CN216120267U - Multi-chip integrated circuit packaging structure - Google Patents
Multi-chip integrated circuit packaging structure Download PDFInfo
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- CN216120267U CN216120267U CN202121961687.7U CN202121961687U CN216120267U CN 216120267 U CN216120267 U CN 216120267U CN 202121961687 U CN202121961687 U CN 202121961687U CN 216120267 U CN216120267 U CN 216120267U
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- sliding
- baffle
- chip
- packaging body
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
- 238000007789 sealing Methods 0.000 claims abstract description 28
- 230000000694 effects Effects 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 8
- 230000009471 action Effects 0.000 abstract description 7
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of chip packaging structures, and discloses a multi-chip integrated circuit packaging structure which comprises a packaging body, wherein sliding grooves are formed in the front surface and the back surface of the packaging body, sliding plates are movably sleeved in the sliding grooves, pull blocks are fixedly installed at the top of the front surface of each sliding plate, and sliding blocks located on the left side and the right side of each sliding plate are movably sleeved in the packaging body. According to the utility model, through the arrangement of the sliding plate, the baffle plate and the sealing gasket, the purpose of clamping the sealing gasket can be achieved through the packaging body and the sealing gasket under the action of the bolt, so that the dustproof effect on the interior of the packaging body is achieved, the sliding plate and the baffle plate can be respectively pushed to the front of the interface through the first spring and the second spring, so that the purpose of preventing dust on the interface is achieved, the sliding plate and the baffle plate can be respectively pulled up through pulling the pulling block and the lifting block, so that the interface is convenient for a worker to use, and the purpose of convenience in use and dust prevention is achieved.
Description
Technical Field
The utility model belongs to the technical field of chip packaging structures, and particularly relates to a multi-chip integrated circuit packaging structure.
Background
The package is a shell for mounting semiconductor integrated circuit chip, which not only plays the roles of mounting, fixing, sealing, protecting chip and enhancing electrothermal performance, but also is connected to the pins of the package shell by wires through the connection points on the chip, and the pins are connected with other devices by wires on the printed circuit board, thereby realizing the connection of internal chip and external circuit.
At present, the packaging structure of the integrated circuit is provided with a plurality of interfaces due to surface mounting when in use, and the interfaces can enable the packaging structure to supply a plurality of instruments for work at the same time, and although the existing packaging structure can meet the work requirement in daily use, the unused interfaces can fall into dust due to the fact that all the interfaces are not necessarily used at the same time when in use, and further normal use in the later period is influenced, so that the packaging structure needs to be improved.
Simultaneously, current integrated circuit packaging structure can fix internal chip when the installation to prevent it because not hard up and lead to the condition that the wiring drops, current packaging structure adopts the mode of draw-in groove or bolt to install fixedly more, though the former is easy to assemble, but has the insecure problem of installation, and the latter is installed more firmly, nevertheless because the narrow then operation of being not convenient for of packaging structure inner space, consequently also need improve it.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems and provides a multi-chip integrated circuit packaging structure which has the advantages of dust prevention and convenience in fixing.
In order to achieve the purpose, the utility model provides the following technical scheme: the multi-chip integrated circuit packaging structure comprises a packaging body, wherein sliding grooves are formed in the front surface and the back surface of the packaging body, sliding plates are movably sleeved in the sliding grooves, pull blocks are fixedly mounted at the top of the front surface of each sliding plate, sliding blocks located on the left side and the right side of each sliding plate are movably sleeved in the packaging body, the other ends of the sliding blocks penetrate through the packaging body, extend into the sliding grooves and are fixedly connected with the tops of the left side and the right side of each sliding plate, first springs are fixedly connected to the tops of the sliding blocks, the tops of the first springs are fixedly connected with the inner wall of the packaging body, notches are formed in the front surface of each sliding plate, baffles are movably sleeved in the sliding plates, the tops of the baffles penetrate through the sliding plates and extend to the upper portions of the sliding plates, lifting blocks located above the sliding plates are fixedly mounted at the top of the front surfaces of the baffles, and sliding rods are movably sleeved in the interiors of the baffles, the top of slide bar runs through the baffle and extends to the top of baffle and with the top fixed connection of spout inner chamber, the surface activity of slide bar has cup jointed the second spring, the top and the bottom of second spring respectively with the top of spout inner chamber and the top fixed connection of baffle, can ensure through first spring and second spring that slide and baffle are in interface the place ahead, and then reach and shield dirt-proof purpose, and because the bottom and the back of notch all communicate with the spout activity, and then can reach the purpose of exposing its interface that corresponds through removing the baffle, and remove the slide and can reach and expose all interfaces etc. simultaneously, and then the staff of being convenient for uses all interfaces simultaneously.
