CN216122272U - Packaging power module for switched reluctance motor and control system applying same - Google Patents
Packaging power module for switched reluctance motor and control system applying same Download PDFInfo
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Abstract
The utility model discloses a packaged power module for a switched reluctance motor and a control system applying the same, wherein the packaged power module comprises a packaging body and a plurality of pins extending out of the packaging body, and a power module circuit is packaged in the packaging body; the power module circuit comprises an asymmetric half-bridge power circuit, an upper switching tube grid driving circuit, a lower switching tube grid driving circuit, an input signal control unit, an over-temperature protection circuit, an under-voltage protection circuit, a VREG power circuit, an over-current protection circuit and an operational amplifier circuit, wherein the asymmetric half-bridge power circuit comprises a plurality of power units. The utility model provides a packaging power module for a switched reluctance motor and a control system applying the same, which simplify components and circuits, have simple structure, small energy consumption and occupied space and more stable operation.
Description
Technical Field
The utility model relates to a packaged power module for a switched reluctance motor and a control system applying the same.
Background
At present, a switched reluctance motor is a novel motor appearing in the eighties of the last century, a stator and a rotor of the switched reluctance motor are of a salient pole solid lamination structure, a concentrated winding is wound on the stator, and the rotor is free of structures such as windings and permanent magnet materials, so that the switched reluctance motor has the advantages of simple and firm structure, multiple controllable parameters, flexible control, high efficiency, good starting performance and the like, and is widely applied to the fields of electric vehicle driving systems, household appliances, general industries, servo driving, mining machinery and the like.
The switched reluctance motor generally adopts an asymmetric half-bridge power circuit, and each phase of power circuit consists of two switching tubes for controlling on-off and two freewheeling diodes. The topology control is flexible, each phase can form an independent module to carry out independent control, and the control is allowed to be overlapped among phases, so that the topology control has the advantages of high reliability and good fault tolerance.
However, in the current switched reluctance motor power circuit, as shown in fig. 7, the power module and the control system designed by using discrete devices use a circuit designed by using discrete devices, each component is an individual package structure, and then each component is assembled into a circuit on a PCB. For example, an asymmetric half-bridge circuit needs to be formed by using six individually-packaged switching tubes T1, T2, T3, T4, T5 and T6 and six individually-packaged diodes D5, D7, D12, D16, D17, D19, and the like, when a PCB is designed, the number of wiring lines is large, the wiring path is long, so that the power module of the switched reluctance motor and the components of the whole control system are excessive, the structure is complex, the occupied space is too large, the failure rate is high, and the cost performance is low. Compared with the existing circuit designed by using discrete devices, the circuit designed by using discrete devices needs to use three independently packaged gate driving chips U10, U11 and U12 to form the gate driving circuits of an upper switching tube and a lower switching tube, the gate driving chips U10, U11 and U12 all need power supplies, and when a PCB is designed, the three independently packaged gate driving chips U10, U11 and U12 occupy large space, have long wiring paths and have poor anti-interference performance. In addition, in the existing circuit designed by using discrete devices, the circuit designed by using discrete devices needs to use some components such as a power supply chip U4 and a regulated power supply chip U3 to form a 3.3V power supply required by the MCU control unit. In the existing circuit designed by using the discrete device, the voltage signal of the current sampling resistor needs to be amplified by using components such as an operational amplifier U4 and the like which are packaged separately.
In summary, the switching tube and the freewheeling diode in the current switched reluctance motor power circuit are both discrete components, and the circuit composition and layout are unreasonable, so that the power module of the switched reluctance motor and the components of the whole control system are too many, the structure is complex, the occupied space is too large, the fault rate is high, the energy consumption is high, the cost performance is low, the occupied space is too large, the industrial development of the switched reluctance motor is not facilitated, and compared with other motors with mature technologies, the competitive advantages of the switched reluctance motor are lost.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of overcoming the defects of the prior art, provides the packaging power module for the switched reluctance motor and the control system applying the packaging power module, simplifies components and circuits, and has the advantages of simple structure, small energy consumption and occupied space and more stable operation.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a packaged power module for a switched reluctance motor comprises a packaging body and a plurality of pins extending out of the packaging body, wherein a power module circuit is packaged in the packaging body;
the power module circuit comprises an asymmetric half-bridge power circuit, an upper switching tube grid driving circuit, a lower switching tube grid driving circuit, an input signal control unit, an over-temperature protection circuit, an under-voltage protection circuit, a VREG power circuit, an over-current protection circuit and an operational amplifier circuit, wherein the asymmetric half-bridge power circuit comprises a plurality of power units;
the input end of the input signal control unit is connected with a plurality of signal control pins on the packaging body, the output end of the input signal control unit is connected with the input end of the asymmetric half-bridge power circuit through an upper switching tube gate drive circuit and a lower switching tube gate drive circuit respectively, the output end of the asymmetric half-bridge power circuit is connected with a plurality of motor control pins on the packaging body, and the sampling end of the asymmetric half-bridge power circuit is connected with a plurality of sampling pins on the packaging body;
the output end of the over-temperature protection circuit is connected with the input end of the input signal control unit, and the output end of the over-current protection circuit is connected with the input end of the input signal control unit;
the VD pin on the packaging body is externally connected with a power supply, the VD pin is connected with the anode of a charging diode in the packaging body, the cathode of the charging diode is connected with one end of a charging current-limiting resistor in the packaging body, the other end of the charging current-limiting resistor is respectively connected with an undervoltage protection circuit and a capacitor pin on the packaging body, and the undervoltage protection circuit is connected with an upper switching tube grid drive circuit;
the input end of the VREG power circuit is connected with a VD pin on the packaging body, and the output end of the VREG power circuit is connected with the VREG pin on the packaging body;
the positive input end of the operational amplifier circuit is connected with the positive input pin of the operational amplifier circuit on the packaging body, the negative input end of the operational amplifier circuit is connected with the negative input pin of the operational amplifier circuit on the packaging body, and the output end of the operational amplifier circuit is connected with the output pin of the operational amplifier circuit on the packaging body.
