upper heat-conducting assembly 13 and the lower heat-conducting assembly 23.

In some embodiments, a heat conductive adhesive (not shown) may be filled between the cooling plate 30 and the upper heat conducting assembly 13 and between the cooling plate 30 and the lower heat conducting assembly 23, so as to improve the adhesion between the cooling plate 30 and the upper heat conducting assembly 13 and the lower heat conducting assembly 23, and ensure that heat generated by the upper component 12 and the lower component 22 can be effectively transferred to the cooling plate 30.

The above description is only for the specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions, such as the reduction or addition of structural elements, the change of shape of structural elements, etc., within the technical scope of the present application, and shall be covered by the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A power supply unit is characterized by comprising a shell, an upper functional module, a lower functional module and a cooling plate, wherein the upper functional module, the lower functional module and the cooling plate are fixed in the shell;

the upper functional module comprises an upper substrate, an upper component and an upper heat conduction assembly, the upper component and the upper heat conduction assembly are fixed on one side, facing the cooling plate, of the upper substrate, the upper component and the cooling plate are mutually spaced, the upper component is also in contact with the upper heat conduction assembly, and heat is transferred towards the cooling plate through the upper heat conduction assembly;

the lower functional module comprises a lower substrate, a lower component and a lower heat conduction assembly, the lower component and the lower heat conduction assembly are fixed on one side, facing the cooling plate, of the lower substrate, the lower component and the cooling plate are mutually spaced, the lower component is also in contact with the lower heat conduction assembly, and heat is transferred towards the cooling plate through the lower heat conduction assembly;

the cooling plate is fixedly connected with an input pipe and an output pipe, the input pipe and the output pipe penetrate out of the shell respectively and are communicated with an external refrigeration source, and therefore cooling heat exchange of the cooling plate is achieved.

2. The power supply unit according to claim 1, wherein the upper component comprises an upper power semiconductor, the upper heat conducting assembly comprises an upper heat conducting block, the upper power semiconductor is attached to the upper heat conducting block, and the upper heat conducting block is attached to the cooling plate to realize heat transfer of the upper power semiconductor towards the cooling plate;

the lower component comprises a lower power semiconductor, the lower component comprises a lower heat conduction block corresponding to the lower heat conduction assembly, the lower power semiconductor is attached to the lower heat conduction block, and the lower heat conduction block is attached to the cooling plate so as to realize heat transfer of the lower power semiconductor towards the cooling plate.

3. The power supply unit according to claim 2, wherein the upper heat conduction block comprises an upper temperature equalizing portion and an upper heat conduction portion, the upper power semiconductor is attached to the upper temperature equalizing portion, the upper heat conduction portion is attached to the cooling plate, and the upper power semiconductor transfers heat to the cooling plate through the upper temperature equalizing portion and the upper heat conduction portion in sequence;

the lower heat conducting block comprises a lower temperature equalizing part and a lower heat conducting part, the lower power semiconductor is attached to the lower temperature equalizing part, the lower heat conducting part is attached to the cooling plate, and the lower power semiconductor sequentially passes through the lower temperature equalizing part and the lower heat conducting part and faces the cooling plate to transfer heat.

4. The power supply unit according to claim 3, wherein the upper heat-conducting block further comprises upper heat-dissipating teeth which protrude toward the upper power semiconductor side along an outer surface of the upper heat-conducting portion and are located between the upper temperature-uniforming portion and the cooling plate;

the lower heat conducting block also comprises lower heat dissipation teeth, and the lower heat dissipation teeth extend out towards one side of the lower power semiconductor along the outer surface of the lower heat conducting part and are positioned between the lower temperature equalizing part and the cooling plate.

