CN216123053U

CN216123053U - Chip mounter for electronic component assembling system

Info

Publication number: CN216123053U
Application number: CN202121368915.XU
Authority: CN
Inventors: 姜杰林; 罗旭
Original assignee: Zhejiang Yuou Electronic Technology Co ltd
Current assignee: Zhejiang Yuou Electronic Technology Co ltd
Priority date: 2021-06-21
Filing date: 2021-06-21
Publication date: 2022-03-22
Anticipated expiration: 2031-06-21

Abstract

The utility model discloses a chip mounter for an electronic component assembling system, which comprises a chip mounter base, wherein side plates are fixedly arranged on the left side and the right side of the outer surface of the upper end of the chip mounter base, protective mechanisms are arranged on the outer surfaces of the two ends of the chip mounter base, and a soot blowing assembly is fixedly arranged on the left side plate. According to the chip mounter for the electronic component assembly system, the filter plate is arranged to filter dust in air, the dust removal effect is improved, the pressure inside the collecting box is stable, the dust cannot flow backwards, the filter plate is convenient to mount and dismount through the first handle, the mounting cavity, the sliding rod and the sliding groove, the cleaning is convenient, the protection mechanism is arranged, when the dust is required to be removed, the baffle plate is pulled out of the movable cavity only by pulling the second handle, the first magnetic block and the movable hole are attracted in a heteropolar mode, the baffle plate is fixed, the dust removal effect is improved, the dust is prevented from escaping from the side face, and the better use prospect is brought.

Description

Chip mounter for electronic component assembling system

Technical Field

The utility model relates to the technical field of chip mounters, in particular to a chip mounter for an electronic component assembling system.

Background

The chip mounter has the advantages of high mounting speed, high precision and stable and reliable quality as the support column type equipment in the field of electronic mounting, thoroughly changes the characteristics of labor intensive enterprises in the field of mounting, greatly improves the production efficiency, liberates labor force, is necessary equipment in the modern mounting industry, and has the advantages of smooth surface of a worktable of the chip mounter, easy dust accumulation on the surface of the worktable and chip mounting after the dust falls on the surface of a workpiece in actual use, thereby influencing the quality of the chip mounting.

In the prior art, a chinese patent document with an authorization publication number of CN202021020496.6 describes a chip mounter for an electronic component assembly system, which uses a wind collecting pipe with a blowing head, wherein a fan blows out air flow into the wind collecting pipe through the blowing head to blow away dust on the surface of a rack worktable, thereby reducing dust scattering on the surface of a workpiece, a material storage box is provided, the surface of the material storage box is additionally provided with a docking bracket connected with the rack, an axial flow fan is arranged inside the docking bracket to suck the flying dust, the sucked dust scatters inside the material storage box to be collected, however, the material storage box is not provided with a vent, and the pressure of the input air is increased all the time, so that the dust inside flows back and is discharged through a discharge port, thereby affecting the external environment, and baffles are not arranged at two ends of a base of the chip mounter, the dust can run out from two sides, thereby bringing certain adverse effects to the use process of people, therefore, a chip mounter for an electronic component assembling system is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides the chip mounter for the electronic component assembly system, which has the advantages of increasing the dust collection effect, facilitating dust filtration, improving the air quality and the like, and can effectively solve the problems in the background art.

(II) technical scheme

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a chip mounter that electronic component equipment system used, includes the chip mounter base, the left and right sides fixed mounting of chip mounter base upper end surface has the curb plate, the both ends surface of chip mounter base is provided with protection machanism, left side curb plate fixed mounting has the soot blowing subassembly, one side fixed surface of right side curb plate installs the collecting box.

Preferably, a filter plate is arranged on the outer surface of one side of the collecting box, a first handle is fixedly mounted in the middle of the outer surface of the upper end of the filter plate, sliding rods are fixedly mounted on the outer surfaces of the two sides of the filter plate, a mounting cavity is formed in the outer surface of one side of the collecting box, and sliding grooves are formed in the two sides of the mounting cavity.

Preferably, the outer wall of the filter plate is clamped with the inner wall of the mounting cavity, and the outer wall of the sliding rod is clamped with the inner wall of the sliding groove.

Preferably, the protection mechanism comprises a first limit block, a second limit block, a buffer spring, a movable cavity, a buffer plate, a buffer cavity, a baffle plate, a second handle, a first magnetic block, a movable hole and a second magnetic block, the movable holes are arranged at two ends of the outer surface of the upper end of the chip mounter base, the movable cavity is arranged at the lower part of the movable hole, the second magnetic blocks are fixedly arranged at two sides of the upper end of the movable cavity, the second handle is fixedly arranged on the outer surface of the upper end of the baffle plate, the buffer cavity is arranged on the outer surface of the lower end of the baffle, the first limiting block is fixedly arranged on two sides of the buffer cavity of the paster base, the buffer spring is fixedly arranged in the buffer cavity, the second limiting block is fixedly arranged on the outer surface of one end of the buffer spring, the buffer plate is fixedly installed on the outer wall of one side of the second limiting block, and the first magnetic blocks are fixedly installed on the outer walls of the two sides of the bottom of the baffle.