Further, the power unit comprises an upper power switch tube S1, a lower power switch tube S2, an upper power diode D1 and a lower power diode D2, wherein the anode of the upper power diode D1 is connected with the drain of the lower power switch tube S2 to form a winding wire outlet, the cathode of the lower power diode D2 is connected with the source of the upper power switch tube S1 to form a winding wire inlet, the winding wire inlet and the winding wire outlet are respectively the wire inlet and the wire outlet of a phase coil of the switched reluctance motor, the cathode of the upper power diode D1 and the drain of the upper power switch tube S1 are both connected with a power bus VCC, the anode ground wire GND of the lower power diode D2, the source of the lower power switch tube S2 is led out of a sampling pin, and the sampling pin is used for reserving a current sampling resistor.
Further, the number of the operational amplifier circuits is the same as that of the power units, and the operational amplifier circuits are used for amplifying the voltage of the reserved current sampling resistors.
Further, go up switch tube gate drive circuit include with the unanimous upper tube drive module unit of power unit quantity, upper tube drive module unit includes upper tube drive module chip, the interface that is used for the signal that corresponds with the input signal control unit and links to each other, the interface that corresponds with undervoltage protection circuit, resistance Rg1 and resistance Rgs1, resistance Rg1 'S one end links to each other with upper tube drive module chip, resistance Rg 1' S the other end links to each other with the last power switch pipe S1 'S of the power unit that corresponds grid, resistance Rgs 1' S one end links to each other with upper tube drive module chip, resistance Rgs1 'S the other end links to each other with the last power switch pipe S1' S of the power unit that corresponds source electrode.
Further, the lower switch tube gate drive circuit comprises a lower tube drive module unit with the same number of the power units, the lower tube drive module unit is composed of a lower tube drive module chip, an interface, a V + interface, a resistor Rg2 and a resistor Rgs2, the interface is used for signal connection and corresponds to the input signal control unit, one end of the resistor Rg2 is connected with the lower tube drive module chip, the other end of the resistor Rg2 is connected with the gate of the lower power switch tube S2 of the corresponding power unit, one end of the resistor Rgs2 is connected with the lower tube drive module chip, the other end of the resistor Rgs2 is connected with the source of the lower power switch tube S2 of the corresponding power unit, and the V + interface is connected with the VD pin on the packaging body.
Furthermore, the power module circuit also comprises a VREG power supply circuit, the input end of the VREG power supply circuit is connected with the VD pin on the packaging body, the output end of the VREG power supply circuit is connected with the VREG pin on the packaging body, and the VREG power supply circuit is used for converting the voltage input by the VD pin on the packaging body into 5V or 3.3V voltage.
A control system of a packaging power module for an applied switch reluctance motor comprises an MCU control unit, a three-phase switch reluctance motor, a bootstrap capacitor, a current sampling resistor, a differential resistor and the packaging power module for the switch reluctance motor, wherein the input end of an input signal control unit is connected with an I/O port of the MCU control unit through a plurality of signal control pins on a packaging body, a VREG pin on the packaging body is connected with a power supply port VDD of the MCU control unit, a three-phase coil of the three-phase switch reluctance motor is respectively connected with the output end of an asymmetric half-bridge power circuit through a plurality of motor control pins on the packaging body, one end of the bootstrap capacitor is connected with the motor control pin, the other end of the bootstrap capacitor is connected with a capacitor pin on the packaging body, one end of the current sampling resistor is connected with the sampling pin on the packaging body, the other end of the current sampling resistor is connected with a ground wire GND, the positive input end and the negative input end of the operational amplifier circuit are connected with an I/O port of the MCU control unit through a differential resistor, and the differential resistor and the operational amplifier circuit form a differential amplification circuit.
Further, the current sampling resistor comprises a current sampling resistor RS1, a current sampling resistor RS2 and a current sampling resistor RS3, one end of the current sampling resistor RS1 Is connected with a sampling pin Is1 on the package body, the other end of the current sampling resistor RS1 Is connected with a ground wire GND, one end of the current sampling resistor RS2 Is connected with a sampling pin Is2 on the package body, the other end of the current sampling resistor RS2 Is connected with the ground wire GND, one end of the current sampling resistor RS3 Is connected with a sampling pin Is3 on the package body, and the other end of the current sampling resistor RS3 Is connected with the ground wire GND.
Further, the bootstrap capacitor includes bootstrap capacitor CB1, bootstrap capacitor CB2 and bootstrap capacitor CB3, the one end of bootstrap capacitor CB1 links to each other with motor control pin L1+ on the encapsulation body, bootstrap capacitor CB 1's the other end links to each other with the capacitance pin VB1 on the encapsulation body, bootstrap capacitor CB 2's one end links to each other with motor control pin L2+ on the encapsulation body, bootstrap capacitor CB 2's the other end links to each other with capacitance pin VB2 on the encapsulation body, bootstrap capacitor CB 3's one end links to each other with motor control pin L3+ on the encapsulation body, bootstrap capacitor CB 3's the other end links to each other with capacitance pin VB3 on the encapsulation body.
Further, the operational amplifier circuit includes a first operational amplifier circuit AM1, a second operational amplifier circuit AM2, and a third operational amplifier circuit AM 3.
Further, the first operational amplifier circuit AM1, the differential resistor R11, the differential resistor R12, the differential resistor R13, the differential resistor R14 and the differential resistor R15 form a first differential amplifier circuit, one end of the differential resistor R11 Is connected to a negative input pin AMP 1-of the first operational amplifier circuit on the package body, the other end of the differential resistor R11 Is connected to a ground GND, one end of the differential resistor R12 Is connected to an output pin AMP1 of the first operational amplifier circuit on the package body, the other end of the differential resistor R12 Is connected to a negative input pin AMP 1-of the first operational amplifier circuit on the package body, one end of the differential resistor R13 Is connected to a positive input pin AMP1+ of the first operational amplifier circuit on the package body, the other end of the differential resistor R13 Is connected to a sampling pin Is1 on the package body, and one end of the differential resistor R14 Is connected to a positive input pin AMP1 of the first operational amplifier circuit on the package body The other end of the differential resistor R14 is connected with a ground line GND, and the seventh I/O port of the MCU control unit U1 is connected with the differential resistor R15 in series and then connected with an output pin AMP1 of a first operational amplifier circuit on the package body.