As a preferred technical scheme of the utility model, the front surface of the inner cavity of the sliding chute is provided with the interface positioned right behind the baffle, the interior of the interface is communicated with the notch, and due to the arrangement of the interface, a worker can conveniently connect the instrument with the packaging equipment, so that the aim of indirectly connecting the instrument with the chip is fulfilled.
According to a preferred technical scheme of the utility model, the left side and the right side of the inner cavity of the packaging body are respectively provided with a clamping groove, the chip is movably sleeved in the clamping groove, the side surface of the chip is fixedly connected with a wire, the other end of the wire is fixedly connected with the left side of the interface, the chip can be conveniently and simply positioned by a worker through the arranged clamping grooves, and the interface and the chip can be electrically connected through the wire, so that the instrument and the chip can be indirectly electrically connected.
As a preferred technical scheme of the utility model, the top of the packaging body is fixedly connected with a sealing gasket, the top of the sealing gasket is movably connected with a sealing cover, and due to the arrangement of the sealing cover, the sealing gasket can be extruded through the matching with the packaging body, so that the sealing effect is achieved, and the purpose of preventing dust in the packaging body is further achieved.
As a preferred technical scheme of the present invention, mounting grooves are formed around the top of the sealing cover, bolts are movably sleeved inside the mounting grooves, the bottoms of the bolts penetrate through the sealing cover and extend into the interior of the package body and are movably connected with the inner wall of the package body, the bolts can be mounted inside the sealing cover through the mounting grooves, and thus the situation that the mounting grooves protrude outside the sealing cover and are inconvenient to use is avoided, and the sealing cover and the package body can be stably connected through the bolts.
As a preferred technical scheme of the utility model, the periphery of the bottom of the sealing cover is fixedly connected with a third spring, the bottom of the third spring is fixedly connected with a pressing plate, the side surface of the pressing plate is movably connected with the inner wall of the packaging body, the bottom of the pressing plate is movably connected with the top of the chip, and due to the arrangement of the third spring, the pressing plate can be pushed by the third spring under the action of the sealing cover, so that the effect of pressing the chip is achieved by the pressing plate, and the purpose of convenient fixation is realized.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the arrangement of the sliding plate, the first spring, the baffle, the second spring and the sealing gasket, the purpose of clamping the sealing gasket can be achieved through the packaging body and the sealing gasket under the action of the bolt, so that the dustproof effect on the interior of the packaging body is achieved, the sliding plate and the baffle can be respectively pushed to the front of the interface through the first spring and the second spring, so that the purpose of abutting against the interface and further preventing dust is achieved, the sliding plate and the baffle can be respectively pulled up through pulling the pulling block and the lifting block, so that a worker can conveniently use the interface, and the purposes of convenience in use and dust prevention are achieved.
2. According to the utility model, through the arrangement of the interface, the sealing cover, the third spring and the pressing plate, a worker can conveniently carry out primary installation on the chip through the interface and achieve the effect of limiting the chip, the sealing cover can be driven to move by the matching of the packaging body and the bolt, and the purpose of pushing the pressing plate to move can be achieved through the third spring, so that the chip is pressed inside the packaging body and the interface through the pressing plate, and finally, the purpose of convenient fixation can be realized.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic sectional front view of the chute of the present invention;
FIG. 3 is a schematic cross-sectional front view of the card slot of the present invention;
FIG. 4 is a side cross-sectional structural view of the third spring of the present invention;
FIG. 5 is a schematic side sectional view of the mounting groove of the present invention;
fig. 6 is a partially enlarged schematic view of a portion a in fig. 1.