Preferably, the first magnetic block and the second magnetic block are attracted oppositely, and the outer wall of the baffle plate is in sliding connection with the inner wall of the movable hole.

Preferably, the outer surface of one side of the second limiting block is elastically connected with the inner wall of the buffer cavity through a buffer spring.

(III) advantageous effects

Compared with the prior art, the utility model provides a chip mounter for an electronic component assembling system, which has the following beneficial effects:

1. this chip mounter that electronic component equipment system used, dust through blow the inside time of grey subassembly discrepancy collecting box, the filter of setting filters the dust of air, increases dust removal effect, and the inside pressure of collecting box is stable, can not make the dust refluence, through the first in command, installation cavity, slide bar and the spout that sets up, the installation of the filter of being convenient for is dismantled, is convenient for clear up.

2. This chip mounter that electronic component equipment system used, blow off from the both sides of chip mounter base in order to prevent the dust, increase the effect of dust removal, the protection machanism of setting, when needs go dirt, only need through pulling second handle, pull out the outside in activity chamber with the baffle, make first magnetic path and activity hole heteropolar attracting mutually, make the baffle fixed, increase dust removal effect, prevent that the dust from running out from the side, after the dust removal finishes, push down the second handle, the buffer board receives the impact, the buffer board passes through second stopper extrusion buffer spring, cushion, reduce the damage that the baffle received.

Drawings

Fig. 1 is a schematic view of an overall structure of a chip mounter for an electronic component assembly system according to the present invention.

Fig. 2 is an enlarged view of a part a of a chip mounter for an electronic component mounting system according to the present invention.

Fig. 3 is a schematic structural diagram of a protection mechanism in a chip mounter for an electronic component assembly system according to the present invention.

In the figure: 1. a chip mounter base; 2. a side plate; 3. a protection mechanism; 4. a soot blowing assembly; 5. a collection box; 6. a filter plate; 7. a first handle; 8. a mounting cavity; 9. a slide bar; 10. a chute; 11. a first stopper; 12. a second limiting block; 13. a buffer spring; 14. a movable cavity; 15. a buffer plate; 16. a buffer chamber; 17. a baffle plate; 18. a second handle; 19. a first magnetic block; 20. a movable hole; 21. a second magnetic block.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

Detailed description of the preferred embodiment

The embodiment is a chip mounter for an electronic component assembly system.

As shown in fig. 1-3, the dust blowing device comprises a chip mounter base 1, side plates 2 are fixedly mounted on the left side and the right side of the outer surface of the upper end of the chip mounter base 1, protection mechanisms 3 are arranged on the outer surfaces of the two ends of the chip mounter base 1, a dust blowing assembly 4 is fixedly mounted on the side plate 2 on the left side, and a collecting box 5 is fixedly mounted on the outer surface of one side of the side plate 2 on the right side.

A filter plate 6 is arranged on the outer surface of one side of the collecting box 5, a first handle 7 is fixedly arranged in the middle of the outer surface of the upper end of the filter plate 6, slide bars 9 are fixedly arranged on the outer surfaces of the two sides of the filter plate 6, a mounting cavity 8 is arranged on the outer surface of one side of the collecting box 5, and sliding grooves 10 are arranged on the two sides of the mounting cavity 8; the outer wall of the filter plate 6 is clamped with the inner wall of the mounting cavity 8, and the outer wall of the sliding rod 9 is clamped with the inner wall of the sliding groove 10; the protection mechanism 3 comprises a first limit block 11, a second limit block 12, a buffer spring 13, a movable cavity 14, a buffer plate 15, a buffer cavity 16, a baffle 17, a second handle 18, a first magnetic block 19, a movable hole 20 and a second magnetic block 21, the movable holes 20 are formed in two ends of the outer surface of the upper end of the paster base 1, the movable cavity 14 is formed in the lower portion of the movable hole 20, the second magnetic blocks 21 are fixedly mounted on two sides of the upper end of the movable cavity 14, the second handle 18 is fixedly mounted on the outer surface of the upper end of the baffle 17, the buffer cavity 16 is formed in the outer surface of the lower end of the baffle 17, the first limiting block 11 is fixedly mounted on two sides of the buffer cavity 16 of the paster base 1, the buffer spring 13 is fixedly mounted inside the buffer cavity 16, the second limiting block 12 is fixedly mounted on the outer surface of one end of the buffer spring 13, the buffer plate 15 is fixedly mounted on the outer wall of one side of the second limiting block 12, and the first magnetic blocks 19 are fixedly mounted on the outer walls of two sides of the bottom of the baffle 17; the first magnetic block 19 and the second magnetic block 21 are attracted oppositely, and the outer wall of the baffle plate 17 is in sliding connection with the inner wall of the movable hole 20; the outer surface of one side of the second stopper 12 is elastically connected with the inner wall of the buffer cavity 16 through a buffer spring 13.