Further, the second operational amplifier circuit AM2, the differential resistor R21, the differential resistor R22, the differential resistor R23, the differential resistor R24 and the differential resistor R25 form a second differential amplifier circuit, one end of the differential resistor R21 Is connected to a negative input pin AMP 2-of the second operational amplifier circuit on the package body, the other end of the differential resistor R21 Is connected to the ground GND, one end of the differential resistor R22 Is connected to an output pin AMP2 of the second operational amplifier circuit on the package body, the other end of the differential resistor R22 Is connected to a negative input pin AMP 2-of the second operational amplifier circuit on the package body, one end of the differential resistor R23 Is connected to a positive input pin AMP2+ of the second operational amplifier circuit on the package body, the other end of the differential resistor R23 Is connected to a sampling pin Is2 on the package body, and one end of the differential resistor R24 Is connected to a positive input pin AMP2 of the second operational amplifier circuit on the package body The other end of the differential resistor R24 is connected with a ground line GND, and the eighth I/O port of the MCU control unit U1 is connected with the differential resistor R25 in series and then connected with an output pin AMP2 of a second operational amplifier circuit on the package body.
Further, the third operational amplifier circuit AM3, the differential resistor R31, the differential resistor R32, the differential resistor R33, the differential resistor R34 and the differential resistor R35 form a third differential amplifier circuit, one end of the differential resistor R31 Is connected to a negative input pin AMP 3-of the third operational amplifier circuit on the package body, the other end of the differential resistor R31 Is connected to the ground GND, one end of the differential resistor R32 Is connected to an output pin AMP3 of the third operational amplifier circuit on the package body, the other end of the differential resistor R32 Is connected to a negative input pin AMP 3-of the third operational amplifier circuit on the package body, one end of the differential resistor R33 Is connected to a positive input pin AMP2+ of the third operational amplifier circuit on the package body, the other end of the differential resistor R33 Is connected to a sampling pin Is2 on the package body, and one end of the differential resistor R34 Is connected to a positive input pin AMP3 of the third operational amplifier circuit on the package body The other end of the differential resistor R34 is connected with a ground line GND, and the ninth I/O port of the MCU control unit U1 is connected with the differential resistor R35 in series and then connected with an output pin AMP3 of a third operational amplifier circuit on the package body.
Further, a first I/O port of the MCU control unit is connected to a signal control pin Hin1 on the package body, and the signal control pin Hin1 is connected to an input terminal of the input signal control unit;
a second I/O port of the MCU control unit is connected with a signal control pin Lin1 on the packaging body, and the signal control pin Lin1 is connected with the input end of the input signal control unit;
the third I/O port of the MCU control unit is connected with a signal control pin Hin2 on the packaging body, and the signal control pin Hin2 is connected with the input end of the input signal control unit;
a fourth I/O port of the MCU control unit is connected with a signal control pin Lin2 on the packaging body, and the signal control pin Lin2 is connected with the input end of the input signal control unit;
a fifth I/O port of the MCU control unit is connected with a signal control pin Hin3 on the packaging body, and the signal control pin Hin3 is connected with the input end of the input signal control unit;
and a sixth I/O port of the MCU control unit is connected with a signal control pin Lin3 on the packaging body, and the signal control pin Lin3 is connected with the input end of the input signal control unit.
Furthermore, the three-phase switched reluctance motor comprises a first phase coil, a second phase coil and a third phase coil, wherein the wire inlet end and the wire outlet end of the first phase coil of the three-phase switched reluctance motor are respectively connected with a motor control pin L1+ and a motor control pin L1-on the packaging body, the wire inlet end and the wire outlet end of the second phase coil are respectively connected with a motor control pin L2+ and a motor control pin L2-on the packaging body, and the wire inlet end and the wire outlet end of the third phase coil are respectively connected with a motor control pin L3+ and a motor control pin L3-on the packaging body.
By adopting the technical scheme, the utility model has the following beneficial effects:
1. the packaged power module integrates an asymmetric half-bridge power circuit, all components in the circuit are connected in the packaged module through bonding wires with small volume, and then the whole power module is packaged, so that the area of a PCB (printed circuit board) can be obviously reduced, wiring is simplified, the period for designing the PCB is short, the production cost of a switched reluctance motor controller is reduced, the occupied volume of the switched reluctance motor controller is greatly reduced, the structural design of a radiator is simple, and the problems of low reliability and the like caused by excessive discrete elements are solved.
2. The packaging power module integrates the upper switching tube grid drive circuit and the lower switching tube grid drive circuit, the upper switching tube grid drive circuit driving the upper power switching tube adopts a bootstrap power supply mode, the whole integrated power module only needs one driving power supply to supply power, and only needs to supply power to a pin VD of the packaging power module, so that the driving controller is simplified, the number of components is reduced, and the reliability and the anti-interference capability of the controller can be improved.
3. The encapsulated power module of the utility model is specially reserved with a low-cost resistance current sampling mode, can be flexibly designed into a single-phase, a plurality of-phase current sampling or bus current resistance sampling mode in a peripheral circuit, and can also directly short-circuit the source electrode of the lower switch tube and the ground wire of the power supply through the external wire.
4. The packaging power module integrates a VREG power circuit, a power input port VDD of the MCU control unit is directly connected with the packaging power module to meet the power use requirement of the MCU control unit, an LDO (Low dropout regulator) power circuit for supplying power to the MCU control unit does not need to be additionally designed, and the packaging power module integrated with the VREG power circuit can also supply power to a position sensor of a three-phase switch reluctance motor through a pin VREG. The design simplifies the circuit, reduces the number of components and lowers the system cost of the switched reluctance motor controller.
5. The packaged power module integrates a plurality of operational amplifier circuits, can meet the requirements only by external resistors and capacitors, simplifies the circuit, reduces the number of components and lowers the system cost of the switched reluctance motor controller.
6. Under the working conditions of overload operation or locked-rotor operation of a motor and the like, the temperature of the packaged power module exceeds a specified value, the temperature protection circuit integrated in the packaged power module cuts off a coil power supply of the motor, so that the temperature of the motor and the temperature of the packaged power module are not increased any more, the reliability and the safety of the packaged power module are ensured, and the failure rate is reduced.
7. The utility model effectively improves the batch production efficiency of the switched reluctance motor controller, flexibly forms the switched reluctance motor control system with different phase numbers, voltages and powers, shortens the research and development period of new products, reduces the research and development cost and obviously improves the market competitive advantage of the SR motor.