In the figure: 1. a package body; 2. a chute; 3. a slide plate; 4. pulling the block; 5. a slider; 6. a first spring; 7. a notch; 8. a baffle plate; 9. lifting blocks; 10. a slide bar; 11. a second spring; 12. an interface; 13. a card slot; 14. a chip; 15. a wire; 16. a gasket; 17. a sealing cover; 18. mounting grooves; 19. a bolt; 20. a third spring; 21. and a pressing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, the utility model provides a multi-chip integrated circuit package structure, which comprises a package body 1, wherein the front and back of the package body 1 are both provided with a sliding chute 2, a sliding plate 3 is movably sleeved inside the sliding chute 2, a pull block 4 is fixedly arranged at the top of the front of the sliding plate 3, sliding blocks 5 positioned at the left and right sides of the sliding plate 3 are movably sleeved inside the package body 1, the other end of the sliding block 5 penetrates through the package body 1, extends into the sliding chute 2 and is fixedly connected with the tops of the left and right sides of the sliding plate 3, the top of the sliding block 5 is fixedly connected with a first spring 6, the top of the first spring 6 is fixedly connected with the inner wall of the package body 1, the front of the sliding plate 3 is provided with a notch 7, the inside of the sliding plate 3 is movably sleeved with a baffle plate 8, the top of the baffle plate 8 penetrates through the sliding plate 3 and extends to the upper side of the sliding plate 3, a lifting block 9 positioned above the sliding plate 3 is fixedly arranged at the top of the front of the baffle plate 8, the inside activity of baffle 8 has cup jointed slide bar 10, the top of slide bar 10 runs through baffle 8 and extends to baffle 8's top and with the top fixed connection of 2 inner chambers of spout, the surface activity of slide bar 10 has cup jointed second spring 11, the top and the bottom of second spring 11 respectively with the top of 2 inner chambers of spout and the top fixed connection of baffle 8, can ensure through first spring 6 and second spring 11 that slide 3 and baffle 8 are in interface 12 the place ahead, and then reach and shield dirt-proof purpose, and because the bottom and the back of notch 7 all communicate with the spout 2 activity, and then can reach the purpose of exposing its interface 12 that corresponds through removing baffle 8, and remove slide 3 can reach and expose all interfaces 12 etc. simultaneously, and then the staff of being convenient for uses all interfaces 12 simultaneously.
Wherein, the interface 12 that is located baffle 8 dead astern is seted up on the front of 2 inner chambers of spout, and the inside and the notch 7 of interface 12 communicate each other, because the setting of interface 12 can make things convenient for the staff to be connected instrument and encapsulation equipment to the realization carries out the indirect purpose that links to each other with instrument and chip 14.
Wherein, draw-in groove 13 has all been seted up to the left and right sides of 1 inner chamber of packaging body, chip 14 has been cup jointed in the inside activity of draw-in groove 13, chip 14's side fixedly connected with wire 15, the other end of wire 15 and the left side fixed connection of interface 12, through the draw-in groove 13 that sets up, can make things convenient for the staff to carry out simple location with chip 14, and can carry out electric connection with interface 12 and chip 14 through wire 15 to ensure that the instrument can indirectly carry out electric connection with chip 14.
Wherein, the sealed pad 16 of top fixedly connected with of packaging body 1, the sealed top swing joint who fills up 16 has sealed lid 17, because the setting of sealed lid 17, can extrude sealed pad 16 through the cooperation with packaging body 1, and then reach sealed effect to further play carries out dirt-proof purpose to its inside.
Wherein, mounting groove 18 has all been seted up all around at sealed lid 17 top, bolt 19 has been cup jointed in the inside activity of mounting groove 18, bolt 19's bottom runs through sealed lid 17 and extends to the inside of packaging body 1 and with packaging body 1's inner wall swing joint, through the mounting groove 18 that sets up, can install bolt 19 in the inside of sealed lid 17, and then avoid the outside of mounting groove 18 protrusion at sealed lid 17 and the condition of not convenient for use, and can carry out stable being connected with sealed lid 17 and packaging body 1 through bolt 19.
Wherein, the equal fixedly connected with third spring 20 all around of sealed lid 17 bottom, the bottom fixedly connected with pressure strip 21 of third spring 20, the side of pressure strip 21 and the inner wall swing joint of packaging body 1, the bottom of pressure strip 21 and the top swing joint of chip 14, because the setting of third spring 20, can promote pressure strip 21 through third spring 20 under the effect of sealed lid 17, and then reach the effect that compresses tightly chip 14 through pressure strip 21, thereby realize convenient fixed purpose.
The working principle and the using process of the utility model are as follows:
when the dustproof purpose is needed to be realized, firstly, the sealing cover 17 is fixed above the sealing gasket 16 through the bolt 19 and extrudes the sealing gasket 16, so that the purpose of sealing and preventing dust is achieved inside the packaging body 1, the sliding plate 3 and the baffle plate 8 can be conveniently pulled by a worker through the pulling block 4 and the lifting block 9, and further the purpose of exposing the interface 12 is achieved, so that the worker can conveniently connect the instrument and the packaging body 1 through the interface 12, the instrument and the chip 14 are indirectly connected through the wire 15, the sliding plate 3 and the baffle plate 8 can be respectively ensured to be in front of the interface 12 under the action of the sliding block 5 and the second spring 11, and the dustproof effect on any one or more interfaces 12 is achieved.