The chip mounter for the electronic component assembly system is characterized in that when dust enters and exits from the interior of the collection box 5 through the soot blowing assembly 4, the filter plate 6 is arranged to filter the dust in the air and increase the dust removal effect, the pressure in the interior of the collection box 5 is stable, the dust cannot flow backwards, and the filter plate 6 is convenient to mount and dismount and clean through the first handle 7, the mounting cavity 8, the sliding rod 9 and the sliding groove 10; in order to prevent that the dust from blowing off from chip mounter base 1's both sides, increase the effect of dust removal, the protection machanism 3 of setting, when needs go dirt, only need through pulling second handle 18, pull out the outside of activity chamber 14 with baffle 17, make first magnetic path 19 inhale with the heteropolar of activity hole 20 mutually, make baffle 17 fixed, after the dust removal finishes, second handle 18 pushes down, buffer board 15 receives the impact, buffer board 15 extrudees buffer spring 13 through second stopper 12, cushion, reduce the damage that baffle 17 received.

Detailed description of the utility model

The embodiment is an embodiment of a protection mechanism 3 in a chip mounter for an electronic component assembly system.

As shown in fig. 1 and 3, a protection mechanism 3 for a chip mounter used for an electronic component assembly system, the protection mechanism 3 includes a first limit block 11, a second limit block 12, a buffer spring 13, a movable cavity 14, a buffer plate 15, a buffer cavity 16, a baffle plate 17, a second handle 18, a first magnet 19, a movable hole 20 and a second magnet 21, the movable hole 20 is opened at both ends of the outer surface of the upper end of a chip mounter base 1, the movable cavity 14 is opened at the lower portion of the movable hole 20, the second magnet 21 is fixedly installed at both sides of the upper end of the movable cavity 14, the second handle 18 is fixedly installed at the outer surface of the upper end of the baffle plate 17, the buffer cavity 16 is opened at the outer surface of the lower end of the baffle plate 17, the first limit block 11 is fixedly installed at both sides of the buffer cavity 16 of the chip mounter base 1, the buffer spring 13 is fixedly installed in the cavity 16, the second limit block 12 is fixedly installed at the outer surface of one end of the buffer spring 13, the buffer plate 15 is fixedly arranged on the outer wall of one side of the second limiting block 12, and the first magnetic blocks 19 are fixedly arranged on the outer walls of two sides of the bottom of the baffle 17; the first magnetic block 19 and the second magnetic block 21 are attracted oppositely, and the outer wall of the baffle plate 17 is in sliding connection with the inner wall of the movable hole 20; the outer surface of one side of the second stopper 12 is elastically connected with the inner wall of the buffer cavity 16 through a buffer spring 13.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a chip mounter that electronic component equipment system used, includes chip mounter base (1), its characterized in that: the utility model discloses a chip mounter is characterized in that the left and right sides fixed mounting of paster base (1) upper end surface has curb plate (2), the both ends surface of paster base (1) is provided with protection machanism (3), left side curb plate (2) fixed mounting has soot blowing subassembly (4), one side fixed surface of right side curb plate (2) installs collecting box (5).

2. The mounter for an electronic component assembling system according to claim 1, wherein: the outer surface of one side of collecting box (5) is provided with filter (6), the middle part fixed mounting of filter (6) upper end surface has the first in command (7), the both sides outer fixed surface of filter (6) installs slide bar (9), installation cavity (8) have been seted up to one side surface of collecting box (5), spout (10) have been seted up to the both sides of installation cavity (8).

3. The mounter for an electronic component assembling system according to claim 2, wherein: the outer wall of the filter plate (6) is clamped with the inner wall of the mounting cavity (8), and the outer wall of the sliding rod (9) is clamped with the inner wall of the sliding groove (10).

4. The mounter for an electronic component assembling system according to claim 1, wherein: the protection mechanism (3) comprises a first limiting block (11), a second limiting block (12), a buffer spring (13), a movable cavity (14), a buffer plate (15), a buffer cavity (16), a baffle plate (17), a second handle (18), a first magnetic block (19), a movable hole (20) and a second magnetic block (21), the movable hole (20) is formed in two ends of the outer surface of the upper end of the paster base (1), the movable cavity (14) is formed in the lower portion of the movable hole (20), the second magnetic block (21) is fixedly arranged on two sides of the upper end of the movable cavity (14), the second handle (18) is fixedly arranged on the outer surface of the upper end of the baffle plate (17), the buffer cavity (16) is formed in the outer surface of the lower end of the baffle plate (17), the two sides of the buffer cavity (16) of the paster base (1) are fixedly arranged on the first limiting block (11), the buffer spring (13) is fixedly arranged in the buffer cavity (16), the second limiting block (12) is fixedly installed on the outer surface of one end of the buffer spring (13), the buffer plate (15) is fixedly installed on the outer wall of one side of the second limiting block (12), and the first magnetic blocks (19) are fixedly installed on the outer walls of the two sides of the bottom of the baffle plate (17).

5. The mounter for an electronic component assembling system according to claim 4, wherein: the first magnetic block (19) and the second magnetic block (21) are attracted oppositely, and the outer wall of the baffle plate (17) is in sliding connection with the inner wall of the movable hole (20).

6. The mounter for an electronic component assembling system according to claim 4, wherein: the outer surface of one side of the second limiting block (12) is elastically connected with the inner wall of the buffer cavity (16) through a buffer spring (13).