Drawings
Fig. 1 is an integrated circuit diagram of a packaged power module for a switched reluctance motor according to the present invention;
FIG. 2 is a schematic circuit diagram of a power cell of the present invention;
FIG. 3 is a schematic circuit diagram of an asymmetric half-bridge power circuit of the present invention;
FIG. 4 is a schematic diagram of an upper tube driving module unit according to the present invention;
FIG. 5 is a schematic view of a lower tube driving module unit according to the present invention;
FIG. 6 is a schematic diagram of a control system for a packaged power module for a switched reluctance motor according to the present invention;
fig. 7 is a circuit diagram of a conventional control system using a discrete device design.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the utility model briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
Example one
As shown in fig. 1 to 6, the present embodiment provides a packaged power module for a switched reluctance motor, which includes a package body and a plurality of pins extending from the package body, wherein a power module circuit is packaged in the package body. The power module circuit of the embodiment comprises an asymmetric half-bridge power circuit, an upper switching tube grid driving circuit, a lower switching tube grid driving circuit, an input signal control unit, an over-temperature protection circuit, an under-voltage protection circuit, a VREG power circuit, an over-current protection circuit and an operational amplifier circuit, wherein the asymmetric half-bridge power circuit comprises a plurality of power units.
As shown in fig. 2, in the present embodiment, each power unit includes: an upper power switch tube S1, a lower power switch tube S2, an upper power diode D1 and a lower power diode D2, wherein the anode of the upper power diode D1 is connected with the drain of the lower power switch tube S2 to form a winding wire outlet end X1-, the cathode of the lower power diode D2 is connected with the source of the upper power switch tube S1 to form a winding wire inlet end X1+, the winding wire inlet end X1+ and the winding wire outlet end X1-are respectively the wire inlet end and the wire outlet end of one-phase coil of the switched reluctance motor, the winding wire outlet end X1-is connected with the L1-pin on the package body, the winding wire inlet end X1+ is connected with the L1+ pin on the package body, and so on, the winding wire outlet end XN-is connected with the LN-pin on the package body, and the winding wire inlet end XN + is connected with the LN + pin on the package body. The cathode of the upper power diode D1 and the drain of the upper power switch tube S1 are both connected with a power bus VCC, the anode of the lower power diode D2 is connected with a ground wire GND, the source of the lower power switch tube S2 is led out of a sampling pin, and the sampling pin is used for reserving a current sampling resistor and is not connected with the ground wire GND, so that a current sampling form can be flexibly designed. As shown in fig. 3, a plurality of the power units may be combined to form an upper switch tube common power source VCC bus, a lower diode common ground GND, a lower switch tube current sampling and power source ground separated multiphase switch reluctance motor asymmetric half-bridge circuit.
As shown in fig. 1 to 5, an input end of the input signal control unit of this embodiment is connected to a plurality of signal control pins on the package body, an output end of the input signal control unit is connected to an input end of the asymmetric half-bridge power circuit through the upper switching tube gate driving circuit and the lower switching tube gate driving circuit, an output end of the asymmetric half-bridge power circuit is connected to a plurality of motor control pins on the package body, and a sampling end of the asymmetric half-bridge power circuit is connected to a plurality of sampling pins on the package body. When the upper power switch tube S1 and the lower power switch tube S2 are turned off, the current of the coil freewheels through two forward conducting power diodes D1 and D2, and the energy of the coil is fed back to the power supply VCC. As shown in fig. 6, the MCU control unit U1 may calculate the current of the motor coil by measuring the voltages of the sampling pins Is1 to IsN through an operational amplifier circuit. The MCU control unit can calculate the currents of the motor coils L1, L2 and L3 by measuring the voltages of the pins Is1, Is2 and Is 3.
As shown in fig. 1, an output end of the over-temperature protection circuit of this embodiment is connected to an input end of the input signal control unit, the over-temperature protection circuit includes a temperature sensor (not shown) packaged inside the power module, when detecting that the temperature of the packaged power module is higher than a predetermined limit value, the over-temperature protection circuit sends an over-temperature signal to the input signal control unit, the input signal control unit stops the motor from operating according to the over-temperature signal, and when detecting that the temperature of the packaged power module is lower than the predetermined limit value, the over-temperature protection circuit does not send the over-temperature signal to the input signal control unit.
As shown in fig. 1, an output terminal of the overcurrent protection circuit of this embodiment is connected to an input terminal of the input signal control unit, the overcurrent protection circuit monitors a current of the bus power VCC, the overcurrent protection circuit sends an overcurrent signal to the input signal control unit when detecting that the current of the bus power VCC is higher than a predetermined limit value, the input signal control unit stops the motor according to the overcurrent signal, and when the overcurrent protection circuit detects the current of the bus power VCC at the predetermined limit value, the overcurrent protection circuit does not send an overtemperature signal to the input signal control unit.
As shown in fig. 1, the VD pin on the package body is externally connected with a +15V power supply, the VD pin is connected with the anode of the charging diode inside the package body, the cathode of the charging diode is connected with one end of the charging current limiting resistor inside the package body, the other end of the charging current limiting resistor is connected with the undervoltage protection circuit and the capacitor pin on the package body, and the undervoltage protection circuit is connected with the upper switching tube gate drive circuit. The motor is during operation under different operating modes, for example power switch tube is at high duty cycle during operation, probably causes bootstrap capacitor's the not enough of charging, leads to the drive voltage who goes up switch tube gate drive circuit drive switching tube not enough, and the undervoltage protection circuit who links to each other with last switch tube gate drive circuit can effectually prevent to go up the switch tube because the drive voltage is not enough the inefficacy that arouses.
As shown in fig. 1, the input end of the VREG power supply circuit is connected to the VD pin on the package body, the output end of the VREG power supply circuit is connected to the VREG pin on the package body, the VREG power supply circuit is configured to convert the voltage of the VD pin of the input power supply into a voltage of 5V or 3.3V, and the converted voltage is connected to the VREG pin.
As shown in fig. 1, the number of operational amplifier circuits for amplifying the voltage of the reserved current sampling resistor is the same as the number of power cells. The positive input end of the operational amplifier circuit is connected with the positive input pin of the operational amplifier circuit on the packaging body, the negative input end of the operational amplifier circuit is connected with the negative input pin of the operational amplifier circuit on the packaging body, and the output end of the operational amplifier circuit is connected with the output pin of the operational amplifier circuit on the packaging body. And amplifying the voltage of the current sampling resistor connected to the Isa pin so that the MCU control unit U1 can measure the coil current to control the motor.