When the purpose of convenient fixing is reached to needs, at first install chip 14 in the inside of draw-in groove 13, then with the inside of bolt 19 by mounting groove 18 department precession packaging body 1, and then can fix sealed lid 17 in packaging body 1's top, and because sealed lid 17's removal can promote pressure strip 21 through third spring 20, and then can cooperate pressure strip 21 to extrude chip 14 under packaging body 1 hinders the effect to chip 14, and then reach the purpose of fixing chip 14, thereby realize convenient fixed function.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Multi-chip integrated circuit packaging structure, including package body (1), its characterized in that: the packaging structure is characterized in that sliding chutes (2) are respectively formed in the front and the back of the packaging body (1), sliding plates (3) are movably sleeved in the sliding chutes (2), pull blocks (4) are fixedly mounted at the front tops of the sliding plates (3), sliding blocks (5) positioned on the left side and the right side of the sliding plates (3) are movably sleeved in the packaging body (1), the other ends of the sliding blocks (5) penetrate through the packaging body (1), extend to the inside of the sliding chutes (2) and are fixedly connected with the tops of the left side and the right side of the sliding plates (3), first springs (6) are fixedly connected with the tops of the sliding blocks (5), the tops of the first springs (6) are fixedly connected with the inner wall of the packaging body (1), notches (7) are formed in the front of the sliding plates (3), baffle plates (8) are movably sleeved in the sliding plates (3), the tops of the baffle plates (8) penetrate through the sliding plates (3) and extend to the tops of the sliding plates (3), baffle (8) positive top fixed mounting has the piece (9) of carrying that is located slide (3) top, the inside activity of baffle (8) has cup jointed slide bar (10), the top of slide bar (10) runs through baffle (8) and extend to the top of baffle (8) and with the top fixed connection of spout (2) inner chamber, the surface activity of slide bar (10) has cup jointed second spring (11), the top and the bottom of second spring (11) respectively with the top of spout (2) inner chamber and the top fixed connection of baffle (8).
2. The multi-chip integrated circuit package structure of claim 1, wherein: the front of the inner cavity of the sliding chute (2) is provided with an interface (12) which is positioned right behind the baffle (8), and the inside of the interface (12) is communicated with the notch (7).
3. The multi-chip integrated circuit package structure of claim 1, wherein: clamping grooves (13) are formed in the left side and the right side of an inner cavity of the packaging body (1), a chip (14) is sleeved on the inner portion of each clamping groove (13) in a movable mode, a lead (15) is fixedly connected to the side face of each chip (14), and the other end of each lead (15) is fixedly connected with the left side of the interface (12).
4. The multi-chip integrated circuit package structure of claim 1, wherein: the top fixedly connected with of encapsulation body (1) seals up (16), the top swing joint that seals up (16) has sealed lid (17).
5. The multi-chip integrated circuit package structure of claim 4, wherein: all seted up mounting groove (18) around sealed lid (17) top, bolt (19) have been cup jointed in the inside activity of mounting groove (18), the bottom of bolt (19) runs through sealed lid (17) and extends to the inside of encapsulation body (1) and with the inner wall swing joint of encapsulation body (1).
6. The multi-chip integrated circuit package structure of claim 4, wherein: the packaging structure is characterized in that the periphery of the bottom of the sealing cover (17) is fixedly connected with a third spring (20), the bottom of the third spring (20) is fixedly connected with a pressing plate (21), the side face of the pressing plate (21) is movably connected with the inner wall of the packaging body (1), and the bottom of the pressing plate (21) is movably connected with the top of the chip (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121961687.7U CN216120267U (en) | 2021-08-20 | 2021-08-20 | Multi-chip integrated circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121961687.7U CN216120267U (en) | 2021-08-20 | 2021-08-20 | Multi-chip integrated circuit packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216120267U true CN216120267U (en) | 2022-03-22 |
Family
ID=80727244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121961687.7U Active CN216120267U (en) | 2021-08-20 | 2021-08-20 | Multi-chip integrated circuit packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216120267U (en) |
-
2021
- 2021-08-20 CN CN202121961687.7U patent/CN216120267U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231218 Address after: 200120 building 3, No. 1558, Pingzhuang East Road, Lingang xinpian District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai Nuozhangqiang Technology Co.,Ltd. Patentee after: Liu Yingguo Patentee after: Chen Huacheng Address before: 518107 4th floor, building 18, shatouxiang Industrial Zone, Changzhen community, Yutang street, Guangming District, Shenzhen, Guangdong Patentee before: Shenzhen Huasi Ketai Electronics Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240307 Address after: No.26-1 Xiexin West Road, Liujiagang, Fuqiao Town, Taicang City, Suzhou City, Jiangsu Province, 215000 Patentee after: Zhuoxinjie (Suzhou) Semiconductor Materials Technology Co.,Ltd. Country or region after: China Address before: 200120 building 3, No. 1558, Pingzhuang East Road, Lingang xinpian District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee before: Shanghai Nuozhangqiang Technology Co.,Ltd. Country or region before: China Patentee before: Liu Yingguo Patentee before: Chen Huacheng |
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| TR01 | Transfer of patent right |