5. The power supply unit according to any one of claims 1 to 4, wherein the upper component includes an upper power inductor, the upper power inductor includes an upper potting case and an upper potting adhesive corresponding to the upper heat conducting assembly, the upper power inductor is accommodated in the upper potting case and fixed to the upper potting case by the upper potting adhesive, the upper potting case is respectively in contact with the upper substrate and the cooling plate, and the upper power inductor transfers heat to the cooling plate through the upper potting adhesive and the upper potting case;

lower part components and parts include down the power inductance, correspond heat conduction assembly includes down potting box and lower potting compound down, down the power inductance accept in the potting box down, and pass through down the potting compound with the potting box is fixed down, down the potting box respectively with the infrabasal plate with the cooling plate laminating contact, down the power inductance pass through down the potting compound with down the potting box orientation the cooling plate heat transfer.

6. The power supply unit according to claim 5, wherein the upper potting box comprises an upper sidewall connected between the upper base plate and the cooling plate, and an upper heat dissipation fin is protruded on the upper sidewall;

the lower potting box comprises a lower side wall, the lower side wall is connected between the lower substrate and the cooling plate, and lower heat dissipation fins are further arranged below the lower side wall in a protruding mode.

7. The power supply unit of any one of claims 1 to 6, wherein a turbulent fan is further disposed in the housing, and the turbulent fan blows air corresponding to a gap between the upper component and the cooling plate, and/or

The turbulent fan supplies air corresponding to a gap between the lower component and the cooling plate so as to balance the temperature in the shell.

8. The power supply unit of claim 7, wherein an upper heat sink and a lower heat sink are further disposed in the housing, the upper heat sink is located between the upper substrate and the cooling plate and is fixedly connected to the cooling plate, and at least one upper component is further disposed between the upper heat sink and the disturbing flow fan;

the lower radiator is positioned between the lower substrate and the cooling plate and is fixedly connected with the cooling plate, and at least one lower component is arranged between the lower radiator and the turbulent flow fan.

9. The power supply unit of claim 8, wherein the upper heat sink includes a plurality of upper heat dissipating fins, each of the plurality of upper heat dissipating fins is disposed parallel to an air blowing direction of the disturbing fan, and the plurality of upper heat dissipating fins are spaced apart from each other, and the plurality of upper heat dissipating fins extend from the cooling plate toward the upper substrate;

the lower radiator comprises a plurality of lower radiating fins, the lower radiating fins are all parallel to the air supply direction of the turbulent fan, the lower radiating fins are arranged at intervals, and the lower radiating fins are multiple and extend towards the lower substrate from the cooling plate.

10. The power supply unit according to any one of claims 1-9, wherein the upper functional module further comprises an upper auxiliary component, the upper auxiliary component being positioned between the upper substrate and the cooling plate and spaced apart from the cooling plate;

the lower functional module further comprises a lower auxiliary component, and the lower auxiliary component is located between the lower substrate and the cooling plate and is mutually spaced from the cooling plate.

11. The power supply unit of claim 10, wherein a disturbing flow fan is further disposed in the housing, and in an air blowing direction of the disturbing flow fan, the upper auxiliary device is located on a side of the upper device facing away from the disturbing flow fan, and the lower auxiliary device is located on a side of the lower device facing away from the disturbing flow fan.

12. The power supply unit according to claim 11, wherein a thermal conductive paste is further filled between the upper substrate and the lower substrate, the thermal conductive paste is used for wrapping the upper auxiliary component and the lower auxiliary component, and the thermal conductive paste is further in contact with the cooling plate to transfer heat of the upper auxiliary component and the lower auxiliary component to the cooling plate.

13. The power supply unit according to any one of claims 1 to 12, wherein the input pipe inputs a cooling medium into the cooling plate along a first direction, a plurality of flow guide grooves are formed in the cooling plate, the flow guide grooves are arranged in parallel and at intervals along a second direction, and the second direction is perpendicular to the first direction.

14. The power supply unit of claim 13 wherein said channels include a first channel and a second channel, said first channel being located between said input pipe and said second channel, said first channel having a length that is shorter than a length of said second channel.

15. An electronic device, characterized in that it comprises a power supply unit according to any one of claims 1-14 for supplying the electronic device with electrical energy required for its operation.