As shown in fig. 4, the upper switch gate driving circuit of the present embodiment includes the number of upper tube driving module units corresponding to the number of power cells, and each upper tube driving module unit drives the upper power switch S1 of the corresponding power cell. The upper tube driving module unit comprises an upper tube driving module chip, an interface which corresponds to the input signal control unit and is used for signal connection, an interface which corresponds to the under-voltage protection circuit, a resistor Rg1 and a resistor Rgs1, one end of the resistor Rg1 is connected with the upper tube driving module chip, the other end of the resistor Rg1 is connected with the grid electrode of the upper power switch tube S1 of the corresponding power unit, one end of the resistor Rgs1 is connected with the upper tube driving module chip, and the other end of the resistor Rgs1 is connected with the source electrode of the upper power switch tube S1 of the corresponding power unit. The upper switching tube gate driving circuit of the embodiment is used for driving the upper power switching tube S1 of the asymmetric half-bridge power circuit to be switched on and off, and the upper switching tube gate driving circuit adopts a bootstrap driving mode and needs to be externally connected with a bootstrap capacitor. Due to the special control time sequence of the switched reluctance motor, in an asymmetric half-bridge power circuit, an upper power switch tube and a lower power switch tube which are in the same phase are simultaneously switched on and simultaneously switched off according to position signals, and in order to effectively switch on the bootstrap power supply of the upper power switch tube S1, a control method of switching on the lower power switch tube S2 in advance to charge a bootstrap capacitor of the upper power switch tube S1 is adopted.
As shown in fig. 5, the lower switch gate driving circuit of this embodiment is used to drive the lower power switch tube S2 of the asymmetric half-bridge power circuit to be turned on and off, and includes at least one lower tube driving module unit, where each lower tube driving module unit drives the lower power switch tube S2 of a corresponding power unit. The lower tube driving module unit comprises a lower tube driving module chip, an interface which is corresponding to the input signal control unit and used for signal connection, a V + interface, a resistor Rg2 and a resistor Rgs2, one end of the resistor Rg2 is connected with the lower tube driving module chip, the other end of the resistor Rg2 is connected with the grid electrode of the lower power switch tube S2 of the corresponding power unit, one end of the resistor Rgs2 is connected with the lower tube driving module chip, the other end of the resistor Rgs2 is connected with the source electrode of the lower power switch tube S2 of the corresponding power unit, and the V + interface is connected with a VD pin on the packaging body.
Example two
As shown in fig. 6, this embodiment takes a three-phase switched reluctance motor as an example, and provides a control system applying the packaged power module for the switched reluctance motor as an example, which includes an MCU control unit U1, a packaged power module U2 for the switched reluctance motor, a three-phase switched reluctance motor, a bootstrap capacitor, a current sampling resistor, and a differential resistor, wherein an input terminal of an input signal control unit is connected to an I/O port of the MCU control unit U1 through a plurality of signal control pins on a package body, a VREG pin on the package body is connected to a power port VDD of the MCU control unit U1, three-phase coils of the three-phase switched reluctance motor are respectively connected to an output terminal of an asymmetric half-bridge power circuit through a plurality of motor control pins on the package body, one end of the bootstrap capacitor is connected to the motor control pin, and the other end of the bootstrap capacitor is connected to a capacitor pin on the package body, one end of the current sampling resistor is connected with a sampling pin on the packaging body, the other end of the current sampling resistor is connected with a ground wire GND, the positive input end and the negative input end of the operational amplifier circuit are connected with an I/O port of the MCU control unit U1 through a differential resistor, and the differential resistor and the operational amplifier circuit form a differential amplification circuit.
As shown in fig. 6, the current sampling resistor of this embodiment includes a current sampling resistor RS1, a current sampling resistor RS2, and a current sampling resistor RS3, one end of the current sampling resistor RS1 Is connected to a sampling pin Is1 on the package body, the other end of the current sampling resistor RS1 Is connected to a ground GND, one end of the current sampling resistor RS2 Is connected to a sampling pin Is2 on the package body, the other end of the current sampling resistor RS2 Is connected to the ground GND, one end of the current sampling resistor RS3 Is connected to a sampling pin Is3 on the package body, and the other end of the current sampling resistor RS3 Is connected to the ground GND.
As shown in fig. 6, the bootstrap capacitor of this embodiment includes bootstrap capacitor CB1, bootstrap capacitor CB2 and bootstrap capacitor CB3, one end of bootstrap capacitor CB1 is connected to a motor control pin L1+ on the package body, the other end of bootstrap capacitor CB1 is connected to a capacitor pin VB1 on the package body, one end of bootstrap capacitor CB2 is connected to a motor control pin L2+ on the package body, the other end of bootstrap capacitor CB2 is connected to a capacitor pin VB2 on the package body, one end of bootstrap capacitor CB3 is connected to a motor control pin L3+ on the package body, and the other end of bootstrap capacitor CB3 is connected to a capacitor pin VB3 on the package body.
As shown in fig. 6, the operational amplifier circuit of the present embodiment includes a first operational amplifier circuit AM1, a second operational amplifier circuit AM2, and a third operational amplifier circuit AM 3.
The first operational amplifier circuit AM1, the differential resistor R11, the differential resistor R12, the differential resistor R13, the differential resistor R14 and the differential resistor R15 form a first differential amplifier circuit, one end of the differential resistor R11 Is connected with a negative input pin AMP 1-of the first operational amplifier circuit on the package body, the other end of the differential resistor R11 Is connected with a ground GND, one end of the differential resistor R12 Is connected with an output pin AMP1 of the first operational amplifier circuit on the package body, the other end of the differential resistor R12 Is connected with a negative input pin AMP 1-of the first operational amplifier circuit on the package body, one end of the differential resistor R13 Is connected with a positive input pin AMP1+ of the first operational amplifier circuit on the package body, the other end of the differential resistor R13 Is connected with a sampling pin IS1 on the package body, one end of the differential resistor R14 Is connected with a positive input pin AMP1+ of the first operational amplifier circuit on the package body, the other end of the differential resistor R14 is connected with the ground GND, and the seventh I/O port of the MCU control unit U1 is connected with the differential resistor R15 in series and then connected with the output pin AMP1 of the first operational amplifier circuit on the package body.
The second operational amplifier circuit AM2, the differential resistor R21, the differential resistor R22, the differential resistor R23, the differential resistor R24 and the differential resistor R25 form a second differential amplifier circuit, one end of the differential resistor R21 Is connected with a negative input pin AMP 2-of the second operational amplifier circuit on the package body, the other end of the differential resistor R21 Is connected with a ground GND, one end of the differential resistor R22 Is connected with an output pin AMP2 of the second operational amplifier circuit on the package body, the other end of the differential resistor R22 Is connected with a negative input pin AMP 2-of the second operational amplifier circuit on the package body, one end of the differential resistor R23 Is connected with a positive input pin AMP2+ of the second operational amplifier circuit on the package body, the other end of the differential resistor R23 Is connected with a sampling pin IS2 on the package body, one end of the differential resistor R24 Is connected with a positive input pin AMP2+ of the second operational amplifier circuit on the package body, the other end of the differential resistor R24 is connected with the ground GND, and the eighth I/O port of the MCU control unit U1 is connected with the differential resistor R25 in series and then connected with the output pin AMP2 of the second operational amplifier circuit on the package body.
The third operational amplifier circuit AM3, the differential resistor R31, the differential resistor R32, the differential resistor R33, the differential resistor R34 and the differential resistor R35 form a third differential amplifier circuit, one end of the differential resistor R31 Is connected with a negative input pin AMP 3-of the third operational amplifier circuit on the package body, the other end of the differential resistor R31 Is connected with a ground GND, one end of the differential resistor R32 Is connected with an output pin AMP3 of the third operational amplifier circuit on the package body, the other end of the differential resistor R32 Is connected with a negative input pin AMP 3-of the third operational amplifier circuit on the package body, one end of the differential resistor R33 Is connected with a positive input pin AMP2+ of the third operational amplifier circuit on the package body, the other end of the differential resistor R33 Is connected with a sampling pin IS2 on the package body, one end of the differential resistor R34 Is connected with a positive input pin AMP3+ of the third operational amplifier circuit on the package body, the other end of the differential resistor R34 is connected with the ground GND, and the ninth I/O port of the MCU control unit U1 is connected with the differential resistor R35 in series and then connected with the output pin AMP3 of the third operational amplifier circuit on the package body.
As shown in fig. 6, in this embodiment, the first I/O port of the MCU control unit is connected to a signal control pin Hin1 on the package body, and the signal control pin Hin1 is connected to the input terminal of the input signal control unit;
a second I/O port of the MCU control unit is connected with a signal control pin Lin1 on the packaging body, and the signal control pin Lin1 is connected with the input end of the input signal control unit;
a third I/O port of the MCU control unit is connected with a signal control pin Hin2 on the packaging body, and a signal control pin Hin2 is connected with the input end of the input signal control unit;
a fourth I/O port of the MCU control unit is connected with a signal control pin Lin2 on the packaging body, and the signal control pin Lin2 is connected with the input end of the input signal control unit;
a fifth I/O port of the MCU control unit is connected with a signal control pin Hin3 on the packaging body, and a signal control pin Hin3 is connected with the input end of the input signal control unit;
and a sixth I/O port of the MCU control unit is connected with a signal control pin Lin3 on the packaging body, and the signal control pin Lin3 is connected with the input end of the input signal control unit.
As shown in fig. 6, the three-phase switched reluctance motor of this embodiment includes a first phase coil, a second phase coil and a third phase coil, where a wire inlet end and a wire outlet end of the first phase coil of the three-phase switched reluctance motor are respectively connected to a motor control pin L1+ and a motor control pin L1-on the package body, a wire inlet end and a wire outlet end of the second phase coil are respectively connected to a motor control pin L2+ and a motor control pin L2-on the package body, and a wire inlet end and a wire outlet end of the third phase coil are respectively connected to a motor control pin L3+ and a motor control pin L3-on the package body.
The working principle of the utility model is as follows:
the MCU control unit U1 calculates and obtains driving signals of each switching tube according to a given value of the motor rotating speed, detected rotor position signals and speed and motor coil current values, the MCU control unit U1 transmits the driving signals of each power switching tube from a first I/O port to a sixth I/O port to corresponding pins Hin1, Lin1, Hin2, Lin2, Hin3 and Lin3 of a packaged power module, an input signal control unit of the packaged power module receives the driving signals through the pins Hin1, Lin1, Hin2, Lin2, Hin3 and Lin3 and then sends the driving signals to an upper switching tube gate driving circuit and a lower switching tube gate driving circuit, the upper switching tube gate driving circuit enables a corresponding upper switching tube S1 in the asymmetric half-bridge power circuit to be connected or disconnected according to the received signals, the lower switching tube gate driving circuit enables a corresponding lower power switching tube S2 in the asymmetric half-bridge power circuit to be connected or disconnected according to the received signals, the coils of the motor generate a rotating magnetic field for driving the rotor to rotate under the control of the connection or disconnection of the corresponding upper power switch tube S1 and the corresponding lower power switch S2, so that the rotor rotates according to the specified position and rotating speed requirements. The motor is during operation under different operating modes, for example power switch tube is at high duty cycle during operation, probably causes bootstrap capacitor' S the not enough of charging, leads to the drive voltage who goes up switch tube gate drive circuit drive switching tube not enough, and the undervoltage protection circuit who links to each other with last switch tube gate drive circuit can effectually prevent to go up power switch tube S1 because the inefficacy that drive voltage is not enough arouses. When the over-temperature protection circuit detects that the temperature of the packaged power module is higher than the specified limit value, the over-temperature protection circuit sends an over-temperature signal to the input signal control unit, the input signal control unit stops the motor from working according to the over-temperature signal, and when the over-temperature protection circuit detects that the temperature of the packaged power module is lower than the specified limit value, the over-temperature protection circuit does not send the over-temperature signal to the input signal control unit. The upper switching tube gate drive circuit is used for driving an upper power switching tube S1 of an asymmetric half-bridge power circuit to be switched on and off, the upper switching tube gate drive circuit adopts a bootstrap drive mode and needs to be externally connected with bootstrap capacitors CB1, CB2 and CB3, and due to the special control time sequence of the switched reluctance motor, in the asymmetric half-bridge power circuit, an upper power switching tube and a lower power switching tube which are in the same phase are simultaneously switched on and simultaneously switched off according to position signals, and in order to enable the upper power switching tube S1 to be effectively switched on for bootstrap power supply, a control method for charging the bootstrap capacitor of the upper power switching tube S1 by switching on the lower power switching tube S2 in advance is adopted.
The technical problems, technical solutions and advantages of the present invention have been described in detail with reference to the above embodiments, and it should be understood that the above embodiments are merely exemplary and not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (17)
1. The utility model provides a switch reluctance motor is with encapsulation power module which characterized in that: the power module comprises a packaging body and a plurality of pins extending out of the packaging body, wherein a power module circuit is packaged in the packaging body;
the power module circuit comprises an asymmetric half-bridge power circuit, an upper switching tube grid driving circuit, a lower switching tube grid driving circuit, an input signal control unit and an over-temperature protection circuit, wherein the asymmetric half-bridge power circuit comprises at least one power unit;
the input end of the input signal control unit is connected with the plurality of signal control pins on the packaging body, the output end of the input signal control unit is connected with the input end of the asymmetric half-bridge power circuit through the upper switch tube grid drive circuit and the lower switch tube grid drive circuit respectively, the output end of the asymmetric half-bridge power circuit is connected with the plurality of motor control pins on the packaging body, the sampling end of the asymmetric half-bridge power circuit is connected with the plurality of sampling pins on the packaging body, and the output end of the over-temperature protection circuit is connected with the input end of the input signal control unit.
2. The packaged power module for the switched reluctance motor according to claim 1, wherein: the power unit comprises an upper power switch tube S1, a lower power switch tube S2, an upper power diode D1 and a lower power diode D2, wherein the anode of the upper power diode D1 is connected with the drain of the lower power switch tube S2 to form a winding wire outlet, the cathode of the lower power diode D2 is connected with the source of the upper power switch tube S1 to form a winding wire inlet end, the winding wire inlet end and the winding wire outlet end are respectively the wire inlet end and the wire outlet end of a phase coil of the switched reluctance motor, the cathode of the upper power diode D1 and the drain of the upper power switch tube S1 are both connected with a power bus VCC, the anode grounding wire GND of the lower power diode D2, and a sampling pin is led out from the source of the lower power switch tube S2.
3. The packaged power module for the switched reluctance motor according to claim 2, wherein: the power module circuit further comprises operational amplifier circuits, the number of the operational amplifier circuits is consistent with that of the power units, and the operational amplifier circuits are used for amplifying the voltage of the reserved current sampling resistors.
4. The packaged power module for the switched reluctance motor according to claim 1, wherein: go up switch tube gate drive circuit include with the unanimous top tube drive module unit of power unit quantity, top tube drive module unit includes top tube drive module chip, the interface that is used for the signal that corresponds with input signal control unit and links to each other, the interface that corresponds with undervoltage protection circuit, resistance Rg1 and resistance Rgs1, resistance Rg1 'S one end links to each other with top tube drive module chip, resistance Rg 1' S the other end links to each other with the last power switch pipe S1 'S of the power unit who corresponds grid, resistance Rgs 1' S one end links to each other with top tube drive module chip, resistance Rgs1 'S the other end links to each other with the last power switch pipe S1' S of the power unit that corresponds source electrode.
5. The packaged power module for the switched reluctance motor according to claim 1, wherein: lower switch tube gate drive circuit include with the unanimous lower tube drive module unit of power unit quantity, lower tube drive module unit comprises lower tube drive module chip, the interface that is used for the signal to link to each other that corresponds with the input signal control unit, V + interface, resistance Rg2, resistance Rgs2, resistance Rg2 'S one end links to each other with lower tube drive module chip, resistance Rg 2' S the other end links to each other with the lower power switch tube S2 'S of power unit that corresponds grid, resistance Rgs 2' S one end links to each other with lower tube drive module chip, resistance Rgs2 'S the other end links to each other with the lower power switch tube S2' S of power unit that corresponds source electrode, the V + interface links to each other with the VD pin on the encapsulation body.
6. The packaged power module for the switched reluctance motor according to claim 1, wherein: the power module circuit further comprises a VREG power circuit, the input end of the VREG power circuit is connected with the VD pin on the packaging body, the output end of the VREG power circuit is connected with the VREG pin on the packaging body, and the VREG power circuit is used for converting the voltage input by the VD pin on the packaging body into 5V or 3.3V voltage.
7. The packaged power module for the switched reluctance motor according to claim 1, wherein: the power module circuit still includes undervoltage protection circuit, the external power supply of VD pin on the encapsulation body, the VD pin links to each other with the inside positive pole of the diode that charges of encapsulation body, the negative pole of the diode that charges links to each other with the inside one end of the current-limiting resistor that charges of encapsulation body, the other end of the current-limiting resistor that charges links to each other with undervoltage protection circuit and the electric capacity pin on the encapsulation body respectively, undervoltage protection circuit links to each other with last switch tube grid drive circuit.
8. The packaged power module for the switched reluctance motor according to claim 1, wherein: the power module circuit further comprises an overcurrent protection circuit, and the output end of the overcurrent protection circuit is connected with the input end of the input signal control unit.
9. A control system, characterized by: the power module comprises an MCU control unit, a three-phase switch reluctance motor, a bootstrap capacitor, a current sampling resistor, a differential resistor and the package power module for the switch reluctance motor as claimed in any one of claims 1 to 8, wherein the input end of the input signal control unit is connected with the I/O port of the MCU control unit through a plurality of signal control pins on a package body, the VREG pin on the package body is connected with the power port VDD of the MCU control unit, the three-phase coil of the three-phase switch reluctance motor is connected with the output end of an asymmetric half-bridge power circuit through a plurality of motor control pins on the package body, one end of the bootstrap capacitor is connected with the motor control pin, the other end of the bootstrap capacitor is connected with a capacitor pin on the package body, one end of the current sampling resistor is connected with the sampling pin on the package body, the other end of the current sampling resistor is connected with the ground wire GND, the switched reluctance motor is connected with an I/O port of the MCU control unit through a differential resistor, and the differential resistor and the operational amplifier circuit form a differential amplification circuit.
10. The control system of claim 9, wherein: the current sampling resistor comprises a current sampling resistor RS1, a current sampling resistor RS2 and a current sampling resistor RS3, one end of the current sampling resistor RS1 Is connected with a sampling pin Is1 on the packaging body, the other end of the current sampling resistor RS1 Is connected with a ground wire GND, one end of the current sampling resistor RS2 Is connected with a sampling pin Is2 on the packaging body, the other end of the current sampling resistor RS2 Is connected with the ground wire GND, one end of the current sampling resistor RS3 Is connected with a sampling pin Is3 on the packaging body, and the other end of the current sampling resistor RS3 Is connected with the ground wire GND.
11. The control system of claim 9, wherein: the bootstrap capacitor comprises a bootstrap capacitor CB1, a bootstrap capacitor CB2 and a bootstrap capacitor CB3, one end of the bootstrap capacitor CB1 is connected with a motor control pin L1+ on the packaging body, the other end of the bootstrap capacitor CB1 is connected with a capacitor pin VB1 on the packaging body, one end of the bootstrap capacitor CB2 is connected with the motor control pin L2+ on the packaging body, the other end of the bootstrap capacitor CB2 is connected with the capacitor pin VB2 on the packaging body, one end of the bootstrap capacitor CB3 is connected with the motor control pin L3+ on the packaging body, and the other end of the bootstrap capacitor CB3 is connected with the capacitor pin VB3 on the packaging body.
12. The control system of claim 9, wherein: the operational amplifier circuit includes a first operational amplifier circuit AM1, a second operational amplifier circuit AM2, and a third operational amplifier circuit AM 3.
13. The control system of claim 12, wherein: the first operational amplifier circuit AM1, the differential resistor R11, the differential resistor R12, the differential resistor R13, the differential resistor R14 and the differential resistor R15 form a first differential amplifying circuit, one end of the differential resistor R11 Is connected with a negative input pin AMP 1-of the first operational amplifier circuit on the package body, the other end of the differential resistor R11 Is connected with a ground GND, one end of the differential resistor R12 Is connected with an output pin AMP1 of the first operational amplifier circuit on the package body, the other end of the differential resistor R12 Is connected with a negative input pin AMP 1-of the first operational amplifier circuit on the package body, one end of the differential resistor R13 Is connected with a positive input pin AMP1+ of the first operational amplifier circuit on the package body, the other end of the differential resistor R13 Is connected with a sampling pin IS1 on the package body, one end of the differential resistor R14 Is connected with a positive input pin 1+ of the first operational amplifier circuit on the package body, the other end of the differential resistor R14 is connected with a ground wire GND, and a seventh I/O port of the MCU control unit U1 is connected with the differential resistor R15 in series and then connected with an output pin AMP1 of a first operational amplifier circuit on the packaging body.
14. The control system of claim 12, wherein: the second operational amplifier circuit AM2, the differential resistor R21, the differential resistor R22, the differential resistor R23, the differential resistor R24 and the differential resistor R25 form a second differential amplifier circuit, one end of the differential resistor R21 Is connected to a negative input pin AMP 2-of the second operational amplifier circuit on the package body, the other end of the differential resistor R21 Is connected to the ground GND, one end of the differential resistor R22 Is connected to an output pin AMP2 of the second operational amplifier circuit on the package body, the other end of the differential resistor R22 Is connected to a negative input pin AMP 2-of the second operational amplifier circuit on the package body, one end of the differential resistor R23 Is connected to a positive input pin AMP2+ of the second operational amplifier circuit on the package body, the other end of the differential resistor R23 Is2 on the package body, one end of the differential resistor R24 Is connected to a positive input pin 2+ of the second operational amplifier circuit on the package body, the other end of the differential resistor R24 is connected with a ground wire GND, and an eighth I/O port of the MCU control unit U1 is connected with the differential resistor R25 in series and then connected with an output pin AMP2 of a second operational amplifier circuit on the packaging body.
15. The control system of claim 12, wherein: the third operational amplifier circuit AM3, the differential resistor R31, the differential resistor R32, the differential resistor R33, the differential resistor R34 and the differential resistor R35 form a third differential amplifier circuit, one end of the differential resistor R31 Is connected to a negative input pin AMP 3-of the third operational amplifier circuit on the package body, the other end of the differential resistor R31 Is connected to the ground GND, one end of the differential resistor R32 Is connected to an output pin AMP3 of the third operational amplifier circuit on the package body, the other end of the differential resistor R32 Is connected to a negative input pin AMP 3-of the third operational amplifier circuit on the package body, one end of the differential resistor R33 Is connected to a positive input pin AMP2+ of the third operational amplifier circuit on the package body, the other end of the differential resistor R33 Is2 on the package body, one end of the differential resistor R34 Is connected to a positive input pin 3+ of the third operational amplifier circuit on the package body, the other end of the differential resistor R34 is connected with a ground wire GND, and a ninth I/O port of the MCU control unit U1 is connected with the differential resistor R35 in series and then connected with an output pin AMP3 of a third operational amplifier circuit on the packaging body.
16. The control system of claim 9, wherein:
the first I/O port of the MCU control unit is connected with a signal control pin Hin1 on the packaging body, and the signal control pin Hin1 is connected with the input end of the input signal control unit;
a second I/O port of the MCU control unit is connected with a signal control pin Lin1 on the packaging body, and the signal control pin Lin1 is connected with the input end of the input signal control unit;
the third I/O port of the MCU control unit is connected with a signal control pin Hin2 on the packaging body, and the signal control pin Hin2 is connected with the input end of the input signal control unit;
a fourth I/O port of the MCU control unit is connected with a signal control pin Lin2 on the packaging body, and the signal control pin Lin2 is connected with the input end of the input signal control unit;
a fifth I/O port of the MCU control unit is connected with a signal control pin Hin3 on the packaging body, and the signal control pin Hin3 is connected with the input end of the input signal control unit;
and a sixth I/O port of the MCU control unit is connected with a signal control pin Lin3 on the packaging body, and the signal control pin Lin3 is connected with the input end of the input signal control unit.
17. The control system of claim 9, wherein: the three-phase switched reluctance motor comprises a first-phase coil, a second-phase coil and a third-phase coil, wherein the wire inlet end and the wire outlet end of the first-phase coil of the three-phase switched reluctance motor are respectively connected with a motor control pin L1+ and a motor control pin L1-on the packaging body, the wire inlet end and the wire outlet end of the second-phase coil are respectively connected with a motor control pin L2+ and a motor control pin L2-on the packaging body, and the wire inlet end and the wire outlet end of the third-phase coil are respectively connected with a motor control pin L3+ and a motor control pin L3-on the packaging body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122622741.1U CN216122272U (en) | 2021-10-29 | 2021-10-29 | Packaging power module for switched reluctance motor and control system applying same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122622741.1U CN216122272U (en) | 2021-10-29 | 2021-10-29 | Packaging power module for switched reluctance motor and control system applying same |
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| CN216122272U true CN216122272U (en) | 2022-03-22 |
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| CN202122622741.1U Active CN216122272U (en) | 2021-10-29 | 2021-10-29 | Packaging power module for switched reluctance motor and control system applying same |
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| CN (1) | CN216122272U (en) |
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